CN106953029A - A kind of film encapsulation method and packaging film, ink jet printing device - Google Patents
A kind of film encapsulation method and packaging film, ink jet printing device Download PDFInfo
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- CN106953029A CN106953029A CN201710176308.5A CN201710176308A CN106953029A CN 106953029 A CN106953029 A CN 106953029A CN 201710176308 A CN201710176308 A CN 201710176308A CN 106953029 A CN106953029 A CN 106953029A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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Abstract
The embodiment of the present invention provides a kind of film encapsulation method and packaging film, ink jet printing device, is related to display technology field, and solution prepares barricade and pixel defining layer by a patterning processes, causes the problem of barricade size, position are limited.The film encapsulation method is used to be packaged organic light emitting display substrate, and methods described, which is included on organic light emitting display substrate, forms organic encapsulation layer：By InkJet printing processes, barricade is formed on organic light emitting display substrate, barricade at least surrounds the viewing area of organic light emitting display substrate；By InkJet printing processes, on organic light emitting display substrate, and the region correspondingly surrounded by barricade forms organic thin film layer；Wherein, the height of barricade is more than the height of organic thin film layer and barricade contact surface, and barricade is defined to the border of organic thin film layer.
Description
Technical field
Set the present invention relates to display technology field, more particularly to a kind of film encapsulation method and packaging film, inkjet printing
It is standby.
Background technology
OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) is used as a kind of current mode photophore
Part, the features such as there is self-luminous, quick response, wide viewing angle and can be produced in flexible substrate because of it and answered more and more
Among high-performance display field.In OLED display AMOLED (Active Matrix Driving OLED, it is active
Matrix driving Organic Light Emitting Diode) display device has low manufacturing cost, high answer speed, power saving, sets available for portable
The advantages of standby DC driven, operating temperature range are big etc. and be expected to turn into novel flat panel display of future generation.
Because AMOLED electrode and organic layer are easily caused its service life reduction by the erosion of water, oxygen, it is therefore desirable to
AMOLED display panels are packaged.In the prior art, common packaged type has glass cement (Frit Seal) encapsulation, UV
Cementing conjunction drying sheet (Getter) encapsulation, face glue encapsulation (Face Seal), ald encapsulation (Atomic Layer
Deposition, ALD) and a variety of methods such as thin-film package (Thin Film Encapsulation, TFE).Wherein, for soft
Property display for, TFE is one of the most frequently used packaged type.
Above-mentioned TFE structures include organic thin film layer 10 as shown in Figure 1, and the organic thin film layer 10 is generally set using inkjet printing
It is prepared by standby (Ink Jet Printer).In preparation process, in order to avoid ink (Ink) on underlay substrate 11 levelling
There is the phenomenon of uneven or beyond substrate scope in the border of the film formed afterwards, it will usually right on underlay substrate 11
Answer the position on ink printed border that barricade 20 (Bank) is set.But in the prior art, generally will gear in order to simplify manufacture craft
Wall 20 passes through mask, exposure (MASK) technique shape with pixel defining layer 12 (Pixel Definition Layer, PDL)
Into.But so, PDL design is limited to so that the size of barricade 20, position can not flexibly be adjusted as needed.
The content of the invention
Embodiments of the invention provide a kind of film encapsulation method and packaging film, ink jet printing device, solve to pass through one
Secondary patterning processes prepare barricade and pixel defining layer, cause the problem of barricade size, position are limited.
To reach above-mentioned purpose, embodiments of the invention are adopted the following technical scheme that：
The one side of the embodiment of the present invention is there is provided a kind of film encapsulation method, for being carried out to organic light emitting display substrate
Encapsulation, methods described, which is included on the organic light emitting display substrate, forms organic encapsulation layer：By InkJet printing processes, in institute
State and barricade is formed on organic light emitting display substrate, the barricade at least surrounds the viewing area of the organic light emitting display substrate；
By InkJet printing processes, on the organic light emitting display substrate, and the region correspondingly surrounded by the barricade forms organic
Film layer；Wherein, the height of the barricade is more than the height of the organic thin film layer and the barricade contact surface, the barricade pair
The border of the organic thin film layer is defined.
It is preferred that, the barricade and the organic thin film layer are made up of an InkJet printing processes；Constitute described organic
The material of film layer and the barricade is respectively the first organic material and the second organic material；Wherein, it is organic using described second
The wetting speed on surface to be filmed for the ink that material is constituted is less than the ink constituted using first organic material in institute
State the wetting speed on surface to be filmed.
It is preferred that, methods described also includes：On the organic light emitting display substrate, formation at least covers organic hair
The inorganic thin film layer of the viewing area of light display base plate.
It is preferred that, repeatedly it is alternately repeated the step of forming the organic encapsulation layer and the inorganic thin film layer；Or, in shape
Into having on the organic light emitting display substrate of the organic encapsulation layer, repeatedly it is alternately repeated to form the organic thin film layer and the nothing
The step of machine film layer；Wherein, the height of the barricade is more than what is stacked gradually, and the multi-layer thin film layer in the barricade
With the height sum of the barricade contact surface.
It is preferred that, when the surface of the organic light emitting display substrate is provided with the N layer films layer stacked gradually, and the N
When layer film layer includes the organic thin film layer and the inorganic thin film layer, the inorganic thin film layer is located at odd-level；Wherein, N
>=3, N are odd number.
It is preferred that, the film layer in the multi-layer thin film layer farthest away from the organic light emitting display substrate is described inorganic thin
Film layer.
It is preferred that, the area coverage of the inorganic thin film layer is more than covering for the organic thin film layer or the organic encapsulation layer
Capping is accumulated.
The another aspect of the embodiment of the present invention is there is provided a kind of packaging film, and the packaging film is using as described above any
A kind of film encapsulation method is made.
The another aspect of the embodiment of the present invention, the ink-jet used in any one film encapsulation method as described above is beaten
Printing apparatus, including for printing the first child print module of organic thin film layer and being connected with the first child print module
First reservoir；The ink jet printing device also include be used for print barricade the second child print module and with described second son
The second reservoir that printing module is connected.
It is preferred that, the first child print module includes 1~5 the first printhead；The second child print module includes 1
~2 the second printheads.
The embodiment of the present invention provides a kind of film encapsulation method and packaging film, ink jet printing device.The thin-film package side
Method is used to be packaged organic light emitting display substrate, and this method, which is included on organic light emitting display substrate, forms organic packages
Layer.Specifically forming the method for the organic encapsulation layer includes：By InkJet printing processes, formed on organic light emitting display substrate
Barricade, the barricade at least surrounds the viewing area of organic light emitting display substrate.And by InkJet printing processes, it is aobvious in organic light emission
Show on substrate, and the region correspondingly surrounded by barricade forms organic thin film layer.Wherein, the height of barricade be more than organic thin film layer with
The height of barricade contact surface, the barricade is defined to the border of organic thin film layer.From the foregoing, on the one hand, due to barricade
Formed by InkJet printing processes, therefore the position of printhead in inkjet-printing device can be adjusted as needed, with to barricade
Position be adjusted.On the other hand, the size of the ink droplet that printing is instilled every time can also be controlled as needed, to reach control
The purpose of barricade size.So, because the barricade in the application with the pixel in organic light emitting display substrate without defining
Layer is formed by a mask exposure technique, therefore the size of barricade and position are no longer limited by the making work of pixel defining layer
Skill, and can be adjusted as needed, so as to improve flexibility and the scope of application of thin film encapsulation processes.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
A kind of membrane structure schematic diagram that Fig. 1 provides for prior art；
A kind of schematic diagram of the packaging film for film encapsulation method formation that Fig. 2 provides for use the embodiment of the present application；
A kind of film encapsulation method flow chart that Fig. 3 provides for the application；
Fig. 4 is the schematic diagram that barricade is printed using the method shown in Fig. 3；
Fig. 5 is the schematic diagram that organic thin film layer is printed using the method shown in Fig. 3；
Fig. 6 is the structural representation that inorganic thin film layer is formed on the basis of the packaging film shown in Fig. 2；
Fig. 7 is the set location schematic diagram of inorganic thin film layer in Fig. 6；
The overlapping packaging film set of a kind of organic thin film layer and inorganic thin film layer that Fig. 8 provides for the embodiment of the present application
Schematic diagram；
The overlapping packaging film set of another organic thin film layer and inorganic thin film layer that Fig. 9 provides for the embodiment of the present application
Schematic diagram；
A kind of structural representation for ink jet printing device that Figure 10 provides for the embodiment of the present application.
Reference：
01- organic light emitting display substrates；11- underlay substrates；12- pixel defining layers；13- organic layers；100- organic packages
Layer；10- organic thin film layers；20- barricades；201- ink droplets；30- inorganic thin film layers；200- multi-layer thin film layers；300- prints module；
40- the first child print modules；The printheads of 401- first；The reservoirs of 41- first；50- the second child print modules；501- second is printed
Head；The reservoirs of 51- second；A- viewing areas；The height of H1- barricades；The height of H2- organic thin film layers and barricade contact surface；H3-
Multi-layer thin film layer and the height sum of barricade contact surface in barricade.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
The embodiment of the present invention provides a kind of film encapsulation method, for organic light emitting display substrate 01 as shown in Figure 2
It is packaged, this method is included in formation organic encapsulation layer 100 on organic light emitting display substrate 01.
Wherein, above-mentioned organic light emitting display substrate 01 includes underlay substrate 11, and formation is defined with the pixel on underlay substrate
Layer 12, and the organic layer 13 in the pixel region limited by pixel defining layer 12.Above-mentioned underlay substrate 11 has for making
The array base palte of multiple image element circuits of array arrangement.
Specifically, form the method for above-mentioned organic encapsulation layer 100 includes as shown in Figure 3：
Step S101, by InkJet printing processes, on organic light emitting display substrate 01 formed barricade 20.Wherein, such as Fig. 4
The shown ink droplet 201 for constituting barricade 20 at least surrounds the viewing area A of organic light emitting display substrate 01, so, above-mentioned ink
After drop solidification, it can cause that barricade 20 at least surrounds the viewing area A of organic light emitting display substrate 01 as shown in Figure 5.
Step S102, as shown in figure 5, by InkJet printing processes, being kept off on organic light emitting display substrate 01, and correspondingly
The region that wall 20 is surrounded forms organic thin film layer 10.
Wherein, as shown in Fig. 2 the height H1 of barricade 20 is more than the height H2 of organic thin film layer 10 and the contact surface of barricade 20.
The barricade 20 is defined to the border of organic thin film layer 10.
It should be noted that because barricade 20 is formed by InkJet printing processes, the ink droplet of inkjet printing formation is in solidification
Surface is arcwall face afterwards, therefore barricade 20 is arc away from a side surface of the underlay substrate 11 of above-mentioned luminescence display substrate 01
Face.In the case, in the application the height H1 of barricade 20 be the arcwall face into the vertical range of the underlay substrate 11 most
Big value.Based on this, the height H2 of organic thin film layer 10 and the contact surface of barricade 20 refers to, the organic thin film layer 10 connects with barricade 20
Contacting surface is to the maximum in the vertical range of the underlay substrate 11.
In addition, can first carry out above-mentioned steps S101 in the present invention to print barricade 20, and use curing process, such as UV
Curing process solidifies to barricade 20.Next above-mentioned steps S102 is being carried out, to print organic thin film layer 10, and to organic
Film layer 10 is solidified.
Based on this, when InkJet printing processes are respectively formed with machine film layer 10 and barricade 20 twice for use, for constituting
The material of organic thin film layer 10 and barricade 20 can be with identical, can also be different.Typically comprise above-mentioned organic thin film layer 10 or barricade
20 material can be used in organic material, such as organic material of acrylic series, epoxy resin series or silicon substrate series
Any one.Because the material for constituting organic thin film layer 10 and barricade 20 is in organic material, therefore ink jet printing process, use
There is certain compatibility in the ink Ink2 for forming barricade 20 and for the ink Ink1 for forming organic thin film layer 10.
Or, in order to simplify manufacture craft, it is preferred that above-mentioned steps S101 and step S102 can beat for same ink-jet
Print technique, i.e. organic thin film layer 10 and barricade 20 are made up of an InkJet printing processes.
In the case, in order that the ink Ink2 that must be used to be formed barricade 20 can be blocked for forming organic thin film layer
10 ink Ink1, to enable barricade 20 to be defined the border of organic thin film layer 10, constitutes the He of organic thin film layer 10
The material of barricade 20 needs to be set to different materials.Specifically, for example constituting the material point of organic thin film layer 10 and barricade 20
Wei not the first organic material and the second organic material.Wherein, the ink Ink2 constituted using the second organic material is in table to be filmed
Wetting speed on face is less than wetting speeds of the ink Ink1 constituted using the first organic material on surface to be filmed, Jimo
Wettabilities of the water Ink2 on surface to be filmed is less than wettabilities of the Ink1 on surface to be filmed.So, it is used for
Form diffusion velocities of the ink Ink2 of barricade 20 on surface to be filmed and be less than the ink for being used for forming organic thin film layer 10
Ink1 diffusion velocity so that the height H1 of the barricade 20 of formation is more than the height of organic thin film layer 10 and the contact surface of barricade 20
H2, so as to ensure that the barricade 20 can be defined to the border of organic thin film layer 10.Wherein, above-mentioned surface to be filmed is
With the surface of ink Ink1 or ink the Ink2 substrate directly contacted, such as packed table of above-mentioned organic light emitting display substrate 01
Surface of the underlay substrate 11 close to packaging film side in face, or the organic light emitting display substrate 01.
It should be noted that due to the viscosity of ink, the wetting speed on surface to be filmed is inversely proportional with ink, so black
Water Ink2 viscosity is more than ink Ink1 viscosity.Further, since the contact angle that ink is formed with surface to be filmed exists with ink
Wetting speed on surface to be filmed is inversely proportional, therefore ink Ink2 is more than ink Ink1 with the contact angle that surface to be filmed is formed
The contact angle formed with surface to be filmed.
From the foregoing, on the one hand, because barricade 20 is formed by InkJet printing processes, therefore can adjust as needed
The position of printhead in inkjet-printing device, is adjusted with the position to barricade 20.On the other hand, it can also control as needed
System prints the size of the ink droplet instilled every time, to reach the purpose of control 20 wall sizes of gear.So, due in the application
Barricade 20 with the pixel defining layer 12 in organic light emitting display substrate 01 by a mask exposure technique without being formed, therefore gear
The size of wall 20 and position are no longer limited by the manufacture craft of pixel defining layer, and can be adjusted as needed, so that
Improve flexibility and the scope of application of thin film encapsulation processes.
On this basis, in order to improve the barriering effect of thin-film package, it is preferred that above-mentioned film encapsulation method also includes：
As is seen in fig. 6 or fig. 7, on organic light emitting display substrate 01, the viewing area of at least covering organic light emitting display substrate 01 is formed
Domain A inorganic thin film layer 30.
Specifically, can using low temperature PECVD (Plasma Enhanced Chemical Vapor Deposition, etc.
Gas ions strengthen chemical vapour deposition technique), form above-mentioned inorganic thin film layer on the surface of organic encapsulation layer 100 as shown in Figure 6
30.Or as shown in fig. 7, form inorganic thin film layer 30 on the surface of organic light emitting display substrate 01.Due to constituting inorganic thin film
The material of layer 30 includes the inorganic material such as silica, silicon nitride.Therefore the molecules align in the inorganic thin film layer 30 is close, energy
Enough steam and oxygen to external world is effectively obstructed.
Based on this, because inorganic thin film layer 30 has the characteristic of similar shape covering (Conformal Coverage), i.e., such as Fig. 6
Shown, after the surface of organic encapsulation layer 100 is covered with inorganic thin film layer 30, the inorganic thin film layer 30 deviates from underlay substrate 11 1
The surface topography profile of the surface topography profile of side and organic encapsulation layer 100 away from the side of underlay substrate 11 is identical or approximate phase
Together.In the case, because the barricade 20 in above-mentioned organic encapsulation layer 100 is made of InkJet printing processes, therefore the barricade
20 size, such as height H1 can be adjusted.In the case, the border of organic thin film layer 10 is limited meeting barricade 20
Under conditions of fixed, it can suitably reduce the height H1 of barricade 20, so as to reduce inorganic thin film layer 30 away from underlay substrate 11
The segment difference on the surface of side, reduces the harder inorganic thin film layer 30 of quality and damaged (Crack) phenomenon odds occurs.
On this basis, because inorganic thin film layer 30 possesses good barrier property, it is therefore preferred that when the organic light emission
When the surface of display base plate 01 includes the multi-layer thin film layer stacked gradually, as shown in fig. 7, farthest away from the organic light emitting display substrate
01 film layer is the inorganic thin film layer 30.So that being capable of conduct positioned at outermost inorganic thin film layer 30 in packaging film
Above-mentioned AMOLED display panels prevent the first line of defence that steam and oxygen are invaded.
In addition, the barriering effect in order to further improve steam and oxygen, directly connects with the organic light emitting display substrate 01
Tactile film layer is also above-mentioned inorganic thin film layer 30.
Based on this, it is preferred that organic thin film layer 10 can be arranged in a crossed manner with inorganic thin film layer 30.So, on the one hand,
Organic thin film layer 10 between adjacent two layers inorganic thin film layer 30 can play flat effect to the film layer that it is covered,
To reduce the segment difference on surface so that breakage is less likely to occur the inorganic thin film layer 30 of covering thereon.On the other hand, this is organic thin
Film layer 10 also has the characteristic that particle (Particle) is wrapped up, it is to avoid above-mentioned particle is impacted to OLED.Another aspect,
The water oxygen that the organic thin film layer 10 can also extend between adjacent two layers inorganic thin film layer 30 corrodes path.Specifically, adjacent
In the case that crackle occurs in two layers of inorganic thin film layer 30, steam or oxygen need to initially pass through the inorganic of first layer inorganic thin film layer 30
Crack, then into organic thin film layer 10, next can enter the inorganic crack of second layer inorganic thin film layer 30,
Extended so that the water oxygen of adjacent two layers inorganic thin film layer 30 corrodes path.Another further aspect, the organic thin film layer 10
Quality it is relatively soft, therefore can make it that the stress in the inorganic thin film layer 30 being in contact with the organic thin film layer 10 is released
Put, be conducive to the designer trends of flexible display apparatus.
In summary, in the case of the N layer films layer stacked gradually is provided with the surface of organic light emitting display substrate 01,
It is preferred that, N layer films layer includes organic thin film layer 10 and inorganic thin film layer 30 arranged in a crossed manner, and the inorganic thin film layer 30 is located at
Odd-level；Wherein, N >=3, N is odd number.For example, above-mentioned N can be 3,5 or 7, the present invention is not limited this.In this situation
Under, so that N is 7 as an example, i.e., when the seven layer films layer stacked gradually is provided with the surface of organic light emitting display substrate 01, preferably
, first and third, five, seven layer films layer is above-mentioned inorganic thin film layer 30.
Based on this, when being beaten by an ink-jet being formed with the organic light emitting display substrate 01 of above-mentioned inorganic thin film layer 30
When print technique prepares above-mentioned organic thin film layer 10 and barricade 20, for forming the ink Ink1 of organic thin film layer 10 and for shape
Ink Ink2 into barricade 20 can directly be contacted with inorganic thin film layer 30.In the case, it is above-mentioned to be used to carry the organic film
The surface to be filmed of layer 10 and barricade 20 deviates from the surface of the above-mentioned side of organic light emitting display substrate 01 for the inorganic thin film layer 30.
Further, in order to improve barriering effect, the area coverage of inorganic thin film layer 30 preferably is more than above-mentioned organic thin
The area coverage of film layer 10 or organic encapsulation layer 100.
Below to forming multiple organic thin film layers 10 arranged in a crossed manner on the surface of organic light emitting display substrate 01 and inorganic
The method of film layer 30 carries out detailed illustration.
Specifically, for example, being repeatedly alternately repeated to form above-mentioned organic encapsulation layer 100 and above-mentioned inorganic thin film as shown in Figure 8
The step of layer 30, make it that inorganic thin film layer 30 is arranged alternately with organic encapsulation layer 100.
Or, and for example, as shown in figure 9, be formed with the organic light emitting display substrate 01 of organic encapsulation layer 100, it is many
It is secondary to be alternately repeated the step of forming organic thin film layer 10 and inorganic thin film layer 30, to cause inorganic thin film layer 30 and organic thin film layer
10 are arranged alternately.
Wherein, when using preparation method as shown in Figure 9, due to being formed with the organic light emission of organic encapsulation layer 100
When making multi-layer thin film layer 200 on display base plate 01, without making barricade 20, therefore in order to ensure the organic encapsulation layer 100
In barricade 20 border for the multi-layer thin film layer 200 being subsequently formed can be defined, the height H1 of the barricade 20 needs big
In what is stacked gradually, and multi-layer thin film layer 200 and the height sum H3 of the contact surface of barricade 20 in barricade 20.
It should be noted that multi-layer thin film layer 200 and the height sum H3 of the contact surface of barricade 20 refer to the multi-layer thin film layer
200 with the contact surface of barricade 20 to the maximum in the vertical range of the underlay substrate 11.
The embodiment of the present invention provides a kind of packaging film, is made of any one film encapsulation method as described above.
With the film encapsulation method identical beneficial effect provided with previous embodiment, here is omitted.
The embodiment of the present invention provides a kind of inkjet printing used in any one film encapsulation method as described above
Equipment, as shown in Figure 10, the ink jet printing device include be used for print organic thin film layer 10 the first child print module 40 and
The first reservoir 41 being connected with the first child print module 40.
In addition, the ink jet printing device also include be used for print barricade 20 the second child print module 50 and with second son
The second reservoir 51 that printing module 50 is connected.
Wherein, above-mentioned first child print module 40 and the second child print module 50 constitute beating for above-mentioned ink jet printing device
Stamp group 300.The ink jet printing device has the film encapsulation method identical beneficial effect provided with previous embodiment, herein
Repeat no more.In addition, the ink jet printing device can pass through two sets of independent child print modules (Sub Print Module) point
It is other that inkjet printing is carried out to organic thin film layer 10 and barricade 20, therefore the organic thin film layer 10 and barricade 20 can be by once spraying
Black printing technology is made, so as to simplify manufacture craft.
Based on this, in order that the ink Ink2 that must be used to be formed barricade 20 can be blocked for forming organic thin film layer 10
Ink Ink1, is defined with the border to organic thin film layer 10, is constituted the material of organic thin film layer 10 and barricade 20 and is needed to set
Different materials are set to, therefore the first child print module 40 and the second child print module 50 have each independent feed flow dress respectively
Put.Specific same as above, the material for constituting organic thin film layer 10 and barricade 20 is respectively that the first organic material and second are organic
Material.The ink Ink1 wherein constituted using the first organic material is contained in the first reservoir 41, what the second organic material was constituted
Ink Ink2 is contained in the second reservoir 51.
On this basis, above-mentioned first child print module 40 can include 1~5 the first printhead 401.Second child print
Module 50 includes 1~2 the second printhead 501.Any one printhead in first printhead 401 and the second printhead 501
On be provided with multiple nozzles, for the ink in reservoir to be printed to predeterminated position according to operational order.
In the case, for the display panel of advanced lines line, the quantity of the printhead of use is more, and such as first
Child print module 40 can have 4 or 5 the first printheads 401, and the second child print module 50 can have 2 second printings
First 501.So, it can avoid in print procedure, due to the spray nozzle clogging on portion printhead, and cause film forming thickness not
.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (10)
1. a kind of film encapsulation method, for being packaged to organic light emitting display substrate, it is characterised in that methods described includes
Organic encapsulation layer is formed on the organic light emitting display substrate：
By InkJet printing processes, barricade is formed on the organic light emitting display substrate, the barricade, which is at least surrounded, described to be had
The viewing area of machine luminescence display substrate；
By InkJet printing processes, on the organic light emitting display substrate, and the region correspondingly surrounded by the barricade is formed
Organic thin film layer；
Wherein, the height of the barricade is more than the height of the organic thin film layer and the barricade contact surface, and the barricade is to institute
The border for stating organic thin film layer is defined.
2. film encapsulation method according to claim 1, it is characterised in that the barricade and the organic thin film layer pass through
One time InkJet printing processes are made；
The material for constituting the organic thin film layer and the barricade is respectively the first organic material and the second organic material；
Wherein, wetting speed of the ink on surface to be filmed constituted using second organic material is less than using described the
Wetting speed of the ink that one organic material is constituted on the surface to be filmed.
3. film encapsulation method according to claim 1, it is characterised in that methods described also includes：
On the organic light emitting display substrate, formation at least covers the inorganic of the viewing area of the organic light emitting display substrate
Film layer.
4. film encapsulation method according to claim 3, it is characterised in that
Repeatedly it is alternately repeated the step of forming the organic encapsulation layer and the inorganic thin film layer；
Or, it is being formed with the organic light emitting display substrate of the organic encapsulation layer, is repeatedly being alternately repeated to form described organic
The step of film layer and the inorganic thin film layer；
Wherein, the height of the barricade is more than what is stacked gradually, and multi-layer thin film layer and the barricade in the barricade
The height sum of contact surface.
5. the film encapsulation method according to claim 3 or 4, it is characterised in that when the organic light emitting display substrate
Surface is provided with the N layer films layer stacked gradually, and N layer films layer includes the organic thin film layer and the inorganic thin film
During layer, the inorganic thin film layer is located at odd-level；Wherein, N >=3, N is odd number.
6. film encapsulation method according to claim 5, it is characterised in that have in the multi-layer thin film layer farthest away from described
The film layer of machine luminescence display substrate is the inorganic thin film layer.
7. the film encapsulation method according to claim 3 or 4, it is characterised in that the area coverage of the inorganic thin film layer
More than the area coverage of the organic thin film layer or the organic encapsulation layer.
8. a kind of packaging film, it is characterised in that be made of the film encapsulation method as described in claim any one of 1-7.
9. the ink jet printing device used in a kind of film encapsulation method as described in claim any one of 1-7, its feature
Be, including for print the first child print module of organic thin film layer and be connected with the first child print module
One reservoir；
The ink jet printing device also include be used for print barricade the second child print module and with the second child print mould
The second reservoir that group is connected.
10. ink jet printing device according to claim 9, it is characterised in that
The first child print module includes 1~5 the first printhead；
The second child print module includes 1~2 the second printhead.
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