CN106953029B - A kind of film encapsulation method and packaging film, ink jet printing device - Google Patents
A kind of film encapsulation method and packaging film, ink jet printing device Download PDFInfo
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- CN106953029B CN106953029B CN201710176308.5A CN201710176308A CN106953029B CN 106953029 B CN106953029 B CN 106953029B CN 201710176308 A CN201710176308 A CN 201710176308A CN 106953029 B CN106953029 B CN 106953029B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
Abstract
The embodiment of the present invention provides a kind of film encapsulation method and packaging film, ink jet printing device, is related to field of display technology, solves to prepare barricade and pixel defining layer by a patterning processes, the problem for causing barricade size, position to be limited.The film encapsulation method is for being packaged organic light emitting display substrate, the method includes forming organic encapsulation layer on organic light emitting display substrate: passing through InkJet printing processes, barricade is formed on organic light emitting display substrate, barricade at least surrounds the display area of organic light emitting display substrate；By InkJet printing processes, on organic light emitting display substrate, and the corresponding region surrounded by barricade forms organic thin film layer；Wherein, the height of barricade is greater than the height of organic thin film layer and barricade contact surface, and barricade is defined the boundary of organic thin film layer.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of film encapsulation method and packaging film, inkjet printing to set
It is standby.
Background technique
OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) is used as a kind of current mode photophore
Part, because its had self-luminous, quick response, wide viewing angle and can be produced in flexible substrate the features such as due to are answered more and more
In high-performance display field.In OLED display AMOLED (Active Matrix Driving OLED, it is active
Matrix driving Organic Light Emitting Diode) display device have low manufacturing cost, high answer speed, power saving, can be used for portable set
The advantages that standby DC driven, operating temperature range are big etc. and be expected to become next-generation novel flat panel display.
Since the electrode and organic layer of AMOLED are easy to be led to its service life reduction by the erosion of water, oxygen, it is therefore desirable to
AMOLED display panel is packaged.In the prior art, common packaged type has glass cement (Frit Seal) encapsulation, UV
Cementing conjunction drying sheet (Getter) encapsulation, face glue encapsulation (Face Seal), atomic layer deposition encapsulate (Atomic Layer
Deposition, ALD) and a variety of methods such as thin-film package (Thin Film Encapsulation, TFE).Wherein, for soft
Property display for, TFE is one of most common packaged type.
Above-mentioned TFE structure includes organic thin film layer 10 as shown in Figure 1, which generallys use inkjet printing and set
It is prepared by standby (Ink Jet Printer).During the preparation process, in order to avoid ink (Ink) on underlay substrate 11 levelling
There is the phenomenon that irregular or range beyond substrate in the boundary of the film formed afterwards, it will usually right on underlay substrate 11
Answer the position on ink printed boundary that barricade 20 (Bank) is set.It however in the prior art, usually will gear in order to simplify manufacture craft
Wall 20 and pixel defining layer 12 (Pixel Definition Layer, PDL) pass through an exposure mask, exposure (MASK) technique shape
At.However so, the design of PDL is limited to so that 20 size of barricade, position can not flexibly be adjusted as needed.
Summary of the invention
The embodiment of the present invention provides a kind of film encapsulation method and packaging film, ink jet printing device, solves to pass through one
Secondary patterning processes prepare barricade and pixel defining layer, the problem for causing barricade size, position limited.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that
The one side of the embodiment of the present invention provides a kind of film encapsulation method, for carrying out to organic light emitting display substrate
Encapsulation, the method includes forming organic encapsulation layer on the organic light emitting display substrate: by InkJet printing processes, in institute
It states and forms barricade on organic light emitting display substrate, the barricade at least surrounds the display area of the organic light emitting display substrate；
By InkJet printing processes, on the organic light emitting display substrate, and it is corresponding formed by the region that the barricade surrounds it is organic
Film layer；Wherein, the height of the barricade is greater than the height of the organic thin film layer and the barricade contact surface, the barricade pair
The boundary of the organic thin film layer is defined.
Preferably, the barricade and the organic thin film layer are made up of an InkJet printing processes；It constitutes described organic
The material of film layer and the barricade is respectively the first organic material and the second organic material；Wherein, organic using described second
The wetting speed on surface to be filmed for the ink that material is constituted is less than the ink constituted using first organic material in institute
State the wetting speed on surface to be filmed.
Preferably, the method also includes: on the organic light emitting display substrate, formation at least cover organic hair
The inorganic thin film layer of the display area of light display base plate.
Preferably, repeatedly it is alternately repeated the step of forming the organic encapsulation layer and the inorganic thin film layer；Alternatively, in shape
At on the organic light emitting display substrate for having the organic encapsulation layer, repeatedly it is alternately repeated to form the organic thin film layer and the nothing
The step of machine film layer；Wherein, the height of the barricade is greater than and stacks gradually, and the multi-layer thin film layer being located in the barricade
With the sum of the height of the barricade contact surface.
Preferably, when the surface of the organic light emitting display substrate is provided with the N layer film layer stacked gradually, and the N
When layer film layer includes the organic thin film layer and the inorganic thin film layer, the inorganic thin film layer is located at odd-level；Wherein, N
>=3, N are odd number.
It preferably, is described inorganic thin farthest away from the film layer of the organic light emitting display substrate in the multi-layer thin film layer
Film layer.
Preferably, the area coverage of the inorganic thin film layer is greater than covering for the organic thin film layer or the organic encapsulation layer
Capping product.
The another aspect of the embodiment of the present invention provides a kind of packaging film, and the packaging film is using as described above any
A kind of film encapsulation method is made.
The another aspect of the embodiment of the present invention, the ink-jet used in any one film encapsulation method as described above are beaten
Printing apparatus is connected including the first child print mould group for printing organic thin film layer and with the first child print mould group
First liquid storage device；The ink jet printing device further include the second child print mould group for printing barricade and with second son
The second liquid storage device that impression block group is connected.
Preferably, the first child print mould group includes 1~5 the first print head；The second child print mould group includes 1
~2 the second print heads.
The embodiment of the present invention provides a kind of film encapsulation method and packaging film, ink jet printing device.The thin-film package side
For method for being packaged to organic light emitting display substrate, this method includes forming organic packages on organic light emitting display substrate
Layer.The method for specifically forming the organic encapsulation layer includes: to be formed on organic light emitting display substrate by InkJet printing processes
Barricade, the barricade at least surround the display area of organic light emitting display substrate.It is aobvious in organic light emission and by InkJet printing processes
Show on substrate, and the corresponding region surrounded by barricade forms organic thin film layer.Wherein, the height of barricade be greater than organic thin film layer with
The height of barricade contact surface, the barricade are defined the boundary of organic thin film layer.It can be seen from the above, on the one hand, due to barricade
It is formed by InkJet printing processes, therefore can according to need the position of print head in adjustment inkjet-printing device, to barricade
Position be adjusted.On the other hand, the size for the ink droplet that printing instills every time can also be controlled, as needed to reach control
The purpose of barricade size.So, since the barricade in the application is not necessarily to define with the pixel in organic light emitting display substrate
Layer is formed by a mask exposure technique, therefore the size of barricade and position are no longer limited by the production work of pixel defining layer
Skill, and can according to need and be adjusted, to improve the flexibility and the scope of application of thin film encapsulation processes.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of membrane structure schematic diagram that the prior art provides；
Fig. 2 is using a kind of schematic diagram for the packaging film that film encapsulation method is formed provided by the embodiments of the present application；
Fig. 3 is a kind of film encapsulation method flow chart provided by the present application；
Fig. 4 is the schematic diagram using method shown in Fig. 3 printing barricade；
Fig. 5 is the schematic diagram using method shown in Fig. 3 printing organic thin film layer；
Fig. 6 is the structural schematic diagram of formation inorganic thin film layer on the basis of packaging film shown in Fig. 2；
Fig. 7 is the setting position view of inorganic thin film layer in Fig. 6；
Fig. 8 is a kind of packaging film of the overlapping setting of organic thin film layer and inorganic thin film layer provided by the embodiments of the present application
Schematic diagram；
Fig. 9 is the packaging film of the overlapping setting of another organic thin film layer and inorganic thin film layer provided by the embodiments of the present application
Schematic diagram；
Figure 10 is a kind of structural schematic diagram of ink jet printing device provided by the embodiments of the present application.
Appended drawing reference:
01- organic light emitting display substrate；11- underlay substrate；12- pixel defining layer；13- organic layer；100- organic packages
Layer；10- organic thin film layer；20- barricade；201- ink droplet；30- inorganic thin film layer；200- multi-layer thin film layer；300- impression block group；
40- the first child print mould group；The first print head of 401-；The first liquid storage device of 41-；50- the second child print mould group；501- second is printed
Head；The second liquid storage device of 51-；The display area A-；The height of H1- barricade；The height of H2- organic thin film layer and barricade contact surface；H3-
The sum of the height of multi-layer thin film layer and barricade contact surface in barricade.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the present invention provides a kind of film encapsulation method, for organic light emitting display substrate 01 as shown in Figure 2
It is packaged, this method includes the formation organic encapsulation layer 100 on organic light emitting display substrate 01.
Wherein, above-mentioned organic light emitting display substrate 01 includes underlay substrate 11, and formation is defined with the pixel on underlay substrate
Layer 12, and the organic layer 13 in the pixel region limited by pixel defining layer 12.Above-mentioned underlay substrate 11 is that production has
The array substrate of multiple pixel circuits of array arrangement.
Specifically, the method for forming above-mentioned organic encapsulation layer 100 includes: as shown in Figure 3
Step S101, by InkJet printing processes, barricade 20 is formed on organic light emitting display substrate 01.Wherein, such as Fig. 4
The shown ink droplet 201 for constituting barricade 20 at least surrounds the display area A of organic light emitting display substrate 01, so, above-mentioned ink
After drop solidification, barricade 20 can be made at least to surround the display area A of organic light emitting display substrate 01 as shown in Figure 5.
Step S102, as shown in figure 5, by InkJet printing processes, on organic light emitting display substrate 01, and correspondence is kept off
The region that wall 20 surrounds forms organic thin film layer 10.
Wherein, as shown in Fig. 2, the height H1 of barricade 20 is greater than the height H2 of organic thin film layer 10 and 20 contact surface of barricade.
The barricade 20 is defined the boundary of organic thin film layer 10.
It should be noted that the ink droplet that inkjet printing is formed is solidifying since barricade 20 is formed by InkJet printing processes
Rear surface is arcwall face, therefore barricade 20 is arc away from a side surface of the underlay substrate 11 of above-mentioned luminescence display substrate 01
Face.In the case, in the application the height H1 of barricade 20 be the arcwall face into the vertical range of the underlay substrate 11 most
Big value.Based on this, organic thin film layer 10 and the height H2 of 20 contact surface of barricade refer to, which connects with barricade 20
Contacting surface is to the maximum value in the vertical range of the underlay substrate 11.
In addition, above-mentioned steps S101 can be carried out in the present invention first to print barricade 20, and use curing process, such as UV
Curing process solidifies barricade 20.Next above-mentioned steps S102 is being carried out, to print organic thin film layer 10, and to organic
Film layer 10 is solidified.
Based on this, when using InkJet printing processes are respectively formed organic film layer 10 and barricade 20 twice, for constituting
The material of organic thin film layer 10 and barricade 20 may be the same or different.Typically comprise above-mentioned organic thin film layer 10 or barricade
20 material can use in organic material, such as the organic material of acrylic series, epoxy resin series or silicon substrate series
Any one.Material due to constituting organic thin film layer 10 and barricade 20 is organic material, in ink jet printing process, is used
There is certain compatibility in the ink Ink2 for forming barricade 20 and the ink Ink1 for being used to form organic thin film layer 10.
Alternatively, in order to simplify manufacture craft, it is preferred that above-mentioned steps S101 and step S102 can beat for same secondary ink-jet
Print technique, i.e. organic thin film layer 10 and barricade 20 are made up of an InkJet printing processes.
In the case, in order to enable the ink Ink2 for being used to form barricade 20 can be blocked and is used to form organic thin film layer
10 ink Ink1 constitutes 10 He of organic thin film layer so that barricade 20 can be defined the boundary of organic thin film layer 10
The material of barricade 20 needs to be set as different materials.Specifically, for example constituting the material point of organic thin film layer 10 and barricade 20
It Wei not the first organic material and the second organic material.Wherein, the ink Ink2 constituted using the second organic material is in table to be filmed
Wetting speed on face is less than wetting speed of the ink Ink1 constituted using the first organic material on surface to be filmed, Jimo
Water Ink2 is less than wetting ability of the Ink1 on surface to be filmed in the wetting ability on surface to be filmed.So, it is used for
It forms diffusion velocity of the ink Ink2 of barricade 20 on surface to be filmed and is less than the ink for being used to form organic thin film layer 10
The diffusion velocity of Ink1, so that the height H1 of the barricade 20 formed is greater than the height of organic thin film layer 10 and 20 contact surface of barricade
H2, so as to ensure that the barricade 20 can be defined the boundary of organic thin film layer 10.Wherein, above-mentioned surface to be filmed is
With the surface of ink Ink1 or ink the Ink2 substrate directly contacted, such as the packed table of above-mentioned organic light emitting display substrate 01
Surface of the underlay substrate 11 close to packaging film side in face or the organic light emitting display substrate 01.
It should be noted that due to ink viscosity and ink on surface to be filmed wetting speed be inversely proportional, so black
The viscosity of water Ink2 is greater than the viscosity of ink Ink1.Further, since contact angle and ink that ink and surface to be filmed are formed exist
Wetting speed on surface to be filmed is inversely proportional, therefore the contact angle that ink Ink2 and surface to be filmed are formed is greater than ink Ink1
The contact angle formed with surface to be filmed.
It can be seen from the above, on the one hand, since barricade 20 is formed by InkJet printing processes, can according to need adjustment
The position of print head in inkjet-printing device, is adjusted with the position to barricade 20.On the other hand, it can also control as needed
The size of the system ink droplet that printing instills every time, to achieve the purpose that control 20 wall sizes of gear.So, due in the application
Barricade 20 is kept off without being formed with the pixel defining layer 12 in organic light emitting display substrate 01 by a mask exposure technique
The size of wall 20 and position are no longer limited by the manufacture craft of pixel defining layer, and can according to need and be adjusted, thus
Improve the flexibility and the scope of application of thin film encapsulation processes.
On this basis, in order to improve the barriering effect of thin-film package, it is preferred that above-mentioned film encapsulation method further include:
As is seen in fig. 6 or fig. 7, on organic light emitting display substrate 01, the viewing area at least covering organic light emitting display substrate 01 is formed
The inorganic thin film layer 30 of domain A.
Specifically, can using low temperature PECVD (Plasma Enhanced Chemical Vapor Deposition, etc.
Gas ions enhance chemical vapour deposition technique), above-mentioned inorganic thin film layer is formed on the surface of organic encapsulation layer 100 as shown in FIG. 6
30.Or as shown in fig. 7, inorganic thin film layer 30 is formed on the surface of organic light emitting display substrate 01.Due to constituting inorganic thin film
The material of layer 30 includes the inorganic material such as silica, silicon nitride.Therefore the molecules align in the inorganic thin film layer 30 is close, energy
It is enough that extraneous steam and oxygen are effectively obstructed.
Based on this, since inorganic thin film layer 30 has the characteristic of similar shape covering (Conformal Coverage), i.e., such as Fig. 6
Shown, after the surface of organic encapsulation layer 100 is covered with inorganic thin film layer 30, which deviates from underlay substrate 11 1
The surface topography profile of side phase identical or approximate with the surface topography profile that organic encapsulation layer 100 deviates from 11 side of underlay substrate
Together.In the case, it is made due to the barricade 20 in above-mentioned organic encapsulation layer 100 of InkJet printing processes, the barricade
20 size, such as height H1 are adjustable.In the case, the boundary of organic thin film layer 10 is limited meeting barricade 20
Under conditions of fixed, it can suitably reduce the height H1 of barricade 20, so as to reduce inorganic thin film layer 30 away from underlay substrate 11
The segment difference on the surface of side reduces the harder inorganic thin film layer 30 of quality and damaged (Crack) phenomenon odds occurs.
On this basis, since inorganic thin film layer 30 has good barrier property, it is therefore preferred that working as the organic light emission
When the surface of display base plate 01 includes the multi-layer thin film layer stacked gradually, as shown in fig. 7, farthest away from the organic light emitting display substrate
01 film layer is the inorganic thin film layer 30.So that being located in packaging film, outermost inorganic thin film layer 30 being capable of conduct
The first line of defence that above-mentioned AMOLED display panel prevents steam and oxygen from invading.
In addition, directly being connect to further increase the barriering effect of steam and oxygen with the organic light emitting display substrate 01
The film layer of touching is also above-mentioned inorganic thin film layer 30.
Based on this, it is preferred that organic thin film layer 10 can be arranged in a crossed manner with inorganic thin film layer 30.So, on the one hand,
Organic thin film layer 10 between adjacent two layers inorganic thin film layer 30 can play flat effect to the film layer that it is covered,
To reduce the segment difference on surface, so that breakage is less likely to occur the inorganic thin film layer 30 of covering thereon.On the other hand, this is organic thin
Characteristic of the film layer 10 also with particle (Particle) package, avoids above-mentioned particle from impacting OLED device.Another aspect,
The organic thin film layer 10 can also extend the water oxygen between adjacent two layers inorganic thin film layer 30 and corrode path.Specifically, adjacent
In the case that two layers of inorganic thin film layer 30 is cracked, steam or oxygen need to initially pass through the inorganic of first layer inorganic thin film layer 30
Next crack can enter the inorganic crack of second layer inorganic thin film layer 30 then into organic thin film layer 10,
Extended so that the water oxygen of adjacent two layers inorganic thin film layer 30 corrodes path.In another aspect, the organic thin film layer 10
Quality it is relatively soft, therefore the stress in the inorganic thin film layer 30 being in contact with the organic thin film layer 10 can be made to be released
It puts, is conducive to the designer trends of flexible display apparatus.
In conclusion in the case where the surface of organic light emitting display substrate 01 is provided with the N layer film layer stacked gradually,
Preferably, N layer film layer includes organic thin film layer 10 and inorganic thin film layer 30 arranged in a crossed manner, and the inorganic thin film layer 30 is located at
Odd-level；Wherein, N >=3, N are odd number.For example, above-mentioned N can be 3,5 or 7, which is not limited by the present invention.In this situation
Under, by taking N is 7 as an example, i.e., when the surface of organic light emitting display substrate 01 is provided with the seven layer film layer stacked gradually, preferably
, first and third, five, seven layer film layers are above-mentioned inorganic thin film layer 30.
Based on this, beaten when passing through an ink-jet on the organic light emitting display substrate 01 for being formed with above-mentioned inorganic thin film layer 30
When print technique prepares above-mentioned organic thin film layer 10 and barricade 20, it is used to form the ink Ink1 of organic thin film layer 10 and for shape
It can directly be contacted with inorganic thin film layer 30 at the ink Ink2 of barricade 20.In the case, above-mentioned for carrying the organic film
The surface to be filmed of layer 10 and barricade 20 is the surface that the inorganic thin film layer 30 deviates from above-mentioned 01 side of organic light emitting display substrate.
Further, in order to improve barriering effect, the area coverage of preferred inorganic thin film layer 30 is greater than above-mentioned organic thin
The area coverage of film layer 10 or organic encapsulation layer 100.
Multiple organic thin film layers 10 arranged in a crossed manner and inorganic are formed on the surface of organic light emitting display substrate 01 below
The method of film layer 30 carries out detailed illustration.
Specifically, for example, being repeatedly alternately repeated to form above-mentioned organic encapsulation layer 100 and above-mentioned inorganic thin film as shown in Figure 8
The step of layer 30, so that inorganic thin film layer 30 is arranged alternately with organic encapsulation layer 100.
Alternatively, in another example, as shown in figure 9, on the organic light emitting display substrate 01 for being formed with organic encapsulation layer 100, it is more
It is secondary to be alternately repeated the step of forming organic thin film layer 10 and inorganic thin film layer 30, so that inorganic thin film layer 30 and organic thin film layer
10 are arranged alternately.
Wherein, when using production method as shown in Figure 9, due in the organic light emission for being formed with organic encapsulation layer 100
When making multi-layer thin film layer 200 on display base plate 01, without making barricade 20, therefore in order to guarantee the organic encapsulation layer 100
In barricade 20 boundary for the multi-layer thin film layer 200 being subsequently formed can be defined, the height H1 of the barricade 20 needs big
In what is stacked gradually, and the sum of height of multi-layer thin film layer 200 and 20 contact surface of barricade being located in barricade 20 H3.
It should be noted that the sum of multi-layer thin film layer 200 and the height of 20 contact surface of barricade H3 refer to the multi-layer thin film layer
200 with 20 contact surface of barricade to the maximum value in the vertical range of the underlay substrate 11.
The embodiment of the present invention provides a kind of packaging film, is made of any one film encapsulation method as described above.
With beneficial effect identical with the film encapsulation method that previous embodiment provides, details are not described herein again.
The embodiment of the present invention provides a kind of inkjet printing used in any one film encapsulation method as described above
Equipment, as shown in Figure 10, the ink jet printing device include the first child print mould group 40 for printing organic thin film layer 10 and
The first liquid storage device 41 being connected with the first child print mould group 40.
In addition, the ink jet printing device further include the second child print mould group 50 for printing barricade 20 and with the second son
The second liquid storage device 51 that impression block group 50 is connected.
Wherein, above-mentioned first child print mould group 40 and the second child print mould group 50 constitute beating for above-mentioned ink jet printing device
Stamp group 300.The ink jet printing device has beneficial effect identical with the film encapsulation method that previous embodiment provides, herein
It repeats no more.In addition, the ink jet printing device can pass through two sets of independent child print mould groups (Sub Print Module) point
It is other that inkjet printing is carried out to organic thin film layer 10 and barricade 20, therefore the organic thin film layer 10 and barricade 20 can be by once spraying
Black printing technology is made, so as to simplify manufacture craft.
Based on this, in order to enable the ink Ink2 for being used to form barricade 20 can be blocked and is used to form organic thin film layer 10
Ink Ink1 is defined with the boundary to organic thin film layer 10, and the material needs for constituting organic thin film layer 10 and barricade 20 are set
It is set to different materials, therefore the first child print mould group 40 and the second child print mould group 50 are respectively provided with feed flow dress independent
It sets.Specific same as above, the material for constituting organic thin film layer 10 and barricade 20 is respectively that the first organic material and second are organic
Material.Wherein contained in the first liquid storage device 41 using the ink Ink1 that the first organic material is constituted, what the second organic material was constituted
Ink Ink2 is contained in the second liquid storage device 51.
On this basis, above-mentioned first child print mould group 40 may include 1~5 the first print head 401.Second child print
Mould group 50 includes 1~2 the second print head 501.Any one print head in first print head 401 and the second print head 501
On be provided with multiple nozzles, for being printed the ink in liquid storage device according to operational order to predeterminated position.
In the case, for the display panel of advanced lines line, the quantity of the print head of use is more, such as first
Child print mould group 40 can have 4 or 5 the first print heads 401, and the second child print mould group 50 can have 2 second printings
First 501.So, it can be avoided in print procedure, due to the spray nozzle clogging on portion printhead, and lead to film forming thickness not
?.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (8)
1. a kind of film encapsulation method, for being packaged to organic light emitting display substrate, which is characterized in that the method includes
Organic encapsulation layer is formed on the organic light emitting display substrate:
By InkJet printing processes, form barricade on the organic light emitting display substrate, the barricade at least surround described in have
The display area of machine luminescence display substrate；
By InkJet printing processes, on the organic light emitting display substrate, and correspondence is formed by the region that the barricade surrounds
Organic thin film layer；
Wherein, the height of the barricade is greater than the height of the organic thin film layer and the barricade contact surface, and the barricade is to institute
The boundary for stating organic thin film layer is defined；
The height of the organic thin film layer and the barricade contact surface is that the contact surface of the organic thin film layer and the barricade arrives
Maximum value in the vertical range of underlay substrate；
The barricade and the organic thin film layer are made up of an InkJet printing processes；
The material for constituting the organic thin film layer and the barricade is respectively the first organic material and the second organic material；
Wherein, it is less than using wetting speed of the ink on surface to be filmed that second organic material is constituted using described the
Wetting speed of the ink that one organic material is constituted on the surface to be filmed.
2. film encapsulation method according to claim 1, which is characterized in that the method also includes:
On the organic light emitting display substrate, the inorganic of the display area at least covering the organic light emitting display substrate is formed
Film layer.
3. film encapsulation method according to claim 2, which is characterized in that
Repeatedly it is alternately repeated the step of forming the organic encapsulation layer and the inorganic thin film layer；
Alternatively, on the organic light emitting display substrate for being formed with the organic encapsulation layer, be repeatedly alternately repeated to be formed it is described organic
The step of film layer and the inorganic thin film layer；
Wherein, the height of the barricade is greater than and stacks gradually, and the multi-layer thin film layer being located in the barricade and the barricade
The sum of height of contact surface；
The sum of the multi-layer thin film layer and the height of the barricade contact surface are the multi-layer thin film layer and the barricade contact surface
To the maximum value in the vertical range of underlay substrate.
4. film encapsulation method according to claim 2, which is characterized in that when the surface of the organic light emitting display substrate
It is provided with the N layer film layer stacked gradually, and the N layer film layer includes the organic thin film layer and the inorganic thin film layer
When, the inorganic thin film layer is located at odd-level；Wherein, N >=3, N are odd number.
5. film encapsulation method according to claim 3, which is characterized in that when the surface of the organic light emitting display substrate
It is provided with the N layer film layer stacked gradually, and the N layer film layer includes the organic thin film layer and the inorganic thin film layer
When, the inorganic thin film layer is located at odd-level；Wherein, N >=3, N are odd number.
6. film encapsulation method according to claim 5, which is characterized in that have in the multi-layer thin film layer farthest away from described
The film layer of machine luminescence display substrate is the inorganic thin film layer.
7. film encapsulation method according to claim 2 or 3, which is characterized in that the area coverage of the inorganic thin film layer
Greater than the area coverage of the organic thin film layer or the organic encapsulation layer.
8. a kind of packaging film, which is characterized in that be made of such as the described in any item film encapsulation methods of claim 1-7.
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| US10340475B2 (en) | 2017-08-28 | 2019-07-02 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | OLED panel fabrication method and OLED panel |
| CN109904336B (en) | 2017-12-07 | 2020-06-30 | 京东方科技集团股份有限公司 | Electronic device substrate and manufacturing method/display device |
| CN108198837A (en) * | 2017-12-26 | 2018-06-22 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
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| CN108598286B (en) * | 2018-07-03 | 2020-10-13 | 武汉华星光电半导体显示技术有限公司 | OLED display panel and packaging method |
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