CN106893515A - 导电胶带 - Google Patents
导电胶带 Download PDFInfo
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- CN106893515A CN106893515A CN201710212142.8A CN201710212142A CN106893515A CN 106893515 A CN106893515 A CN 106893515A CN 201710212142 A CN201710212142 A CN 201710212142A CN 106893515 A CN106893515 A CN 106893515A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
本发明公开了一种导电胶带,从上至下依次设有遮光层、导电层、基层、保护层,所述遮光层为黑色PET膜层,所述导电层为铜镀银导电橡胶,并且在所述铜镀银导电橡胶上表面设有导电油墨层,所述导电层的上下表面设有凸起,所述遮光层和基层设有与所述凸起相配合的凹槽。本发明通过黑色PET膜层遮光,防止胶带由于光的照射而发生老化;导电层为铜镀银导电橡胶,并且在铜镀银导电橡胶上表面设有导电油墨层,增强导电效果;导电层的上下表面设有凸起,遮光层和基层设有与所述凸起相配合的凹槽,使导电层、遮光层和基层之间粘贴的更牢固。
Description
技术领域
本发明涉及一种胶带,特别是涉及一种导电胶带。
背景技术
导电胶带是以基体树脂和导电填料即导电粒子为主要组成成分,通过基体
树脂的粘接作用把导电粒子结合在一起,形成导电通路,实现被粘材料的导电连接。由于导电胶的基体树脂是一种胶黏剂,可以选择适宜的固化温度进行粘接,同时,由于电子元件的小型化、微型化及印刷电路板的高密度化和高度集成化的迅速发展,而导电胶可以制成浆料,实现很高的线分辨率。而且导电胶工艺简单,易于操作,可提高生产效率,所以导电胶是替代铅锡焊接,实现导电连接的理想选择,但是胶带容易老化,使用起来也不安全,适用范围较窄,边角处难粘,不牢固。
发明内容
本发明所要解决的技术问题是克服现有技术的缺陷,提供一种导电胶带,粘贴牢固,不易老化,使用寿命长。
为解决上述技术问题,本发明提供一种导电胶带,其特征是,从上至下依次设有遮光层、导电层、基层、保护层,所述遮光层为黑色PET膜层,所述导电层为铜镀银导电橡胶,并且在所述铜镀银导电橡胶上表面设有导电油墨层,所述导电层的上下表面设有凸起,所述遮光层和基层设有与所述凸起相配合的凹槽。
前述的导电胶带,其特征是,所述的遮光层、导电层、基层、保护层之间通过粘接层相粘接。
前述的导电胶带,其特征是,所述的粘接层为聚酯胶粘剂层。
前述的导电胶带,其特征是,所述的基层为PVC薄膜。
前述的导电胶带,其特征是,所述的保护层为离型膜。
前述的导电胶带,其特征是,所述遮光层的厚度为15~20um。
前述的导电胶带,其特征是,所述导电层的厚度为20~30um。
前述的导电胶带,其特征是,所述基层的厚度为10~20um。
本发明所达到的有益效果:通过黑色PET膜层遮光,防止胶带由于光的照射而发生老化;导电层为铜镀银导电橡胶,并且在铜镀银导电橡胶上表面设有导电油墨层,增强导电效果;导电层的上下表面设有凸起,遮光层和基层设有与所述凸起相配合的凹槽,使导电层、遮光层和基层之间粘贴的更牢固。
附图说明
图1是本发明的结构示意图。
具体实施方式
下面结合附图对本发明作进一步描述。以下实施例仅用于更加清楚地说明本发明的技术方案,而不能以此来限制本发明的保护范围。
如图1所示,一种导电胶带,从上至下依次设有遮光层1、导电层2、基层3、保护层4,所述导电层2的厚度为20~30um,所述导电层2为铜镀银导电橡胶,并且在所述铜镀银导电橡胶上表面设有导电油墨层,增强导电效果。
为了使导电层2、遮光层1和基层2之间粘贴的更牢固,所述导电层2的上下表面设有凸起5,所述遮光层1和基层2设有与所述凸起5相配合的凹槽。
所述的遮光层1、导电层2、基层3、保护层4之间通过粘接层相粘接,所述的粘接层为聚酯胶粘剂层。
防止胶带由于光的照射而发生老化,所述遮光层1为黑色PET膜层,所述遮光层1的厚度为15~20um。
所述的基层3为PVC薄膜,所述基层3的厚度为10~20um,轻薄耐用。
所述的保护层4为离型膜,便于与胶带分离。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明技术原理的前提下,还可以做出若干改进和变形,这些改进和变形也应视为本发明的保护范围。
Claims (8)
1.导电胶带,其特征是,从上至下依次设有遮光层、导电层、基层、保护层,所述遮光层为黑色PET膜层,所述导电层为铜镀银导电橡胶,并且在所述铜镀银导电橡胶上表面设有导电油墨层,所述导电层的上下表面设有凸起,所述遮光层和基层设有与所述凸起相配合的凹槽。
2.根据权利要求1所述的导电胶带,其特征是,所述的遮光层、导电层、基层、保护层之间通过粘接层相粘接。
3.根据权利要求2所述的导电胶带,其特征是,所述的粘接层为聚酯胶粘剂层。
4.根据权利要求1所述的导电胶带,其特征是,所述的基层为PVC薄膜。
5.根据权利要求1所述的导电胶带,其特征是,所述的保护层为离型膜。
6.根据权利要求1所述的导电胶带,其特征是,所述遮光层的厚度为15~20um。
7.根据权利要求1所述的导电胶带,其特征是,所述导电层的厚度为20~30um。
8.根据权利要求1所述的导电胶带,其特征是,所述基层的厚度为10~20um。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101654601A (zh) * | 2009-09-03 | 2010-02-24 | 友达光电股份有限公司 | 一种用于背光模块的胶带及其制造方法 |
CN103031081A (zh) * | 2013-01-22 | 2013-04-10 | 昆山汉品电子有限公司 | 一种遮光热扩散膜 |
CN104194664A (zh) * | 2014-08-22 | 2014-12-10 | 桐城信邦电子有限公司 | 一种导电胶带 |
CN204918466U (zh) * | 2015-08-26 | 2015-12-30 | 东莞市粤辉实业有限公司 | 导电胶带 |
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2017
- 2017-04-01 CN CN201710212142.8A patent/CN106893515A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101654601A (zh) * | 2009-09-03 | 2010-02-24 | 友达光电股份有限公司 | 一种用于背光模块的胶带及其制造方法 |
CN103031081A (zh) * | 2013-01-22 | 2013-04-10 | 昆山汉品电子有限公司 | 一种遮光热扩散膜 |
CN104194664A (zh) * | 2014-08-22 | 2014-12-10 | 桐城信邦电子有限公司 | 一种导电胶带 |
CN204918466U (zh) * | 2015-08-26 | 2015-12-30 | 东莞市粤辉实业有限公司 | 导电胶带 |
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