CN106879169A - A kind of printed circuit board - Google Patents
A kind of printed circuit board Download PDFInfo
- Publication number
- CN106879169A CN106879169A CN201710284411.1A CN201710284411A CN106879169A CN 106879169 A CN106879169 A CN 106879169A CN 201710284411 A CN201710284411 A CN 201710284411A CN 106879169 A CN106879169 A CN 106879169A
- Authority
- CN
- China
- Prior art keywords
- base plate
- aluminum base
- layer
- layers
- copper core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of printed circuit board, it is characterised in that：Including one layer of aluminum base plate, two layers of aluminum base plate, heat conduction copper core；One layer of aluminum base plate is mutually superimposed with two layers of aluminum base plate, and is provided with channel part between shown one layer of aluminum base plate and two layers of aluminum base plate；The copper core is affixed with one layer of aluminum base plate, and through hole is provided with two layers of aluminum base plate, and the copper core is through the through hole and exposes two layers of aluminum base plate, and the copper core is fitted with two layers of aluminum base plate.The present invention has the advantages that perfect heat-dissipating.
Description
Technical field
The present invention relates to printed circuit board construction applications, and in particular to a kind of printed circuit board.
Background technology
Aluminum base PCB is mainly used on the circuit products of big heat power consuming devices, its main purpose be in order to radiate, but
Actually radiating and heat conduction are not just the same, because the surface of aluminium base is bound to be enclosed insulating barrier, and power consuming devices
What real Copper Foil on the insulating layer was welded, so power consuming devices its heat when heating must be carried out by insulating barrier
Transmission is got on aluminium base, and insulating barrier is not in itself outstanding heat-conducting, can not which results in aluminum base PCB
Performance due ability in itself.
The content of the invention
It is an object of the invention to provide a kind of printed circuit board, the present invention is by setting heat conduction copper core by the heat of power dissipating chip
Amount is derived, then is radiated by aluminum base plate, and its radiating efficiency is high, and effect is good.
Above-mentioned technical purpose of the invention technical scheme is that：A kind of printed circuit board, it is special
Levy and be：Including one layer of aluminum base plate, two layers of aluminum base plate, heat conduction copper core；
One layer of aluminum base plate is mutually superimposed with two layers of aluminum base plate, and shown one layer of aluminum base plate and two layers of aluminium
Channel part is provided between substrate processed；
The copper core is affixed with one layer of aluminum base plate, and through hole is provided with two layers of aluminum base plate, and the copper core is passed through
The through hole simultaneously exposes two layers of aluminum base plate, and the copper core is fitted with two layers of aluminum base plate.
As it is of the invention preferably, described heat conduction copper core is fixed in one layer of aluminum base plate table by welding manner
Face, junction forms weld layer, and the weld layer is mainly made up of M51 alloys.
Include being used for and one layer of aluminum base plate and two layers of aluminum base plate as of the invention preferred, described heat conduction copper core
The pile body of connection and the heat carrier for power consuming devices of fitting, the heat carrier are arranged on the top of the pile body, described to lead
The upper end face of hot body is plane.
Include ring shaped slot and linear groove, the ring shaped slot and the line as of the invention preferred, described channel part
Type groove UNICOM, described heat conduction copper core is located at the annular groove center with the junction of one layer of aluminum base plate.
As it is of the invention preferably, the linear groove extends to the edge of one layer of aluminum base plate and by the ring shaped slot
With outside air UNICOM.
As it is of the invention preferably, two layers of aluminum base plate and the heat conduction copper core interference fit.
As of the invention preferred, pad and wire are provided with two layers of described aluminum base plate, around the through hole
At least provided with two pads.
As it is of the invention preferably, the ring shaped slot be connected with the heat conduction copper core one layer of aluminum base plate region it
Between be provided with heat transfer part.
As it is of the invention preferably, the surface area of the heat transfer part is connected one layer of aluminum base plate with the heat conduction copper core
The ratio of surface area in region be at least 1:1.
In sum, the present invention has the advantages that：
The present invention has the advantages that perfect heat-dissipating.
Brief description of the drawings
Fig. 1 is embodiment of the present invention structural representation；
Fig. 2 is embodiment of the present invention configuration schematic diagram；
Fig. 3 is the structural representation of embodiment of the present invention channel part；
In figure：
Mono- layer of aluminum base plate of 1-；Bis- layers of aluminum base plates of 2-；3- heat conduction copper cores；4- channel parts；5- through holes；6- weld layers；301-
Body；302- heat carriers；401- ring shaped slots；402- linear grooves；7- pads；8- wires；9- heat transfer parts.
Specific embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
As shown in Figure 1 and Figure 2, the embodiment of the present invention includes one layer of aluminum base plate 1, two layers of aluminum base plate 2, heat conduction copper core 3；
One layer of aluminum base plate 1 is arranged on two layers of lower section of aluminum base plate 2, and the two is affixed, and affixed face is smooth to be easy to heat transfer, two layers of base
Plate surface attaches insulating barrier, and docile Copper Foil is used to form circuit on insulating barrier.
One layer of aluminum base plate 1 is mutually superimposed with two layers of aluminum base plate 2, and shown one layer of aluminum base plate 1 and two layers of aluminum base
It is provided between plate 2 for by channel part 4 derived from internal heat；Due to the heat internal of the substrate during radiating in itself
Can not be concentrated on inside substrate which results in heat quickly from surface radiating, after heat saturation inside substrate, aluminium base
Also the function of its radiating is just lost, so needing to set the heat derives inside channel part substrate in 4 future, the present embodiment is used
One layer of aluminum base plate, 1, two layers of aluminum base plate 2 are thin by abundant substrate side itself so that heat is not easy to concentrate on inside, while
The actual area of dissipation of substrate is increased using channel part 4, simultaneously because the setting of channel part 4 causes that internal heat also can quilt
Derive.Channel part 4 is beginning in one layer of sagging cell body of aluminum base plate 1
Copper core is affixed with one layer of aluminum base plate 1, is provided with through hole 5 on two layers of aluminum base plate 2, and copper core is through through hole 5 and exposes two
Layer aluminum base plate 2, and copper core fits with two layers of aluminum base plate 2.Two layers of aluminum base plate 2 and the interference fit of heat conduction copper core 3.Aluminium base
PCB is mainly used on the circuit products of big heat power consuming devices, its main purpose be in order to radiate, but actually radiate
Not just the same with heat conduction, because the surface of aluminium base is bound to be enclosed insulating barrier, and power consuming devices are real on the insulating layer
Copper Foil welded, so power consuming devices its heat when heating must carry out transmission and get to by insulating barrier
On aluminium base, and insulating barrier is not in itself outstanding heat-conducting, and can not play itself which results in aluminum base PCB should have
Ability, and in the present embodiment, the heat of power consuming devices directly can be derived quickly simultaneously by heat conductivility higher than the heat conduction copper core 3 of aluminium
On conduction to one layer of aluminum base plate 1 and two layers of aluminum base plate 2, then carried out by one layer of aluminum base plate 1 and two layers of aluminum base plate 2
Radiating, while coordinate channel part 4 further to lift heat dispersion, the present embodiment its 1 hour reality when the LED chip of 1W is surveyed
Survey LED chip heat and be less than 45 °, and common aluminium base is above 55 °, for LED, temperature can major injury more than 60 °
Its actual light efficiency, so the present embodiment applies to LED illumination industry with very significant effect.
Heat conduction copper core 3 is fixed in one layer of surface of aluminum base plate 1 by welding manner, and junction forms weld layer 6, weld layer
6 are mainly made up of M51 alloys.
Heat conduction copper core 3 includes the pile body 301 and use for be connected with one layer of aluminum base plate 1 and two layers of aluminum base plate 2
In the heat carrier 302 of laminating power consuming devices, heat carrier 302 is arranged on the top of pile body 301, and the upper end face of heat carrier 302 is
Plane.
As shown in figure 3, the channel part 4 of the embodiment of the present invention include ring shaped slot 401 and linear groove 402, ring shaped slot 401 with
The UNICOM of linear groove 402, heat conduction copper core 3 and one layer of junction of aluminum base plate 1 are located at annular groove center.Linear groove 402 is prolonged
Extend one layer of edge of aluminum base plate 1 and by ring shaped slot 401 and outside air UNICOM.Ring shaped slot 401 is connected one with heat conduction copper core 3
Heat transfer part 9 is provided between the region of layer aluminum base plate 1.The setting of heat transfer part 9 is very necessary, if lacking heat transfer part 9, just makes
Obtain heat to be directly entered in annular groove after one layer of aluminum base plate 1 is imported into from heat conduction copper core 3, its radiating effect is bad on the contrary,
And the setting of heat transfer part 9 can be stored to provide a certain degree of heat around junction so that the region will not be due to structure
Weak and cause storage capacity too small, covert improves radiating effect.The surface area of heat transfer part 9 is connected one with heat conduction copper core 3
The ratio of the surface area in the region of layer aluminum base plate 1 is at least 1:1.
The pad 7 and wire 8 for bonding power device are provided with two layers of aluminum base plate 2, are at least set around through hole 5
Two pads 7 are equipped with, through hole 5 is, for fixing heat conduction copper core 3, two pads 7 at least to be set around him and is gone power consumption
Device is fixed so that the heating part 9 of power consuming devices can be close to heat conduction copper core 3.
This specific embodiment is only explanation of the invention, and it is not limitation of the present invention, people in the art
Member can make the modification without creative contribution to the present embodiment as needed after this specification is read, but as long as at this
All protected by Patent Law in the right of invention.
Claims (9)
1. a kind of printed circuit board, it is characterised in that：Including one layer of aluminum base plate（1）, two layers of aluminum base plate（2）, heat conduction copper core
（3）；
One layer of aluminum base plate（1）With two layers of aluminum base plate（2）It is mutually superimposed, and shown one layer of aluminum base plate（1）With
Two layers of aluminum base plate（2）Between be provided with channel part（4）；
The copper core and one layer of aluminum base plate（1）It is affixed, two layers of aluminum base plate（2）On be provided with through hole（5）, it is described
Copper core passes through the through hole（5）And expose two layers of aluminum base plate（2）, and the copper core and two layers of aluminum base plate（2）
Laminating.
2. a kind of printed circuit board according to claim 1, it is characterised in that：Described heat conduction copper core（3）By welding
Mode is fixed in one layer of aluminum base plate（1）Surface, junction forms weld layer（6）, the weld layer（6）Mainly by M51
Alloy is constituted.
3. a kind of printed circuit board according to claim 1, it is characterised in that：Described heat conduction copper core（3）Including being used for
With one layer of aluminum base plate（1）And two layers of aluminum base plate（2）The pile body of connection（301）And for the heat conduction of power consuming devices of fitting
Body（302）, the heat carrier（302）It is arranged on the pile body（301）Top, the heat carrier（302）Upper end face be
Plane.
4. a kind of printed circuit board according to claim 1, it is characterised in that：Described channel part（4）Including ring shaped slot
（401）And linear groove（402）, the ring shaped slot（401）With the linear groove（402）UNICOM, described heat conduction copper core（3）With
One layer of aluminum base plate（1）Junction be located at the annular groove center.
5. a kind of printed circuit board according to claim 4, it is characterised in that：The linear groove（402）Extend to described
One layer of aluminum base plate（1）Edge and by the ring shaped slot（401）With outside air UNICOM.
6. a kind of printed circuit board according to claim 1, it is characterised in that：Two layers of aluminum base plate（2）With it is described
Heat conduction copper core（3）Interference fit.
7. a kind of printed circuit board according to claim 1, it is characterised in that：Two layers of described aluminum base plate（2）On set
It is equipped with pad（7）And wire（8）, the through hole（5）Surrounding is at least provided with two pads（7）.
8. a kind of printed circuit board according to claim 4, it is characterised in that：The ring shaped slot（401）With the heat conduction
Copper core（3）Connect one layer of aluminum base plate（1）Region between be provided with heat transfer part（9）.
9. a kind of printed circuit board according to claim 8, it is characterised in that：The heat transfer part（9）Surface area and institute
State heat conduction copper core（3）Connect one layer of aluminum base plate（1）The ratio of surface area in region be at least 1:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710284411.1A CN106879169A (en) | 2017-04-25 | 2017-04-25 | A kind of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710284411.1A CN106879169A (en) | 2017-04-25 | 2017-04-25 | A kind of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106879169A true CN106879169A (en) | 2017-06-20 |
Family
ID=59161531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710284411.1A Pending CN106879169A (en) | 2017-04-25 | 2017-04-25 | A kind of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106879169A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN111954370A (en) * | 2020-08-24 | 2020-11-17 | 浙江集迈科微电子有限公司 | PCB board miniflow channel heat dissipation embedding structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201916764U (en) * | 2011-01-06 | 2011-08-03 | 黄柱联 | LED illuminating device |
| CN102721025A (en) * | 2012-07-03 | 2012-10-10 | 陈建伟 | Power type LED (light-emitting diode) radiator |
| JP2015198106A (en) * | 2014-03-31 | 2015-11-09 | 住友ベークライト株式会社 | Metal base circuit board and electronic device |
-
2017
- 2017-04-25 CN CN201710284411.1A patent/CN106879169A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201916764U (en) * | 2011-01-06 | 2011-08-03 | 黄柱联 | LED illuminating device |
| CN102721025A (en) * | 2012-07-03 | 2012-10-10 | 陈建伟 | Power type LED (light-emitting diode) radiator |
| JP2015198106A (en) * | 2014-03-31 | 2015-11-09 | 住友ベークライト株式会社 | Metal base circuit board and electronic device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN111954370A (en) * | 2020-08-24 | 2020-11-17 | 浙江集迈科微电子有限公司 | PCB board miniflow channel heat dissipation embedding structure |
| CN111954370B (en) * | 2020-08-24 | 2021-08-10 | 浙江集迈科微电子有限公司 | PCB board miniflow channel heat dissipation embedding structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170620 |