CN106851994A - A kind of preparation method of high heat-conducting ceramic printed circuit board - Google Patents
A kind of preparation method of high heat-conducting ceramic printed circuit board Download PDFInfo
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- CN106851994A CN106851994A CN201710226193.6A CN201710226193A CN106851994A CN 106851994 A CN106851994 A CN 106851994A CN 201710226193 A CN201710226193 A CN 201710226193A CN 106851994 A CN106851994 A CN 106851994A
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- ceramic substrate
- ceramic
- circuit board
- copper
- printed circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of preparation method of high heat-conducting ceramic printed circuit board, its step is：Sawing sheet → drilling → hole metallization → whole plate plating increasing copper → pattern transfer → graphic plating → move back film, etch, move back tin → anti-welding and surface treatment → CNC shapings.This case is especially suitable for making ceramic base circuit board, and overall work flow is very detailed, by repeatedly plating, changes gold treatment, can produce that aesthetics is high, the measured circuit board of matter.
Description
Technical field
The invention belongs to printed-board technology field, and in particular to a kind of making side of high heat-conducting ceramic printed circuit board
Method.
Background technology
Circuit board due to making the difference of material and manufacturing technology, with many different titles, such as pcb board, aluminium base,
Copper-clad plate, impedance plate, ultrathin circuit board, printed circuit board (PCB) etc..Circuit board can cause circuit miniaturization, directly perceivedization, for solid
The batch production and optimization appliance circuit layout for determining circuit play an important roll.
Circuit board is mainly supported the use with the electronic component such as central processing unit in electronic equipment, and these electronic components are in work
Many heats can be produced during work, these heats are too high or radiate not in time, are easily damaged electronic component, and this requires circuit
Plate has thermal conductivity and heat-sinking capability higher.In the prior art, the material of good heat conductivity is typically with to make electricity
Road plate, then sets louvre to improve heat-sinking capability on circuit boards.
Ceramic base printed circuit board has that high temperature resistant, high pressure resistant, thermal conductivity are good, thermal cycle is good, air-tightness is good, high frequency is situated between
Damage small, mechanical stress it is strong, the advantages of intensity is high, anti-corrosion capability is strong, adhesion is strong, its be mainly used in high density power supply product,
In the end communication products high such as HF link control product.Existing ceramic base printed circuit board production technology is that disposable gong goes out into
Molded dimension, this processing technology can cause the percent defective that the size of circuit board occurs after deviation, and production higher.Therefore how to carry
The yield rate and production efficiency of ceramic base printed circuit board high turn into the problem of urgent need to resolve.
201410176918.1 disclose a kind of high-frequency microwave printed circuit plate, and method and step is as follows：The drilling of sawing sheet one one
One line pattern of heavy one electric plating of whole board of copper one etches one and goes the anti-welding numerical control V of a word one of a black graphic plating one to cut.This kind is processed
Technique is not suitable for the production of ceramic base printed circuit board, and the percent defective of ceramic base printed circuit board can be caused to increase.
201210115314.7 disclose a kind of making method of nobaking photosensitive soldermask circuit board, and it includes following step
Suddenly：Step one, carries out engineering, light and paints data make；Step 2, sawing sheet, the making of drilling；Step 3, the making of surfacial pattern；
Step 4, to plating, the making of etching；Step 5, exempts from baking photosensitive solder resist and makes and the treatment of surface solderability；Step 6, into
Type makes.This kind of processing technology is also not suitable for the production of ceramic base printed circuit board, and it does not carry out many to ceramic base circuit board
Secondary plating increases copper, and work flow is relatively simple coarse, and the product quality for being processed is relatively low, and aesthetics is relatively low.
The content of the invention
The present invention proposes a kind of preparation method of high heat-conducting ceramic printed circuit board, is especially suitable for making ceramic base circuit
Plate, overall work flow is very detailed, by repeatedly plating, changes gold treatment, can produce that aesthetics is high, the measured electricity of matter
Road plate.
The technical proposal of the invention is realized in this way：
A kind of preparation method of high heat-conducting ceramic printed circuit board, it is characterised in that comprise the following steps：
（1）Sawing sheet：Take raw material to be placed on sawing sheet banding machine, the size required by list is indicated according to production, cut out thickness
It is the ceramic base copper-clad plate of 0.6mm, carrying out wrapper sheet further according to thickness of slab forms compoboard；
（2）Drilling：Some pin holes are first got on the short side position of combinations thereof plate with pin machine, then pin hole will be got
Compoboard afterwards is fixed on the workbench of numerically controlled drill, the speed of mainshaft and roll setting speed of rig is set, to combinations thereof
Plate is drilled, and after compoboard is drilled hole, compoboard is removed from the workbench of numerically controlled drill, is reused and is moved back pin machine by combination
Pin on plate is exited, and obtains being drilled the ceramic substrate behind hole, reuses the burr that sand paper is processed on above-mentioned ceramic base plate surface
With batch cutting edge of a knife or a sword, the hole bored on the above-mentioned ceramic substrate of machine check of verifying is reused；
（3）Hole metallization：Above-mentioned ceramic substrate is carried out into high-pressure washing, it is water washed after the vertical bay of ceramic substrate, then successively
Carry out removing glue, neutralization, heavy Copper treatment so that adhere to one layer of thin copper on ceramic base plate surface and hole wall；
（4）Whole plate plating increases copper：Above-mentioned ceramic substrate is electroplated, is increased hole copper, the thickness of face copper, then by the pottery after plating
Porcelain substrate is cleaned, dried, checked successively；
（5）Pattern transfer：First carry out polish-brush treatment to the surface of above-mentioned ceramic substrate, then toward pasting last layer on ceramic base plate surface
Dry film, is then positioned by CCD holes, and graph exposure is carried out using semi-automatic exposure machine, and it is 1.0% ~ 1.2% to reuse concentration
Na2CO3Solution develops to the ceramic substrate after exposure, then is overhauled；
（6）Graphic plating：Ceramic substrate after above-mentioned development is put into plating cylinder, copper, tin are electrolysed onto ceramic substrate, and
Cause that the thickness of the copper on ceramic substrate, tin thickness reach requirement；
（7）Film is moved back, etched, moved back tin：The dry film on ceramic base plate surface is removed using the liquid medicine of strong basicity, uses strong oxidizing property
Liquid medicine will move back after film process that unwanted part copper is etched removal in ceramic base plate surface figure, the medicine for using band acid
Water removes the anti-etching tin layers on above-mentioned ceramic base plate surface figure, will move back the ceramic substrate after tin and is dried, checked；
（8）Anti-welding and surface treatment：Slight polish-brush is carried out to above-mentioned ceramic base plate surface using scrubber to process, then will mill
Ceramic substrate after brush carries out anti-solder ink printing, carries out that low temperature is pre-baked after being completed for printing, and the CCD location holes further according to edges of boards enter
Hot setting treatment is carried out in row positioning, exposure, development, maintenance, then the ceramic substrate feeding tunnel oven that will have been overhauled, is dried
Ceramic substrate after roasting carries out the gold treatment that comes to the surface, after the completion of dried and checked；
（9）CNC is molded：Shaping making is carried out to ceramic substrate using CNC milling machine, after the completion of using finished product cleaning agent to ceramics
Substrate carries out high-pressure wash, is dried after cleaning, checked, obtains finished product high heat-conducting ceramic printed circuit board.
In the preparation method of high heat-conducting ceramic printed circuit board of the invention, step（2）Described in numerically controlled drill adopt
Tungsten carbide two-point bit is used, and described bit bore quantity is less than 400.
In the preparation method of high heat-conducting ceramic printed circuit board of the invention, step（2）Described in sand paper model
1500 mesh.
In the preparation method of high heat-conducting ceramic printed circuit board of the invention, step（9）Described in CNC milling machine adopt
Use Double-edged milling cutter.
The preparation method for implementing this high heat-conducting ceramic printed circuit board of the invention, has the advantages that：This case
It is especially suitable for making ceramic base circuit board, overall work flow is very detailed, is produced using semi-automation, greatly improves
The production efficiency of product, by repeatedly plating, changes gold treatment so that the copper circuit on circuit board is very firm, greatly carries
The high reliability and aesthetics of product, the circuit board performance stabilization produced by this programme, long service life.
Brief description of the drawings
Fig. 1 is the schematic block diagram of the preparation method of this high heat-conducting ceramic printed circuit board of the invention.
Specific embodiment
In order that technological means, creation characteristic, reached purpose and effect that the present invention is realized are easy to understand, below will
Technical scheme is clearly and completely described.
A kind of preparation method of high heat-conducting ceramic printed circuit board, it comprises the following steps：
Step one, sawing sheet：Take raw material to be placed on sawing sheet banding machine, the size required by list is indicated according to production, cut out
Thickness is the ceramic base copper-clad plate of 0.6mm, and carrying out wrapper sheet further according to thickness of slab forms compoboard.Step 2, drilling：First use pin machine
Some pin holes are got on the short side position of combinations thereof plate, then the compoboard that will be got after pin hole is fixed on numerically controlled drill
Workbench on, set the speed of mainshaft and roll setting speed of rig, and choose drilling hole amount less than the tungsten carbide twolip of 400
Drill bit, drills to the above-mentioned compoboard for fixing, and after compoboard is drilled hole, combination is removed from the workbench of numerically controlled drill
Plate, reuses and moves back pin machine and exit the pin on compoboard, obtains being drilled the ceramic substrate behind hole, reuses the sand of 1500 mesh
Burr and batch cutting edge of a knife or a sword on the above-mentioned ceramic base plate surface of paper treatment, reuse the hole bored on the above-mentioned ceramic substrate of machine check of verifying,
The ceramic substrate for reaching requirement enters next step operation, and ceramic substrate defective can be sorted out, repaired.Step
Three, hole metallization：Ceramic substrate after above-mentioned inspection is carried out into high-pressure washing, the spot on ceramic substrate is washed, washed
Later the vertical bay of ceramic substrate, then removing glue, neutralization, heavy Copper treatment are carried out successively so that ceramic base plate surface and hole wall
One layer of thin copper of upper attachment.Ceramic substrate first carries out removing glue, and epoxy resin layer is aoxidized, while the brill removed on borehole wall is dirty,
Neutralisation treatment is carried out again, the oxidant on ceramic substrate is remained in during reduction removing glue, to prevent rear operation because of residual liquid medicine
Pollution causes backlight bad, and the ceramic substrate after neutralization carries out heavy Copper treatment so that adhere to one on the hole wall on ceramic substrate
The thin copper of layer, to reach the effect of hole wall conducting.Step 4, whole plate plating increases copper：Ceramic substrate after above-mentioned heavy copper is carried out
Plating, increases hole copper, the thickness of face copper, then the ceramic substrate after plating is cleaned successively, dry, checked.Wash pottery
Liquid, and flash baking are left on porcelain substrate, it is ensured that hole copper, face copper on ceramic substrate are not etched, then are examined
Look into, underproof product can be sorted out, separately repair.Step 5, pattern transfer：First to the ceramic substrate after above-mentioned plating
Surface carries out polish-brush treatment, increases the roughness of copper face, then toward patch last layer dry film on ceramic base plate surface, then by CCD
Hole is positioned, and graph exposure is carried out using semi-automatic exposure machine, reuses the Na that concentration is 1.0% ~ 1.2%2CO3After solution is to exposure
Ceramic substrate developed, then overhauled.Step 6, graphic plating：Ceramic substrate after above-mentioned development is put into plating
In cylinder, by copper, tin electrolysis on ceramic substrate, and to cause that the copper on ceramic substrate is thick, tin thickness reaches requirement.Repeatedly plating increases
Copper, strengthens the stability of circuit connection.Step 7, moves back film, etches, moves back tin：Using the liquid medicine of strong basicity by ceramic substrate
Dry film removal on surface, unwanted part in ceramic base plate surface figure will be moved back after film process using the liquid medicine of strong oxidizing property
Copper is etched removal, and the anti-etching tin layers on above-mentioned ceramic base plate surface figure are removed using the acid liquid medicine of band, will move back tin
Ceramic substrate afterwards is dried, checked.Move back film, etch, move back the step of tin three and carry out successively, after the completion of need to be rinsed, wash away
The liquid of residual, flash baking, then checked, underproof product can be sorted out, repaired.Step 8, it is anti-welding and
Surface treatment：Slight polish-brush is carried out to above-mentioned ceramic base plate surface using scrubber to process, then by the ceramic base after polish-brush
Plate carries out anti-solder ink printing, carries out that low temperature is pre-baked after being completed for printing, further according to edges of boards CCD location holes positioned successively,
Hot setting treatment is carried out in exposure, development, maintenance, then the ceramic substrate feeding tunnel oven that will have been overhauled, after baking
Ceramic substrate come to the surface gold treatment, after the completion of dried and checked.The golden treatment of carrying out of ceramic substrate after baking, can
With the surface of smooth ceramic substrate, the aesthetics of ceramic substrate is improved.Change is needed to rinse after gold is treated, and flash baking is simultaneously examined
Look into.Step 9, CNC shapings：Shaping making is carried out to ceramic substrate using CNC milling machine, CNC milling machine needs to use Double-edged milling cutter
Processing, improves operating efficiency.High-pressure wash is carried out to ceramic substrate using finished product cleaning agent after the completion of milling, spot is rinsed out,
Dried after cleaning, checked, obtained finished product high heat-conducting ceramic printed circuit board.So far, the object of the invention is accomplished.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (4)
1. a kind of preparation method of high heat-conducting ceramic printed circuit board, it is characterised in that comprise the following steps：
（1）Sawing sheet：Take raw material to be placed on sawing sheet banding machine, the size required by list is indicated according to production, cut out thickness
It is the ceramic base copper-clad plate of 0.6mm, carrying out wrapper sheet further according to thickness of slab forms compoboard；
（2）Drilling：Some pin holes are first got on the short side position of combinations thereof plate with pin machine, then pin hole will be got
Compoboard afterwards is fixed on the workbench of numerically controlled drill, the speed of mainshaft and roll setting speed of rig is set, to combinations thereof
Plate is drilled, and after compoboard is drilled hole, compoboard is removed from the workbench of numerically controlled drill, is reused and is moved back pin machine by combination
Pin on plate is exited, and obtains being drilled the ceramic substrate behind hole, reuses the burr that sand paper is processed on above-mentioned ceramic base plate surface
With batch cutting edge of a knife or a sword, the hole bored on the above-mentioned ceramic substrate of machine check of verifying is reused；
（3）Hole metallization：Above-mentioned ceramic substrate is carried out into high-pressure washing, it is water washed after the vertical bay of ceramic substrate, then successively
Carry out removing glue, neutralization, heavy Copper treatment so that adhere to one layer of thin copper on ceramic base plate surface and hole wall；
（4）Whole plate plating increases copper：Above-mentioned ceramic substrate is electroplated, is increased hole copper, the thickness of face copper, then by the pottery after plating
Porcelain substrate is cleaned, dried, checked successively；
（5）Pattern transfer：First carry out polish-brush treatment to the surface of above-mentioned ceramic substrate, then toward pasting last layer on ceramic base plate surface
Dry film, is then positioned by CCD holes, and graph exposure is carried out using semi-automatic exposure machine, and it is 1.0% ~ 1.2% to reuse concentration
Na2CO3Solution develops to the ceramic substrate after exposure, then is overhauled；
（6）Graphic plating：Ceramic substrate after above-mentioned development is put into plating cylinder, copper, tin are electrolysed onto ceramic substrate, and
Cause that the thickness of the copper on ceramic substrate, tin thickness reach requirement；
（7）Film is moved back, etched, moved back tin：The dry film on ceramic base plate surface is removed using the liquid medicine of strong basicity, uses strong oxidizing property
Liquid medicine will move back after film process that unwanted part copper is etched removal in ceramic base plate surface figure, the medicine for using band acid
Water removes the anti-etching tin layers on above-mentioned ceramic base plate surface figure, will move back the ceramic substrate after tin and is dried, checked；
（8）Anti-welding and surface treatment：Slight polish-brush is carried out to above-mentioned ceramic base plate surface using scrubber to process, then will mill
Ceramic substrate after brush carries out anti-solder ink printing, carries out that low temperature is pre-baked after being completed for printing, and the CCD location holes further according to edges of boards enter
Hot setting treatment is carried out in row positioning, exposure, development, maintenance, then the ceramic substrate feeding tunnel oven that will have been overhauled, is dried
Ceramic substrate after roasting carries out the gold treatment that comes to the surface, after the completion of dried and checked；
（9）CNC is molded：Shaping making is carried out to ceramic substrate using CNC milling machine, after the completion of using finished product cleaning agent to ceramics
Substrate carries out high-pressure wash, is dried after cleaning, checked, obtains finished product high heat-conducting ceramic printed circuit board.
2. a kind of preparation method of high heat-conducting ceramic printed circuit board according to claim 1, it is characterised in that step
（2）Described in numerically controlled drill use tungsten carbide two-point bit, and described bit bore quantity is less than 400.
3. a kind of preparation method of high heat-conducting ceramic printed circuit board according to claim 1, it is characterised in that step
（2）Described in the mesh of sand paper model 1500.
4. a kind of preparation method of high heat-conducting ceramic printed circuit board according to claim 1, it is characterised in that step
（9）Described in CNC milling machine use Double-edged milling cutter.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710226193.6A CN106851994A (en) | 2017-04-08 | 2017-04-08 | A kind of preparation method of high heat-conducting ceramic printed circuit board |
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| CN201710226193.6A CN106851994A (en) | 2017-04-08 | 2017-04-08 | A kind of preparation method of high heat-conducting ceramic printed circuit board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108184312A (en) * | 2017-12-29 | 2018-06-19 | 赛创电气（铜陵）有限公司 | A kind of double-side conduction ceramic circuit-board and preparation method thereof |
| CN111417260A (en) * | 2020-04-07 | 2020-07-14 | 信丰祥达丰电子有限公司 | Production process of PCB bevel edge metallization copper clad |
| CN112864024A (en) * | 2021-01-08 | 2021-05-28 | 池州昀冢电子科技有限公司 | Ceramic circuit board and manufacturing method thereof |
| CN113543490A (en) * | 2021-07-08 | 2021-10-22 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
| CN114096070A (en) * | 2021-11-17 | 2022-02-25 | 博罗县宏瑞兴电子有限公司 | PCB electroplating etching solution and etching process thereof |
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| CN102905471A (en) * | 2012-10-21 | 2013-01-30 | 蔡新民 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
| CN103298267A (en) * | 2013-03-05 | 2013-09-11 | 深圳市迅捷兴电路技术有限公司 | Manufacturing method for circuit board with surface to be partially processed in thick plate electroplating mode |
| CN104582293A (en) * | 2014-12-19 | 2015-04-29 | 泰州市金鼎电子有限公司 | Manufacturing method of ceramic-based circuit board |
| CN104640353A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Method for manufacturing ceramic-based printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101146407A (en) * | 2006-09-15 | 2008-03-19 | 李东明 | Graph transfer shaping technology for carrier board circuit of printed circuit board |
| CN102905471A (en) * | 2012-10-21 | 2013-01-30 | 蔡新民 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
| CN103298267A (en) * | 2013-03-05 | 2013-09-11 | 深圳市迅捷兴电路技术有限公司 | Manufacturing method for circuit board with surface to be partially processed in thick plate electroplating mode |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108184312A (en) * | 2017-12-29 | 2018-06-19 | 赛创电气（铜陵）有限公司 | A kind of double-side conduction ceramic circuit-board and preparation method thereof |
| CN111417260A (en) * | 2020-04-07 | 2020-07-14 | 信丰祥达丰电子有限公司 | Production process of PCB bevel edge metallization copper clad |
| CN112864024A (en) * | 2021-01-08 | 2021-05-28 | 池州昀冢电子科技有限公司 | Ceramic circuit board and manufacturing method thereof |
| CN113543490A (en) * | 2021-07-08 | 2021-10-22 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
| CN113543490B (en) * | 2021-07-08 | 2023-01-10 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
| CN114096070A (en) * | 2021-11-17 | 2022-02-25 | 博罗县宏瑞兴电子有限公司 | PCB electroplating etching solution and etching process thereof |
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Application publication date: 20170613 |