WO2017166904A1 - Method for manufacturing power cell circuit board while exposing copper of internal copper plate - Google Patents

Method for manufacturing power cell circuit board while exposing copper of internal copper plate Download PDF

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Publication number
WO2017166904A1
WO2017166904A1 PCT/CN2017/071097 CN2017071097W WO2017166904A1 WO 2017166904 A1 WO2017166904 A1 WO 2017166904A1 CN 2017071097 W CN2017071097 W CN 2017071097W WO 2017166904 A1 WO2017166904 A1 WO 2017166904A1
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Prior art keywords
circuit board
copper
layer
inner layer
prepreg
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PCT/CN2017/071097
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French (fr)
Chinese (zh)
Inventor
何艳球
李雄杰
张亚锋
施世坤
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胜宏科技（惠州）股份有限公司
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Publication of WO2017166904A1 publication Critical patent/WO2017166904A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer

Definitions

  • the invention belongs to the field of circuit board manufacturing, and particularly relates to a method for manufacturing an inner layer copper plate exposed copper of a power battery circuit board.
  • the power battery circuit board needs to carry a large current and a high voltage, the ordinary circuit board can not meet this requirement, and a certain thickness of the copper plate needs to be buried in the circuit board, and the inner copper plate of the finished circuit board needs to expose a small portion for current output. Therefore, the difficulty in making the circuit board is greatly increased.
  • the position of the inner copper plate is exposed to be controlled by deep-depth milling, because the depth of the controlled deep milling is not easy to control, and the copper is easily damaged. Low and there is a phenomenon of pre-cured remnant.
  • the technical problem to be solved by the present invention is a method for manufacturing an inner copper plate of a power battery circuit board with good quality and high production efficiency.
  • the present invention is implemented by the following method: a method for manufacturing an inner copper plate of a power battery circuit board, comprising the following steps:
  • the board consists of a copper exposed area and a covered area;
  • S4 is covered with a layer of prepreg on the entire surface of the inner layer to form a prepreg layer;
  • the copper plate has a thickness of 1 to 2 mm.
  • the high temperature tape is a Teflon high temperature tape or a high temperature PET green tape.
  • step S5 when the line is etched, the area on the outer circuit board opposite to the position of the exposed copper region of the inner layer is etched to expose the prepreg layer.
  • the covering area of the inner layer board and the prepreg layer above the exposed copper area are cut during the cutting in step S6.
  • the width of the laser cut prepreg is controlled to be 1 mm.
  • the present invention has a layer of high-temperature adhesive tape adhered to the exposed copper area of the inner layer board, and the prepreg is pasted, which can effectively remove the prepreg in the exposed copper area of the inner layer board, so that the exposed copper area has no glue. Stains, avoiding the residue of prepreg; cutting with laser machine will not damage the inner layer, high cutting efficiency, improve the quality of the made circuit board, and is suitable for proofing or mass production, reducing production costs and shortening production. Cycles increase productivity.
  • Figure 1 is a schematic view showing the structure of an inner layer board of the present invention.
  • a method for manufacturing an inner copper plate of a power battery circuit board includes the following steps:
  • a copper plate with a thickness of 1.5 mm is selected as the inner layer, and the copper plate is subjected to boring, drilling, contouring, and the copper plate is used as the inner layer 1.
  • the inner layer plate is composed of a copper exposed area 11 and a cover area 12; the exposed copper area is an area where the metal copper is exposed after the finished circuit board is formed, and the cover area is made into a cost circuit board and then the outer circuit board is formed. Covered area.
  • the inner layer 1 is subjected to browning, and during the browning process, a uniform, good adhesion property and roughening organic metal layer structure is formed on the copper surface, and the organic metal layer structure is usually copper complexing. And then washing with water to remove the syrup on the surface of the inner layer;
  • High temperature PET green tape as high temperature tape.
  • the high temperature PET green tape is pasted to the exposed copper region 11 of the inner layer, and the exposed copper region 11 is completely covered when pasted, and a high temperature adhesive tape layer is formed on the surface of the exposed copper region 11.
  • the surface of the inner layer 1 is covered with a layer of prepreg, and the whole board is covered by the cover.
  • the surface of the inner layer is formed into a prepreg layer.
  • the thickness of the copper plate according to the present invention may be processed by using a copper plate having a thickness of any one of 1 to 2 mm in addition to the example of 1.5 mm as described in the above embodiments;
  • a Teflon high temperature tape can also be used, which achieves the same effect as the above embodiment.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laser Beam Processing (AREA)

Abstract

A method for manufacturing a power cell circuit board while exposing copper of an internal copper plate comprises the following steps: S1, making an internal plate consisting of a copper exposure region (11) and a coverage region (12); S2, performing surface treatment; S3, pasting a high temperature adhesive tape on the copper exposure region (11); S4, covering the whole surface of the internal plate with a layer of prepreg; S5, covering the internal plate with an external circuit board, and performing lamination, drilling, desmearing, full-plate electroplating, pattern transferring, pattern electroplating, circuit etching, solder mask screen printing and profile forming; S6, cutting, by a laser machine, along a connection portion between the copper exposure region (11) and the coverage region (12) of the internal plate; and S7, removing the prepreg layer and the high temperature adhesive tape layer on the surface of the circuit board of the internal plate, to obtain the power cell circuit board. By means of the method, the prepreg in the copper exposure region (11) in the internal plate is effectively removed, so that no adhesive stain is left on the copper exposure region (11), and prepreg residues are avoided; the quality of the circuit board is improved; moreover, the method is suitable for proofing or batch production, so that the production costs are reduced, the production period is shortened, and the production efficiency is improved.

Description

一种动力电池线路板的内层铜板露铜制作方法Method for manufacturing inner layer copper plate exposed copper of power battery circuit board 技术领域Technical field
本发明属于线路板制作领域，具体涉及一种动力电池线路板的内层铜板露铜制作方法。The invention belongs to the field of circuit board manufacturing, and particularly relates to a method for manufacturing an inner layer copper plate exposed copper of a power battery circuit board.
背景技术Background technique
随着线路板行业的不断发展，促使各种用途的线路板也随之出现。目前，除了传统追求精密、精细外，近年来由于国际及国内对环保问题的关注，拉动了新能源电动汽车及动车行业的快速发展，相应对于大电流高电压电池保护的线路板的需求也得到了快速的增长。With the continuous development of the circuit board industry, circuit boards for various purposes have also emerged. At present, in addition to the traditional pursuit of precision and precision, in recent years, due to international and domestic concerns about environmental protection issues, the rapid development of new energy electric vehicles and motor vehicles has been spurred, and the demand for circuit boards protected by high current and high voltage batteries has also been increased. A rapid increase.
由于动力电池线路板需要承载大电流高电压，普通线路板已不能达到此要求，需要在线路板内埋置一定厚度铜板，且成品线路板的内层铜板需要露出一小部分，用于电流输出，因此大大增加了线路板的制作难度。另外，在传统的加工中，由于内层铜板压合时会被半固化片覆盖，露出内层铜板的位置需要采用控深铣出的方式制作，因控深铣深度不易管控，容易伤到铜，效率低且会有半固化片残胶现象。Since the power battery circuit board needs to carry a large current and a high voltage, the ordinary circuit board can not meet this requirement, and a certain thickness of the copper plate needs to be buried in the circuit board, and the inner copper plate of the finished circuit board needs to expose a small portion for current output. Therefore, the difficulty in making the circuit board is greatly increased. In addition, in the traditional processing, since the inner copper plate is covered by the prepreg when it is pressed, the position of the inner copper plate is exposed to be controlled by deep-depth milling, because the depth of the controlled deep milling is not easy to control, and the copper is easily damaged. Low and there is a phenomenon of pre-cured remnant.
因此，如何克服上述问题，研发一种新的动力电池线路板制作工艺成为线路板生产企业亟待解决的问题。Therefore, how to overcome the above problems, the development of a new power battery circuit board manufacturing process has become an urgent problem to be solved by circuit board manufacturers.
发明内容Summary of the invention
有鉴于此，本发明要解决的技术问题是一种品质好、生产效率高的动力电池线路板的内层铜板露铜制作方法。In view of this, the technical problem to be solved by the present invention is a method for manufacturing an inner copper plate of a power battery circuit board with good quality and high production efficiency.
为了解决上述技术问题，本发明采用如下方案实现：一种动力电池线路板的内层铜板露铜制作方法，包括具体如下步骤：In order to solve the above technical problem, the present invention is implemented by the following method: a method for manufacturing an inner copper plate of a power battery circuit board, comprising the following steps:
S1.选取铜板做内层，并对铜板进行加工，制成内层板，该内层 板由露铜区和覆盖区组成；S1. Select a copper plate as an inner layer, and process the copper plate to form an inner layer, the inner layer The board consists of a copper exposed area and a covered area;
S2.对内层板的整个板面进行表面处理；S2. Surface treating the entire surface of the inner layer board;
S3.在内层板的露铜区粘贴高温胶带，形成高温胶带层；S3. Apply high temperature tape to the exposed copper area of the inner layer to form a high temperature tape layer;
S4在内层板的整个板面覆盖一层半固化片，形成半固化片层；S4 is covered with a layer of prepreg on the entire surface of the inner layer to form a prepreg layer;
S5.将外层线路板覆盖在内层板上，进行压合、钻孔、除胶渣、全板电镀、图形转移、图形电镀、线路蚀刻、防焊油丝印、外形轮廓加工成型；S5. Covering the outer circuit board on the inner layer board for pressing, drilling, degreasing, full board plating, pattern transfer, pattern plating, line etching, solder resist screen printing, contour contour forming;
S6.采用镭射机沿内层板的露铜区和覆盖区之间的连接部位进行裁切；S6. Cutting the connecting portion between the exposed copper area of the inner layer board and the covering area by using a laser;
S7.去除内板线路板表面的半固化片层和高温胶带层，制成动力电池线路板。S7. The prepreg layer and the high temperature tape layer on the surface of the inner board are removed to form a power battery board.
作为发明的改进，所述的铜板的厚度为1～2mm。As an improvement of the invention, the copper plate has a thickness of 1 to 2 mm.
作为发明的改进，所述的高温胶带为铁氟龙高温胶带或高温PET绿胶带。As an improvement of the invention, the high temperature tape is a Teflon high temperature tape or a high temperature PET green tape.
作为发明的改进，步骤S5中线路蚀刻时将外层线路板上、与内层板的露铜区位置相对于的区域蚀刻，露出半固化片层。As an improvement of the invention, in the step S5, when the line is etched, the area on the outer circuit board opposite to the position of the exposed copper region of the inner layer is etched to expose the prepreg layer.
作为发明的进一步改进，步骤S6中进行裁切时将内层板的覆盖区和露铜区上方的半固化片层切断。As a further improvement of the invention, the covering area of the inner layer board and the prepreg layer above the exposed copper area are cut during the cutting in step S6.
作为发明的更进一步改进，镭射机裁切半固化片的宽度控制为1mm。As a further improvement of the invention, the width of the laser cut prepreg is controlled to be 1 mm.
与现有技术相比，本发明在内层板的露铜区粘贴一层高温胶带层，再粘贴半固化片，可以有效的去除内层板中的露铜区内的半固化片，使得露铜区无胶渍，避免半固化片残留；采用镭射机进行裁切不会伤害内层板，裁切效率高，提高了制成线路板的品质，且适用于打样或批量化生产，降低了生产成本，缩短了生产周期，提高了生产效率。Compared with the prior art, the present invention has a layer of high-temperature adhesive tape adhered to the exposed copper area of the inner layer board, and the prepreg is pasted, which can effectively remove the prepreg in the exposed copper area of the inner layer board, so that the exposed copper area has no glue. Stains, avoiding the residue of prepreg; cutting with laser machine will not damage the inner layer, high cutting efficiency, improve the quality of the made circuit board, and is suitable for proofing or mass production, reducing production costs and shortening production. Cycles increase productivity.
附图说明DRAWINGS
图1为本发明的内层板的结构示意图。 Figure 1 is a schematic view showing the structure of an inner layer board of the present invention.
1内层板；11露铜区；12覆盖区。1 inner layer; 11 exposed copper area; 12 coverage area.
具体实施方式detailed description
为了让本领域的技术人员更好地理解本发明的技术方案，下面结合附图对本发明作进一步阐述。In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described below in conjunction with the accompanying drawings.
如图1所示，一种动力电池线路板的内层铜板露铜制作方法，包括具体如下步骤：As shown in FIG. 1 , a method for manufacturing an inner copper plate of a power battery circuit board includes the following steps:
S1.根据客户要求，选取厚度为1.5mm的铜板做内层，对铜板进行锣板、钻孔、外形轮廓加工，并将此铜板作为内层板1。其中该内层板由露铜区11和覆盖区12组成；所述的露铜区为制成成品线路板后露出金属铜的区域，而覆盖区则制成成本线路板后被外层线路板覆盖的区域。S1. According to the customer's request, a copper plate with a thickness of 1.5 mm is selected as the inner layer, and the copper plate is subjected to boring, drilling, contouring, and the copper plate is used as the inner layer 1. The inner layer plate is composed of a copper exposed area 11 and a cover area 12; the exposed copper area is an area where the metal copper is exposed after the finished circuit board is formed, and the cover area is made into a cost circuit board and then the outer circuit board is formed. Covered area.
S2.对内层板1的整个板面进行表面处理；对内层板1的板面进行处理时采用棕化工序，粗化内层板的铜表面，增加结合面积，增加表面的结合力，增加加工后的成品线路板的品质。棕化处理的具体步骤为：S2. Surface treatment of the entire surface of the inner layer 1; when the surface of the inner layer 1 is treated, a browning process is used to roughen the copper surface of the inner layer, increase the bonding area, and increase the bonding force of the surface. Increase the quality of the finished printed circuit board after processing. The specific steps of browning are:
S21.微蚀内层板1板面，然后进行水洗，去除内层板表面的药水，增加铜面的附着力；S21. Micro-etching the inner panel 1 surface, and then washing with water to remove the syrup on the surface of the inner layer to increase the adhesion of the copper surface;
S22.通过碱性化学物质将铜面的游行物质、氧化膜除去，再使用水洗，去除内层板表面的药水；S22. Removing the parade substance and the oxide film on the copper surface by an alkaline chemical, and then washing with water to remove the syrup on the surface of the inner layer;
S23.对内层板1进行预浸，为棕化前提供缓和及加强药物的适用性前处理，再使用水洗，去除内层板表面的药水；S23. pre-dipping the inner layer board 1 to provide a pre-treatment for easing and strengthening the drug before browning, and then using water washing to remove the syrup on the surface of the inner layer board;
S24.对内层板1进行棕化，棕化过程中在铜表面通过反应产生一种均匀、有良好粘合特性及粗化的有机金属层结构，该有机金属层结构通常为铜的络合物，再使用水洗，去除内层板表面的药水；S24. The inner layer 1 is subjected to browning, and during the browning process, a uniform, good adhesion property and roughening organic metal layer structure is formed on the copper surface, and the organic metal layer structure is usually copper complexing. And then washing with water to remove the syrup on the surface of the inner layer;
S25.通过热风烘干内层板，烘干后再进行下一步操作。S25. Dry the inner layer by hot air, and then dry it before proceeding to the next step.
S3.选用高温PET绿胶带作为高温胶带。将高温PET绿胶带粘贴在内层板的露铜区11，粘贴时将露铜区11完全覆盖，并在露铜区11表面形成高温胶带层。S3. Use high temperature PET green tape as high temperature tape. The high temperature PET green tape is pasted to the exposed copper region 11 of the inner layer, and the exposed copper region 11 is completely covered when pasted, and a high temperature adhesive tape layer is formed on the surface of the exposed copper region 11.
S4.在内层板1的板面覆盖一层半固化片，覆盖时采用全板覆盖， 使得内层板的板面形成半固化片层。S4. The surface of the inner layer 1 is covered with a layer of prepreg, and the whole board is covered by the cover. The surface of the inner layer is formed into a prepreg layer.
S5.将外层线路板覆盖在内层板上，进行排板、压合、钻孔、除胶渣、全板电镀、图形转移、图形电镀、线路蚀刻、防焊油丝印、外形轮廓加工成型；其中在进行线路蚀刻时，将外层线路板上、与内层板的露铜区位置相对应的区域的金属铜蚀刻，露出内层板的露铜区上方的半固化片层。S5. Covering the outer circuit board on the inner layer board, performing plate arranging, pressing, drilling, degreasing, full plate plating, pattern transfer, pattern plating, line etching, solder oil screen printing, contour contour forming Wherein, during the etching of the line, the metal copper on the outer circuit board in a region corresponding to the position of the exposed copper region of the inner layer is etched to expose the prepreg layer above the exposed copper region of the inner layer.
S6.采用镭射机沿内层板的露铜区11和覆盖区12之间的连接部位进行裁切；裁切时，沿露铜区一侧进行裁切，将内层板的覆盖区11上方和露铜区12上方的半固化片层切断，使得半固化片分离。镭射机裁切半固化片时，将镭射机裁切的宽度控制为1mm。其中所述的镭射机可以采用现有的镭射机均可实现。S6. Cutting the connecting portion between the exposed copper area 11 and the covering area 12 of the inner layer plate by using a laser; cutting the side of the exposed copper area when cutting, and above the covering area 11 of the inner layer board The prepreg layer above the exposed copper zone 12 is severed to separate the prepreg. When the laser cuts the prepreg, the width of the laser cutting is controlled to 1 mm. The laser machine described therein can be realized by using an existing laser machine.
S7.去除内层板表面上的半固化片层和高温胶带层，制成动力电池线路板。去除内层板表面上的半固化片层和高温胶带层时，采用人工操作将高温胶带层撕除；撕除高温胶带层的同时一并将半固化片层撕除，可以有限避免半固化片残留，去除胶渣，提高成品的品质。S7. Removing the prepreg layer and the high temperature tape layer on the surface of the inner layer to form a power battery board. When removing the prepreg layer and the high temperature tape layer on the surface of the inner layer board, the high temperature tape layer is manually removed; the high temperature tape layer is peeled off and the prepreg layer is peeled off, and the prepreg residue can be avoided to remove the glue residue. Improve the quality of the finished product.
本发明所述的铜板的厚度除了上述实施例所述的举例的1.5mm外，还可以选用厚度为1～2mm中任一厚度值的铜板进行加工均可；所述的高温胶带出来上述实施例中的高温PET绿胶带外，还可以选用铁氟龙高温胶带，其实现的效果与上述实施例相同。The thickness of the copper plate according to the present invention may be processed by using a copper plate having a thickness of any one of 1 to 2 mm in addition to the example of 1.5 mm as described in the above embodiments; In addition to the high temperature PET green tape, a Teflon high temperature tape can also be used, which achieves the same effect as the above embodiment.
上述实施例仅为本发明的其中具体实现方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些显而易见的替换形式均属于本发明的保护范围。 The above embodiments are only specific implementations of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention.

Claims (6)

  1. 一种动力电池线路板的内层铜板露铜制作方法，其特征在于，包括具体如下步骤：A method for manufacturing an inner copper plate of a power battery circuit board, characterized in that the method comprises the following steps:
    S1.选取铜板做内层，并对铜板进行加工，制成内层板(1)，该内层板由露铜区(11)和覆盖区(12)组成；S1. selecting a copper plate as an inner layer, and processing the copper plate to form an inner layer plate (1), the inner layer plate being composed of a copper exposed area (11) and a covering area (12);
    S2.对内层板(1)的整个板面进行表面处理；S2. Surface treatment of the entire surface of the inner layer (1);
    S3.在内层板的露铜区(11)粘贴高温胶带，形成高温胶带层；S3. Apply high temperature tape to the exposed copper area (11) of the inner layer to form a high temperature tape layer;
    S4在内层板(1)的整个板面覆盖一层半固化片，形成半固化片层；S4 is covered with a layer of prepreg on the entire surface of the inner layer (1) to form a prepreg layer;
    S5.将外层线路板覆盖在内层板(1)上，进行压合、钻孔、除胶渣、全板电镀、图形转移、图形电镀、线路蚀刻、防焊油丝印、外形轮廓加工成型；S5. Cover the outer circuit board on the inner layer board (1) for pressing, drilling, degreasing, full board plating, pattern transfer, pattern plating, line etching, solder resist screen printing, contour forming ;
    S6.采用镭射机沿内层板的(11)和覆盖区(12)之间的连接部位进行裁切；S6. cutting the connecting portion between the (11) and the covering area (12) of the inner layer plate by using a laser;
    S7.去除内层板表面的半固化片层和高温胶带层，制成动力电池线路板。S7. Removing the prepreg layer and the high temperature tape layer on the surface of the inner layer to form a power battery board.
  2. 根据权利要求1所述的动力电池线路板的内层铜板露铜制作方法，其特征在于，所述的铜板的厚度为1～2mm。The method for manufacturing an inner copper plate of a power battery circuit board according to claim 1, wherein the copper plate has a thickness of 1 to 2 mm.
  3. 根据权利要求1所述的动力电池线路板的内层铜板露铜制作方法，其特征在于，所述的高温胶带为铁氟龙高温胶带或高温PET绿胶带。The method for manufacturing an inner copper plate of a power battery circuit board according to claim 1, wherein the high temperature tape is a Teflon high temperature tape or a high temperature PET green tape.
  4. 根据权利要求1所述的动力电池线路板的内层铜板露铜制作方法，其特征在于，步骤S5中线路蚀刻时将外层线路板上、与内层板的露铜区位置相对于的区域蚀刻，露出半固化片层。The method for fabricating an inner copper plate of a power battery circuit board according to claim 1, wherein the area of the outer circuit board and the exposed copper area of the inner layer are opposite to each other when the circuit is etched in step S5. Etching to expose the prepreg layer.
  5. 根据权利要求4所述的动力电池线路板的内层铜板露铜制作方法，其特征在于，步骤S6中进行裁切时将内层板的覆盖区和露铜区上方的半固化片层切断。The method for fabricating an inner copper plate of a power battery circuit board according to claim 4, wherein the covering portion of the inner layer and the prepreg layer above the exposed copper region are cut during the cutting in step S6.
  6. 根据权利要求5所述的动力电池线路板的内层铜板露铜制作方法，其特征在于，镭射机裁切半固化片的宽度控制为1mm。 The method for manufacturing an inner layer copper plate dew of a power battery circuit board according to claim 5, wherein the width of the laser cutting prepreg is controlled to be 1 mm.
PCT/CN2017/071097 2016-03-31 2017-01-13 Method for manufacturing power cell circuit board while exposing copper of internal copper plate WO2017166904A1 (en)

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