CN106785792A - A kind of elongated high-frequency contact assembling encapsulating method of band cable - Google Patents
A kind of elongated high-frequency contact assembling encapsulating method of band cable Download PDFInfo
- Publication number
- CN106785792A CN106785792A CN201611044056.2A CN201611044056A CN106785792A CN 106785792 A CN106785792 A CN 106785792A CN 201611044056 A CN201611044056 A CN 201611044056A CN 106785792 A CN106785792 A CN 106785792A
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- Prior art keywords
- encapsulating
- glue
- frequency contact
- electric connector
- filling opening
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
The present invention relates to a kind of elongated high-frequency contact assembling encapsulating method of band cable, comprise the following steps：The glue filling opening more smaller than encapsulating syringe needle maximum gauge is opened up on the outer layer metal body that electric connector needs above the position of encapsulating at 1 2mm；Cable and electric connector are carried out into assembling and forms unencapsulated high-frequency contact；High-frequency contact is inclined into 45° angle, encapsulating syringe needle is tightly connected with the glue filling opening of electric connector, pressurize encapsulating, until glue overflows from high-frequency contact afterbody crimping position；High-frequency contact is disposed vertically and is solidified, part glue overflows from glue filling opening.The technology of the present invention is operated and method is practical, realizes the reliable embedding of the elongated class tape cable contact of self sealss and high-reliability electrical performance.
Description
Technical field
The present invention relates to a kind of elongated high-frequency contact assembling encapsulating method of band cable, belong to element embedding field.
Background technology
Electrical property and sealing property are conventional examination items in electric connector, with the high-tech, highly reliable of high speed development
The development need of model weapon, new requirements at the higher level is proposed to electric connector, such as：With high-reliability electrical performance and sealing property
Special electric connector, this kind of electric connector use condition be harsh, and environmental resistance requirement is high, and reliability requirement is high etc..
Described by taking general electric connector as an example, general electric connector is in structure mainly by housing, insulator, low frequency
The part of contact three constitutes, and the sealing of electric connector mainly uses embedding sizing material, it is ensured that between insulator and housing, low frequency contacts
Sealing between part and insulator, electrical property reliability is also ensured by the dielectric constant of glue-line, air, at present by above-mentioned knot
The electric connector of structure composition, is the electric connector that can obtain sealed reliable by common embedding mode.
In current connectors demand, the electric connector of high frequency assembly of more and more user's requests with cable, it is to avoid follow-up
The electric connector blow-by sex chromosome mosaicism that dismounting high frequency assembly causes.Be this develop electric connector when, except ensure band low frequency connect
Outside contact element sealing, self sealss reliability with cable high frequency assembly also turns into influence electric connector electrical property and sealing property
Principal element.
General encapsulating mode is open perfusion, and space is larger, and encapsulating syringe needle easily stretches into electric connector encapsulating layer bottom, makes
Glue is obtained from bottom slowly full of encapsulating layer.And the high-frequency contact with cable, structure is tiny, and reperfusion space is narrow and small, syringe needle compared with
Difficulty is stretched into, and embedding difficulty is big, and product percent of pass is low；Using assembling mode after first injecting glue, there is of poor quality, the encapsulating matter of assembling
The problems such as amount, insulaion resistance, proof voltage cannot can ensure.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, there is provided a kind of elongated high-frequency contact assembling of band cable is filled
Encapsulation method, realizes the reliable embedding of this class component.
The object of the invention is achieved by following technical solution：
There is provided a kind of band cable elongated high-frequency contact assembling encapsulating method, comprise the following steps：
(1) multiple grooves are opened up as filling on surface in the outer layer metal body that electric connector needs around the position of encapsulating
Glue groove；Opened up than encapsulating syringe needle maximum gauge on the outer layer metal body that electric connector needs above the position of encapsulating at 1-2mm
Smaller glue filling opening；
(2) cable and electric connector are carried out into assembling and forms unencapsulated high-frequency contact；
(3) high-frequency contact is inclined into 45° angle, encapsulating syringe needle is tightly connected with the glue filling opening of electric connector, pressurization is filled
Glue, until glue overflows from high-frequency contact afterbody crimping position；
(4) high-frequency contact is disposed vertically and is solidified, excessive glue overflows from glue filling opening.
Preferably, the encapsulating syringe needle is taper encapsulating syringe needle.
Preferably, high-frequency contact is No. 8 coaxial contact pieces, and the part between portion and screen layer is added on the metal layer
It is long, it is set to encapsulating layer.
Preferably, during step (2) is assembled cable and electric connector, the double of cable are observed by glue filling opening
Whether twisted wire is distorted, and then twisted-pair feeder is adjusted in the event of distortion.
Preferably, step (4) also includes, glue surface is observed by glue filling opening, if cannot observe glue surface by glue filling opening
Show that encapsulating is unsatisfactory for requiring.
Preferably, also including step (4) after the solidification is complete, air-leakage test and electrical property detection are carried out.
The present invention has the following advantages that compared with prior art：
(1) the technology of the present invention operation and method are practical, realize the elongated class tape cable of self sealss and high-reliability electrical performance
The reliable embedding of contact.
(2) by setting taper encapsulating syringe needle pressurization encapsulating, glue filling opening and syringe needle form fit, it is ensured that glue-line is without gas
Bubble, it is ensured that glue-line it is closely knit, it is ensured that the reliability of sealing.
(3) the mode encapsulating of about 45° angle is inclined, is easy to the discharge of air, further ensure glue-line bubble-free.
(4) preferred glue filling opening opens up position, is easy to observe in an assembling process the assembled state of wire；It is easy to fill
Glue, unnecessary glue discharge and the observation in encapsulating face are easy in solidification.
Brief description of the drawings
Fig. 1 is assembled state structural representation of the present invention；
Fig. 2 is present invention pressurization potting process schematic diagram；
Fig. 3 places solid state schematic diagram vertically for the present invention.
Specific embodiment
The technical solution adopted in the present invention is：(1) the outer layer metal body around the position of encapsulating is needed in electric connector
Multiple grooves are opened up on inner surface as glue-filling slot；The outer layer metal body on the position of encapsulating at 1-2mm is needed in electric connector
On open up the glue filling opening more smaller than encapsulating syringe needle maximum gauge；
(2) cable and electric connector are carried out into assembling and forms unencapsulated high-frequency contact, cable is observed by glue filling opening
Twisted-pair feeder whether be distorted, in the event of distortion then twisted-pair feeder is adjusted.；
(3) high-frequency contact is inclined into 45° angle, encapsulating syringe needle is tightly connected with the glue filling opening of electric connector, pressurization is filled
Glue, until glue overflows from high-frequency contact afterbody crimping position；
(4) high-frequency contact is disposed vertically and is solidified, excessive glue overflows from glue filling opening, is observed by glue filling opening
Glue surface, if cannot observe that glue surface shows that encapsulating is unsatisfactory for requiring by glue filling opening, rejects the high-frequency contact；
(5) after the solidification is complete, air-leakage test is carried out, if air-tightness is undesirable, the high-frequency resistance is rejected
Part.
By first assembling rear enclosed formula embedding, using the technology by process for filling colloid hole enhancing perfusion, to realize encapsulating layer
Seal request and high electrical performance requirement.Sealant pouring and sealing is general to be ensured by effective bonding surface area, adhesive strength, in the present invention
In technology, it is to increase effective encapsulating bonding surface area, is to increase in the inner surface auxiliary cutting glue-filling slot of elongated high-frequency contact
Plus glue and the adhesive strength of metallic object, it is applied to the auxiliary of fluid sealant liquid similar compatibility in the encapsulating inner surface of high-frequency contact
Silane coupling agent；Reliable insulaion resistance and proof voltage performance indications, are typically carried out by contact spacing and dielectric constant in electric connector
Ensure, to ensure the reliability of electrical property, in the case where contact spacing can not be changed, to avoid contact between part or bare wire
The smaller air breakdown for causing of spacing, encapsulating hole site is arranged on more than wire and metal contact element docking location, it is necessary to fill
At the position top 1-2mm of glue.
The mode (shown in Fig. 1) for first assembling is taken, cable shielding layer can be avoided because encapsulating syringe needle stretches into high-frequency contact bottom
During portion's encapsulating, the screen layer for causing is pushed into insulaion resistance, the unqualified problem of proof voltage energy caused by inside；Also line can be avoided
The problem pockety that cable screen layer causes by sealing glue sticking.
Employ a kind of mode pressurizeed encapsulating and incline about 45° angle (shown in Fig. 2) so that during perfusion sealing glue,
In the presence of pressure and gravity, glue falls into rapidly encapsulating layer bottom, and is rapidly filled with sealing space from bottom, air quickly from
Screen layer is discharged with the gap of wire, will not form bubble in encapsulating layer.
Another main points of encapsulating are the taper encapsulating syringe needle matched with glue filling opening in this technology, and syringe needle is in glue filling opening at this
Tight engagement, can allow pressure encapsulating to be guaranteed, more conducively the exclusion of air；Slight excess of sealing glue is separately irrigated,
Glue is allowed to be overflowed from outer conductor and wire tail, excessive glue can form one layer of insulation and be situated between in wire and shielding line surface
Matter so that the insulaion resistance of high-frequency contact, proof voltage can be relatively reliable.
In high-frequency contact solidification process, the mode (shown in Fig. 3) being disposed vertically is taken, in this kind of curing mode
Under, glue backflow is sealed under gravity so that the colloid of sealant is more closely knit；Excessive sealed colloid can lead in addition
Cross glue filling opening to be overflowed, now glue filling opening is converted into peep hole, the state of cured glue body can be observed.
The above, optimal specific embodiment only of the invention, but protection scope of the present invention is not limited thereto,
Any one skilled in the art the invention discloses technical scope in, the change or replacement that can be readily occurred in,
Should all be included within the scope of the present invention.
The content not being described in detail in description of the invention belongs to the known technology of professional and technical personnel in the field.
Claims (6)
1. a kind of elongated high-frequency contact of band cable assembles encapsulating method, it is characterised in that comprise the following steps：
(1) needed in electric connector encapsulating position outer layer metal body in open up multiple grooves as glue-filling slot on surface；
Electric connector need encapsulating position top 1-2mm at outer layer metal body on open up the filling more smaller than encapsulating syringe needle maximum gauge
Glue hole；
(2) cable and electric connector are carried out into assembling and forms unencapsulated high-frequency contact；
(3) high-frequency contact is inclined into 45° angle, encapsulating syringe needle is tightly connected with the glue filling opening of electric connector, pressurize encapsulating, directly
Overflowed from high-frequency contact afterbody crimping position to glue；
(4) high-frequency contact is disposed vertically and is solidified, excessive glue overflows from glue filling opening.
2. method according to claim 1, it is characterised in that the encapsulating syringe needle is taper encapsulating syringe needle.
3. method according to claim 1, it is characterised in that high-frequency contact is No. 8 coaxial contact pieces, in outer layer metal layer
Part between top and screen layer is lengthened, and is set to encapsulating layer.
4. method according to claim 1, it is characterised in that the process that step (2) is assembled cable and electric connector
In, whether the twisted-pair feeder for observing cable by glue filling opening is distorted, and then twisted-pair feeder is adjusted in the event of distortion.
5. method according to claim 1, it is characterised in that step (4) also includes, glue surface is observed by glue filling opening, if
Cannot observe that glue surface shows that encapsulating is unsatisfactory for requiring by glue filling opening.
6. method according to claim 1, it is characterised in that also including step (4) after the solidification is complete, carry out air-tightness inspection
Survey and electrical property detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611044056.2A CN106785792B (en) | 2016-11-21 | 2016-11-21 | A kind of elongated high-frequency contact assembling encapsulating method of band cable |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611044056.2A CN106785792B (en) | 2016-11-21 | 2016-11-21 | A kind of elongated high-frequency contact assembling encapsulating method of band cable |
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| CN106785792A true CN106785792A (en) | 2017-05-31 |
| CN106785792B CN106785792B (en) | 2019-01-25 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611736A (en) * | 2017-08-30 | 2018-01-19 | 江西昌河航空工业有限公司 | A kind of manufacture method of pluggable interim colloid plug |
| CN109787021A (en) * | 2018-12-21 | 2019-05-21 | 深圳市中科电工科技有限公司 | A kind of airtight detection structure and method and the socket with the airtight detection structure |
| CN109802260A (en) * | 2019-01-30 | 2019-05-24 | 洛阳隆盛科技有限责任公司 | A kind of high voltage test patchcord |
| CN111146643A (en) * | 2020-03-11 | 2020-05-12 | 江苏正恺电子科技有限公司 | Sealed shock attenuation multicore connector tied in a bundle |
| CN113872012A (en) * | 2021-09-13 | 2021-12-31 | 安徽中邦特种电缆科技有限公司 | Resin filling thermal shrinkage connecting device for cable and using method |
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| JP2010135121A (en) * | 2008-12-02 | 2010-06-17 | Yazaki Corp | Waterproof treatment and waterproof device of terminal connection part of coated cable |
| CN103794897A (en) * | 2012-10-29 | 2014-05-14 | 西安艾力特电子实业有限公司 | Bent type inner conductor structure with pouring-encapsulation groove |
| CN203674533U (en) * | 2013-11-04 | 2014-06-25 | 图尔克（天津）科技有限公司 | Resin-potted flow guide sleeve for sensor connector |
| CN104394965A (en) * | 2012-06-28 | 2015-03-04 | 伊沃夸水处理技术有限责任公司 | A potting method |
| CN105655839A (en) * | 2016-01-26 | 2016-06-08 | 沈阳兴华航空电器有限责任公司 | Inlaying plastic compressing sealing method for contact element |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2010135121A (en) * | 2008-12-02 | 2010-06-17 | Yazaki Corp | Waterproof treatment and waterproof device of terminal connection part of coated cable |
| CN104394965A (en) * | 2012-06-28 | 2015-03-04 | 伊沃夸水处理技术有限责任公司 | A potting method |
| CN103794897A (en) * | 2012-10-29 | 2014-05-14 | 西安艾力特电子实业有限公司 | Bent type inner conductor structure with pouring-encapsulation groove |
| CN203674533U (en) * | 2013-11-04 | 2014-06-25 | 图尔克（天津）科技有限公司 | Resin-potted flow guide sleeve for sensor connector |
| CN105655839A (en) * | 2016-01-26 | 2016-06-08 | 沈阳兴华航空电器有限责任公司 | Inlaying plastic compressing sealing method for contact element |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611736A (en) * | 2017-08-30 | 2018-01-19 | 江西昌河航空工业有限公司 | A kind of manufacture method of pluggable interim colloid plug |
| CN107611736B (en) * | 2017-08-30 | 2019-09-13 | 江西昌河航空工业有限公司 | A kind of manufacturing method of pluggable interim colloid plug |
| CN109787021A (en) * | 2018-12-21 | 2019-05-21 | 深圳市中科电工科技有限公司 | A kind of airtight detection structure and method and the socket with the airtight detection structure |
| CN109787021B (en) * | 2018-12-21 | 2021-01-01 | 深圳市中科电工科技有限公司 | Airtightness detection structure and method and socket with airtightness detection structure |
| CN109802260A (en) * | 2019-01-30 | 2019-05-24 | 洛阳隆盛科技有限责任公司 | A kind of high voltage test patchcord |
| CN111146643A (en) * | 2020-03-11 | 2020-05-12 | 江苏正恺电子科技有限公司 | Sealed shock attenuation multicore connector tied in a bundle |
| CN113872012A (en) * | 2021-09-13 | 2021-12-31 | 安徽中邦特种电缆科技有限公司 | Resin filling thermal shrinkage connecting device for cable and using method |
| CN113872012B (en) * | 2021-09-13 | 2023-09-29 | 安徽中邦特种电缆科技有限公司 | Resin-filled heat-shrinkable connecting device for cable and use method |
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| Publication number | Publication date |
|---|---|
| CN106785792B (en) | 2019-01-25 |
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