JP2010135121A - Waterproof treatment and waterproof device of terminal connection part of coated cable - Google Patents

Waterproof treatment and waterproof device of terminal connection part of coated cable Download PDF

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JP2010135121A
JP2010135121A JP2008307813A JP2008307813A JP2010135121A JP 2010135121 A JP2010135121 A JP 2010135121A JP 2008307813 A JP2008307813 A JP 2008307813A JP 2008307813 A JP2008307813 A JP 2008307813A JP 2010135121 A JP2010135121 A JP 2010135121A
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cavity
mold resin
terminal connection
terminal
electric wire
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JP5219762B2 (en
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Masayoshi Sawai
正義 澤井
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Yazaki Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent the spill-over of molding resin to the outside a cavity, and to prevent the generation of burrs. <P>SOLUTION: In a waterproof treatment method in which a terminal connection part is formed and molded by molding resin by injecting the molten molding resin into a cavity in a state that the terminal connection part 20 with a terminal fitting 10 connected with an exposed part of a conductor Wa at the end of the coated cable W is set in the cavity 103 of a molding die 100 and an opening 104 at one side of the cavity from which the coated cable is extracted to the outside is closed by an elastic closing plate 110, magnetic powder is dispersed uniformly in the molding resin so as to obtain magnetism and a magnetic field is generated in a space in the cavity by magnets 201-203 and the molding resin 230 is molded while being attracted parting from the opening 104 at the one side of the cavity. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、樹脂モールドすることで防水処理を施す被覆電線の端末接続部の防水処理方法および防水処理装置に関する（尚、本発明の説明における『防水』は、水の浸入を阻止することに限らず、水、油、アルコール、等を含む液体全般に有効に作用することを意味するが、ここでは一般的に名称として広く用いられている『防水』を用いて説明する）。   The present invention relates to a waterproof processing method and a waterproof processing apparatus for a terminal connection portion of a covered electric wire that is waterproofed by resin molding (note that "waterproof" in the description of the present invention is limited to preventing water from entering. In other words, it effectively works on all liquids including water, oil, alcohol, etc., but here, it will be described using “waterproof”, which is generally used as a name).

被覆電線の端末を何かに接続する場合、被覆電線の端末の絶縁被覆を除去して導体を露出させ、その導体露出部に端子金具を取り付けて接続することが多い。その場合、端子金具と導体を接続した部分をそのまま放置しておくと、その部分に水がかかった場合に、そこから毛細管現象により被覆電線中に水分が浸入する不都合がある。   When connecting the end of a covered electric wire to something, the insulation coating at the end of the covered electric wire is often removed to expose the conductor, and a terminal fitting is attached to the exposed conductor portion for connection. In that case, if the portion where the terminal metal fitting and the conductor are connected is left as it is, when the portion is splashed with water, there is a disadvantage that moisture enters the covered electric wire by capillary action.

それを防止するために、導体露出部を含む端末接続部に樹脂モールドを施す防水処理方法が知られている（例えば、特許文献１参照）。以下、その方法を図２〜図４を用いて説明する。   In order to prevent this, a waterproof treatment method is known in which a resin mold is applied to a terminal connection portion including a conductor exposed portion (see, for example, Patent Document 1). Hereinafter, the method will be described with reference to FIGS.

図２は樹脂モールドを施す前の被覆電線の端末部の構成を示す斜視図、図３は樹脂モールドした被覆電線の端末部を車体等にボルトで接続している状態を示す側断面図である。   FIG. 2 is a perspective view showing the configuration of the terminal portion of the covered electric wire before resin molding, and FIG. 3 is a side sectional view showing a state in which the terminal portion of the resin-molded covered electric wire is connected to a vehicle body or the like with bolts. .

図２および図３において、Ｗは被覆電線、Ｗａは被覆電線Ｗの導体、Ｗｂは被覆電線Ｗの絶縁被覆、１０は端子金具、１２は端子金具１０の後端に設けられた電線圧着部、１４はその更に後側に設けられた被覆加締部である。端子金具１０は、被覆電線Ｗの端末の導体Ｗａの露出部に電線圧着部１２を圧着することで、被覆電線Ｗの端末に接続されており、導体Ｗａの露出部と電線圧着部１２を含む範囲である端末接続部２０を、モールド樹脂３０で被覆成形することにより、端末接続部２０が防水処理されている。   2 and 3, W is a covered electric wire, Wa is a conductor of the covered electric wire W, Wb is an insulation coating of the covered electric wire W, 10 is a terminal fitting, 12 is a wire crimping portion provided at the rear end of the terminal fitting 10, Reference numeral 14 denotes a coating caulking portion provided further on the rear side thereof. The terminal fitting 10 is connected to the end of the covered wire W by crimping the wire crimping portion 12 to the exposed portion of the conductor Wa at the end of the covered wire W, and includes the exposed portion of the conductor Wa and the wire crimping portion 12. The terminal connection part 20 which is a range is covered with the mold resin 30 so that the terminal connection part 20 is waterproofed.

図４は樹脂モールドするために、防水処理装置の成形型に端末処理部をセットした状態を示している。
成形型１００は、上型１０１と下型１０２よりなり、上型１０１と下型１０２の間に成形空間であるキャビティ１０３が形成されている。キャビティ１０３は、被覆電線Ｗの端末接続部２０を収容できる大きさのもので、その一側部には、端子金具１０から後方に延びる被覆電線Ｗを外部に引き出すための一側部開口１０４が設けられている。 FIG. 4 shows a state in which the terminal processing unit is set in the mold of the waterproof processing device for resin molding.
The mold 100 includes an upper mold 101 and a lower mold 102, and a cavity 103 that is a molding space is formed between the upper mold 101 and the lower mold 102. The cavity 103 is of a size that can accommodate the terminal connection portion 20 of the covered electric wire W, and one side opening 104 for drawing out the covered electric wire W extending backward from the terminal fitting 10 to the outside is provided on one side thereof. Is provided.

この一側部開口１０４には、該一側部開口１０４を塞ぐゴム製などの弾性塞ぎ板１１０が装着されており、クランプ１１２で加圧力を付与することにより、上下の弾性塞ぎ部材１１０で被覆電線Ｗを挟持できるようになっている。また、上型１０１と下型１０２の合わせ目のキャビティ１０３外の部分には、端子金具１０の先端側の樹脂モールドしない部分をセットする先端保持部１０６が設けられている。   The one side opening 104 is provided with an elastic blocking plate 110 made of rubber or the like that closes the one side opening 104, and is covered with the upper and lower elastic blocking members 110 by applying pressure with a clamp 112. The electric wire W can be clamped. In addition, a tip holding portion 106 for setting a portion of the tip end of the terminal fitting 10 that is not resin-molded is provided outside the cavity 103 where the upper die 101 and the lower die 102 are joined.

また、上型１０１には、キャビティ１０３内にモールド樹脂３０を射出するための射出通路１０７が設けられており、その射出通路１０７の基端側に溶融状態のモールド樹脂３０を注入する射出手段（図示略）が接続されている。   Further, the upper mold 101 is provided with an injection passage 107 for injecting the mold resin 30 into the cavity 103, and injection means (injecting molten mold resin 30 into the base end side of the injection passage 107 ( (Not shown) are connected.

被覆電線Ｗの端末接続部２０をモールド樹脂３０で被覆成形する場合には、まず、キャビティ１０３の内部に端子金具１０の後端を含む端末接続部２０をセットする。また、端子金具１０の先端側の樹脂モールドしない部分は先端保持部１０６にセットする。また、端子金具１０の後方に延びる被覆電線Ｗは、キャビティ１０３の一側部開口１０４から外部に引き出して、一側部開口部１０４を塞ぐように装着した弾性塞ぎ板１１０により被覆電線Ｗを挟持する。   When the terminal connection part 20 of the covered wire W is covered and molded with the mold resin 30, first, the terminal connection part 20 including the rear end of the terminal fitting 10 is set inside the cavity 103. Further, the portion of the terminal metal fitting 10 on the front end side that is not resin-molded is set in the front end holding portion 106. The covered electric wire W extending behind the terminal fitting 10 is pulled out from the one side opening 104 of the cavity 103 and sandwiched by the elastic closing plate 110 attached so as to close the one side opening 104. To do.

このようにセットした状態で、射出通路１０７からキャビティ１０３内に溶融状態のモールド樹脂３０を射出することにより、モールド樹脂３０で被覆電線Ｗの端末接続部２０を被覆成形することができる。   In the set state, the terminal connection portion 20 of the covered electric wire W can be covered with the mold resin 30 by injecting the molten mold resin 30 into the cavity 103 from the injection passage 107.

特開２００１−１６７６４０号公報JP 2001-167640 A

ところで、上記弾性塞ぎ板１１０はモールド樹脂３０の流出防止板であると同時に、被覆電線Ｗを挟持して位置決めする電線押え板として機能するが、材質がゴム等の弾性材料製であるために、何らかの原因で変形した際に、モールド樹脂３０がキャビティ１０３から外側にはみ出すことがあった。モールド樹脂３０がキャビティ１０３外にはみ出して固まると、バリとなって残るという問題を生じる。   By the way, the elastic closing plate 110 functions as a wire retainer plate that sandwiches and positions the covered electric wire W at the same time as a flow prevention plate for the mold resin 30, but the material is made of an elastic material such as rubber. When the resin is deformed for some reason, the mold resin 30 sometimes protrudes from the cavity 103 to the outside. When the mold resin 30 protrudes out of the cavity 103 and is hardened, there is a problem that it remains as a burr.

本発明は、上述した事情に鑑みてなされたものであり、その目的は、モールド樹脂のキャビティ外へのはみ出しを防止して、バリの発生を防止することのできる被覆電線端末接続部の防水処理方法および防水処理装置を提供することにある。   The present invention has been made in view of the above-described circumstances, and the object thereof is to prevent the occurrence of burrs by preventing the molding resin from protruding out of the cavity and waterproofing the coated wire terminal connection portion. It is to provide a method and a waterproofing apparatus.

前述した目的を達成するために、本発明に係る防水処理方法は、下記（１）を特徴としている。
（１） 被覆電線の端末の導体露出部に端子金具を接続した端末接続部を成形型のキャビティ内にセットすると共に、前記被覆電線を外部に引き出した前記キャビティの一側部開口を塞ぎ部材で塞いだ状態で、前記キャビティ内に溶融したモールド樹脂を射出して、前記端末接続部をモールド樹脂で被覆成形する被覆電線の端末接続部の防水処理方法であって、
前記モールド樹脂に磁性粉を均一に分散させることで磁性を持たせ、溶融した前記モールド樹脂を前記キャビティ内に射出して前記端末接続部をモールド樹脂で被覆成形する際に、前記キャビティ内の空間に磁界を掛けることで、前記モールド樹脂を前記キャビティの一側部開口から離れた方向へ引き寄せながら成形すること。 In order to achieve the object described above, the waterproofing method according to the present invention is characterized by the following (1).
(1) A terminal connecting portion in which a terminal fitting is connected to a conductor exposed portion of a terminal of a covered electric wire is set in a cavity of a molding die, and one side opening of the cavity from which the covered electric wire is drawn out is closed with a member. In a closed state, a molten mold resin is injected into the cavity, and the terminal connection portion of the covered wire is waterproofed by coating the terminal connection portion with the mold resin.
When the mold resin is magnetized by uniformly dispersing magnetic powder, the molten mold resin is injected into the cavity, and the terminal connection portion is coated with the mold resin to form a space in the cavity. The molding resin is molded while being pulled in a direction away from the one side opening of the cavity by applying a magnetic field to the cavity.

上記（１）の構成の防水処理方法によれば、被覆電線の端末接続部をモールド樹脂で被覆成形する際に、キャビティ内の空間に磁界を掛けることで、モールド樹脂をキャビティの一側部開口から離れた方向へ引き寄せながら成形するので、一側部開口からの樹脂のはみ出しを極力回避することができ、バリの発生を防止することができる。   According to the waterproofing method having the above configuration (1), when the terminal connection portion of the covered electric wire is covered and molded with the mold resin, a magnetic field is applied to the space in the cavity, thereby opening the mold resin on one side of the cavity. Therefore, the resin can be prevented from protruding from the one side opening as much as possible, and the generation of burrs can be prevented.

前述した目的を達成するために、本発明に係る防水処理装置は、下記（２）および（３）を特徴としている。
（２） 被覆電線の端末の導体露出部に端子金具を接続した端末接続部を内部にセットするキャビティを有した成形型と、該キャビティの一側部に設けられ、前記キャビティ内から前記被覆電線を外部に引き出す一側部開口と、該一側部開口を塞ぐ塞ぎ部材と、前記キャビティ内に溶融したモールド樹脂を射出する射出手段と、を備え、前記キャビティ内に前記端末接続部をセットした状態で、キャビティ内に溶融したモールド樹脂を射出して、前記端末接続部をモールド樹脂で被覆成形する被覆電線の端末接続部の防水処理装置であって、
前記モールド樹脂として、該モールド樹脂中に磁性粉を均一に分散させることで磁性が付与された磁性モールド樹脂を用いると共に、
溶融した前記モールド樹脂を前記キャビティ内に射出して前記端末接続部をモールド樹脂で被覆成形する際に、前記キャビティ内の空間に磁界を掛けることで、前記モールド樹脂を前記キャビティの一側部開口から離れた方向へ引き寄せる磁界発生手段を設けたこと。
（３） 上記（２）の防水処理装置において、
前記成形型の前記キャビティを形成する部分の少なくとも主要部が非磁性体で構成され、磁界発生手段として、前記成形型に磁石が設けられていること。 In order to achieve the above-described object, the waterproof processing device according to the present invention is characterized by the following (2) and (3).
(2) A molding die having a cavity for setting a terminal connecting portion in which a terminal fitting is connected to a conductor exposed portion of a terminal of the covered electric wire, and a side portion of the cavity, and the covered electric wire from the inside of the cavity One end opening for pulling out the outside, a closing member for closing the one side opening, and an injection means for injecting molten mold resin into the cavity, and the terminal connection portion is set in the cavity In a state, a waterproof processing device for a terminal connection portion of a covered electric wire that injects molten mold resin into a cavity and coats and forms the terminal connection portion with a mold resin,
As the mold resin, a magnetic mold resin provided with magnetism by uniformly dispersing magnetic powder in the mold resin is used,
When the molten mold resin is injected into the cavity and the terminal connection portion is coated with the mold resin, a magnetic field is applied to the space in the cavity to open the mold resin on one side of the cavity. Provided magnetic field generating means to draw away from the direction.
(3) In the waterproofing processing apparatus of (2) above,
At least the main part of the part forming the cavity of the mold is made of a nonmagnetic material, and a magnet is provided in the mold as a magnetic field generating means.

上記（２）の構成の防水処理装置によれば、被覆電線の端末接続部をモールド樹脂で被覆成形する際に、キャビティ内の空間に磁界を掛けることで、モールド樹脂をキャビティの一側部開口から離れた方向へ引き寄せながら成形することができるので、一側部開口からの樹脂のはみ出しを極力回避することができ、バリの発生を防止することができる。
上記（３）の構成の防水処理装置によれば、成形型のキャビティを形成する部分の少なくとも主要部を非磁性体で構成し、モールド樹脂として磁性を持つものを使用し、成形型に磁石を設けることにより、簡単に樹脂のはみ出しの問題を解消することができる。 According to the waterproof processing apparatus having the configuration of (2) above, when the terminal connection portion of the covered electric wire is covered and molded with the mold resin, a magnetic field is applied to the space in the cavity, thereby opening the mold resin on one side of the cavity. Therefore, the resin can be prevented from protruding from one side opening as much as possible, and the occurrence of burrs can be prevented.
According to the waterproof processing apparatus having the configuration (3) above, at least the main part of the part forming the cavity of the mold is made of a non-magnetic material, and the mold resin is made of magnetism. By providing, the problem of the protrusion of the resin can be easily solved.

本発明によれば、成形時の樹脂のはみ出しを極力回避することができ、バリの発生を防止することができる。   According to the present invention, the protrusion of the resin during molding can be avoided as much as possible, and the occurrence of burrs can be prevented.

以上、本発明について簡潔に説明した。更に、以下に説明される発明を実施するための最良の形態を添付の図面を参照して通読することにより、本発明の詳細は更に明確化されるであろう。   The present invention has been briefly described above. Furthermore, the details of the present invention will be further clarified by reading through the best mode for carrying out the invention described below with reference to the accompanying drawings.

以下、本発明に係る好適な実施形態を図面に基づいて詳細に説明する。   DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the drawings.

図１は実施形態の防水処理装置の断面図であり、（ａ）は型開き状態を示す断面図、（ｂ）は型閉じしてモールド樹脂を射出することにより被覆電線の端末接続部をモールド樹脂で被覆成形している状態を示す断面図である。   1A and 1B are cross-sectional views of a waterproof treatment apparatus according to an embodiment, wherein FIG. 1A is a cross-sectional view showing a mold opening state, and FIG. 1B is a mold-closing terminal injection portion by closing a mold and injecting mold resin. It is sectional drawing which shows the state currently coat-molded with resin.

この防水処理装置は、成形空間としてのキャビティ１０３を形成する成形型１００と、キャビティ１０３内にモールド樹脂６０を射出する射出手段（図示略）と、キャビティ１０３の一側部開口１０４を塞ぐ弾性塞ぎ板（塞ぎ部材）１１０およびそのクランプ１１２と、磁界発生手段としての磁石２０１〜２０３と、を有して構成されている。   This waterproof processing apparatus includes a mold 100 that forms a cavity 103 as a molding space, an injection unit (not shown) that injects a mold resin 60 into the cavity 103, and an elastic blockage that blocks one side opening 104 of the cavity 103. It has a plate (blocking member) 110 and its clamp 112, and magnets 201 to 203 as magnetic field generating means.

被覆電線Ｗおよびその端末部の構成は図２に示したものと同一であり、図２と同一の構成要素には同一符号を付して説明を省略する。   The configurations of the covered electric wire W and the terminal portion thereof are the same as those shown in FIG. 2, and the same components as those in FIG.

成形型１００は、上型１０１と下型１０２よりなり、上型１０１と下型１０２の間に成形空間であるキャビティ１０３が形成されている。この場合の成形型１００は、キャビティ１０３を形成する部分の少なくとも主要部が非磁性体で構成されている。これは、磁石２０１〜２０３の磁界の影響が、射出されたモールド樹脂２３０にだけ効率よく及ぶようにするためである。   The mold 100 includes an upper mold 101 and a lower mold 102, and a cavity 103 that is a molding space is formed between the upper mold 101 and the lower mold 102. In this case, in the mold 100, at least the main part of the part forming the cavity 103 is made of a nonmagnetic material. This is because the influence of the magnetic field of the magnets 201 to 203 is efficiently applied only to the injected mold resin 230.

キャビティ１０３は、被覆電線Ｗの端末接続部２０を収容できる大きさのもので、その一側部には、端子金具１０から後方に延びる被覆電線Ｗを外部に引き出すための一側部開口１０４が設けられている。この一側部開口１０４には、該一側部開口１０４を塞ぐゴム製などの弾性塞ぎ板１１０が装着されており、上下の弾性塞ぎ板１１０をクランプ１１２で固定して、クランプ１１２により弾性塞ぎ板１１０に加圧力Ｐを加えることで、上下の弾性塞ぎ部材１１０を被覆電線Ｗの外周に密着状態で圧接させることができ、それにより被覆電線Ｗを挟持できるようになっている。   The cavity 103 is of a size that can accommodate the terminal connection portion 20 of the covered electric wire W, and one side opening 104 for drawing out the covered electric wire W extending backward from the terminal fitting 10 to the outside is provided on one side thereof. Is provided. The one side opening 104 is provided with an elastic closing plate 110 made of rubber or the like that closes the one side opening 104. The upper and lower elastic closing plates 110 are fixed by clamps 112 and elastically closed by the clamps 112. By applying a pressing force P to the plate 110, the upper and lower elastic blocking members 110 can be brought into close contact with the outer periphery of the covered electric wire W in a close contact state, whereby the covered electric wire W can be clamped.

また、上型１０１と下型１０２の合わせ目のキャビティ１０３外の部分には、端子金具１０の先端側の樹脂モールドしない部分をセットする先端保持部１０６が設けられている。また、上型１０１には、キャビティ１０３内にモールド樹脂２３０を射出するための射出通路１０７が設けられており、その射出通路１０７の基端側に溶融状態のモールド樹脂２３０を注入する射出手段（図示略）が接続されている。   In addition, a tip holding portion 106 for setting a portion of the tip end of the terminal fitting 10 that is not resin-molded is provided outside the cavity 103 where the upper die 101 and the lower die 102 are joined. Further, the upper mold 101 is provided with an injection passage 107 for injecting the mold resin 230 into the cavity 103, and an injection means (injecting molten mold resin 230 into the base end side of the injection passage 107 ( (Not shown) are connected.

この防水処理装置では、モールド樹脂２３０として、該モールド樹脂中に磁性粉を均一に分散させることで磁性が付与された磁性モールド樹脂を用いることにしている。磁性モールド樹脂は、ベースとなる樹脂の中に磁性超微粒子（磁性粉）を均一に分散させたもの（複合材料）であって、各磁性超微粒子の表面には界面活性剤が強固に化学吸着されている。   In this waterproof treatment apparatus, a magnetic mold resin to which magnetism is imparted by uniformly dispersing magnetic powder in the mold resin is used as the mold resin 230. Magnetic mold resin is a resin (base material) in which magnetic ultrafine particles (magnetic powder) are uniformly dispersed in a base resin. The surface of each magnetic ultrafine particle has a strong chemical adsorption. Has been.

そして、磁界発生手段としての磁石２０１〜２０３は、溶融したモールド樹脂２３０をキャビティ１０３内に射出して被覆電線Ｗの端末接続部２０をモールド樹脂２３０で被覆成形する際に、キャビティ１０３内の空間に磁界を掛けることにより、モールド樹脂２３０をキャビティ１０３の一側部開口１０４から離れた方向へ引き寄せる作用を発揮できるように設けられている。この場合、磁石２０１〜２０３は、上下型１０１、１０２の内面の一側部開口１０４から離れた位置に埋め込まれている。   The magnets 201 to 203 as magnetic field generating means are used to inject the molten mold resin 230 into the cavity 103 and cover and mold the terminal connection portion 20 of the covered electric wire W with the mold resin 230. By applying a magnetic field, the mold resin 230 is provided so as to exert an action of pulling the mold resin 230 away from the one side opening 104 of the cavity 103. In this case, the magnets 201 to 203 are embedded at a position away from the one side opening 104 of the inner surfaces of the upper and lower molds 101 and 102.

被覆電線Ｗの端末接続部２０をモールド樹脂２３０で被覆成形する場合は、まず、キャビティ１０３の内部に端子金具１０の後端を含む端末接続部２０をセットする。また、端子金具１０の先端側の樹脂モールドしない部分は先端保持部１０６にセットする。また、端子金具１０の後方に延びる被覆電線Ｗは、キャビティ１０３の一側部開口１０４から外部に引き出しておく。この状態で成形型１００を閉じ、クランプ１１２で弾性塞ぎ板１１０を加圧することにより、弾性塞ぎ板１１０により被覆電線Ｗを挟持する。   When the terminal connection portion 20 of the covered electric wire W is covered and molded with the mold resin 230, first, the terminal connection portion 20 including the rear end of the terminal fitting 10 is set inside the cavity 103. Further, the portion of the terminal metal fitting 10 on the front end side that is not resin-molded is set in the front end holding portion 106. The covered electric wire W extending behind the terminal fitting 10 is drawn out from the one side opening 104 of the cavity 103 to the outside. In this state, the mold 100 is closed, and the elastic closing plate 110 is pressurized by the clamp 112, whereby the covered electric wire W is held by the elastic closing plate 110.

このようにセットした状態で、射出通路１０７からキャビティ１０３内に溶融状態の磁性モールド樹脂２３０を射出する。その際、磁石２０１〜２０３により発生する磁界の働きで、磁性モールド樹脂２３０がキャビティ１０３の一側部開口１０４から離れた方向へ引き寄せられるので、弾性塞ぎ板１１０に加わる内圧を小さく抑えながら成形を行うことができる。その結果、一側部開口１０４からのモールド樹脂２３０のはみ出しを極力回避することができて、バリの発生を防止することができる。   In this state, the molten magnetic mold resin 230 is injected from the injection passage 107 into the cavity 103. At that time, the magnetic mold resin 230 is attracted in the direction away from the one side opening 104 of the cavity 103 by the action of the magnetic field generated by the magnets 201 to 203, so that molding is performed while keeping the internal pressure applied to the elastic closing plate 110 small. It can be carried out. As a result, the protrusion of the mold resin 230 from the one side opening 104 can be avoided as much as possible, and the occurrence of burrs can be prevented.

尚、本発明は、上述した実施形態に限定されるものではなく、適宜、変形、改良、等が可能である。その他、上述した実施形態における各構成要素の材質、形状、寸法、数、配置箇所、等は本発明を達成できるものであれば任意であり、限定されない。   In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably. In addition, the material, shape, dimensions, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

上記実施形態では、磁石２０１〜２０３を直接成形型１００の内面に設けた場合を示したが、ヨークの作用をなす磁性部材を、キャビティ１０３の内面に臨むように上型１０１や下型１０２に設けておき、その磁性部材を介して磁力がキャビティ１０３内に注入されたモールド樹脂２３０に及ぶようにしてもよい。   In the above embodiment, the case where the magnets 201 to 203 are directly provided on the inner surface of the mold 100 is shown. However, the magnetic member that acts as a yoke is attached to the upper mold 101 and the lower mold 102 so as to face the inner surface of the cavity 103. It may be provided so that the magnetic force reaches the mold resin 230 injected into the cavity 103 through the magnetic member.

また、成形型１００の全体を非磁性材料で構成し、成形型１００の外部から磁力をキャビティ１０３内のモールド樹脂２３０に及ばせるようにすることもできる。その場合、磁石として電磁石を用いてもよく、電磁石に流す電流としては、直流を用いることもできるし交流を用いることもできる。   Alternatively, the entire mold 100 may be made of a nonmagnetic material so that a magnetic force can be applied to the mold resin 230 in the cavity 103 from the outside of the mold 100. In that case, an electromagnet may be used as the magnet, and a direct current or an alternating current may be used as a current flowing through the electromagnet.

そして、上記実施形態では、モールド樹脂２３０として、磁性超微粒子（磁性粉）を樹脂の中に分散させた磁性モールド樹脂であって、各磁性超微粒子の表面には界面活性剤が強固に化学吸着されたものを用いたが、磁性超微粒子が樹脂中に均一に分散していれば各磁性超微粒子の表面に界面活性剤が強固に化学吸着していなくてもよい。   In the above embodiment, the mold resin 230 is a magnetic mold resin in which magnetic ultrafine particles (magnetic powder) are dispersed in the resin, and the surfactant is firmly chemisorbed on the surface of each magnetic ultrafine particle. However, as long as the magnetic ultrafine particles are uniformly dispersed in the resin, the surfactant does not have to be strongly chemically adsorbed on the surface of each magnetic ultrafine particle.

本発明の実施形態の防水処理装置の断面図であり、（ａ）は型開き状態を示す断面図、（ｂ）は型閉じしてモールド樹脂を射出することにより被覆電線の端末接続部をモールド樹脂で被覆成形している状態を示す断面図である。BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing of the waterproofing processing apparatus of embodiment of this invention, (a) is sectional drawing which shows a mold open state, (b) molds the terminal connection part of a covered electric wire by closing mold and injecting mold resin. It is sectional drawing which shows the state currently coat-molded with resin. 樹脂モールドを施す前の被覆電線の端末部の構成を示す斜視図である。It is a perspective view which shows the structure of the terminal part of the covered electric wire before giving a resin mold. 樹脂モールドした被覆電線の端末部を車体等にボルトで接続している状態を示す側断面図である。It is a sectional side view which shows the state which has connected the terminal part of the resin-molded covered electric wire to the vehicle body etc. with the volt | bolt. 従来の防水処理装置の成形型に端末処理部をセットした状態を示す断面図である。It is sectional drawing which shows the state which set the terminal process part to the shaping | molding die of the conventional waterproof processing apparatus.

符号の説明Explanation of symbols

Ｗ 被覆電線
Ｗａ 導体
Ｗｂ 絶縁被覆
１０ 端子金具
２０ 端末接続部
１００ 成形型
１０３ キャビティ
１０４ 一側部開口
１１０ 弾性塞ぎ板（塞ぎ部材）
２０１〜２０３ 磁石（磁界発生手段）
２３０ 磁性モールド樹脂 W Covered Wire Wa Conductor Wb Insulation Cover 10 Terminal Fitting 20 End Connection 100 Mold Die 103 Cavity 104 One Side Opening 110 Elastic Closure Plate (Blocking Member)
201-203 Magnet (magnetic field generating means)
230 Magnetic mold resin

Claims (3)

被覆電線の端末の導体露出部に端子金具を接続した端末接続部を成形型のキャビティ内にセットすると共に、前記被覆電線を外部に引き出した前記キャビティの一側部開口を塞ぎ部材で塞いだ状態で、前記キャビティ内に溶融したモールド樹脂を射出して、前記端末接続部をモールド樹脂で被覆成形する被覆電線の端末接続部の防水処理方法であって、
前記モールド樹脂に磁性粉を均一に分散させることで磁性を持たせ、溶融した前記モールド樹脂を前記キャビティ内に射出して前記端末接続部をモールド樹脂で被覆成形する際に、前記キャビティ内の空間に磁界を掛けることで、前記モールド樹脂を前記キャビティの一側部開口から離れた方向へ引き寄せながら成形することを特徴とする被覆電線の端末接続部の防水処理方法。 The terminal connection part in which the terminal fitting is connected to the conductor exposed part of the terminal of the covered electric wire is set in the cavity of the molding die, and the opening of one side of the cavity from which the covered electric wire is drawn to the outside is closed and closed. In the method for waterproofing the terminal connection portion of the covered electric wire, injecting the molten mold resin into the cavity and covering the terminal connection portion with the mold resin,
When the mold resin is magnetized by uniformly dispersing magnetic powder, the molten mold resin is injected into the cavity, and the terminal connection portion is coated with the mold resin to form a space in the cavity. A method for waterproofing a terminal connecting portion of a covered electric wire, wherein the molding resin is molded while being pulled in a direction away from the opening at one side of the cavity by applying a magnetic field to the surface. 被覆電線の端末の導体露出部に端子金具を接続した端末接続部を内部にセットするキャビティを有した成形型と、該キャビティの一側部に設けられ、前記キャビティ内から前記被覆電線を外部に引き出す一側部開口と、該一側部開口を塞ぐ塞ぎ部材と、前記キャビティ内に溶融したモールド樹脂を射出する射出手段と、を備え、前記キャビティ内に前記端末接続部をセットした状態で、キャビティ内に溶融したモールド樹脂を射出して、前記端末接続部をモールド樹脂で被覆成形する被覆電線の端末接続部の防水処理装置であって、
前記モールド樹脂として、該モールド樹脂中に磁性粉を均一に分散させることで磁性が付与された磁性モールド樹脂を用いると共に、
溶融した前記モールド樹脂を前記キャビティ内に射出して前記端末接続部をモールド樹脂で被覆成形する際に、前記キャビティ内の空間に磁界を掛けることで、前記モールド樹脂を前記キャビティの一側部開口から離れた方向へ引き寄せる磁界発生手段を設けたことを特徴とする被覆電線の端末接続部の防水処理装置。 A molding die having a cavity for setting a terminal connection portion in which a terminal fitting is connected to a conductor exposed portion of a terminal of a covered wire, and one side portion of the cavity, and the covered wire is exposed to the outside from the inside of the cavity. With one side opening to be drawn out, a closing member that closes the one side opening, and an injection unit that injects molten mold resin into the cavity, with the terminal connection portion set in the cavity, A waterproof processing device for a terminal connection portion of a covered electric wire that injects molten mold resin into a cavity and coats and forms the terminal connection portion with a mold resin,
As the mold resin, a magnetic mold resin provided with magnetism by uniformly dispersing magnetic powder in the mold resin is used,
When the molten mold resin is injected into the cavity and the terminal connection portion is coated with the mold resin, a magnetic field is applied to the space in the cavity to open the mold resin on one side of the cavity. A waterproof processing apparatus for a terminal connection portion of a covered electric wire, characterized in that a magnetic field generating means for pulling in a direction away from the terminal is provided. 前記成形型の前記キャビティを形成する部分の少なくとも主要部が非磁性体で構成され、磁界発生手段として、前記成形型に磁石が設けられていることを特徴とする被覆電線の端末接続部の防水処理装置。   Waterproofing of a terminal connection portion of a covered electric wire, wherein at least a main part of a portion forming the cavity of the mold is made of a non-magnetic material, and a magnet is provided on the mold as a magnetic field generating means. Processing equipment.
JP2008307813A 2008-12-02 2008-12-02 Waterproof processing method and waterproof processing device for terminal connection part of coated electric wire Expired - Fee Related JP5219762B2 (en)

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JP2012033349A (en) * 2010-07-29 2012-02-16 Hitachi Cable Ltd Harness for oil-cooled device
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