CN106751277B - A kind of welding preparation process of nano particle composite material film - Google Patents
A kind of welding preparation process of nano particle composite material film Download PDFInfo
- Publication number
- CN106751277B CN106751277B CN201611241228.5A CN201611241228A CN106751277B CN 106751277 B CN106751277 B CN 106751277B CN 201611241228 A CN201611241228 A CN 201611241228A CN 106751277 B CN106751277 B CN 106751277B
- Authority
- CN
- China
- Prior art keywords
- film
- nano particle
- composite material
- preparation process
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
- C08L29/02—Homopolymers or copolymers of unsaturated alcohols
- C08L29/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2329/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Derivatives of such polymer
- C08J2329/02—Homopolymers or copolymers of unsaturated alcohols
- C08J2329/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2493/00—Characterised by the use of natural resins; Derivatives thereof
- C08J2493/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The present invention relates to preformed solder technical fields, specifically disclose a kind of preparation process of welding nano particle composite material film, comprising the following steps: material mixing → vacuum defoamation → casting film-forming → dry solidification → post-processing.Preparation process of the present invention has the characteristics that simple and easy, controllability is strong, high-efficient and at low cost, it can be effectively ensured that prepared nano particle composite material film component and stabilization of uniform size, processing performance be excellent and the high reliablity of low-temperature sintering welding, can be widely applied to preformed solder field.
Description
Technical field
The present invention relates to preformed solder technical fields, and in particular to a kind of welding system of nano particle composite material film
Standby technique.
Background technique
In recent years, used for electronic packaging welding material of the soldering paste especially nano mattisolda as a kind of semisolid, because of its tool
There are good thermal conductivity, electric conductivity, high temperature resistant and suitable low-temperature sintering, encapsulates and lead at high power semi-conductor (such as IGBT)
Domain is concerned.However, cream solder contains more solvent composition, solvent volatilizees during heating, or in sintering reaction
When release gas, will lead to welding layer and form cavity, and then influence thermally conductive, the electric conductivity of weld strength and solder layer.This
Outside, soldering paste generally requires low temperature storage, also to pass through the complicated procedures of forming such as stirring of rising again, printing molding using preceding, both be inconvenient to make
With easy waste again；Moreover, nano mattisolda can not realize large-area welding, it is typically necessary and is plated on soldered surface
Silver, the voidage after welding are also larger.
Preforming nanometer silverskin is a kind of nano particle composite material film, by nano-silver powder, film forming agent, dispersing agent, plasticising
Agent, viscosity modifier, corrosion inhibiter and scaling powder composition, preforming nanometer silverskin available stream prolong method preparation.In the prior art, it is cast
Method be as a kind of important moulding technique for preparing large area, Boping ceramic material, and have no for preformed solder lead
Domain.It also there are no the open report of the preparing craft of welding nano particle composite material film at present.
Summary of the invention
In view of this, it is necessary to for above-mentioned problem, provide a kind of preparation of welding nano particle composite material film
Technique, preparation process of the invention have the characteristics that simple and easy, controllability is strong, high-efficient and at low cost, can be effectively ensured and receive
The ingredient of rice grain composite material film and stabilization of uniform size, processing performance be excellent and the high reliablity of low-temperature sintering welding.
To achieve the above object, the present invention takes technical solution below:
The welding of the invention preparation process of nano particle composite material film, comprising the following steps:
(1) material mixes: first mixing nano particle with appropriate solvent, is then respectively adding film forming agent, dispersing agent, plasticising
Agent, viscosity modifier, corrosion inhibiter and scaling powder are both needed to be sufficiently stirred after the addition of each constitutive material, until being formed uniform
Slurry；
(2) vacuum defoamation: slurry is placed under conditions of vacuum degree is -0.04~-0.1MPa and carries out deaeration 5-30min；
(3) casting film-forming: slurry is uniformly sprawled into certain thickness wet film with casting machine, curtain coating height is 0.1-
2.0mm, curtain coating speed are 0.20-1.0m/min；
(4) it dry solidification: is dried under conditions of temperature is 20-60 DEG C and is formed by curing film；
(5) it post-processes: leveling processing being carried out to the film after dry solidification and cuts molding.
Further, the solvent includes in methanol, ethyl alcohol, ether, acetone, chloroform, methylene chloride and ethyl acetate
It is at least one.
Further, the dosage of the solvent is nano particle, film forming agent, dispersing agent, plasticizer, viscosity modifier, delays
3-8 times for losing the quality summation of agent and scaling powder.
Further, the adding order of the film forming agent, dispersing agent, plasticizer, viscosity modifier, corrosion inhibiter and scaling powder
Successively to be added from high to low according to these boiling point substances.
Further, to be stirred using ultrasonic wave, the power of the ultrasonic wave is 300- for step (1) stirring
1000W, the time of ultrasonic wave stirring are 5-60min.
Further, the nano particle include the metal of silver, copper, aluminium, nickel, gold, tin, zinc, iron, indium, gallium etc., alloy and
One of nano particle of its oxide is a variety of.
Preferably, the nano particle is the nano particle of metallic silver.
The invention has the benefit that
Material mixing order of the invention is reasonable, by boiling point from high to low one by one be added film forming agent, dispersing agent, plasticizer,
Viscosity modifier, corrosion inhibiter and scaling powder are conducive to nano particle and are uniformly dispersed and have good sintering character；The present invention is every
Ultrasonic wave is all made of after a kind of addition of composition to be sufficiently stirred, have efficiently, uniform lasting dispersion effect；Vacuum defoamation
It is avoided that hole occurs in film, guarantees quality of forming film；The tape casting is innovatively applied to welding nano particle composite material
Film is uniformly sprawled, and the technological parameter of casting film-forming and the viscosity of slurry and film forming require to match, simple for process, controllably
Property it is strong and at low cost, the nano particle composite material film of preparation is free of solvent, stores simple, easy to use, and ingredient and size are equal
Even stabilization, processing performance is excellent, the high reliablity of low-temperature sintering welding.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the embodiment of the present invention, to this hair
Bright technical solution work further clearly and completely describes.It should be noted that described embodiment is only the present invention one
Section Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
The present invention can select a variety of nano particles according to welding process requirement, type include silver, copper, aluminium, nickel, gold, tin,
Metal, alloy and its oxide of zinc, iron, indium, gallium etc., wherein the thermally conductive and electric conductivity of metallic silver is best.In addition, nanometer
When the size of particle is nanoscale to submicron order (especially average grain diameter is 10-1000nm), it is more suitable for low-temperature sintering, therefore
Currently preferred nano particle is nano-silver powder.
Nano grain surface is easy absorption organic molecule, and the organic composition of composite material film can be according to boiling during the sintering process
Point sequence from low to high is gradually volatilized decompositions, and the boiling point for the molecule organic layer that nano grain surface innermost layer coats is higher,
Thermal stability is higher, is more conducive to nano particle and keeps uniform dispersibility during the sintering process and have good agglutinating property
Energy.Generally, nano particle be to the adsorption process of organic molecule carried out according to the order of addition of organic matter, therefore the present invention
The adding order and these substances for selecting film forming agent, dispersing agent, plasticizer, viscosity modifier, corrosion inhibiter and scaling powder press boiling point
The sequence consensus arranged from high to low.
Material mixing solvent for use should have good solvability and evaporation rate appropriate, currently preferred solvent
Including at least one of methanol, ethyl alcohol, ether, acetone, chloroform, methylene chloride and ethyl acetate.
Amounts of thickness variation after the viscosity and wet film of the adjustable slurry of the amount of solvent are dry, solvent usage is excessive or mistake
It is small, it is all not easy to film forming or quality of forming film is not high, through experimental study, the present invention selects the dosage of solvent for nano particle, film forming
Agent, 3-8 times of quality summation of dispersing agent, plasticizer, viscosity modifier, corrosion inhibiter and scaling powder.
Compared with convention stir mode, the agitating mode in material mixed process using ultrasonic wave can achieve efficient, equal
Uniform lasting dispersion effect, but the power of ultrasonic wave should be with the ingredient, viscous of the specific gravity of nano particle, surface characteristic and system
The physical property such as degree and surface tension match, if ultrasonic power is less than normal, dispersion effect is undesirable, and ultrasonic power is excessive then easy
Cause system temperature quickly to increase, will lead to nanoparticle agglomerates, it is preferable that the present invention use the power of ultrasonic wave for
300-1000W, the time that ultrasonic wave stirring is carried out after each composition addition is 5-60min.
Nano particle composite material film is mainly used in the high reliability welding of Electronic Packaging, has to welding voidage higher
It is required that therefore film it is continuous fine and close, hole cannot be contained, the present invention avoids film from hole occur by vacuum defoamation, guarantee
Quality of forming film, it is demonstrated experimentally that vacuum degree, which carries out deaeration 5-30min under conditions of being -0.04~-0.1MPa, can reach good
Deaeration effect.
The technological parameter of casting film-forming need to be according to the physical property (such as viscosity and plasticity) of slurry and the application requirement of film
(such as film thickness) determines, when curtain coating height is too small, amount of solder needed for will lead to welding is insufficient, and it is excessive to be cast height
When it will cause solder waste and increased costs, therefore in the technological parameter of casting film-forming of the present invention curtain coating height for 0.1-
2.0mm, curtain coating speed are 0.20-1.0m/min.
The temperature of dry solidification also has large effect to the final molding of composite material film, and when temperature is relatively low, solvent is waved
Hair is slow, and film forming efficiency is low, and temperature too Gao Zehui keeps film shrunk too fast, and residual stress is big and leads to the processing performance of post-processing
It is undesirable, therefore it is 20-60 DEG C that the present invention, which selects the temperature of dry solidification,.
In the present invention, the film forming agent includes polyvinyl alcohol, polyvinylpyrrolidone, polyvinyl butyral and resin type
At least one of organic bond；The dispersing agent includes that polyethyleneimine, polyacrylamide, isobutyl hydramine and fatty acid are sweet
At least one of grease；The plasticizer includes propylene glycol, butanediol, polyethylene glycol, glycerol, butyl oleate, citric acid three
At least one in ethyl ester, tributyl citrate, acetyl triethyl citrate, tributyl 2-acetylcitrate and phthalate
Kind；The viscosity modifier includes methyl acrylate, ethyl acrylate, butyl acrylate, Isooctyl acrylate monomer, the different ice of acrylic acid
Piece ester, isobornyl methacrylate, octadecyl methacrylate, hexamethylene diisocyanate, six methylene of trimethyl
At least one of group diisocyanate and triallyl isocyanurate；The corrosion inhibiter includes dopamine, 3- diethylin third
At least one of amine, morpholine, hydrazine class compound, oxime compound, glyoxaline compound and amino acids；It is described
Scaling powder includes rosin, succinic acid, adipic acid, decanedioic acid, lactic acid, tartaric acid, salicylic acid, phenol, p-tert-butylphenol, adjacent benzene
At least one of diphenol.
Embodiment 1
A kind of welding preparation process of nano particle composite material film mainly includes following using the tape casting
Step:
(1) material mix: first nano-silver powder (average grain diameter 20nm) 8g is mixed with ethyl alcohol (solvent) 30g, then according to
Secondary addition dopamine (corrosion inhibiter) 0.2g, rosin (scaling powder) 0.1g, polyethyleneimine (dispersing agent) 0.1g, polyvinyl alcohol (at
Film) 1.2g, propylene glycol (plasticizer) 0.1g and methyl acrylate (viscosity modifier) 0.3g, it is all needed after each composition addition
60min is stirred in the ultrasonic wave that power is 300W, until forming uniform slurry.
(2) vacuum defoamation: slurry is placed under conditions of vacuum degree is -0.04MPa and carries out deaeration 30min.
(3) slurry: uniformly being sprawled into certain thickness wet film with casting machine by casting film-forming, and curtain coating height is 0.10mm,
Curtain coating speed is 0.20m/min.
(4) dry solidification: being dried solidification under conditions of temperature is 20 DEG C, and film thickness is 0.02mm after solidification.
(5) post-process: leveling handles and cuts into the film square of 10mm × 10mm.
Laminated film prepared by above-mentioned technique is directly welded on copper sheet with low temperature sintering technology, is sintered the condition of welding
Are as follows: 280 DEG C of temperature, pressure 10MPa, sintering time 30min.The voidage of postwelding layer is 1.4-1.6%, and thermal coefficient is
220-230W/mK, shear strength 48-52MPa.
Embodiment 2
A kind of welding preparation process of nano particle composite material film mainly includes following using the tape casting
Step:
(1) material mix: first nano-silver powder (average grain diameter 20nm) 8g is mixed with acetone (solvent) 50g, then according to
Secondary addition dopamine (corrosion inhibiter) 0.2g, rosin (scaling powder) 0.1g, polyethyleneimine (dispersing agent) 0.1g, polyvinyl alcohol (at
Film) 1.2g, propylene glycol (plasticizer) 0.1g and methyl acrylate (viscosity modifier) 0.3g, it is all needed after each composition addition
30min is stirred in the ultrasonic wave that power is 600W, until forming uniform slurry；
(2) vacuum defoamation: slurry is placed under conditions of vacuum degree is -0.08MPa and carries out deaeration 20min.
(3) slurry: uniformly being sprawled into certain thickness wet film with casting machine by casting film-forming, and curtain coating height is 0.80mm,
Curtain coating speed is 0.50m/min.
(4) dry solidification: being dried solidification under conditions of temperature is 40 DEG C, and film thickness is 0.10mm after solidification.
(5) post-process: leveling handles and cuts into the film square of 10mm × 10mm.
Laminated film prepared by above-mentioned technique is directly welded on copper sheet with low temperature sintering technology, is sintered the condition of welding
Are as follows: 280 DEG C of temperature, pressure 10MPa, sintering time 30min.The voidage of postwelding layer is 0.4-0.6%, and thermal coefficient is
240-250W/mK, shear strength 60-65MPa.
Embodiment 3
A kind of welding preparation process of nano particle composite material film mainly includes following using the tape casting
Step:
(1) material mixes: first mixing nano-silver powder (average grain diameter 20nm) 8g with ethyl acetate (solvent) 80g, so
After sequentially add dopamine (corrosion inhibiter) 0.2g, rosin (scaling powder) 0.1g, polyethyleneimine (dispersing agent) 0.1g, polyvinyl alcohol
(film forming agent) 1.2g, propylene glycol (plasticizer) 0.1g and methyl acrylate (viscosity modifier) 0.3g, after each composition addition
All 5min need to be stirred in the ultrasonic wave that power is 1000W, until forming uniform slurry；
(2) vacuum defoamation: slurry is placed under conditions of vacuum degree is -0.1MPa and carries out deaeration 5min.
(3) casting film-forming: slurry is uniformly sprawled into certain thickness wet film with casting machine, curtain coating height is 2.0mm, stream
Prolonging speed is 1.0m/min.
(4) dry solidification: being dried solidification under conditions of temperature is 60 DEG C, and film thickness is 0.20mm after solidification.
(5) post-process: leveling handles and cuts into the film square of 10mm × 10mm.
Laminated film prepared by above-mentioned technique is directly welded on copper sheet with low temperature sintering technology, is sintered the condition of welding
Are as follows: 280 DEG C of temperature, pressure 10MPa, sintering time 30min.The voidage of postwelding layer is 1.7-1.9%, and thermal coefficient is
200-210W/mK, shear strength 50-55MPa.
Comparative example 1
By the order of addition replacement of organic substance in embodiment 1 are as follows: polyethyleneimine (dispersing agent) 0.1g, dopamine are (slow
Lose agent) 0.2g, rosin (scaling powder) 0.1g, polyvinyl alcohol (film forming agent) 1.2g, propylene glycol (plasticizer) 0.1g and acrylic acid first
Ester (viscosity modifier) 0.3g.Remaining processing step and Parameter Conditions are same as Example 1.
Laminated film prepared by above-mentioned technique is directly welded on copper sheet with low temperature sintering technology, is sintered the condition of welding
Are as follows: 280 DEG C of temperature, pressure 10MPa, sintering time 30min.The voidage of postwelding layer is 4-5%, thermal coefficient 130-
150W/mK, shear strength 25-30MPa.
Comparative example 2
Agitating mode in embodiment 1 is replaced with and is stirred with mechanical agitator, stirring rate 200r/min, mixing time
For 60min.Remaining processing step and Parameter Conditions are same as Example 1.
Laminated film prepared by above-mentioned technique is directly welded on copper sheet with low temperature sintering technology, is sintered the condition of welding
Are as follows: 280 DEG C of temperature, pressure 10MPa, sintering time 30min.The voidage of postwelding layer is 3.5-4.0%, and thermal coefficient is
170-180W/mK, shear strength 35-40MPa.
Comparative example 3
The dosage of ethyl acetate (solvent) in embodiment 3 is replaced with into 90g, remaining processing step and Parameter Conditions with reality
It is identical to apply example 3.
Laminated film prepared by above-mentioned technique is directly welded on copper sheet with low temperature sintering technology, is sintered the condition of welding
Are as follows: 280 DEG C of temperature, pressure 10MPa, sintering time 30min.The voidage of postwelding layer is 2.1-2.5%, and thermal coefficient is
190-200W/mK, shear strength 45-50MPa.
Comparative example 4
Curtain coating height in embodiment 3 is replaced with into 0.05mm, remaining processing step and Parameter Conditions with 3 phase of embodiment
Together.
Laminated film prepared by above-mentioned technique is directly welded on copper sheet with low temperature sintering technology, is sintered the condition of welding
Are as follows: 280 DEG C of temperature, pressure 10MPa, sintering time 30min.The voidage of postwelding layer is 8-10%, thermal coefficient 100-
110W/mK, shear strength 20-25MPa.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (4)
1. the preparation process that nano particle composite material film is used in a kind of welding, which comprises the following steps:
(1) material mix: first nano particle is mixed with appropriate solvent, be then respectively adding film forming agent, dispersing agent, plasticizer,
Viscosity modifier, corrosion inhibiter and scaling powder are both needed to be sufficiently stirred after the addition of each constitutive material, until forming uniform slurry
Material；
(2) vacuum defoamation: slurry is placed under conditions of vacuum degree is -0.04~-0.1MPa and carries out deaeration 5-30min；
(3) casting film-forming: slurry is uniformly sprawled into certain thickness wet film with casting machine, curtain coating height is 0.1-2.0mm, stream
Prolonging speed is 0.20-1.0m/min；
(4) it dry solidification: is dried under conditions of temperature is 20-60 DEG C and is formed by curing film；
(5) it post-processes: leveling processing being carried out to the film after dry solidification and cuts molding；
The dosage of the solvent is nano particle, film forming agent, dispersing agent, plasticizer, viscosity modifier, corrosion inhibiter and scaling powder
3-8 times of quality summation；
The film forming agent, dispersing agent, plasticizer, viscosity modifier, corrosion inhibiter and scaling powder adding order be according to these objects
Matter boiling point successively adds from high to low；
Step (1) stirring is is stirred using ultrasonic wave, and the power of the ultrasonic wave is 300-1000W, and ultrasonic wave stirs
The time mixed is 5-60min.
2. the preparation process that nano particle composite material film is used in welding according to claim 1, which is characterized in that described molten
Agent includes at least one of methanol, ethyl alcohol, ether, acetone, chloroform, methylene chloride and ethyl acetate.
3. the preparation process that nano particle composite material film is used in welding according to claim 1, which is characterized in that described to receive
Rice grain is the nano particle of metallic silver.
4. the preparation process that nano particle composite material film is used in welding according to claim 1, which is characterized in that described to receive
Rice grain includes one in the nano particle of silver, copper, aluminium, nickel, gold, tin, zinc, iron, indium, the metal of gallium, alloy and its oxide
Kind is a variety of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611241228.5A CN106751277B (en) | 2016-12-29 | 2016-12-29 | A kind of welding preparation process of nano particle composite material film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611241228.5A CN106751277B (en) | 2016-12-29 | 2016-12-29 | A kind of welding preparation process of nano particle composite material film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106751277A CN106751277A (en) | 2017-05-31 |
| CN106751277B true CN106751277B (en) | 2019-06-21 |
Family
ID=58924135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611241228.5A Active CN106751277B (en) | 2016-12-29 | 2016-12-29 | A kind of welding preparation process of nano particle composite material film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106751277B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107778504B (en) * | 2017-10-31 | 2020-09-08 | 吉林省中科聚合工程塑料有限公司 | Continuous preparation method of soluble polyarylethersulfone film |
| CN110640354B (en) * | 2019-08-27 | 2022-03-04 | 北京康普锡威科技有限公司 | Preformed solder and preparation method thereof |
| CN111715878A (en) * | 2020-07-01 | 2020-09-29 | 西安交通大学 | High-performance composite nano bonding material and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1888465A4 (en) * | 2005-05-10 | 2010-12-29 | Nanoproducts Corp | Tungsten comprising nanomaterials and related nanotechnology |
| CN103894695A (en) * | 2014-04-22 | 2014-07-02 | 太原理工大学 | Method for welding CVD diamond thick film and hard alloy |
| CN105513668A (en) * | 2016-01-25 | 2016-04-20 | 深圳市思迈科新材料有限公司 | Conductive silver paste for nano-silver film low-temperature setting and preparation method thereof |
| CN205564798U (en) * | 2016-04-19 | 2016-09-07 | 无锡奥特维科技股份有限公司 | Welding pad pasting equipment of battery piece |
-
2016
- 2016-12-29 CN CN201611241228.5A patent/CN106751277B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1888465A4 (en) * | 2005-05-10 | 2010-12-29 | Nanoproducts Corp | Tungsten comprising nanomaterials and related nanotechnology |
| CN103894695A (en) * | 2014-04-22 | 2014-07-02 | 太原理工大学 | Method for welding CVD diamond thick film and hard alloy |
| CN105513668A (en) * | 2016-01-25 | 2016-04-20 | 深圳市思迈科新材料有限公司 | Conductive silver paste for nano-silver film low-temperature setting and preparation method thereof |
| CN205564798U (en) * | 2016-04-19 | 2016-09-07 | 无锡奥特维科技股份有限公司 | Welding pad pasting equipment of battery piece |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106751277A (en) | 2017-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5651113B2 (en) | Joining material and joining method using metal nanoparticles | |
| CN109317859B (en) | Nano copper soldering paste, preparation method thereof and copper-copper bonding method | |
| CN106751277B (en) | A kind of welding preparation process of nano particle composite material film | |
| WO2017033911A1 (en) | Metal paste having excellent low-temperature sinterability and method for producing the metal paste | |
| CN101555393B (en) | High-temperature resistant one-component isotropic conductive adhesive and preparation method thereof | |
| CN104759725B (en) | A kind of method using micro/nano level metallic particles filling Sn parent metal to realize electronic building brick High-temperature Packaging | |
| CN108847395B (en) | Preparation and packaging method of presintered nano-network silver film for low-temperature quick connection | |
| JP6153077B2 (en) | Metal nanoparticle paste, bonding material containing the same, and semiconductor device using the same | |
| CN108735339A (en) | A kind of high performance sintered conductive silver paste and preparation method thereof and sintering method | |
| WO2018131095A1 (en) | Copper paste for pressureless bonding, bonded body and semiconductor device | |
| JP2017103180A (en) | Copper paste non-pressure conjugation, conjugation, and semiconductor device | |
| WO2008062548A1 (en) | Pasty metal particle composition and method of joining | |
| JP2003234586A5 (en) | ||
| CN102290117A (en) | Low temperature-sintered nano silver paste and preparation method thereof | |
| CN104650789B (en) | A kind of anisotropy conductiving glue and method for packing | |
| CN105949903B (en) | A kind of high efficiency and heat radiation coating and its application process | |
| JP4876979B2 (en) | Joining member and joining method | |
| CN106457404A (en) | Method for manufacturing metal powder | |
| CN106118539A (en) | A kind of conductive silver glue of silver-doped nano-particle and preparation method and application | |
| Wang et al. | Brief review of nanosilver sintering: manufacturing and reliability | |
| CN106783768B (en) | A kind of preforming nanometer silverskin | |
| CN110430951A (en) | Engagement metal thickener, conjugant and its manufacturing method and semiconductor device and its manufacturing method | |
| CN110461504A (en) | Engagement metal thickener, conjugant and its manufacturing method and semiconductor device and its manufacturing method | |
| Khairi Faiz et al. | Low temperature Cu–Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn–Bi eutectic powders | |
| CN107350663A (en) | Liquid metal enhancing base nano mattisolda thermal interfacial material and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220915 Address after: Room 404, Building B, No. 58, Nanyun 2nd Road, Science City, Huangpu District, Guangzhou City, Guangdong Province, 510663 Patentee after: Guangzhou Hanyuan microelectronic packaging material Co.,Ltd. Address before: 510663 No.58, Nanyun 2nd Road, Science City, Guangzhou hi tech Industrial Development Zone, Guangzhou City, Guangdong Province Patentee before: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. |
|
| TR01 | Transfer of patent right |