CN106686895A - Surface treatment method for printed circuit board - Google Patents
Surface treatment method for printed circuit board Download PDFInfo
- Publication number
- CN106686895A CN106686895A CN201611261943.5A CN201611261943A CN106686895A CN 106686895 A CN106686895 A CN 106686895A CN 201611261943 A CN201611261943 A CN 201611261943A CN 106686895 A CN106686895 A CN 106686895A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- pcb
- surface treatment
- treatment method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/086—Using an inert gas
Abstract
The invention belongs to the technical field of manufacturing of a printed circuit board, and relates to a surface treatment method for the printed circuit board. The surface treatment method comprises the steps of cutting, performing tin immersion, baking for the first time, carbon oil printing, baking for the second time and performing board routing and shaping. The printed circuit board is directly formed by performing tin immersion on the copper surface, so that the surface is smooth; nitrogen is low in cost, and the problem of blackening caused by an electrochemical reaction due to contact between the newly generated tin surface and oxygen or water vapor can be effectively avoided; the manufacturing method is short in technological process, high in processing efficiency and suitable for batch production; and the carbon coil is formed on the outer layer, so that the wear-resisting property can be fully embodied.
Description
Technical field
The present invention relates to printed circuit board (PCB) manufacturing technology field, the good printed circuit board (PCB) of more particularly to a kind of low cost effect
Surface treatment method.
Background technology
The surface treatment mode of PCB (i.e. printed circuit board (PCB)) has a lot, such as sprays stannum, turmeric, heavy stannum etc..Ensure that PCB's
Reliability, corrosion resistance and wearability.
Carbon oil is due to good electric conductivity, hardness high abrasion scrape along low cost, being generally used for button class formation
Pcb board, due to interior for surface treatment modes such as turmeric+carbon oil technique, spray stannum+carbon oil technique, OSP+ carbon oil techniques in industry
Can be mass, and carbon oil+heavy process of tin is can be mass because there is carbon oil and stannum face, not only, it is right
In carbon oil+heavy process of tin, the following two kinds mode operation is typically adopted in current industry during production, is cut both ways：
1st, first sink stannum after carbon oil：Carbon oil printing is carried out after the heavy stannum of PCB surface.This method processing is fast, low cost, but carbon
After oil is printed on the heavy stannum of copper face, carbon oil needs to experience baking process, but the high temperature of baking can cause stannum face to aoxidize, and occur blacking
Phenomenon, affects the weldability of PCB.
2nd, heavy stannum after first carbon oil：One layer of blue glue is added a cover on carbon oil surface after carbon oil printing to be protected, and carbon oil is prevented heavy
Attacked by liquid medicine during golden stannum and cause carbon oil, again blue glue is torn after heavy stannum.This method needs to increase the blue glue of print and tears blue glue
Work flow and production cost, and the easy permeability of blue glue on pad, cause heavy stannum dew copper, and with the existing operating type of industry,
Such as using direct heavy stannum after oil, liquid medicine can be attacked carbon oil, cause carbon oil to come off.
Therefore, it is necessary to provide a kind of new method to solve the above problems.
The content of the invention
Present invention is primarily targeted at providing a kind of surface treatment method of the good printed circuit board (PCB) of low cost effect.
The present invention is achieved through the following technical solutions above-mentioned purpose：The surface treatment method of printed circuit board (PCB), step include：
1. sawing sheet process is carried out to printed circuit board (PCB)；
2. carry out heavy stannum to process to printed circuit board (PCB)；
3. first time baking is carried out to printed circuit board (PCB) in the nitrogen atmosphere of flowing；
4. carbon oil is printed on a printed circuit；
5. second baking is carried out to printed circuit board (PCB) in nitrogen atmosphere；
6. gong sheet metal forming process is carried out to printed circuit board (PCB).
Specifically, when 3. the step toasts for the first time, design temperature is 110 DEG C, and the time is 10 minutes.
Specifically, when 5. the step toasts for second, design temperature is 155 DEG C, and the time is 90 minutes.
Specifically, when the carbon oil thickness is less than 15 μm, using 51T silk screen printings；Otherwise carried out twice using 77T silk screens
Printing.
Using above-mentioned technical proposal, the beneficial effect of technical solution of the present invention is：
1st, heavy stannum straight forming on copper face, surface are smooth.
2nd, nitrogen is with low cost but effectively prevent newborn stannum face and contacts with oxygen or vapor and produce electrochemical reaction
And cause On Blackening.
3rd, technological process is short, high in machining efficiency, is adapted to batch production.
4th, carbon oil is molded over outer layer, can fully demonstrate its wearability.
Specific embodiment
The present invention is described in further detail with reference to specific embodiment.
The surface treatment method of printed circuit board (PCB), is operated in accordance with the following steps：
1. sawing sheet process is carried out to printed circuit board (PCB).Sawing sheet process is according to conventional parameter operation.
2. carry out heavy stannum to process to printed circuit board (PCB).Heavy stannum is that directly occur on copper face, therefore the stannum face for being obtained
Than more uniform, the surface of acquisition is more smooth for thickness.
3. first time baking is carried out to printed circuit board (PCB) in the nitrogen atmosphere of flowing, first time baking temperature is 110 DEG C,
Time is 10 minutes.Because stannum face is oxidizable, particularly easily there is electrochemical reaction in the presence of water and
Stannum face is caused to black, it is therefore desirable to first to drain oxygen with the nitrogen of flowing.Dry the boiling point that temperature is slightly above water, therefore stannum face
The moisture of upper residual also can evaporate quickly is drained by nitrogen again.Used nitrogen is with low cost, eliminates what stannum face was harmful to
Composition, it is low for equipment requirements.Because current baking only needs to fall a small amount of moisture evaporation in residual tin face, dry the time compared with
Short, energy cost is not high.
4. carbon oil is printed on a printed circuit.Carbon oil can cover local stannum face, because carbon oil is molded over outer layer, can
To fully demonstrate its wearability.It is noted herein that, when carbon oil thickness is less than 15 μm, using 51T silk screen printings；Otherwise adopt
Printed with 77T silk screens twice.
5. second baking is carried out to circuit board in nitrogen atmosphere, second baking temperature is 155 DEG C, and the time is 90 points
Clock.Second baking makes carbon oil be dried and heat shrinkable, removes the steam inside carbon oil.Because stannum face is also locally exposed to
Outward, it is therefore desirable to which nitrogen is protected.
6. gong sheet metal forming process is carried out to printed circuit board (PCB).After gong plate, printed circuit board (PCB) can just complete to process, full technique
Step is few, and the time is short, therefore process velocity is fast, is more suitable for batch production.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art, not
On the premise of departing from the invention design, some deformations and improvement can also be made, these belong to the protection model of the present invention
Enclose.
Claims (4)
1. the surface treatment method of printed circuit board (PCB), it is characterised in that step includes：
1. sawing sheet process is carried out to printed circuit board (PCB)；
2. carry out heavy stannum to process to printed circuit board (PCB)；
3. first time baking is carried out to printed circuit board (PCB) in the nitrogen atmosphere of flowing；
4. carbon oil is printed on a printed circuit；
5. second baking is carried out to printed circuit board (PCB) in nitrogen atmosphere；
6. gong sheet metal forming process is carried out to printed circuit board (PCB).
2. the surface treatment method of printed circuit board (PCB) according to claim 1, it is characterised in that：The step is 3. for the first time
During baking, design temperature is 110 DEG C, and the time is 10 minutes.
3. the surface treatment method of printed circuit board (PCB) according to claim 1, it is characterised in that：5. second of the step
During baking, design temperature is 155 DEG C, and the time is 90 minutes.
4. the surface treatment method of printed circuit board (PCB) according to claim 1, it is characterised in that：The carbon oil thickness is less than
When 15 μm, using 51T silk screen printings；Otherwise printed using 77T silk screens twice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611261943.5A CN106686895A (en) | 2016-12-30 | 2016-12-30 | Surface treatment method for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611261943.5A CN106686895A (en) | 2016-12-30 | 2016-12-30 | Surface treatment method for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106686895A true CN106686895A (en) | 2017-05-17 |
Family
ID=58848820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611261943.5A Pending CN106686895A (en) | 2016-12-30 | 2016-12-30 | Surface treatment method for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106686895A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548307A (en) * | 2018-12-21 | 2019-03-29 | 遂宁市广天电子有限公司 | A kind of carbon oil plate and preparation method thereof |
| US11408076B2 (en) | 2019-10-10 | 2022-08-09 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Method and apparatus for performing immersion tin process or copper plating process in the production of a component carrier |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102469700A (en) * | 2010-11-12 | 2012-05-23 | 北大方正集团有限公司 | Method for manufacturing circuit board and circuit board |
| CN102802363A (en) * | 2012-08-27 | 2012-11-28 | 长沙牧泰莱电路技术有限公司 | Printed circuit board and manufacturing method thereof |
| CN102917551A (en) * | 2012-10-26 | 2013-02-06 | 景旺电子（深圳）有限公司 | Printed circuit board surface processing method and printed circuit board |
| CN105163506A (en) * | 2015-08-04 | 2015-12-16 | 深圳市景旺电子股份有限公司 | Composite surface treatment method for PCB |
-
2016
- 2016-12-30 CN CN201611261943.5A patent/CN106686895A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102469700A (en) * | 2010-11-12 | 2012-05-23 | 北大方正集团有限公司 | Method for manufacturing circuit board and circuit board |
| CN102802363A (en) * | 2012-08-27 | 2012-11-28 | 长沙牧泰莱电路技术有限公司 | Printed circuit board and manufacturing method thereof |
| CN102917551A (en) * | 2012-10-26 | 2013-02-06 | 景旺电子（深圳）有限公司 | Printed circuit board surface processing method and printed circuit board |
| CN105163506A (en) * | 2015-08-04 | 2015-12-16 | 深圳市景旺电子股份有限公司 | Composite surface treatment method for PCB |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548307A (en) * | 2018-12-21 | 2019-03-29 | 遂宁市广天电子有限公司 | A kind of carbon oil plate and preparation method thereof |
| US11408076B2 (en) | 2019-10-10 | 2022-08-09 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Method and apparatus for performing immersion tin process or copper plating process in the production of a component carrier |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170517 |
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| RJ01 | Rejection of invention patent application after publication |