CN106489199A - 半导体装置用接合线 - Google Patents
半导体装置用接合线 Download PDFInfo
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- CN106489199A CN106489199A CN201580002424.4A CN201580002424A CN106489199A CN 106489199 A CN106489199 A CN 106489199A CN 201580002424 A CN201580002424 A CN 201580002424A CN 106489199 A CN106489199 A CN 106489199A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
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- B23K35/24—Selection of soldering or welding materials proper
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- B23K35/3013—Au as the principal constituent
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Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wire Bonding (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
Claims (8)
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JP2015-120509 | 2015-06-15 | ||
PCT/JP2015/070861 WO2016203659A1 (ja) | 2015-06-15 | 2015-07-22 | 半導体装置用ボンディングワイヤ |
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CN202110317355.3A Pending CN113078134A (zh) | 2015-06-15 | 2016-05-19 | 半导体装置用接合线 |
CN201680002657.9A Pending CN106688086A (zh) | 2015-06-15 | 2016-05-19 | 半导体装置用接合线 |
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JP (5) | JP2017005240A (zh) |
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Cited By (3)
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CN111033706A (zh) * | 2017-08-09 | 2020-04-17 | 日铁化学材料株式会社 | 半导体装置用Cu合金接合线 |
CN111418047A (zh) * | 2017-12-28 | 2020-07-14 | 日铁新材料股份有限公司 | 半导体装置用接合线 |
CN113557595A (zh) * | 2019-03-13 | 2021-10-26 | 日铁新材料股份有限公司 | 接合线 |
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DE112015004422B4 (de) | 2015-06-15 | 2020-02-13 | Nippon Micrometal Corporation | Bonddraht für Halbleitervorrichtung |
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WO2017221434A1 (ja) * | 2016-06-20 | 2017-12-28 | 日鉄住金マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
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CN110284023B (zh) * | 2019-07-22 | 2021-02-26 | 安徽广宇电子材料有限公司 | 一种铜合金键合丝及其制备方法和应用 |
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KR20220091299A (ko) | 2020-12-23 | 2022-06-30 | 이하준 | 부상 방지를 위한 리프팅 벨트 |
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US11929343B2 (en) | 2021-06-25 | 2024-03-12 | Nippon Micrometal Corporation | Bonding wire for semiconductor devices |
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KR20240026929A (ko) * | 2021-06-25 | 2024-02-29 | 닛데쓰마이크로메탈가부시키가이샤 | 반도체 장치용 본딩 와이어 |
JPWO2022270049A1 (zh) * | 2021-06-25 | 2022-12-29 | ||
CN115803856B (zh) * | 2021-06-25 | 2023-08-18 | 日铁新材料股份有限公司 | 半导体装置用接合线 |
WO2022270050A1 (ja) * | 2021-06-25 | 2022-12-29 | 日鉄マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
JP7072126B1 (ja) | 2022-02-10 | 2022-05-19 | 田中貴金属工業株式会社 | Ag-Pd-Cu系合金からなるプローブピン用材料 |
US20240266313A1 (en) * | 2022-06-24 | 2024-08-08 | Nippon Steel Chemical & Material Co., Ltd. | Bonding wire for semiconductor devices |
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