CN106489122A

CN106489122A - Contact panel sensor electroconductive laminate and its manufacture method, contact panel sensor, contact panel

Info

Publication number: CN106489122A
Application number: CN201580037233.1A
Authority: CN
Inventors: 吉田昌史; 塚本直树
Original assignee: Fujifilm Corp
Current assignee: Fujifilm Corp
Priority date: 2014-07-31
Filing date: 2015-07-22
Publication date: 2017-03-08
Anticipated expiration: 2035-07-22
Also published as: JPWO2016017486A1; TW201617810A; WO2016017486A1; CN106489122B; JP6295330B2

Abstract

The present invention provides the detecting electrode contact panel sensor electroconductive laminate high with the electrical connectivity of wiring lead, its manufacture method, contact panel sensor and contact panel.The contact panel sensor electroconductive laminate of the present invention has substrate, the resin bed with the functional group interacting with plating catalyst or its precursor of neighboring area on substrate for the configuration, configure the detecting electrode on substrate with resin bed according to the mode that one end is contacted, and the wiring lead of the configuration one end electrical connection with detecting electrode on the resin layer, wiring lead is the distribution by least having the formation of the method for following operations, in this operation, give plating catalyst or its precursor to resin bed, plating is carried out for the resin bed having been assigned plating catalyst or its precursor.

Description

Contact panel sensor electroconductive laminate and its manufacture method, contact panel pass Sensor, contact panel

【Technical field】

The present invention relates to contact panel sensor electroconductive laminate and its manufacture method and contact panel sensor, Contact panel.

【Background technology】

The conductive film defining elecroconductive thin line on substrate is used in various uses, particularly in recent years, with The rising of installation rate on mobile phone, portable game machine etc. for the contact panel, is capable of the electrostatic capacitance mode of multiple spot detection The demand of the conductive film of contact panel sensor rapidly increase.

With regard to having given play to the conductive layer of function as the wiring lead containing in contact panel sensor conductive film Manufacture method, it is proposed that various method, for example, Patent Document 1 discloses following methods, in the method, for having The graft polymers formation zone of interaction group gives electroless plating catalyst or its precursor, carries out electroless plating Cover, to make conductive layer.

【Prior art literature】

【Patent documentation】

Patent documentation 1：Japanese Unexamined Patent Publication 2008-207401 publication

【Content of the invention】

【Invent problem to be solved】

In patent documentation 1, describing conductive layer can be used as " electrode (detecting electrode) in connection contact panel and driving The guiding distribution (wiring lead) of device " has given play to function this point, but has no record with regard to its concrete composition.

The inventors discovered that, when the method recorded with reference to patent documentation 1 makes conductive layer in the form of wiring lead, It may happen that conduction is bad between detecting electrode.

In view of the foregoing, the problem of the present invention is to provide detecting electrode touch high with the electrical connectivity of wiring lead Control panel sensors electroconductive laminate.

Additionally, the problem of the present invention also resides in the manufacturer providing above-mentioned contact panel sensor electroconductive laminate Method, the contact panel sensor comprising contact panel sensor electroconductive laminate and contact panel.

【Means to solve the problem】

The present inventor has made intensive studies for problem of the prior art, it was found that being had by control and plating The resin bed of functional group of catalyst or the interaction of its precursor and the position relationship of detecting electrode, can solve the problem that above-mentioned problem.

That is, the inventors discovered that, be configured to solve above-mentioned problem using following.

(1) a kind of contact panel sensor electroconductive laminate, it has：

Substrate；

Resin bed, its configuration neighboring area on substrate, be there is the official being interacted with plating catalyst or its precursor Can group；

Detecting electrode, it configures on substrate according to the mode that one end is contacted with resin bed；And

Wiring lead, its configuration on the resin layer, is electrically connected with the one end of detecting electrode；

Wiring lead is the distribution by least having the formation of the method for following operations, in this operation, resin bed is assigned Give plating catalyst or its precursor, plating is carried out for the resin bed having been assigned plating catalyst or its precursor.

(2) the contact panel sensor electroconductive laminate as described in (1), wherein,

This laminate has insulating barrier further, and this insulating barrier is upper with what wiring lead was electrically connected according to detecting electrode State the mode that one end exposes and cover detecting electrode；

Contain substantially no the functional group interacting with plating catalyst or its precursor in a insulating layer.

(3) the contact panel sensor electroconductive laminate as described in (1) or (2), wherein,

Contain coloring agent in resin bed, resin bed is as decorative layer function；

The one end of detecting electrode extends on resin bed.

(4) the contact panel sensor electroconductive laminate as described in (1) or (2), wherein,

Resin bed is the lamination type resin bed comprising downside resin bed and upside resin bed, and on the downside of this, resin bed contains coloring Agent, on the upside of this, resin bed configures on the resin bed of downside, has the functional group interacting with plating catalyst or its precursor；

The one end of detecting electrode extends on the resin bed of upside.

(5) the contact panel sensor electroconductive laminate as described in (1) or (2), wherein,

Resin bed is the lamination type resin bed comprising downside resin bed and upside resin bed, and on the downside of this, resin bed contains coloring Agent, on the upside of this, resin bed configures in a part for downside resin bed, has and interacts with plating catalyst or its precursor Functional group；

The one end of detecting electrode extends on the resin bed of downside, and on the resin bed of downside, one end and upside resin bed connect Touch.

(6) the contact panel sensor electroconductive laminate as described in any one of (1)～(5), wherein, substrate is glass Glass substrate.

(7) a kind of contact panel sensor, it comprises the contact panel sensor described in any one of (1)～(6) with leading Electrically laminate.

(8) a kind of contact panel, it comprises the contact panel sensor conductive layer described in any one of (1)～(6) Long-pending body.

(9) a kind of manufacture method of contact panel sensor electroconductive laminate, it has following operations：

Operation A, in this operation, the neighboring area on substrate is formed to be had and plating catalyst or its precursor phase interaction The resin bed of functional group；

Process B, in this operation, forms detecting electrode, the one end of this detecting electrode extends to resin bed on substrate On, this detecting electrode is contacted with resin bed；

Operation C, in this operation, implements operation C-1 and operation C-2 with sequentially differing, in operation C-1, in resin bed Upper formation Resist patterns；In operation C-2, formed and contain substantially no the official interacting with plating catalyst or its precursor The insulating barrier that can roll into a ball, this insulating barrier covers detection electricity according to the mode that the one end of the detecting electrode being contacted with resin bed is exposed Pole；And

Step D, in this operation, on resin bed do not formed Resist patterns region give plating catalyst or Its precursor, carries out plating for the resin bed having been assigned plating catalyst or its precursor, forms with detecting electrode The wiring lead of end electrical connection.

(10) a kind of manufacture method of contact panel sensor electroconductive laminate, it has following operations：

Operation E, in this operation, the neighboring area on substrate forms the downside resin bed containing coloring agent；

Operation F, in this operation, forms one end on substrate and extends to the detecting electrode on the resin bed of downside；

Operation G, in this operation, implements operation G-1 and operation G-2 with sequentially differing, in operation G-1, formation has The upside resin bed of the functional group interacting with plating catalyst or its precursor, on the upside of this, resin bed configures in downside resin bed A part on, and on the upside of this, resin bed is contacted with detecting electrode；In operation G-2, formed and contain substantially no and plating The insulating barrier of the functional group of catalyst or the interaction of its precursor, this insulating barrier is according to the detecting electrode contacting with upside resin bed The mode exposed of one end cover detecting electrode；And

Step H, in this operation, is formed electric with the one end of detecting electrode by the method at least with following operations The wiring lead connecting, in this operation, gives plating catalyst or its precursor to upside resin bed, for having been assigned plating The upside resin bed of catalyst or its precursor carries out plating.

【The effect of invention】

In accordance with the invention it is possible to provide a kind of detecting electrode the contact panel sensing high with the electrical connectivity of wiring lead Device electroconductive laminate.

Additionally, in accordance with the present invention it is further possible to provide the manufacture method of above-mentioned contact panel sensor electroconductive laminate, Comprise contact panel sensor and the contact panel of contact panel sensor electroconductive laminate.

【Brief description】

Fig. 1 is the top view of the 1st embodiment of the contact panel sensor electroconductive laminate of the present invention.

Fig. 2 is the sectional view being cut off along the cutting line A-A shown in Fig. 1.

Fig. 3 is an embodiment party of the manufacture method illustrating contact panel sensor electroconductive laminate by process sequence The sectional view of formula.

Fig. 4 is the top view of the 2nd embodiment of the contact panel sensor electroconductive laminate of the present invention.

Fig. 5 is the sectional view being cut off along the cutting line B-B shown in Fig. 4.

Fig. 6 is the top view of the 3rd embodiment of the contact panel sensor electroconductive laminate of the present invention.

Fig. 7 is the sectional view being cut off along the cutting line C-C shown in Fig. 6.

【Specific embodiment】

Contact panel sensor electroconductive laminate to the present invention and its manufacture method, contact panel sensing below Device and contact panel are described in detail.

It should be noted that in this manual, use "～" numerical range that represents refer to comprise "～" before and after remembered The numerical value carrying is as the scope of lower limit and higher limit.In addition, the figure in the present invention is schematic diagram, the thickness relationship of each layer, position Putting relation etc. not necessarily must be consistent with practical situation.

One of characteristic point of contact panel sensor electroconductive laminate as the present invention, can enumerate according to containing The mode that the resin bed of particular functional group is contacted with detecting electrode carries out configuring this point.By using such configuration, as (this metal plating layer is for the resin bed enforcement plating having been assigned plating catalyst or its precursor to metal plating layer Formed) wiring lead and detecting electrode be fully contacted the electrically conducting it can be ensured that between the two.

Additionally, one of further feature point as the present invention, the side exposed according to the one end of detecting electrode can be enumerated Formula covers the insulating barrier this point of detecting electrode to arrange.By arrange insulating barrier, for have been assigned plating catalyst or When the resin bed of its precursor carries out plating, precipitation on detecting electrode for the plating thing, as a result, Neng Goujin can be suppressed One step suppresses the generation of the conducting between detecting electrode.

<<1st embodiment>>

The top view of the 1st embodiment of the contact panel sensor electroconductive laminate of the present invention is shown in Fig. 1. Fig. 2 is the sectional view being cut off along cutting line A-A.It should be noted that in this manual, accompanying drawing is in order to easy to understand The figure that each layer constitutes and schematically shown, not for the figure of Precise Representation each layer configuration.

Contact panel sensor electroconductive laminate 10 shown in Fig. 1 possesses：Substrate 12, configuration week on the substrate 12 Border area domain E_OResin bed 14, on the substrate 12 by neighboring area E_OThe middle section E surrounding_IThe of more than 2 of upper configuration 1 detecting electrode 16 and the 2nd detecting electrode 18, configuration are electric with the 1st detecting electrode 16 and the 2nd detecting electrode 18 on resin bed 14 More than 2 wiring leads 20 that gas connects and configuring according to the mode covering the 1st detecting electrode 16 and the 2nd detecting electrode 18 In middle section E_IInsulating barrier 22.

The contact panel sensor electroconductive laminate 10 of present embodiment has composition input area (as touch-control Panel sensors use when, this input area can carry out input operation by user) middle section E_I, and centrally located Region E_IOutside neighboring area E_O.It should be noted that with regard to middle section, being the area of configuration detecting electrode as mentioned above Domain；With regard to neighboring area E_O, it is the exterior lateral area (neighboring area) of the configuration wiring lead outside middle section.

Below above-mentioned composition is described in detail.

[substrate]

Substrate 12 has 2 interareas, for undertaking the part of following effects：It is in middle section E_ISupport the 1st detecting electrode 16 and the 2nd detecting electrode 18, simultaneously in neighboring area E_OSupporting resin bed 14.In addition, in FIG, neighboring area E_OIt is from substrate The region close with neighboring that 12 neighboring extends to center side, is formed as rectangular box-like, but is not limited to this form, can With arbitrarily as cardioid, egg shape, round etc..

The species of substrate 12 is not particularly limited, for example, can enumerate insulated substrate, more specifically, it is possible to use resin Substrate, ceramic substrate, glass substrate etc., preferably glass substrate.

As the material of resin substrate, for example, can enumerate polyethylene terephthalate, poly- naphthalenedicarboxylic acid ethylene glycol Ester, polyether sulfone, polyacrylic based resin, polyurethane series resin, polyester, Merlon, polysulfones, polyamide, polyarylate, polyene Hydrocarbon, cellulose-based resin, polrvinyl chloride, cyclic olefine resin etc..Wherein preferred polyethylene terephthalate, poly- naphthalene diformazan Sour glycol ester or polyolefin.

Resin substrate preferably carries hard conating.Hard conating is preferably disposed to the polyethylene terephthalate on surface, poly- naphthalene Naphthalate or polyolefin, hard conating is more preferably located at polyethylene terephthalate, the polyolefin on surface.

The thickness (mm) of substrate 12 is not particularly limited, from the aspect of the balance of treatability and slimming, resin base Plate is preferably 0.01～2mm, more preferably 0.02～1mm, most preferably 0.03～0.1mm.Additionally, glass substrate is preferably 0.01～2mm, more preferably 0.3～0.8mm, most preferably 0.4～0.7mm.

Additionally, substrate 12 preferably properly passes through light.Specifically, the total light transmittance of substrate 12 be preferably 85～ 100%.

[resin bed]

Resin bed 14 is configuration whole neighboring area E on the substrate 12_OLayer, be have with plating catalyst or its before The layer of functional group's (being hereinafter also referred to simply as " interaction group ") of body phase interaction.Resin bed 14 is according to interaction Property group function (attachment) is adsorbed for the plating catalyst that used or its precursor when making wiring lead.That is, Resin bed 14 has given play to the function of the good receiving layer (so-called plated coating) as plating catalyst or its precursor.

It should be noted that as mentioned below, resin bed 14 preferably comprises coloring agent and has given play to as so-called dress The function of decorations layer.That is, resin bed 14 has preferably also been given play to as decorative layer while having given play to the function as plated coating Function.It should be noted that so-called decorative layer is to recognize contact panel sensor electroconductive laminate 10 from substrate 12 side-looking When can cover the layer of wiring lead 20, the effect as the layer for improving aesthetic property can have been given play to.

The thickness of resin bed 14 is not particularly limited, from the aspect of productivity ratio, preferably 5～100 μm, more preferably 10～70 μm, more preferably 20～60 μm.

Interaction group contained by resin bed 14 means can be with the plating catalyst being imparted to resin bed 14 Or its precursor occurs the functional group of interaction, for example can use can be mutual with plating catalyst or its precursor formation electrostatic The functional group of effect or the nitrogen-containing functional group being coordinated with plating catalyst or the formation of its precursor, sulfur-bearing functional group, oxygen-containing official Can roll into a ball etc..

As interaction group, more specifically, can enumerate：Amino, amide groups, imide, urea groups, tertiary ammonia Base, ammonium, amidino groups, triazine ring, triazole ring, benzotriazole base, imidazole radicals, benzimidazolyl, quinolyl, pyridine radicals, pyrimidine radicals, Pyrazinyl, quinazolyl, quinoxalinyl, purine radicals, triazine radical, piperidyl, piperazinyl, pyrrolidinyl, pyrazolyl, anilino-, Group containing alkyl amine structure, the group containing isocyanide urea structure, nitro, nitroso-group, azo group, diazo, azido, cyanogen The nitrogen-containing functional groups such as base, cyanic acid ester group；Ether, hydroxyl, phenolic hydroxyl group, carboxylic acid group, carbonate group, carbonyl, ester group, containing N- oxidation The oxygen-containing functional groups such as the group of thing structure, the group containing S- oxide structure, the group containing N- hydroxyl structure；Thienyl, Thiol, ghiourea group, thio cyanuric acid base, benzothiazolyl, mercapto-triazine base, thioether group, sulfur epoxide (チオキシ yl), Asia Sulfuryl, sulfuryl, sulfurous acid alkali, the group containing sulphoxide imine structure, the group containing sulfoxide salt structure, sulfonic group, contain The sulfur-bearing such as group of sulfonic acid ester structure functional group；Phosphate ester (ホス Off ォト) base, phosphinylidyne amido, phosphino-, containing phosphate ester knot The phosphorous functional group such as group of structure；Group containing halogen atoms such as chlorine, bromines etc., in the functional group that can adopt salt structure, also may be used With using their salt.

Wherein, the reason high for polarity and plating catalyst or its precursor etc. absorbability is high, particularly preferred carboxylic acid Base, sulfonic group, phosphate and boronate isoiony polar group, ether or cyano group, further preferred carboxylic acid group's (carboxyl) or Cyano group.Especially for increase carboxylic acid group, it is possible to use alkaline solution carries out saponification process to the surface of resin bed.

In resin bed 14, interaction group of more than two kinds can be contained.

The species constituting the resin of resin bed 14 is not particularly limited, and can enumerate heat-curing resin or thermoplastic resin Deng insulative resin (such as (methyl) acrylic resin (including crosslinked and noncrosslinking (methyl) acrylic resin)).? Interaction group is contained in these materials.It should be noted that so-called (methyl) acrylic resin refers to Acrylic resin and the concept of methacrylic resin.

More specifically, as heat-curing resin, for example can enumerate epoxy resin, phenol resin, polyimide resin, Polyester resin, bimaleimide resin, vistanex, isocyanate resin, crosslinking (methyl) acrylic resin, silicon tree Fat etc..As thermoplastic resin, for example, can enumerate phenoxy resin, polyether sulfone, polysulfones, PPSU, polyphenylene sulfide, gather Phenyl ether, Polyetherimide, noncrosslinking (methyl) acrylic resin etc..

The species of the coloring agent containing in resin bed 14 is not particularly limited, using known pigment or dyestuff.As face Material, inorganic pigment and organic pigment all can use.More specifically, as inorganic pigment, can example go out：Titanium dioxide, oxidation The Chinese whites such as zinc；The extender pigments such as Calcium Carbonate, barium sulfate；The black pigment of white carbon black etc；Colcother, Plumbum preparatium, chrome vermillion, cadmium red it The red pigment of class；The yellow uitramarine of lead monoxide (リサジ), chrome yellow, yellow iron oxide etc；Prussian blue, ultramarine it The blue pigment of class.Additionally, as organic pigment, azo pigment, phthualocyanine pigment, quinacridone face can be gone out with example Material, perylene series pigments, isoindolinone pigment, diazine series pigments, intellectual circle's (スレ Application) series pigments etc..

[detecting electrode]

1st detecting electrode 16 and the 2nd detecting electrode 18 are conductive in the contact panel sensor comprising present embodiment Property laminate contact panel sensor in perceive electrostatic capacitance change induction electrode, its constitute sense part (induction part).That is, If making finger tip contact with contact panel, the mutual electrostatic capacitance of each detecting electrode changes, and utilizes IC based on this variable quantity Circuit enters row operation to the position of finger tip.

1st detecting electrode 16 has for close to middle section E_IThe input position of the X-direction of operator's finger carry out The effect of detection, has the function of producing electrostatic capacitance at it and finger between.1st detecting electrode 16 is in the 1st direction (X-direction) Extend, be the electrode being arranged across the interval of regulation in the 2nd direction (Y-direction) orthogonal with the 1st direction.

2nd detecting electrode 18 has for close to middle section E_IThe input position of the Y-direction of operator's finger carry out The effect of detection, has the function of producing electrostatic capacitance at it and finger between.2nd detecting electrode 18 is in the 2nd direction (Y-direction) Extend, be the electrode being arranged across the interval of regulation in the 1st direction (X-direction).

In FIG, the 1st detecting electrode 16 arranges 4, the 2nd detecting electrode 18 setting 4, but its number does not especially limit System, as long as be more than 2.

In FIG, the 1st detecting electrode 16 and the 2nd detecting electrode 18 are solid membrane but it is also possible to comprise netted etc. specific Pattern.

It should be noted that as shown in Fig. 2 the part intersected with the 2nd detecting electrode 18 in the 1st detecting electrode 16, preventing 1st detecting electrode 16 and the conducting of the 2nd detecting electrode 18, are insulated, for this in the 1st detecting electrode 16 and the 2nd detecting electrode Inter-electrode dielectric layer 24 is configured between 18.

In addition, as shown in Fig. 2 in the 2nd detecting electrode 18, respective one end 18A extends to above-mentioned resin bed 14 Above contact with resin bed 14.In other words, one end 18A is located on resin bed 14.It should be noted that in the 1st detecting electrode 16 In similarly, one end is extended on resin bed 14 and is contacted with resin bed 14.

Thus, the one end of the 1st detecting electrode 16 and the one end of the 2nd detecting electrode 18 are contacted with resin bed 14 respectively, Thus, as a result, contact well it can be ensured that the 1st examines with using the wiring lead 20 that aftermentioned method is formed on resin bed 14 Survey electrode 16 and the 2nd detecting electrode 18 and wiring lead 20 good electrically conducting.

Constitute the 1st detecting electrode 16 and the material of the 2nd detecting electrode 18 is not particularly limited, for example, can enumerate Indium sesquioxide. The metal-oxides such as stannum (ITO), stannum oxide, zinc oxide, Aska-Rid., gallium oxide, titanium dioxide.Further, it is also possible to using gold (Au), silver-colored (Ag), metal or alloy such as copper (Cu), aluminum (Al) etc..

[wiring lead]

Wiring lead 20 is the portion undertaking for the effect to the 1st detecting electrode 16 and the 2nd detecting electrode 18 applied voltage Part.Wiring lead 20 is configured neighboring area E on the substrate 12_O, its one end examined with corresponding 1st detecting electrode the 16 and the 2nd Survey electrode 18 to be electrically connected, the other end is located at the position that flexible printed circuit board etc. is configured.In addition, in fig. 2, wiring lead Mode according to the one end (in Fig. 2, the one end 18A of the 2nd detecting electrode 18) covering detecting electrode is configured, but as long as The electrical connection of wiring lead and detecting electrode can be however it is not limited to which.

As mentioned below, wiring lead 20 is the distribution by least having the formation of the method for following operations, in this operation In, give plating catalyst or its precursor to resin bed 14, for the resin bed 14 having been assigned plating catalyst or its precursor Carry out plating.That is, wiring lead 20 is the distribution being made up of the metal plating layer (metal level) being formed in plating.

It should be noted that the number of wiring lead 20 is not particularly limited, generally according to the 1st detecting electrode 16 and the 2nd The number of detecting electrode 18 configures more than 2.

The thickness of wiring lead 20 is not particularly limited, and can suitably select optimal thickness according to application target, from leading From the aspect of electrical characteristics, preferably more than 0.1 μm, more preferably more than 0.5 μm, more preferably 1～30 μm.

The live width of wiring lead 20 is not particularly limited, from the aspect of the low resistive of wiring lead, preferably 30 μ Below m, more preferably less than 15 μm, more preferably less than 10 μm, preferably more than 0.5 μm, be more preferably 1.0 μm with On.

Additionally, the species constituting the metal of wiring lead 20 is not particularly limited, used according to plating described later The species of plating liquid and different, for example can enumerate copper, chromium, lead, nickel, gold, silver, stannum, zinc etc., go out in terms of electric conductivity Send out, preferably copper, gold, silver, more preferably copper, silver.

Although it should be noted that not shown in FIG, wiring lead 20 the other end (not for detection electricity The end of pole side) location can configure flexible printed circuit board etc..Flexible printed circuit board is to be provided with 2 on substrate Above distribution and the plate of terminal, the other end respective with wiring lead 20 is connected, and has given play to capacitive touch panel The effect that sensor and external device (ED) (such as display device) are attached.

[insulating barrier]

Insulating barrier 22 is the one end being connected with wiring lead 20 according to the 1st detecting electrode 16 and the 2nd detecting electrode 18 The mode exposed covers the layer of the 1st detecting electrode 16 and the 2nd detecting electrode 18, spreads all over middle section E in FIG_IWhole area Domain is configured.It should be noted that insulating barrier 22 is arbitrary composition, it is the layer being configured as needed.

The functional group interacting with plating catalyst or its precursor is contained substantially no in insulating barrier 22.Therefore, such as Hereinafter described, in the operation giving plating catalyst or its precursor implemented in above-mentioned manufacture wiring lead 20, can prevent Plating catalyst or its precursor are endowed (absorption) to the 1st detecting electrode 16 and the 2nd detecting electrode 18, as a result, can suppress The generation of the conducting between detecting electrode after plating.

The species of insulating barrier 22 is not particularly limited, it is possible to use known insulant, is for example suitable for using insulating properties Organic material and insulating properties inorganic material.

As insulating properties organic material, it is possible to use known insulative resin.As insulative resin, can enumerate Heat-curing resin used in the above-mentioned formation of resin bed 14 or thermoplastic resin etc..

Additionally, as insulating properties inorganic material, such as metal-oxide such as silicon dioxide, niobium oxide etc. can be used.

As insulating barrier 22,1 layer can be only, can also be more than 2 layers.In the case of more than 2 layers, the material of each layer Can be different.Further, it is also possible to using the weak adhesive tape of the cohesiveness covering band etc.

Insulating barrier 22 contains substantially no functional group's (the interaction base interacting with plating catalyst or its precursor Group).Herein, contain substantially no interaction group and mean that the plating catalyst of insulating barrier 22 or the adsorbance of its precursor are Below 1000 mass ppm, this adsorbance is preferably below 500 mass ppm, is more preferably below 100 mass ppm, is most preferably Below 10 mass ppm.It can be measured by ICP mass analysis.

The thickness (dried thickness) of insulating barrier 22 is not particularly limited, when can suppressing plating further Middle section E_IPlating separate out from the aspect of, preferably 1～9 μm, more preferably 1～8 μm, more preferably 2～8 μ M, particularly preferably 3～8 μm.

Although in addition, not shown in FIG, can be on the region not configuring wiring lead 20 on resin bed 14 Configuration Resist patterns.As mentioned below, when forming wiring lead 20, as needed using Resist patterns.

Although in addition, not shown in FIG, can be according to the part covering beyond the other end of wiring lead 20 Mode configures insulating protective film further.

The manufacture method of the 1st embodiment of above-mentioned contact panel sensor electroconductive laminate does not especially limit System, can be appropriately carried out optimal operation, from the aspect of easy to manufacture, preferably have following operation.

Operation A：Neighboring area on substrate forms the operation of resin bed；

Process B：The operation of detecting electrode is formed on substrate, the one end of this detecting electrode extends on resin bed, from And this detecting electrode is contacted with resin bed；

Operation C：Order implements the operation of operation C-1 and operation C-2 with differing, and in operation C-1, is formed on the resin layer Resist patterns；In operation C-2, the mode that the one end according to the detecting electrode being contacted with resin bed is exposed forms insulation Layer；

Step D：Form the operation of wiring lead, give plating to the region not forming Resist patterns on resin bed and urge Agent or its precursor, carry out plating for the resin bed having been assigned plating catalyst or its precursor, are formed and detection electricity The wiring lead of the one end electrical connection of pole.

Below above-mentioned operation A～step D is described in detail.It should be noted that in the following description using figure 3, this Fig. 3 are the manufacture method of the contact panel sensor electroconductive laminate 10 illustrating Fig. 1 and Fig. 2 record by process sequence Sectional view.

[operation A]

Operation A is that the neighboring area on substrate forms the functional group having with plating catalyst or the interaction of its precursor Resin bed operation.By implementing this operation, shown in such as Fig. 3 (A), neighboring area E on the substrate 12_OConfiguration resin bed 14.

The method forming resin bed is not particularly limited, and preferably uses the combination of the resin bed formation containing specific compound The mode of thing.As the resin bed formation compositionss being used, for example, can enumerate the resin bed shape containing following compound One-tenth compositionss, this compound has the functional group interacting with plating catalyst or its precursor and polymerizable group.By this The compositionss of sample are coated on formation film on substrate, are pointed to the neighboring area E shown in Fig. 1_OOn film give energy, thus The reaction of polymerizable group can be promoted, solidified, then remove the region being not endowed with energy, can obtain configuring in Zhou Bianqu The resin bed in domain.

It is described in detail to using the mode of resin bed formation compositionss below.Describe the material of compositionss first in detail Material, is described in detail to the process of operation thereafter.

(resin bed is formed with compositionss (1))

The compound with interaction group and polymerizable group is contained in resin bed formation compositionss.

Interaction group is as defined above.

Polymerizable group is to give, by energy, the functional group that can form chemical bonding, for example, can enumerate radical polymerization Property group, cationic polymerizable group etc..Wherein, from the aspect of reactivity is more excellent, preferably free-radical polymerised base Group.As free-radical polymerised group, for example, can enumerate acrylate-based (acryloxy), methacrylic acid ester group (first Base acryloxy), itaconic acid ester group, butenoic acid ester group, methacrylate ester group, the unsaturated carboxylic acid ester group such as maleic acid ester group, Styryl, vinyl, acrylamido, methacryl amido etc..Wherein preferred methacryloxy, acryloyl-oxy Base, vinyl, styryl, acrylamido, methacryl amido, more preferably methacryloxy, acryloxy, Styryl.

In compound, polymerizable group can comprise two or more.Additionally, contained polymerizable group in compound Number be not particularly limited, can for 1, can also be more than 2.

Above-claimed cpd can be low molecular compound, can also be macromolecular compound.Low molecular compound means point The compound less than 1000 for the son amount, macromolecular compound means the compound that molecular weight is more than 1000.

It should be noted that the low molecular compound with above-mentioned polymerizable group is equivalent to so-called monomer (monomer).In addition, so-called macromolecular compound can also be the polymer with specific repetitives.

In addition, can be only using a kind it is also possible to share two or more as compound.

In the case that above-claimed cpd is polymer, the weight average molecular weight of polymer is not particularly limited, from dissolubility etc. From the aspect of treatability is more excellent, less than less than preferably more than 1,000 70 ten thousand, more preferably more than 2,000 20 ten thousand. Particularly from the aspect of polymerization sensitivity, preferably more than 20000.

The synthetic method of such polymer with polymerizable group and interaction group is not particularly limited, can Using known synthetic method (referring to Japanese Patent Publication paragraph [0097]～[0125] of No. 2009-280905).

(optimal way 1 of polymer)

As the 1st optimal way of polymer, such copolymer can be enumerated, this copolymer comprises with following formula (a) Repetitives (also suitably becoming polymerizable group unit below) of represented polymerizable group and there is following formula (b) institute table The repetitives (hereinafter appropriately referred to as interaction group unit) of the interaction group showing.

【Change 1】

In above-mentioned formula (a) and formula (b), R¹～R⁵Represent hydrogen atom or substituted or unsubstituted alkyl (example independently of one another As methyl, ethyl, propyl group, butyl etc.).It should be noted that the species of substituent group is not particularly limited, methoxy can be enumerated Base, chlorine atom, bromine atoms or fluorine atom etc..

It should be noted that as R¹, preferably hydrogen atom, methyl or the methyl being replaced by bromine atoms.As R², preferably hydrogen Atom, methyl or the methyl being replaced by bromine atoms.As R³, preferably hydrogen atom.As R⁴, preferably hydrogen atom.As R⁵, preferably Hydrogen atom, methyl or the methyl being replaced by bromine atoms.

In above-mentioned formula (a) and formula (b), X, Y and Z represent that singly-bound or substituted or unsubstituted divalent are organic independently of one another Group.As divalent organic group, (preferably carbon number is 1～8 can to enumerate substituted or unsubstituted divalent aliphatic alkyl. For example, the alkylidene such as methylene, ethylidene, propylidene), (preferably carbon number is substituted or unsubstituted divalent aromatic hydrocarbyl 6～12.Such as phenylene) ,-O- ,-S- ,-SO₂-、-N(R)-(R：Alkyl) ,-CO- ,-NH- ,-COO- ,-CONH- or by it The group (such as alkylidene epoxide, alkylidene Epoxide carbonyl, alkylidene carbonyl acyloxy etc.) combining etc..

As X, Y and Z, from the synthesis of polymer easily, the adaptation of wiring lead more excellent from the aspect of, preferably Singly-bound, ester group (- COO-), amide groups (- CONH-), ether (- O-) or substituted or unsubstituted divalent aromatic hydrocarbyl, more excellent Menu key, ester group (- COO-), amide groups (- CONH-).

In above-mentioned formula (a) and formula (b), L¹And L²Represent singly-bound or substituted or unsubstituted divalent organic group independently of one another Group.As the definition of divalent organic group, identical with the implication of the divalent organic group of narration in above-mentioned X, Y and Z.

As L¹, from the synthesis of polymer easily, the adaptation of wiring lead more excellent from the aspect of, preferred fat Race's alkyl or the divalent organic group (such as aliphatic alkyl) with amino-formate bond or urea bond, wherein preferably total carbon are former Subnumber is 1～9.It should be noted that herein, L¹Total carbon atom number refer to by L¹The substituted or unsubstituted divalent representing is organic Total carbon atom number contained by group.

In addition, from the aspect of the adaptation of wiring lead is more excellent, L²Be preferably singly-bound or for divalent fat Race's alkyl, divalent aromatic hydrocarbyl or the group that they are combined.Wherein, L²Being preferably singly-bound or total carbon atom number is 1 ～15, particularly preferably unsubstituted.It should be noted that herein, L²Total carbon atom number refer to by L²Represented replacement or nothing take The total carbon atom number contained by divalent organic group in generation.

In above-mentioned formula (b), W represents interaction group.Interaction group is as defined above.

From the aspect of gelation when reactive (curable, polymerism) and suppression synthesis, with respect in polymer Whole repetitives, the content of above-mentioned polymerizable group unit is preferably 5～50 moles of %, more preferably 5～40 moles of %.

Additionally, from the aspect of the adsorptivity for plating catalyst or its precursor, with respect to whole in polymer Repetitives, the content of above-mentioned interaction group unit is preferably 5～95 moles of %, more preferably 10～95 moles of %.

(optimal way 2 of polymer)

As the 2nd optimal way of polymer, can enumerate and comprise following formula (A), formula (B) and the repetition represented by formula (C) The copolymer of unit.

【Change 2】

Repetitives represented by formula (A) are identical with the repetitives represented by above-mentioned formula (a), the explanation also phase of each group With.

The R in repetitives represented by formula (B)⁵, X and L²With the R in the repetitives represented by above-mentioned formula (b)⁵, X and L²Identical, the explanation of each group is also identical.

Wa in formula (B) represent hydrophilic radical or its precursor group represented by except V described later in addition to urge with plating Agent or the group of its precursor interaction.Wherein preferred cyano group, ether.

In formula (C), R⁶Represent hydrogen atom or substituted or unsubstituted alkyl independently of one another.

In formula (C), U represents singly-bound or substituted or unsubstituted divalent organic group.The definition of divalent organic group with upper X, the Y stating is identical with the divalent organic group implication represented by Z.As U, easy, wiring lead closely sealed from the synthesis of polymer Property more excellent from the aspect of, preferably singly-bound, ester group (- COO-), amide groups (- CONH-), ether (- O-) or replace or Unsubstituted divalent aromatic hydrocarbyl.

In formula (C), L³Represent singly-bound or substituted or unsubstituted divalent organic group.The definition of divalent organic group with upper The L stating¹And L²Represented divalent organic group implication is identical.As L³, easy, wiring lead closely sealed from the synthesis of polymer From the aspect of property is more excellent, preferably singly-bound or divalent aliphatic alkyl, divalent aromatic hydrocarbyl or they combine Group.

In formula (C), V represents hydrophilic radical or its precursor group.With regard to hydrophilic radical, as long as representing hydrophilic Group be just not particularly limited, for example can enumerate hydroxyl, carboxylic acid group etc..Additionally, the precursor group of so-called hydrophilic radical Refer to generate the group of hydrophilic radical using acid or alkali by specific process (process for example, carrying out), for example permissible Enumerate carboxyl protected by THP (2- THP trtrahydropyranyl) etc..

As hydrophilic radical, from the interaction of plating catalyst or its precursor from the aspect of, preferably ion Property polar group.As ionic polar group, specifically, carboxylic acid group, sulfonic group, phosphate, boronate can be enumerated.Its In, from the aspect of appropriate acidity (not decomposing other functional groups) is such, optimization acid's base.

In 2nd optimal way of above-mentioned polymer, the preferred content of each unit is as follows.

From the aspect of gelation when reactive (curable, polymerism) and suppression synthesis, with respect in polymer Whole repetitives, the content of the repetitives represented by formula (A) is preferably 5～50 moles of %, more preferably 5～30 rubs You are %.

From the aspect of the adsorptivity for plating catalyst or its precursor, repeat list with respect to whole in polymer Unit, the content of the repetitives represented by formula (B) is preferably 5～75 moles of %, more preferably 10～70 moles %.

From the aspect of the developability based on aqueous solution and moisture-proof adaptation, repeat list with respect to whole in polymer Unit, the content of the repetitives represented by formula (C) is preferably 10～70 moles of %, more preferably 20～60 moles %, further It is preferably 30～50 moles of %.

As the concrete example of above-mentioned polymer, for example, can enumerate the paragraph of Japanese Unexamined Patent Publication 2009-007540 publication [0106] in the polymer described in～[0112], paragraph [0065]～[0070] of Japanese Unexamined Patent Publication 2006-135271 publication The polymer of record, No. US2010-080964 polymer described in paragraph [0030]～[0108] etc..

This polymer can be manufactured using known method (for example, the method in the above-mentioned document enumerated).

(optimal way of monomer)

One of in the case that above-claimed cpd is for so-called monomer, it is preferred that, formula (X) can be enumerated represented Compound.

【Change 3】

In formula (X), R¹¹～R¹³Represent hydrogen atom or substituted or unsubstituted alkyl independently of one another.As unsubstituted Alkyl, methyl, ethyl, propyl group or butyl can be enumerated.In addition, as replacing alkyl, can enumerate former by methoxyl group, chlorine Substituted methyl, ethyl, propyl group, the butyl such as son, bromine atoms or fluorine atom.It should be noted that as R¹¹, preferably hydrogen atom or Methyl.As R¹², preferably hydrogen atom.As R¹³, preferably hydrogen atom.

L¹⁰Represent singly-bound or divalent organic group.As divalent organic group, substituted or unsubstituted aliphatic can be enumerated Alkyl (preferably carbon number be 1～8), substituted or unsubstituted aromatic hydrocarbyl (preferably carbon number is 6～12) ,-O- ,- S-、-SO₂-、-N(R)-(R：Alkyl) ,-CO- ,-NH- ,-COO- ,-CONH- or group that they are combined (for example sub- Alkyl oxy, alkylidene Epoxide carbonyl, alkylidene carbonyl acyloxy etc.) etc..

As substituted or unsubstituted aliphatic alkyl, preferably methylene, ethylidene, propylidene or butylidene or this A little groups are replaced, by methoxyl group, chlorine atom, bromine atoms or fluorine atom etc., the group obtaining.

As substituted or unsubstituted aromatic hydrocarbyl, preferably unsubstituted phenylene or by methoxyl group, chlorine atom, The phenylene that the replacement such as bromine atoms or fluorine atom obtains.

In formula (X), as L¹⁰One of optimal way ,-NH- aliphatic alkyl-or-CO- aliphatic hydrocarbon can be enumerated Base-.

The definition of W is identical with the implication of the definition of the W in formula (b), represents interaction group.Interaction group As defined above.

In formula (X), as the optimal way of W, ionic polar group, more preferably carboxylic acid group can be enumerated.

In the case that above-claimed cpd is so-called monomer, as one of other optimal ways, formula (1) institute can be enumerated The compound representing.

【Change 4】

In formula (1), R¹⁰Represent hydrogen atom, metal cation or quaternary ammonium cation.As metal cation, for example, can lift Go out alkali metal cation (sodium ion, calcium ion), copper ion, palladium ion, silver ion etc..It should be noted that as metal sun Ion, mainly uses the metal cation of 1 valency or divalent, in the case of using divalent metal cation (such as palladium ion), after The n stating represents 2.

As quaternary ammonium cation, for example, can enumerate tetramethyl ammonium, potassium ion etc..

Wherein, from the aspect of the metallic residue after the attachment of plating catalyst or its precursor and patterning, preferably hydrogen Atom.

L in formula (1)¹⁰Definition and above-mentioned formula (X) in L¹⁰Definition implication identical, represent singly-bound or divalent organic group Group.Divalent organic group is as defined above.

R in formula (1)¹¹～R¹³Definition and above-mentioned formula (X) in R¹¹～R¹³Definition implication identical, represent hydrogen former Sub or substituted or unsubstituted alkyl.It should be noted that R¹¹～R¹³Optimal way as described above.

N represents 1 or 2 integer.Wherein, from the aspect of the accessibility of compound, preferably n is 1.

As the optimal way of the compound represented by formula (1), the compound represented by formula (2) can be enumerated.

【Change 5】

In formula (2), R¹⁰、R¹¹As defined above with n.

L¹¹Represent ester group (- COO-), amide groups (- CONH-) or phenylene.Wherein, if L¹¹For amide groups, then solvent resistant Property (such as alkali solvent tolerance) improve.

L¹²Represent singly-bound, divalent aliphatic alkyl (preferably carbon number be 1～8, more preferably carbon number be 3～5) or 2 Valency aromatic hydrocarbyl.Aliphatic alkyl can be straight-chain, branched, ring-type.It should be noted that in L¹²Situation for singly-bound Under, L¹¹Represent phenylene.

The molecular weight of the compound represented by formula (1) is not particularly limited, from volatility, dissolubility in a solvent, one-tenth The aspect such as film and treatability is set out, and preferably 100～1000, more preferably 100～300.

The content of the above-claimed cpd in resin bed formation compositionss is not particularly limited, excellent with respect to total composition Elect 2～50 mass %, more preferably 5～30 mass % as.If in above range, then the treatability of compositionss is excellent, easy Control the thickness of resin bed.

From the aspect of treatability, in resin bed formation compositionss, preferably comprise solvent.

The solvent that can use is not particularly limited, for example, can enumerate：Water；Methanol, ethanol, propanol, ethylene glycol, 1- first The alcohols solvents such as epoxide -2- propanol, glycerol, propylene glycol monomethyl ether；The acid such as acetic acid；The ketones such as acetone, methyl ethyl ketone, Ketohexamethylene Solvent；The amide solvents such as Methanamide, dimethyl acetylamide, N-Methyl pyrrolidone；The nitrile solvents such as acetonitrile, propionitrile；Acetic acid The esters solvents such as methyl ester, ethyl acetate；The carbonate-based solvent such as dimethyl carbonate, diethyl carbonate；In addition with ether solvent, Glycolic solvents, amine solvent, thio-alcohol solvent, halogen based solvents etc..

Wherein, preferably alcohols solvent, amide solvent, ketones solvent, nitrile solvents, carbonate-based solvent.

The content of the solvent in resin bed formation compositionss is not particularly limited, and is preferably 50 with respect to total composition ～98 mass %, more preferably 70～95 mass %.If in above range, then the treatability of compositionss is excellent, be easily controlled Thickness of resin bed etc..

Polymerization initiator can be contained in resin bed formation compositionss.By containing polymerization initiator, further shape Become the combination and compound and substrate between compound, can get the more excellent wiring lead of adaptation as a result.

It is not particularly limited as the polymerization initiator being used, for example, can be drawn using thermal polymerization, photopolymerization Send out agent etc..As the example of Photoepolymerizationinitiater initiater, benzophenone, acetophenones, alpha-aminoalkyl benzophenone class, benzene can be enumerated Acyloin class, ketone, thioxanthene ketone class, benzil class, benzyl ketals class, oxime esters, anthrone class, tetramethylthiuram monosulfide class, Double acylphosphine oxide class, acylphosphine oxide class, Anthraquinones, azo-compound etc. and its derivant.

Additionally, as the example of thermal polymerization, diazonium based compound or peroxide based compound etc. can be enumerated.

In the case of containing polymerization initiator in resin bed formation compositionss, the content of polymerization initiator is with respect to group Compound total amount is preferably 0.01～1 mass %, more preferably 0.1～0.5 mass %.When this content is in above range, combination The treatability of thing is excellent, and the adaptation of obtained wiring lead is more excellent.

Resin bed formation compositionss (wherein can not include represented by above-mentioned formula (X) or formula (1) containing monomer Compound).By containing monomer, can suitably control crosslink density in resin bed etc..

The monomer being used is not particularly limited, and for example, can enumerate as the compound with addition polymerization and have The compound of ethylenic unsaturated bond, can enumerate the compound with epoxy radicals as the compound with ring-opening polymerization Deng.Wherein, from improve resin bed crosslink density, further improve wiring lead adaptation from the aspect of, preferably make Use polyfunctional monomer.So-called polyfunctional monomer refers to the monomer with more than 2 polymerizable groups.In particular, it is preferred that using There is the monomer of 2～6 polymerizable groups.

The aspect of the mobility of the molecule from the cross-linking reaction bringing impact to reactivity is many as used The molecular weight of functional monomer is preferably 150～1000, more preferably 200～700.Additionally, as multiple polymerizations Property group between interval (distance), in terms of atomic number be preferably 1～15, more preferably less than more than 6 10.

Other additives (such as sensitizer, firming agent, resistance can be added as needed in resin bed formation compositionss Poly- agent, antioxidant, antistatic additive, UV absorbent, filler, granule, fire retardant, surfactant, lubricant, plasticizer Deng).

Additionally, in the case of containing coloring agent in resin bed, can contain further in resin bed formation compositionss There is coloring agent.

(resin bed is formed with compositionss (2))

Containing the change with interaction group and polymerizable group in above-mentioned resin bed formation compositionss (1) Compound, but it is not limited to which, for example, it is also possible to using containing the compound with interaction group and there is polymerization The resin bed formation compositionss of this 2 kinds of compounds of compound of property group.

The so-called compound with interaction group is to have interaction group but do not have polymerizable group Compound.Interaction group is as defined above.As such compound, can for low molecular compound, It can be macromolecular compound.As the optimal way of the compound with interaction group, can enumerate have above-mentioned The macromolecule of the repetitives represented by formula (b).

The compound with polymerizable group is so-called monomer, from the side that the hardness of the resin bed being formed is more excellent Face considers, it is however preferred to have the polyfunctional monomer of the polymerizable group of more than 2.As polyfunctional monomer, it is possible to use known Monomer.

(process of operation A)

In operation A, configure resin bed formation compositionss first on substrate, its method is not particularly limited, for example Can enumerate and make above-mentioned resin bed formation compositionss that the film to form resin bed formation compositionss to be contacted on substrate Method.As the method, for example, can enumerate the method (rubbing method) that above-mentioned resin bed formation compositionss are coated with substrate.

In the case of rubbing method, on substrate, the method for coating resin layer formation compositions is not particularly limited, can With using known method (such as spin coating, die coating, dip coated etc.).

From the aspect of treatability, manufacture efficiency, preferably following manner：Coating resin layer formation combination on substrate Thing, is dried as needed and processes the solvent removing residual, forms film.

It should be noted that the condition of dried is not particularly limited, from the aspect of productivity ratio is more excellent, excellent It is selected in room temperature～220 DEG C 1～30 minute (preferably 1～10 minute) of (preferably 50～120 DEG C) enforcement.

The method giving energy with pattern-like to the film (composition layer) on substrate is not particularly limited.For example, it is preferable to Using heat treated, exposure-processed (photo-irradiation treatment) etc., from the aspect of process completes at short notice, preferably at exposure Reason.By giving energy to film, the polymerizable group in compound is activated, and produces the crosslinking between compound, carries out layer Solidification.

In exposure-processed, using light irradiation based on UV (ultraviolet light) lamp, luminous ray etc. etc..As light source, for example There are mercury lamp, metal halide lamp, xenon lamp, chemical lamp, carbon arc lamp etc..As lonizing radiation, also electron ray, X-ray, ion Bundle, far infrared etc..As specific mode, can suitably enumerate scan exposure based on infrared laser, xenon discharge lamp Expose etc. high illumination flash exposure, infrared lamp etc..

Different, between usually 10 seconds～5 hours as time of exposure, the reactivity according to compound and light source.Make The scope of the degree being 10～8000mJ for exposure energy, preferably 50～3000mJ.

It should be noted that the method implementing above-mentioned exposure-processed with pattern-like is not particularly limited, can adopt known Method, for example, across mask, film irradiation exposure is used up.

Additionally, giving using in the case of heat treated as energy, it is possible to use blast drier, baking oven, infrared ray Drying machine, heating drum etc..

Then, remove the part that energy imparting is not carried out in film, form resin bed.

Above-mentioned removing method is not particularly limited, and the compound according to being used properly selects the best approach.For example may be used To enumerate using alkaline solution (preferably pH：13.0～13.8) as the method for developer solution.Removing energy using alkaline solution In the case of not giving region, can enumerate by the substrate with the film having been assigned energy impregnate method in the solution, Method of coating developer solution etc. on the substrate, the method preferably being impregnated.In the case of the method being impregnated, from life The aspects such as producing property workability are set out, and are preferably 1 minute to 30 minutes about as dip time.

Additionally, as other methods, can enumerate the solvent of dissolving above-claimed cpd as developer solution, dipping is wherein Method.

It should be noted that being described above for the mode that resin bed is directly formed on substrate, but also may be used To implement other method such as transfer printing.In addition, so-called transfer printing is to form resin bed on false support, by the resin being formed Layer is transferred to the method on substrate.

[process B]

Process B is the operation forming detecting electrode on substrate, and the one end of this detecting electrode extends on resin bed, from And this detecting electrode is contacted with resin bed.More specifically, by implementing this operation, such as shown in Fig. 3 (B), join on the substrate 12 Put the 1st detecting electrode 16 and the 2nd detecting electrode 18.It should be noted that as shown in Fig. 3 (B), detecting electrode (the 1st detecting electrode 16 and the 2nd detecting electrode 18) one end extend on resin bed 14.

The manufacture method of detecting electrode is not particularly limited, using known method.For example, use as detecting electrode In the case of ITO layer, to be formed preferably by sputtering method or vapour deposition method.Additionally, when forming the detecting electrode of given shape, fitting Preferably using mask.

[operation C]

Operation C is the operation that order implements operation C-1 and operation C-2 with differing, in operation C-1, shape on the resin layer Become Resist patterns；In operation C-2, form insulating barrier, this insulating barrier is according to the one end of the detecting electrode contacting with resin bed The mode that portion exposes covers detecting electrode.More specifically, by implementing this operation, such as shown in Fig. 3 (C), configuration covers detection The insulating barrier 22 of electrode.It should be noted that in Fig. 3 (C), although not shown, Resist patterns is configured in Fig. 1's Do not form the region on the resin bed 14 of wiring lead 20.

In operation C, implement operation C-1 and operation C-2 with sequentially differing, specifically, operation can implemented Implement operation C-2 it is also possible to implement operation C-1 after implementing operation C-2 after C-1.

Operation C-1 is the operation forming Resist patterns on the resin layer.More specifically, this operation is in plating described later Cover the operation being not intended to during process make the specific region on the resin bed of plating precipitation form Resist patterns.

The method forming Resist patterns on the resin layer is not particularly limited, using known method；From resist figure From the aspect of the precision of case is more excellent, preferably use the method that photonasty resist forms Resist patterns.

As photonasty resist used in this operation, for example can enumerate light-cured type negative resist, Or there is the positive corrosion-resisting agent of the light lysotype of dissolving by exposure.As photonasty resist, for example can be photosensitive using 1. Property dry film photoresist (DFR), 2. liquid resist, 3.ED (electro-deposition) resist.

As the forming method of Resist patterns, the film (sense being formed by photonasty resist can be configured on the resin layer Photosensitiveness resist film), pattern exposure is carried out to photonasty resist film and then develops, thus forming Resist patterns.

Operation C-2 is the operation forming insulating barrier, and this insulating barrier is according to the one end of the detecting electrode contacting with resin bed The mode exposed covers detecting electrode.

The forming method of insulating barrier is not particularly limited, and selects optimal method according to the material being used.

For example, in the case of using photosensitive insulating resin (such as epoxy resin) etc., can enumerate and apply on substrate Cloth contains the compositionss of photosensitive insulating resin, specific region is exposed make it solidify, then removes the side in unexposed portion Method etc..

Additionally, in the case of using metal-oxide etc., the specific mask of configuration can be enumerated, using sputtering or evaporation Method makes metal oxide layer be deposited in method of ad-hoc location etc..

[step D]

Step D is the operation forming wiring lead, in this operation, to the area not forming Resist patterns on resin bed Domain gives plating catalyst or its precursor, carries out plating for the resin bed having been assigned plating catalyst or its precursor, Form the wiring lead with the one end electrical connection of detecting electrode.More specifically, by implementing this operation, as Fig. 3 (D) institute Show, the wiring lead 20 with the one end 18A electrical connection of the 2nd detecting electrode 18 can be formed.Although it should be noted that not Illustrate, but the one end of the 1st detecting electrode is also electrically connected with wiring lead.

It is divided into the operation (step D -1) that resin bed is given with plating catalyst or its precursor below and for being endowed The operation (step D -2) that the resin bed of plating catalyst or its precursor carries out plating illustrates.

(step D -1：Plating catalyst gives operation)

In this operation, first on resin bed do not formed Resist patterns region give plating catalyst or its before Body.Contained interaction group in resin bed adhered to according to its function the plating catalyst that (absorption) given or its Precursor.More specifically, it is endowed plating catalyst or its precursor in resin bed and on resin layer surface.

Plating catalyst or its precursor are as the catalyst of plating or electrode function.Therefore, the plating being used Cover catalyst or the species of its precursor takes the circumstances into consideration to determine according to the species of plating.

It should be noted that the plating catalyst being used or its precursor be preferably electroless plating catalyst or its before Body.Mainly electroless plating catalyst or its precursor etc. are described in detail below.

With regard to the electroless plating catalyst used in this operation, as long as active nucleus during electroless plating can be become, Then any electroless plating catalyst all can use, and specifically, can enumerate the catalysis with autocatalysis reduction reaction Metal (being known as the metal carrying out electroless plating that ionization tendency is less than Ni) of ability etc..Specifically, Ke Yiju Go out Pd, Ag, Cu, Ni, Pt, Au, Co etc..Wherein, from the aspect of the height of catalytic capability, particularly preferred Ag, Pd, Pt, Cu.

As this electroless plating catalyst, it is possible to use metallic colloid.

As long as electroless plating catalyst precarsor used can become electroless plating by chemical reaction and urge in this operation Agent just can use without particular limitation.The main metal that the metal as above-mentioned electroless plating catalyst enumerated is used Ion.Metal ion as electroless plating catalyst precarsor is become as electroless plating catalyst by reduction reaction 0 valency metal.As electroless plating catalyst precarsor metal ion be imparted to resin bed after, be impregnated into electroless plating Before covering in bath, 0 valency metal can be changing into by other reduction reaction and become electroless plating and cover catalyst.Additionally, can It is immersed in electroless plating bath it is also possible to by electroless plating bath with the state keeping electroless plating catalyst precarsor Reducing agent be changing into metal (electroless plating catalyst).

Metal ion as electroless plating catalyst precarsor preferably uses slaine and gives to resin bed.As being made Slaine, as long as being dissolved in suitable solvent to be dissociated into metal ion and alkali (anion), does not especially limit System, can enumerate M (NO₃)_n、MCl_n、M_2/n(SO₄)、M_3/n(PO₄) (M represents the metallic atom of n valency) etc..As metal ion, can To be suitably used the metal ion that above-mentioned slaine dissociation obtains.Ag ion, Cu ion, Ni ion, Co for example can be enumerated Ion, Pt ion, Pd ion.Wherein preferably can multiple tooth coordination metal ion, from the species number of the functional group that can be coordinated From the aspect of catalytic capability, particularly preferred Ag ion, Pd ion, Cu ion.

In this operation, directly electroplated used catalyst as in order to not carry out electroless plating, also may be used With using 0 valency metal.

Give to the method for resin bed as by plating catalyst or its precursor, for example can prepare plating catalyst or Its precursor dispersion or be dissolved in solution (plating catalyst liquid) in suitable solvent, by this solution coating in resin bed Above or the substrate being formed with resin bed is immersed in this solution.

As above-mentioned solvent, as one sees fit using water or organic solvent.As organic solvent, preferably saturable in resin bed Solvent, for example, can use acetone, methyl acetoacetate, ethyl acetoacetate, ethylene acetate, Ketohexamethylene, levulinic Ketone, 1-Phenylethanone., 2- (1- cyclohexenyl group) Ketohexamethylene, propylene-glycol diacetate, glycerol triacetate, diethylene glycol diacetate, two Oxygen six ring, N-Methyl pyrrolidone, dimethyl carbonate, ethylene glycol dimethyl ether etc..

The pH that catalyst containing plating catalyst or its precursor and solvent gives liquid is not particularly limited, from aftermentioned plating Cover during process easily from the aspect of desired position forms the metal level of desired amount, this pH preferably 3.0～7.0, More preferably 3.2～6.8, more preferably 3.5～6.6.

The preparation method that catalyst gives liquid is not particularly limited, and special metal salt is dissolved in suitable solvent, root Using acid or alkali, pH is adjusted to specific scope according to needs.

The concentration of the plating catalyst in solution or its precursor is not particularly limited, preferably 0.001～50 mass %, more It is preferably 0.005～30 mass %.

Additionally, as time of contact, preferably 30 seconds～24 hours about, more preferably 1 minute～1 hour about.

With regard to the plating catalyst of resin bed or the adsorbance of its precursor, according to the plating bath kind being used, catalyst gold Belong to kind, the interaction group kind of resin bed, using method etc. and different, from the aspect of the precipitation of plating, preferably For 5～1000mg/m², more preferably 10～800mg/m², particularly preferably 20～600mg/m².

(step D -2：Plating operation)

Then, plating is carried out to the resin bed having been assigned plating catalyst or its precursor.By implementing at plating Reason, the region not configuring Resist patterns on the resin layer forms the wiring lead being made up of metal plating layer.

The method of plating is not particularly limited, for example, can enumerate electroless plating or electrolytic coating is processed (electroplating processes).In this operation, can individually implement electroless plating it is also possible to implement electroless plating Implement electrolytic coating afterwards further to process.

It should be noted that in this manual, so-called silver mirror reaction is as one kind of above-mentioned electroless plating And contain.It is thus possible to making accompanying reducing metal ions, form desired pattern-like gold by such as silver mirror reaction etc. Belong to layer, and then electrolytic coating can be implemented thereafter and process.

Below electroless plating is covered with process and the process of electrolytic coating process is described in detail.

So-called electroless plating refers to operations described below：Using dissolving be hopeful in the form of plating separate out metal from The solution of son, makes metal separate out by chemical reaction.

Electroless plating in this operation is for example preferably as follows and carries out：Have been assigned electroless plating catalyst to possessing The substrate of resin bed is washed, and after removing unnecessary electroless plating catalyst (metal), is immersed in electroless plating bath, Thus to carry out electroless plating.As the electroless plating bath being used, it is possible to use known electroless plating bath.

Additionally, will be provided with having been assigned in the absorption of electroless plating catalyst precarsor or in the state of penetrating in resin bed In the case that the substrate of the resin bed of electroless plating catalyst precarsor is impregnated in electroless plating bath, preferred pair substrate is carried out Washing is impregnated in electroless plating bath after removing unnecessary electroless plating catalyst precarsor (slaine etc.).This situation Under, electroless plating bath carries out reduction and the electroless plating immediately after of electroless plating catalyst precarsor.Make For electroless plating bath as used herein it is also possible to use known electroless plating bath as described above.

It should be noted that the reduction with regard to electroless plating catalyst precarsor is it is also possible to use no as described above Separately prepare catalytic activity liquid (reducing solution), as the other operations before electroless plating outside the mode of electrolytic coating liquid Come to carry out.

Additionally, plating bath is not only contacted with the resin bed having been assigned electroless plating catalyst, but also electric with detection Pole contacts, and is separated out by this detecting electrode by this plating.Therefore, also there is plating in the detecting electrode portion apart from more than 2 μm of resin bed Precipitation, the wiring lead that ensure that with the electrically conducting of detecting electrode can be formed.The plating producing on detecting electrode is certainly The length that resin bed rises is preferably more than 3 μm, more preferably more than 10 μm, most preferably more than 1000 μm.

As the composition of general electroless plating bath, in addition to solvent (such as water), mainly comprise：1. plating Metal ion, 2. reducing agent, 3. make the stability-enhanced additive (stabilizer) of metal ion.In this plating bath, except Outside these compositions, the known additive such as stabilizer of plating bath can also be comprised.

As organic solvent used in electroless plating bath, water-soluble solvent is necessary, from this viewpoint, Preferably use the alcohols such as the ketones such as acetone, methanol, ethanol, isopropanol.As the species of metal used in electroless plating bath, Known have copper, stannum, lead, nickel, gold, silver, palladium, rhodium, wherein, from the aspect of electric conductivity, preferably copper, silver, gold, more preferably copper. And optimal reducing agent, additive are selected according to above-mentioned metal.

As the dip time in electroless plating bath, preferably 1 minute～6 hours about, more preferably 1 minute～ 3 hours about, most preferably 1～10 minute.

In this operation, there are the feelings of the function as electrode in the plating catalyst or its precursor being imparted to resin bed Under condition, catalyst can be had been assigned to this or the resin bed of its precursor is electroplated.

It should be noted that as described above, in this operation, can be as needed after above-mentioned electroless plating Carry out electrolytic coating process.Profit in such a way, can suitably adjust the thickness of formed wiring lead.

As electric plating method, it is possible to use existing known method.It should be noted that as gold used in plating Belong to, copper, chromium, lead, nickel, gold, silver, stannum, zinc etc. can be enumerated, from the aspect of electric conductivity, preferably copper, gold, silver, more preferably Copper.

After above-mentioned operation D, can implement as needed to remove the process of Resist patterns.

It should be noted that in above-mentioned mode, carrying out to the mode implementing operation C-2 forming insulating barrier Narration, but give plating catalyst or its precursor, only carry out in the part of this resin bed by the only specific part in resin bed Plating, even if thus not implementing above-mentioned operation C-2, also can get contact panel sensor electroconductive laminate.

Above-mentioned contact panel sensor electroconductive laminate 10 can be applied suitably in contact panel sensor. Above-mentioned such contact panel sensor can be combined with display device etc. and be suitably applied to contact panel (particularly electrostatic electricity Appearance formula contact panel) in.

<<2nd embodiment>>

The top view of the 2nd embodiment of the contact panel sensor electroconductive laminate of the present invention is shown in Fig. 4. Fig. 5 is the sectional view being cut off along cutting line B-B.

Contact panel sensor electroconductive laminate 100 shown in Fig. 4 possesses：Substrate 12, configuration are on the substrate 12 Neighboring area E_OThe lamination type resin bed 34 being made up of downside resin bed 30 and upside resin bed 32, by the week on substrate 12 Border area domain E_OThe middle section E surrounding_I1st detecting electrode 16 of more than 2 of upper configuration and the 2nd detecting electrode 18, configuration are in layer On long-pending type resin bed 34 with the 1st detecting electrode 16 and the 2nd detecting electrode 18 electrical connection more than 2 wiring lead 20, And it is configured at middle section E according to the mode covering the 1st detecting electrode 16 and the 2nd detecting electrode 18_IInsulating barrier 22.

Contact panel sensor shown in Fig. 4 with electroconductive laminate 100, except lamination type resin bed 34 this point with Outward, with the contact panel sensor electroconductive laminate 10 shown in Fig. 1, there is same composition, constitute thus for identical Important document gives identical reference marks the description thereof will be omitted, below mainly lamination type resin bed 34 is described in detail.

In addition, as shown in figure 5, the one end 18A of the 2nd detecting electrode 18 extends on the resin bed 32 of upside, one end 18A Contact with upside resin bed 32.It should be noted that in the 1st detecting electrode, one end also extends on the resin bed of upside.

Lamination type resin bed 34 is the lamination type resin bed comprising downside resin bed 30 and upside resin bed 32, downside resin Layer 30 contains coloring agent, and upside resin bed 32 configures on downside resin bed 30, has mutual with plating catalyst or its precursor Functional group's (interaction group) of effect.In lamination type resin bed 34, downside resin bed has given play to so-called decorative layer Effect, upside resin bed has given play to the effect as so-called plated coating.By using such lamination type resin bed 34, energy Enough decorative layer is separated with the effect of plated coating, the range of choice of the material that this two-layer is used expands.

The species of the coloring agent contained by the resin bed 30 of downside is not particularly limited, and can enumerate in above-mentioned resin bed 14 The coloring agent containing.

Additionally, containing resin in downside resin bed 30, but its species is not particularly limited, and can enumerate in resin bed 14 Contained resin.

It should be noted that interaction group can be contained in downside resin bed 30.

Downside resin bed 30 thickness be not particularly limited, from the function as decorative layer more excellent in terms of and From the aspect of the balance of slimming, preferably 0.5～70 μm, more preferably 1～40 μm.

Upside resin bed 32 is layer on downside resin bed 30 for the configuration, containing interaction group.Interaction Group is as defined above.

Contain resin in upside resin bed 32, but its species is not particularly limited, can enumerate contained in resin bed 14 Some resins.

Coloring agent is preferably contained substantially no in upside resin bed 32.Contain substantially no the content phase meaning coloring agent It is below 10 mass % for upside resin bed 32 gross mass, this content is preferably below 5 mass %, more preferably 0 mass %.

Upside resin bed 32 thickness be not particularly limited, from the function as plated coating more excellent in terms of, with And from the aspect of the balance of slimming, preferably 0.01～10 μm, more preferably 0.2～5 μm, more preferably 0.25～ 1.0μm.

The manufacture method of above-mentioned contact panel sensor electroconductive laminate 100 is not particularly limited, and can enumerate reality Apply following operations A-1 and operation A-2 as the work in the manufacture method of above-mentioned contact panel sensor electroconductive laminate 10 The method of sequence A, in operation A-1, resin bed on the downside of the neighboring area on substrate is formed；In operation A-2, in downside resin Upside resin bed is formed on layer.

The method forming downside resin bed is not particularly limited, the species according to the resin being used and different, Ke Yiju Go out the method using the downside resin bed formation compositionss containing coloring agent and resin.More specifically, can enumerate in base The method of the film of constituent beyond removing on neighboring area after coating downside resin bed formation compositionss on plate.Need Bright, in the case of using photoresist as resin, can be formed downside resin bed：Coating compositions on substrate After thing forms film, pattern-like exposure is carried out for the film on the neighboring area on substrate, is removed by development treatment Unexposed portion, is consequently formed desired downside resin bed.

The method forming upside resin bed is not particularly limited, as one sees fit using the process implemented in process B, this process B For forming the operation of the resin bed in above-mentioned contact panel sensor electroconductive laminate 10.

<<3rd embodiment>>

The top view of the 3rd embodiment of the contact panel sensor electroconductive laminate of the present invention is shown in Fig. 6. Fig. 7 is the sectional view being cut off along cutting line C-C.

Contact panel sensor electroconductive laminate 200 shown in Fig. 6 possesses：Substrate 12, configuration are on the substrate 12 Neighboring area E_ODownside resin bed 30, the upside resin bed 132 of a part on downside resin bed 30 for the configuration, by substrate Neighboring area E on 12_OThe middle section E surrounding_I1st detecting electrode 16 of more than 2 of upper configuration and the 2nd detecting electrode 18, The extraction configuring more than 2 be electrically connected with the 1st detecting electrode 16 and the 2nd detecting electrode 18 on upside resin bed 32 is joined Line 20 and configuring in middle section E according to the mode covering the 1st detecting electrode 16 and the 2nd detecting electrode 18_IInsulating barrier 22.

Contact panel sensor shown in Fig. 6 with electroconductive laminate 200 main except upside resin bed 132 this point with Outward, with the contact panel sensor electroconductive laminate 100 shown in Fig. 2, there is same composition, thus for identical structure Become important document to give identical reference marks the description thereof will be omitted, below the main allocation position to each layer be described in detail.

Contact panel sensor shown in Fig. 4 is with, in electroconductive laminate 100, a part for upside resin bed is located at down Between side resin bed and detecting electrode (the 1st detecting electrode or the 2nd detecting electrode)；And the contact panel sensor shown in Fig. 6 With, in electroconductive laminate 200, upside resin bed is configured according to the mode being contacted with detecting electrode on the resin bed of downside. That is, as shown in fig. 7, the one end 18A of the 2nd detecting electrode 18 extends on the resin bed 30 of downside, one on downside resin bed 30 End 18A is contacted with upside resin bed 132 and wiring lead 20.In 1st detecting electrode, also there is same composition.

With regard to the allocation position of upside resin bed 132, more specifically, as shown in fig. 6, upside resin bed 132 is only located at Between downside resin bed 30 and wiring lead 20.That is, upside resin bed 132 is carried out according to wiring lead 20 identical pattern-like Configuration, wiring lead 20 is only located on the resin bed 132 of upside.In other words, in the manner, upside resin bed is carried out with pattern-like Configuration.

It should be noted that in this approach, the allocation position of upside resin bed 132 is not limited to Fig. 6 and 7 mode, As long as upside resin bed is contacted with the one end of detecting electrode on the resin bed of downside, for example, upside resin bed can also On region beyond region residing in the detecting electrode on the resin bed of downside for the configuration.

The manufacture method of above-mentioned contact panel sensor electroconductive laminate 200 is not particularly limited, from easy to manufacture From the aspect of, preferably there is following operation.

Operation E：Neighboring area on substrate forms the operation of the downside resin bed containing coloring agent；

Operation F：The operation of detecting electrode is formed on substrate, this detecting electrode one end extends on the resin bed of downside；

Operation G：Order implements the operation of operation G-1 and operation G-2 with differing, and in operation G-1, is formed and has and plating The upside resin bed of the functional group of catalyst or the interaction of its precursor, on the upside of this, resin bed configuration is at one of downside resin bed On point, and on the upside of this, resin bed is contacted with detecting electrode；In operation G-2, formed and contain substantially no and plating catalyst Or the insulating barrier of the functional group of its precursor interaction, this insulating barrier is according to the one end of the detecting electrode contacting with upside resin bed The mode that portion exposes covers detecting electrode；

Step H：It is formed by the following method the operation with the wiring lead of the one end electrical connection of detecting electrode, the party Method at least has following operations：Give plating catalyst or its precursor to upside resin bed, for having been assigned plating catalyst Or the upside resin bed of its precursor carries out plating.

Below above-mentioned operation E～step H is described in detail.

[operation E]

Operation E is the operation of the downside resin bed containing coloring agent for the neighboring area formation on substrate.This operation can be led to Cross the process same with above-mentioned operation A-1 to implement.

[operation F]

Operation F is the operation forming detecting electrode on substrate, and the one end of this detecting electrode extends to downside resin bed On.This operation can be implemented by the process same with above-mentioned process B.

[operation G]

Operation G is the operation that order implements operation G-1 and operation G-2 with differing, and in operation G-1, is formed and has and plating Cover the upside resin bed of the functional group of catalyst or the interaction of its precursor, on the upside of this, resin bed configures the one of downside resin bed Partly go up, and on the upside of this, resin bed is contacted with detecting electrode；In operation G-2, formed and contain substantially no and plating catalysis The insulating barrier of the functional group that agent or its precursor interact, this insulating barrier is according to the one of the detecting electrode contacting with upside resin bed The mode that end is exposed covers detecting electrode.

In operation G, implement operation G-1 and operation G-2 with sequentially differing, specifically, operation can implemented Implement operation G-2 it is also possible to implement operation G-1 after implementing operation G-2 after G-1.

Operation G-1 is the work forming the upside resin bed with the functional group interacting with plating catalyst or its precursor Sequence, on the upside of this, resin bed configures in a part for downside resin bed, and on the upside of this, resin bed is contacted with detecting electrode.This work The suitable employing of the process of sequence is forming above-mentioned contact panel sensor reality in operation A of the resin bed in electroconductive laminate 10 The process applied, resin bed on the upside of configuration only on the specific region on the resin bed of downside.It should be noted that only in given zone On domain during the resin bed of configuration upside, adjustment as one sees fit gives the region of energy.

Operation G-2 is to form the insulating barrier containing substantially no the functional group interacting with plating catalyst or its precursor Operation, this insulating barrier covers detecting electrode according to the mode that the one end of the detecting electrode being contacted with upside resin bed is exposed. The process of this operation takes the circumstances into consideration the work using the insulating barrier being formed in above-mentioned contact panel sensor electroconductive laminate 10 The process implemented in sequence C-2.

[step H]

Step H is the operation being formed by the following method with the wiring lead of the one end electrical connection of detecting electrode, should Method at least has following operations：Give plating catalyst or its precursor to upside resin bed, be catalyzed for having been assigned plating The upside resin bed of agent or its precursor carries out plating.

As shown in fig. 6, in the case that upside resin bed is only located at the region that wiring lead is configured, in this operation, By implementing step D, desired wiring lead can be formed, it is conductive that this step D forms above-mentioned contact panel sensor Wiring lead in property laminate 10.

It should be noted that in step H, as needed, can for by plating on the resin bed of upside institute The metal level being formed is etched with pattern-like further, forms wiring lead.

As method now, (mask of pattern-like is set on the metal layer, to non-shape using commonly known subtractive process After becoming the region of mask to be etched processing, remove mask, the method forming wiring lead), semi-additive process (sets on the metal layer The mask of placing graphic pattern shape, the mode according to forming metal level in the region not forming mask carries out plating, removes mask, enters Row etch processes, the method forming wiring lead).

It should be noted that in operation G, formation also can not be carried out and contains substantially no and plating catalyst or its precursor Interact the insulating barrier of functional group operation, and in the case of not forming insulating barrier only for have been assigned plating catalysis The one end of the upside resin bed of agent or its precursor and detecting electrode carries out plating.

Additionally, in above-mentioned Fig. 1～Fig. 7, for configuration detecting electrode only on the surface of the side of substrate, drawing and join The mode of line and resin bed carried out describing but it is also possible to the above-mentioned detecting electrode of the two sides of substrate configuration, wiring lead and Resin bed.Now, as the substrate being used, as set forth above, it is possible to using resin substrate (such as pet substrate) etc..

【Embodiment】

Below by embodiment, the present invention is illustrated in further detail, but the present invention is not limited to these.

Carry out 5 silk screen printings, be coated using black anti-corrosion agent on thickness is for the glass substrate of 0.55mm.Then Remove solvent composition using pressure Reduction Dryer, be exposed using proximity printing mode (extra-high-pressure mercury vapour lamp) afterwards.Herein, Use mask obtained from Cr (chromium) implements pattern on soda-lime glass as photomask for use in exposure.Next using alkalescence Developer solution carries out developing, carries out heat treatment, and the position of the resin bed 14 shown in Fig. 1 forms resin bed.

It should be noted that as black anti-corrosion agent, used in the embodiment 4 using Japanese Unexamined Patent Publication 2014-130417 Black combination 4.In addition, containing the carboxylic acid group as interaction group in obtained resin bed.

Then, 95 are compared with stannum oxide for weight using Indium sesquioxide.:5 composition, packed density are 98% Indium sesquioxide .-oxidation Stannum target, forms ITO layer by sputtering method on obtained glass substrate, using photolithography by Resist patterns Change, be etched, obtain being equivalent to the pattern-like ITO layer of the 1st detecting electrode 16 shown in Fig. 1 and the 2nd detecting electrode 18.Its In, carry out pattern exposure using acrylic acid seriess photosensitive polymer combination between the 1st detecting electrode 16 and the 2nd detecting electrode 18 Light, configures inter-electrode dielectric layer.

It should be noted that as shown in figure 1, the one end of ITO layer extends on resin bed.

Then, the negative resist containing cyclisation isoprene rubber for the coating in the ITO layer of obtained glass substrate (Fuji Film manufacture, SC-450), is exposed with pattern-like, and development removes unexposed portion, with the insulating barrier shown in Fig. 1 22 same positions obtain insulating barrier.It should be noted that not containing interaction group in a insulating layer.In addition, as Fig. 1 Shown, insulating barrier is configured according to the mode that each one end of ITO layer exposes.

Then, coating contains negative resist (Fuji Film manufacture, the SC- of cyclisation isoprene rubber on the resin layer 450), it is exposed with pattern-like, the region on the resin bed not configuring wiring lead 20 shown in Fig. 1 forms resist figure Case.

Next, after utilizing maintenance band (day, east electrician manufactured) to cover in the face of the glass substrate not forming resin bed, Under room temperature, Pd catalyst is only being given the MAT-2A in liquid MAT-2 (industry of upper village manufactures) by the glass substrate with resin bed Carry out (catalyst imparting liquid, pH after 5 times of dilutions：3.5) impregnate 5 minutes in solution, cleaned 2 times using pure water.Then 36 Impregnate 5 minutes in reducing agent MAB (industry of upper village manufactures) at DEG C, cleaned 2 times using pure water.Thereafter at room temperature in activation Dipping 5 minutes in treatment fluid MEL-3 (industry of upper village manufactures), in the case of not being carried out, at room temperature respectively in no electricity Dipping 60 minutes in solution plating liquid Thru-cup PEA (industry of upper village manufactures).Peel off the band covering, cleaned 2 times using pure water, Possessed the electroconductive laminate of pattern-like layers of copper (being equivalent to wiring lead) on the resin layer.Confirm shown in Fig. 2 The length of the distribution 20 being formed on the 2nd detecting electrode end 18A is from the 2nd detecting electrode end 18A most external for more than 1mm.

(synthesis example：Polymer 1)

Add ethyl acetate 1L, 2- ethylaminoethanol 159g in the there-necked flask of 2L, cooled down using ice bath.It is adjusted to Interior temperature is less than 20 DEG C Deca 2- bromo isobutyl acylbromide 150g thereto.Thereafter interior temperature is made to rise to room temperature (25 DEG C) and react 2 Hour.After reaction terminating, additional distilled water 300mL makes reaction stop.Thereafter using distilled water 300mL, ethyl acetate phase is carried out 4 cleanings, are dried using magnesium sulfate afterwards, and then ethyl acetate are distilled off, thus obtaining raw material A 80g.

Then, raw material A 47.4g, pyridine 22g, ethyl acetate 150mL are added in the there-necked flask of 500mL, using ice Bath is cooled down.Being adjusted to interior temperature is less than 20 DEG C Deca acryloyl chloride 25g thereto.Thereafter rise to room temperature and to react 3 little When.After reaction terminating, additional distilled water 300mL makes reaction stop.Thereafter using distilled water 300mL, 4 are carried out to ethyl acetate phase Secondary cleaning, is dried using magnesium sulfate afterwards, and then ethyl acetate is distilled off.Thereafter obtain following list using column chromatography Body M1 (20g).

【Change 6】

Add N,N-dimethylacetamide 8g in the there-necked flask of 500mL, be heated to 65 DEG C under nitrogen flowing.Using 4 The time Deca monomer M1 thereto of hour：14.3g, acrylonitrile (Tokyo HuaCheng Industry Co., Ltd's manufacture) 3.0g, acrylic acid The DMAC N,N' dimethyl acetamide 8g solution of (Tokyo chemical conversion manufactures) 6.5g, V-65 (and pure medicine manufacture) 0.4g.

After completion of dropwise addition, reaction solution is stirred further 3 hours.Thereafter add N,N-dimethylacetamide 41g, will be anti- Solution is answered to be cooled to room temperature.4- hydroxyl TEMPO (Tokyo chemical conversion manufactures) 0.09g, DBU (phenodiazine is added in above-mentioned reaction solution Miscellaneous bicyclic endecatylene) 54.8g, carry out reaction in 12 hours at room temperature.70 mass % methanesulfonic acids are added in its backward reactant liquor Aqueous solution 54g.After reaction terminating, carry out reprecipitation using water, take out solid matter, obtain polymer 1 (12g).

The identification of the polymer 1 obtained by being carried out using IR measuring machine ((strain) hole field makes manufactured).In mensure, make Polymer dissolves in acetone, crystallizes to carry out using KBr.The result being measured according to IR, in 2240cm^-1Nearby observe peak Value is it is known that acrylonitrile is directed in polymer as nitrile unit.Additionally, understanding that acrylic acid is used as carboxylic acid list by acid value measuring Unit is imported into.And, so that polymer is dissolved in deuterated DMSO (dimethyl sulfoxide), the 300MHz's being manufactured using Bruker NMR (nuclear magnetic resonance, NMR, Nuclear Magnetic Resonance) (AV-300) is measured.Understand, in 2.5-0.7ppm (5H) observe the broad peak being equivalent to nitrile group-containing unit, in 7.8-8.1ppm (1H), 5.8-5.6ppm (1H), 5.4-5.2ppm (1H), 4.2-3.9ppm (2H), 3.3-3.5ppm (2H), 2.5-0.7ppm (6H) observe and are equivalent to unit containing polymerizable group Broad peak, observe the broad peak being equivalent to containing carboxylic acid, unit containing polymerizable group in 2.5-0.7ppm (3H):Nitrile group-containing list Unit:Carboxylic acid group unit=30:30:40 (mol%).

【Change 7】

(modulation of upside resin bed formation compositionss)

Water (18.95 mass parts), propylene glycol monomethyl ether (75.8 matter are added in the 200ml beaker insert magnetic agitation Amount part), polymer 1 (5 mass parts) and IRGACURE OXE 02 (manufacture of BASF society) (0.25 mass parts), modulation liquid, obtain Upside resin bed formation compositionss.

In addition to the manufacture process of resin bed is changed to following method (manufacture method of lamination type resin bed), press Manufacture electroconductive laminate according to process same as Example 1.

(manufacture method of lamination type resin bed)

Using the decorative layer formation photosensitive film L1 manufacturing in the embodiment 1 of Japanese Unexamined Patent Publication 2013-218313, press According to the process same with above-mentioned document, decorative layer is configured in substrate in the position same with the downside resin bed 30 shown in Fig. 4 On.It should be noted that containing coloring agent in decorative layer.

Then, resin bed formation compositionss on the upside of spin coating on the substrate possess decorative layer, in 80 DEG C of dryings 5 minutes. Thereafter, under air, with pattern-like, UV irradiation (energy is carried out to film entire surface：2J, 10mW, wavelength：256nm), with Fig. 4 The same position of shown upside resin bed 32 forms upside resin bed (thickness：0.25μm).

There is the substrate of decorative layer according to process manufacture similarly to Example 2.

Then, according to the process same with the method for enforcement in embodiment 1, ITO layer is configured on substrate.Need explanation It is that the one end of ITO layer extends on decorative layer.

Then, resin bed formation compositionss on the upside of spin coating on the substrate possess decorative layer, in 80 DEG C of dryings 5 minutes. Thereafter, under air, with pattern-like, UV irradiation (energy is carried out to film entire surface：2J, 10mW, wavelength：256nm), with Fig. 6 The same position of shown upside resin bed 132 forms upside resin bed (thickness：0.25μm).

Thereafter, using obtained substrate, insulating barrier is set according to process same as Example 1, and then carries out plating Process, the position of the wiring lead 20 shown in Fig. 6 forms pattern-like layers of copper, obtains electroconductive laminate.

Implement following (connection resistance measurements) using the electroconductive laminate obtaining in above-described embodiment 1～3, result exists It is " A " in arbitrary electroconductive laminate to evaluate, confirm the electricity of ITO layer (detecting electrode) and pattern-like layers of copper (wiring lead) Gas connectivity is high.

(connection resistance measurement)

As evaluation methodology, the resistance value between above-mentioned pattern-like layers of copper and pattern-like ITO layer is measured with (day puts electricity Machine society manufactures, Milliohm HiTester 3540), evaluated according to following benchmark.

“A”：Resistance value is the situation of below 10m Ω

“B”：Resistance value is more than the situation of 10m Ω

“C”：Cannot determine resistance value, substantially occur break situation

It should be noted that in embodiment 1, employ by the negative resist containing cyclisation isoprene rubber The insulating barrier that (Fuji Film manufactures, SC-450) is formed, uses SiO even in substituting insulating barrier₂Layer (33nm) and NbO₅ In the case of the laminated layer of layer (14nm), also confirm to have obtained same effect.

Manufacture and possessed the contact panel sensor of each electroconductive laminate comprising to obtain in above-described embodiment 1～3 Contact panel, each contact panel of result all works well.

It should be noted that being that setting insulating barrier carries out plating but it is also possible to not in above-described embodiment 1～3 Insulating barrier is set and only makes the part that wiring lead separates out implement plating in hope, form desired pattern-like layers of copper. More specifically, only hope is made partial immersion solution used in above-mentioned plating of the resin bed of wiring lead precipitation In, so that plating thing is separated out.

【The explanation of symbol】

10,100,200 contact panel sensor electroconductive laminates

12 substrates

14 resin beds

16 the 1st detecting electrodes

18 the 2nd detecting electrodes

20 wiring leads

22 insulating barriers

24 inter-electrode dielectric layer

30 downside resin beds

32,132 upside resin beds

34 lamination type resin beds

Claims

1. a kind of contact panel sensor electroconductive laminate, it has：

Substrate；

Resin bed, its configuration neighboring area on aforesaid substrate, be there is the official being interacted with plating catalyst or its precursor Can group；

Detecting electrode, it configures on aforesaid substrate according to the mode that one end is contacted with above-mentioned resin bed；And

Wiring lead, above-mentioned one end electrical connection on above-mentioned resin bed, with above-mentioned detecting electrode for its configuration；

Above-mentioned wiring lead is the distribution by least having the formation of the method for following operations, in this operation, to above-mentioned resin Layer gives plating catalyst or its precursor, has been assigned plating catalyst or the resin bed of its precursor is carried out at plating for above-mentioned Reason.

2. contact panel sensor electroconductive laminate as claimed in claim 1, wherein,

This laminate has insulating barrier further, and this insulating barrier is electrically connected with above-mentioned wiring lead according to above-mentioned detecting electrode The mode exposed of above-mentioned one end cover above-mentioned detecting electrode；

The functional group interacting with plating catalyst or its precursor is contained substantially no in above-mentioned insulating barrier.

3. contact panel sensor electroconductive laminate as claimed in claim 1 or 2, wherein,

Coloring agent is contained, above-mentioned resin bed is as decorative layer function in above-mentioned resin bed；

The above-mentioned one end of above-mentioned detecting electrode extends on above-mentioned resin bed.

4. contact panel sensor electroconductive laminate as claimed in claim 1 or 2, wherein,

Above-mentioned resin bed is the lamination type resin bed comprising downside resin bed and upside resin bed, and on the downside of this, resin bed contains coloring Agent, on the upside of this resin bed configure on the resin bed of above-mentioned downside, and on the upside of this resin bed have with above-mentioned plating catalyst or The functional group that its precursor interacts；

The above-mentioned one end of above-mentioned detecting electrode extends on the resin bed of above-mentioned upside.

5. contact panel sensor electroconductive laminate as claimed in claim 1 or 2, wherein,

Above-mentioned resin bed is the lamination type resin bed comprising downside resin bed and upside resin bed, and on the downside of this, resin bed contains coloring Agent, a part on the resin bed of above-mentioned downside for the resin bed configuration on the upside of this, and on the upside of this, resin bed has and above-mentioned plating Catalyst or the functional group of its precursor interaction；

The above-mentioned one end of above-mentioned detecting electrode extends on the resin bed of above-mentioned downside, on the resin bed of above-mentioned downside, above-mentioned one End is contacted with above-mentioned upside resin bed.

6. the contact panel sensor electroconductive laminate as described in any one of Claims 1 to 5, wherein, aforesaid substrate For glass substrate.

7. a kind of contact panel sensor, the contact panel sensor that it comprises described in any one of claim 1～6 is conductive Property laminate.

8. a kind of contact panel, the contact panel sensor electric conductivity lamination described in its any one comprising claim 1～6 Body.

9. a kind of manufacture method of contact panel sensor electroconductive laminate, it has following operations：

Operation A, in this operation, neighboring area on substrate is formed to have and is interacted with plating catalyst or its precursor The resin bed of functional group；

Process B, in this operation, forms detecting electrode, the one end of this detecting electrode extends to above-mentioned tree on aforesaid substrate In lipid layer, this detecting electrode is contacted with above-mentioned resin bed；

Operation C, in this operation, implements operation C-1 and operation C-2 with sequentially differing, in operation C-1, in above-mentioned resin bed Upper formation Resist patterns；In operation C-2, formed and contain substantially no the official interacting with plating catalyst or its precursor The insulating barrier that can roll into a ball, this insulating barrier covers according to the mode that the one end of the above-mentioned detecting electrode being contacted with above-mentioned resin bed is exposed Above-mentioned detecting electrode；And

Step D, in this operation, gives plating catalyst to the region not forming above-mentioned Resist patterns on above-mentioned resin bed Or its precursor, plating is carried out for the above-mentioned resin bed having been assigned plating catalyst or its precursor, is formed and above-mentioned inspection Survey the wiring lead that the above-mentioned one end of electrode is electrically connected.

10. a kind of manufacture method of contact panel sensor electroconductive laminate, it has following operations：

Operation F, in this operation, forms one end on aforesaid substrate and extends to the detecting electrode on the resin bed of above-mentioned downside；

Operation G, in this operation, implements operation G-1 and operation G-2 with sequentially differing, and in operation G-1, is formed and has and plating Cover the upside resin bed of the functional group of catalyst or the interaction of its precursor, on the upside of this, resin bed configures in above-mentioned downside resin bed A part on, and on the upside of this, resin bed is contacted with above-mentioned detecting electrode；In operation G-2, formed contain substantially no with The insulating barrier of the functional group that plating catalyst or its precursor interact, this insulating barrier is according to contacting with above-mentioned upside resin bed The mode that the one end of above-mentioned detecting electrode exposes covers above-mentioned detecting electrode；And

Step H, in this operation, is formed by the following method drawing of being electrically connected with the above-mentioned one end of above-mentioned detecting electrode Go out distribution, the method at least has following operations：Give plating catalyst or its precursor to above-mentioned upside resin bed, for above-mentioned Have been assigned plating catalyst or the upside resin bed of its precursor carries out plating.