TWI744537B

TWI744537B - Method for manufacturing a touch panel

Info

Publication number: TWI744537B
Application number: TW107122710A
Authority: TW
Inventors: 白志強; 林孟癸; 林青峰
Original assignee: 洋華光電股份有限公司
Priority date: 2018-06-30
Filing date: 2018-06-30
Publication date: 2021-11-01
Also published as: TW202006795A

Abstract

A method for manufacturing a touch panel includes: a) a glass substrate pre-segmentation step: a plurality of grooves are formed in the glass substrate to define a plurality of touch substrates, and ribs are disposed in the grooves to integrate the glass substrate and the touch substrate; b) the glass substrate strengthening step: a compressive stress layer is formed on the surface of the touch substrate; c) a decorative border pattern layer setting steps; d) a touch sensing electrode pattern layer setting step; e) a jumper insulation layer setup steps; f) a signal wire layer setting step: the signal wire can be electrically connected to the electrical contacts on the touch sensing electrode pattern layer through the through holes on the jumper insulating layer; and g) a cutting step: the ribs in each groove are cut off to separate the touch substrate from the glass substrate.

Description

觸控面板的製造方法Manufacturing method of touch panel

本發明涉及觸控面板技術，特別是有關一種可高效率生產高強度觸控面板的製造方法。The present invention relates to touch panel technology, in particular to a manufacturing method capable of producing high-strength touch panels with high efficiency.

現今廣泛應用於配置在顯示器幀面上使用觸控面板大多使用透明玻璃為基板；在觸控面板的產製方式上，以往為避免強化玻璃在切割方面的技術困難，一般會先將觸控面板的玻璃基板切割成個別單元所需尺寸規格，再對已分割玻璃基板進行強化處理，然後再將觸控感應電極、絕緣膜以及訊號導線等必要元件配置到玻璃基板，以組成一觸控面板結構；然而由於觸控面板產製步驟繁複，前述傳統觸控面板製造方法採用個別單元逐一生產方式，人力及時間成本耗費至鉅，且產能效率低下難符需求，更甚者，觸控面板結構具備高度精密性，產製過程中組裝元件的位置對準操作成為產品成敗的主要關鍵，然而傳統觸控面板製造方法將玻璃基板切割成較小尺寸規格，導致在位置對準操作上愈加困難，這結果不僅形成生產技術上的瓶頸，更造成使產品不良率高居不下的缺失。Nowadays, it is widely used to configure the touch panel on the display frame. Most of the transparent glass is used as the substrate; in the production method of touch panel, in the past, in order to avoid the technical difficulties in cutting strengthened glass, the touch panel is generally used first The glass substrate is cut into the required size specifications for individual units, and then the divided glass substrate is strengthened, and then necessary components such as touch sensing electrodes, insulating film and signal wires are arranged on the glass substrate to form a touch panel structure However, due to the complex production steps of touch panels, the aforementioned traditional touch panel manufacturing methods adopt individual unit-by-unit production methods, which consumes enormous manpower and time costs, and low productivity and efficiency are difficult to meet the needs. What's more, the touch panel structure has High precision, the position alignment operation of the assembled components during the production process has become the main key to the success of the product. However, the traditional touch panel manufacturing method cuts the glass substrate into smaller sizes, which makes the position alignment operation more difficult. The result is not only a bottleneck in production technology, but also a defect that keeps the defective rate of products high.

面對前述觸控面板生產技術的難題，目前已知的改善方案是改採用大面積的整片玻璃板為基材，在玻璃板分別預先配置若干個單元的觸控感應電極、絕緣膜以及訊號導線等元件，再使用截斷器分割以獲得各個觸控面板；該改善方案雖可提升生產效率及產品良率，但為了避免在生產過程中面臨整片玻璃板難以切割加工的問題，所以大多採用僅經低度強化處理或未經強化處理的玻璃板材，因此導致觸控面板成品的玻璃基板強度不足，容易因外力碰撞而碎裂，產品耐用度差，此外，在玻璃板材的裁切加工過程中，經常會在切割開口部位造成不規則破裂，並且在切口邊緣附近以及切口斷面產生許多微裂纹，導致後續的加工製程中或是使用過程中承受外力或溫度變化時，可能造成裂紋繼續擴展或加深，致使玻璃基板產生變形或破裂；所以在實務上，對於裁切所得的觸控面板成品的玻璃基板，通常還必須再經過邊緣修整或二次強化的過程，以確保玻璃抵抗破裂的能力與強度，但卻因此倍增生產成本。In the face of the aforementioned technical difficulties in touch panel production, the currently known improvement scheme is to use a large-area whole glass plate as the base material, and to pre-configure several units of touch sensing electrodes, insulating films and signals on the glass plate. The wires and other components are then divided by a cutter to obtain each touch panel; although this improvement scheme can improve production efficiency and product yield, in order to avoid the problem that the entire glass plate is difficult to cut during the production process, most of them are adopted Only low-strengthened or un-strengthened glass plates have led to insufficient strength of the glass substrate of the finished touch panel, which is likely to be broken due to external force collisions, and the durability of the product is poor. In addition, in the cutting process of the glass plate In the process, irregular cracks are often caused at the cutting opening, and many micro-cracks are generated near the edge of the incision and the incision section, which may cause the cracks to continue to grow when the subsequent processing or use is subjected to external force or temperature changes. Or deepen, causing the glass substrate to deform or crack; therefore, in practice, for the cut glass substrate of the finished touch panel, it is usually necessary to go through an edge trimming or secondary strengthening process to ensure the glass's ability to resist cracking And strength, but therefore double the production cost.

本發明之主要目的乃在提供一種可高效率生產高強度觸控面板的製造方法，其採用具有易於裁切結構大面積的強化玻璃為基材，使製成的觸控面板具備高機械強度，且可在一次的生產製程中可同時生產出數個甚至數十個的個別觸控面板，達高效率生產及節省成本之目的。The main purpose of the present invention is to provide a manufacturing method that can produce high-strength touch panels with high efficiency, which uses a large-area strengthened glass with an easy-to-cut structure as a base material, so that the manufactured touch panel has high mechanical strength. In addition, several or even dozens of individual touch panels can be produced at the same time in a single production process, achieving the purpose of high efficiency production and cost saving.

為達上述目的，本發明所提供之觸控面板的製造方法，包含： a)玻璃基材預分割步驟：在大面積玻璃基材上開設複數溝槽以界定出多個觸控基板，且在溝槽中設有肋將該玻璃基材與觸控基板連結一體，該肋的截面寬度在1mm以下； b)玻璃基材強化步驟：對玻璃基材進行化學離子強化處理，以在觸控基板表面形成一壓應力層，該壓應力層深度範圍在5µm以上； c)裝飾邊框圖案層設置步驟：在觸控基板的表面塗布感光型油墨，通過一黃光製程而在觸控基板四周邊緣部位形成一裝飾邊框圖案層，該裝飾邊框圖案層可在觸控基板上界定出可瞻區及遮蔽區的範圍； d)觸控感應電極圖案層設置步驟：對設在前述裝飾邊框圖案層上的透明導電薄膜進行黃光製程及蝕刻製程以形成一觸控感應電極圖案層，該觸控感應電極圖案層的感應電極形成在前述可瞻區範圍內，而連接該等感應電極的電接點則設於前述遮蔽區範圍內； e)跳線絕緣層設置步驟：一跳線絕緣層被設置前述遮蔽區範圍的觸控感應電極圖案層上面，該跳線絕緣層上設有複數貫穿孔對應於前述電接點的位置； f)訊號導線層設置步驟：對設置前述跳線絕緣層上的導電薄膜進行黃光製程及蝕刻製程以形成一訊號導線層，該訊號導線層具有複數訊號導線，且該等訊號導線分別通過前述貫穿孔電性連接前述電接點；以及 g)裂片步驟：進行***施作以截斷各溝槽內的肋，使觸控基板自該玻璃基材上分離出來。In order to achieve the above objective, the manufacturing method of the touch panel provided by the present invention includes: a) a glass substrate pre-segmentation step: a plurality of grooves are formed on a large-area glass substrate to define a plurality of touch substrates, and A rib is provided in the groove to connect the glass substrate and the touch substrate as a whole, and the cross-sectional width of the rib is less than 1mm; b) Glass substrate strengthening step: chemical ion strengthening treatment is performed on the glass substrate to strengthen the touch substrate A compressive stress layer is formed on the surface, and the depth range of the compressive stress layer is above 5µm; c) Steps of setting the decorative frame pattern layer: Coating photosensitive ink on the surface of the touch substrate, and apply a yellow light process to the peripheral edge of the touch substrate A decorative frame pattern layer is formed, and the decorative frame pattern layer can define the range of the visible area and the shielding area on the touch substrate; The transparent conductive film undergoes a yellow light process and an etching process to form a touch sensing electrode pattern layer, the sensing electrodes of the touch sensing electrode pattern layer are formed in the aforementioned visible region, and the electrical contacts connecting the sensing electrodes are Set in the aforementioned shielded area; e) jumper insulating layer setting step: a jumper insulating layer is set on the touch sensing electrode pattern layer in the aforementioned shielded area, and the jumper insulating layer is provided with a plurality of through holes corresponding to The position of the aforementioned electrical contact; f) the signal wire layer setting step: yellow light process and etching process are performed on the conductive film on the jumper insulation layer to form a signal wire layer, the signal wire layer has a plurality of signal wires, and The signal wires are respectively electrically connected to the electrical contacts through the through holes; and g) the splitting step: splitting is performed to cut off the ribs in the grooves, and the touch substrate is separated from the glass substrate.

特別是，所述觸控感應電極圖案層的透明導電薄膜材料選自於金屬氧化物薄膜或石墨烯薄膜等，但不限於此；所述金屬氧化物薄膜的材料選自於氧化銦錫、氧化銦鋅、氧化鋅鋁、氧化錫銻或聚乙撐二氧噻吩等，但不限於此。In particular, the transparent conductive film material of the touch sensing electrode pattern layer is selected from metal oxide film or graphene film, but not limited to this; the material of the metal oxide film is selected from indium tin oxide, oxide Indium zinc, zinc aluminum oxide, tin antimony oxide, or polyethylene dioxythiophene, etc., but not limited thereto.

特別是，所述訊號導線層的導電薄膜材料選自於金、銀、銅、鋁、鎳或前述材料合金等，但不限於此；優選，所述訊號導線層的導電薄膜為鉬鋁金屬鍍膜。In particular, the conductive film material of the signal wire layer is selected from gold, silver, copper, aluminum, nickel or the foregoing material alloys, but not limited to this; preferably, the conductive film of the signal wire layer is a molybdenum aluminum metal plating film .

特別是，所述***施作是以切割工具對所述肋進行裁切，使所述肋斷裂；或是以沖壓模具對所述肋施予壓應力，使所述肋斷裂。In particular, the splitting operation is to cut the ribs with a cutting tool to break the ribs; or to apply a compressive stress to the ribs by a stamping die to break the ribs.

本「發明內容」係以簡化形式介紹一些選定概念，在下文之「實施方式」中將進一步對其進行描述。本「發明內容」並非意欲辨識申請專利之標的之關鍵特徵或基本特徵，亦非意欲用於限制申請專利之標的之範圍。This "Summary of the Invention" introduces some selected concepts in a simplified form, which will be further described in the "Implementation Modes" below. This "Summary of the Invention" is not intended to identify the key features or basic features of the subject matter of the patent application, nor is it intended to be used to limit the scope of the subject matter of the patent application.

圖1至圖21描述本發明一較佳實施例，本發明的製造方法可在一次加工過程中同時製作出多個具有邊緣強化基板的觸控面板，如圖2至圖4所示，所製成的觸控面板結構包含依序疊層的一經強化觸控基板2、一裝飾邊框圖案層3、一觸控感應電極圖案層4、一跳線絕緣層5以及一訊號導線層6；參見圖1所示，所述觸控感應器的製造方法包含如下步驟：Figures 1 to 21 describe a preferred embodiment of the present invention. The manufacturing method of the present invention can simultaneously produce multiple touch panels with edge-strengthened substrates in a single process, as shown in Figures 2 to 4, The completed touch panel structure includes a strengthened touch substrate 2, a decorative frame pattern layer 3, a touch sensing electrode pattern layer 4, a jumper insulation layer 5, and a signal wire layer 6 laminated in sequence; see FIG. As shown in 1, the manufacturing method of the touch sensor includes the following steps:

a) 玻璃基材預分割步驟S1：首先，選用一片大面積的平板型玻璃基材1，其上、下表面至少之一為平坦面，該平坦面的另一對應表面可為平坦面或非平坦面，例如是規則或不規則的曲面，以及該玻璃基材1具有鹼金屬離子，例如，鈉鈣矽酸鹽玻璃、鋁矽酸鹽玻璃或鋁硼矽酸鹽玻璃…等，但實施的材料範圍不以前述材料為限。圖5及圖6為玻璃基材1結構的平面圖與側面剖示圖，顯示玻璃基材1完成預分割之後，在玻璃基材1上界定出至多片觸控基板2；可藉由使用切割刀具，例如雷射刀、鑽石刀或碳化鎢刀等，或是使用化學蝕刻手段，在玻璃基材1表面順沿預設的各個觸控基板2外型邊緣劃設出溝槽12，該溝槽12貫穿設置玻璃基材1的上、下表面，並於該溝槽12中設有多個肋13，該肋13橫向連接於溝槽12的二相對側牆之間(參見圖6)；肋13的截面寬度W在1mm以下；該等觸控基板2藉由肋13的支撐固定而與玻璃基材1連接成一體，以便於後續加工製程的施作。此外，在前述玻璃基材預分割步驟S1中，進行溝槽12開設加工的同時，亦可在觸控基板2上設置所需的孔28、凹穴或缺口等構造。a) Glass substrate pre-segmentation step S1: First, a large-area flat glass substrate 1 is selected, at least one of its upper and lower surfaces is a flat surface, and the other corresponding surface of the flat surface can be a flat surface or a non-flat surface. The flat surface is, for example, a regular or irregular curved surface, and the glass substrate 1 has alkali metal ions, for example, soda lime silicate glass, aluminosilicate glass, or aluminoborosilicate glass, etc., but it is implemented The range of materials is not limited to the aforementioned materials. 5 and 6 are a plan view and a side cross-sectional view of the structure of the glass substrate 1, showing that after the glass substrate 1 is pre-divided, at most multiple touch substrates 2 are defined on the glass substrate 1; a cutting tool can be used For example, a laser knife, a diamond knife or a tungsten carbide knife, etc., or using chemical etching means, a groove 12 is formed on the surface of the glass substrate 1 along the edge of each preset touch substrate 2. The groove 12 penetrates the upper and lower surfaces of the glass substrate 1, and a plurality of ribs 13 are provided in the groove 12, and the ribs 13 are transversely connected between the two opposite side walls of the groove 12 (see FIG. 6); The cross-sectional width W of 13 is less than 1 mm; the touch substrates 2 are supported and fixed by the ribs 13 and are connected to the glass substrate 1 as a whole to facilitate subsequent processing. In addition, in the aforementioned pre-segmentation step S1 of the glass substrate, while the trench 12 is opened and processed, the touch substrate 2 may also be provided with required structures such as holes 28, cavities, or notches.

b) 玻璃基材強化步驟S2：以化學離子強化處理手段進行玻璃強化，將玻璃基材1浸漬在熔態的鉀鹽浴池中，使鉀離子與玻璃基材表層的鈉離子進行離子交換，在玻璃基材1及觸控基板2的各個表面形成一壓應力層14(參見圖6)，並使玻璃基材1及觸控基板2內部衍生出適當的張應力以使整體達到力平衡，從而使玻璃板體產生抵抗衝擊與變形破裂的強度；較佳的，前述壓應力層14深度範圍約在5~90µm之間，但實施的範圍不以前述深度範圍為限；在本實施例中所述壓應力層深度定義為45µm。b) Glass substrate strengthening step S2: Glass is strengthened by chemical ion strengthening treatment. The glass substrate 1 is immersed in a molten potassium salt bath to exchange potassium ions with sodium ions on the surface of the glass substrate. A compressive stress layer 14 is formed on each surface of the glass substrate 1 and the touch substrate 2 (see FIG. 6), and appropriate tensile stress is derived from the glass substrate 1 and the touch substrate 2 to achieve a force balance as a whole, thereby Make the glass plate body have the strength to resist impact and deformation; preferably, the depth range of the aforementioned compressive stress layer 14 is about 5~90μm, but the scope of implementation is not limited to the aforementioned depth range; in this embodiment, The depth of the compressive stress layer is defined as 45 µm.

c) 裝飾邊框圖案層設置步驟S3：在各個所述觸控基板的一表面均勻塗布絕緣性的感光型油墨，再通過黃光製程(Photo Process)形成裝飾邊框圖案層3，該裝飾邊框圖案層3係設置在該等觸控基板2的四周邊緣部位，據此在觸控基板2上界定出可瞻區21及遮蔽區22的範圍；前述設置步驟S3的具體操作方式如下：對各個觸控基板2的欲施工表面清洗潔淨，然後將選用絕緣性的黑色感光型油墨材料經由精密定量幫浦以噴塗方式均勻的塗布於觸控基板2上，形成一光阻薄膜BM(如圖7所示)；提供約80℃熱風對光阻薄膜BM進行烘烤，然後徐徐降溫至常溫(約25℃左右)，藉以增加光阻薄膜BM在觸控基板2表面的附著力；接續以一具有裝飾邊框圖案化的光罩91對光阻薄膜BM進行曝光固化(如圖8所示)，然後以顯影劑(例如：碳酸鉀或碳酸鈉等鹼性溶劑等)噴灑至該光阻薄膜BM上，將該光阻薄膜的未曝光固化部分BMb的光阻材料去除，在觸控基板2上面形成一層已曝光固化部分MFa的光阻材料，據此在各個觸控基板2的四周邊緣部位形成一層固化的裝飾邊框圖案層3(如圖9及圖10所示)。c) Decorative frame pattern layer setting step S3: uniformly coat insulating photosensitive ink on one surface of each touch substrate, and then form a decorative frame pattern layer 3 through a photo process. The decorative frame pattern layer The 3 system is arranged on the peripheral edge of the touch substrates 2, according to which the range of the visible area 21 and the shielding area 22 is defined on the touch substrate 2. The specific operation method of the aforementioned setting step S3 is as follows: The surface of the substrate 2 to be applied is cleaned and cleaned, and then the insulating black photosensitive ink material is uniformly coated on the touch substrate 2 by a precise quantitative pump by spraying to form a photoresist film BM (as shown in Figure 7) ); Provide about 80 ℃ hot air to bake the photoresist film BM, and then slowly lower the temperature to normal temperature (about 25 ℃), so as to increase the adhesion of the photoresist film BM on the surface of the touch substrate 2; followed by a decorative frame The patterned mask 91 exposes and cures the photoresist film BM (as shown in FIG. 8), and then sprays it with a developer (for example, alkaline solvents such as potassium carbonate or sodium carbonate, etc.) on the photoresist film BM, and The photoresist material of the unexposed and cured part BMb of the photoresist film is removed, and a layer of photoresist material of the exposed and cured part of MBa is formed on the touch substrate 2, and a layer of cured material is formed on the peripheral edge of each touch substrate 2. Decorative frame pattern layer 3 (as shown in Figure 9 and Figure 10).

d) 觸控感應電極圖案層設置步驟S4：在各個裝飾邊框圖案層3上設置一透明導電薄膜，對所述透明導電薄膜進行一黃光製程及一蝕刻製程以形成觸控感應電極圖案層4；如圖3及圖4所示，觸控感應電極圖案層4在該可瞻區21範圍形成複數感應電極41以及在該遮蔽區22範圍具有複數電接點42分別連接各個所述感應電極41；前述設置步驟S4的具體操作方式如下：如圖11所示，在各個觸控基板2的裝飾邊框圖案層3上濺鍍形成一氧化銦錫薄膜層ITO，在ITO上再塗佈一層光阻薄膜PF(例如聚異戊二烯，Polyisoprene)，然後將光阻薄膜PF放置於熱風烤箱中進行預烤，接續以一具有觸控感應電極精密圖案化的光罩92對該光阻薄膜PF進行曝光固化(如圖12所示)，然後以顯影劑(例如：碳酸鉀或碳酸鈉等鹼性溶劑等)噴灑至該光阻薄膜PF上，將該光阻薄膜的未曝光固化部分PFb的光阻材料去除，因此在ITO上面形成一層已曝光固化部分PFa的光阻材料(如圖13所示)；接續進行蝕刻製程，將ITO蝕刻劑(例如：鹽酸系ITO蝕刻液)噴灑至該氧化銦錫薄膜層ITO上，未受該光阻薄膜的已曝光固化部分PFa遮蔽的ITO材料即被蝕刻去除，因此可在ITO上保留下所需的觸控感應器圖案(如圖14所示)，隨後以剝膜劑(例如：氫氧化鉀或氫氧化鈉)噴灑至玻璃基材1上，將該光阻薄膜的已曝光固化部分PFa加以剝離去除，再以洗滌液(例如：清水)對該基板施予清洗，因此在各個裝飾邊框圖案層3上分別形成一觸控感應電極圖案層4(如圖15所示)。d) Touch sensing electrode pattern layer setting step S4: A transparent conductive film is disposed on each decorative frame pattern layer 3, and a yellow light process and an etching process are performed on the transparent conductive film to form a touch sensing electrode pattern layer 4 3 and 4, the touch sensing electrode pattern layer 4 forms a plurality of sensing electrodes 41 in the range of the viewable area 21 and has a plurality of electrical contacts 42 in the range of the shielding area 22 to respectively connect each of the sensing electrodes 41 The specific operation of the aforementioned setting step S4 is as follows: As shown in FIG. 11, an indium tin oxide thin film layer ITO is sputtered on the decorative frame pattern layer 3 of each touch substrate 2, and a layer of photoresist is coated on the ITO Film PF (for example, polyisoprene, Polyisoprene), then place the photoresist film PF in a hot air oven for pre-bake, and then use a photomask 92 with precise patterning of touch sensing electrodes to perform the photoresist film PF Exposure and curing (as shown in Figure 12), and then spray the photoresist film PF with a developer (for example, alkaline solvents such as potassium carbonate or sodium carbonate, etc.), and The resist material is removed, so a layer of photoresist material with exposed and cured part of PCa is formed on the ITO (as shown in Figure 13); then the etching process is carried out, and ITO etchant (for example: hydrochloric acid-based ITO etchant) is sprayed on the indium oxide On the tin film layer ITO, the ITO material that is not shielded by the exposed and cured part of the photoresist film PCa is etched and removed, so the required touch sensor pattern can be retained on the ITO (as shown in Figure 14), Then spray a stripping agent (for example: potassium hydroxide or sodium hydroxide) on the glass substrate 1, peel off the exposed and cured part of the photoresist film PCa, and then use a washing solution (for example: clean water) to The substrate is cleaned, so a touch sensing electrode pattern layer 4 is formed on each decorative frame pattern layer 3 (as shown in FIG. 15).

e) 跳線絕緣層設置步驟S5：如圖3、圖4及如圖16所示，在各個觸控感應電極圖案層4上且在前述遮蔽區22範圍分別設置一跳線絕緣層5，該跳線絕緣層上設有多個貫穿孔51，該等貫穿孔51恰可分別對應於各個前述電接點42的位置；該跳線絕緣層的材料可選用油墨、光阻或光學膠等絕緣性材料，並藉由實施印刷、塗佈或是黃光製程等技術手段將絕緣性材料設置到觸控感應電極圖案層4上。e) Jumper insulation layer setting step S5: As shown in FIG. 3, FIG. 4 and FIG. 16, a jumper insulation layer 5 is respectively provided on each touch sensing electrode pattern layer 4 and in the aforementioned shielding area 22. The jumper insulation layer is provided with a plurality of through holes 51, and the through holes 51 can correspond to the positions of the aforementioned electrical contacts 42; the material of the jumper insulation layer can be ink, photoresist or optical glue. The insulating material is placed on the touch sensing electrode pattern layer 4 by technical means such as printing, coating, or yellowing process.

f) 訊號導線層設置步驟S6：在各個前述跳線絕緣層5上且在前述遮蔽區22範圍分別設有一訊導電薄膜，對所述導電薄膜進行黃光製程及蝕刻製程以形成訊號導線層6，該訊號導線層包含複數條訊號導線61，且該等訊號導線61可分別通過前述跳線絕緣層上的貫穿孔51電性連接至觸控感應電極圖案層上的電接點42；前述設置步驟S6的具體操作方式如下：如圖16所示，在各個觸控基板2的跳線絕緣層5上且在前述遮蔽區22範圍分別設置一鉬鋁(Mo/Al)金屬鍍膜MA，然後在MA上再塗佈一層光阻薄膜PF(例如聚異戊二烯，polyisoprene)，並將光阻薄膜PF放置於熱風烤箱中進行預烤，接續以一具有訊號導線精密圖案化的光罩93對該光阻薄膜PF進行曝光固化(如圖17所示)，然後以顯影劑(例如：碳酸鉀或碳酸鈉等鹼性溶劑等)噴灑至該光阻薄膜PF上，將該光阻薄膜的未曝光固化部分PFb的光阻材料去除，因此在鉬鋁金屬鍍膜MA上面形成一層已曝光固化部分PFa的光阻材料(如圖18所示)；接續進行蝕刻製程，將鋁鉬蝕刻劑(Aluminum molybdenum etching liquid)噴灑至鉬鋁金屬鍍膜MA上，未受該光阻薄膜的已曝光固化部分PFa遮蔽的MA材料即被蝕刻去除，因此可在MA上保留下所需的訊號導線圖案(如圖19所示)，隨後以剝膜劑(例如：氫氧化鉀或氫氧化鈉)噴灑至玻璃基材1上，將該光阻薄膜的已曝光固化部分PFa加以剝離去除，再以洗滌液(例如：清水)對該基板施予清洗，因此在各個跳線絕緣層5上分別形成一訊號導線層6(如圖20所示)。f) Signal wire layer setting step S6: A signal conductive film is respectively provided on each of the aforementioned jumper insulation layers 5 and in the aforementioned shielding area 22, and yellow light processing and etching processes are performed on the conductive film to form a signal wire layer 6 The signal wire layer includes a plurality of signal wires 61, and the signal wires 61 can be respectively electrically connected to the electrical contacts 42 on the touch sensing electrode pattern layer through the through holes 51 on the jumper insulation layer; The specific operation method of step S6 is as follows: As shown in FIG. 16, a molybdenum aluminum (Mo/Al) metal coating MA is provided on the jumper insulation layer 5 of each touch substrate 2 and in the aforementioned shielding area 22, and then A layer of photoresist film PF (such as polyisoprene, polyisoprene) is coated on the MA, and the photoresist film PF is placed in a hot-air oven for pre-bake, followed by a mask with 93 pairs of signal wires precisely patterned The photoresist film PF is exposed and cured (as shown in Figure 17), and then sprayed on the photoresist film PF with a developer (for example, alkaline solvents such as potassium carbonate or sodium carbonate, etc.), The photoresist material of the exposed and cured part of PFb is removed, so a layer of photoresist material of the exposed and cured part of Pfa is formed on the molybdenum aluminum metal coating MA (as shown in Figure 18); the etching process is continued, and the aluminum molybdenum etchant (Aluminum molybdenum Etching liquid) is sprayed on the molybdenum aluminum metal coating MA, the MA material that is not covered by the exposed and cured part of the photoresist film PFA is etched and removed, so the required signal wire pattern can be retained on the MA (Figure 19 (Shown), and then spray a stripping agent (for example: potassium hydroxide or sodium hydroxide) on the glass substrate 1, peel off the exposed and cured part of the photoresist film PCa, and then use a washing solution (for example: Clean water) cleans the substrate, so a signal wire layer 6 is formed on each jumper insulation layer 5 (as shown in FIG. 20).

g) 裂片步驟S7：分別順沿玻璃基材上的各個溝槽12進行***施作，以截斷溝槽中的各個肋13，自玻璃基材1分離出各個觸控基板2，據此獲得完成加工製作的各個觸控面板；其中，該***施作可選擇地以切割工具對該等肋13進行裁切，或是以沖壓模具對該等肋13施予壓應力，使肋13斷裂；前述裂片步驟S7的具體操作方式如下：如圖21所示，在這個實施例中是使用一銳緣端的玻璃裂片壓板95對溝槽12進行沖壓以將該等肋13截斷，使各個觸控基板2自玻璃基材1分離出；以沖壓裂片的實施手段不僅操作簡易快速，可進節省裂片加工的成本，而且當進行裂片步驟時，由於溝槽12已預先切割出所需觸控基板2的外型邊緣，因此使得切割裂片的操作變得非常容易，可大幅降低製程中的破片率，並使切口端面平整，減少產生玻璃表面的微裂痕，以確保其機械強度。g) Splitting step S7: Splitting is performed along each groove 12 on the glass substrate to cut off each rib 13 in the groove, and each touch substrate 2 is separated from the glass substrate 1, and the completion is obtained accordingly. Each touch panel manufactured by processing; wherein, the splitting operation can selectively cut the ribs 13 with a cutting tool, or apply a compressive stress to the ribs 13 with a stamping die to break the ribs 13; The specific operation method of the splitting step S7 is as follows: As shown in FIG. 21, in this embodiment, a sharp-edged glass split pressing plate 95 is used to punch the groove 12 to cut off the ribs 13 to make each touch substrate 2 Separated from the glass substrate 1; the implementation of stamping and splitting is not only easy and quick to operate, but also saves the cost of split processing, and when the splitting step is performed, because the groove 12 has been pre-cut out of the required touch substrate 2 Shaped edge, therefore, the operation of cutting the splinters is very easy, can greatly reduce the fragmentation rate in the process, and make the end face of the cut flat, reduce the generation of micro-cracks on the glass surface, and ensure its mechanical strength.

綜上所述可知，本發明可在一次的生產製程中可同時生產出多個觸控面板，生產效率佳，且其大面積工件批量生產模式，使元件組合定位的更加準確，可提升成品良率及品質的穩定性，此外，在其觸控基板的各個表面、四周邊面與端角均已預先經過玻璃強化處理，具備高機械強度、耐衝擊性以及表面剛性，可提升產品使用壽命。In summary, it can be seen that the present invention can simultaneously produce multiple touch panels in a single production process, with good production efficiency, and its large-area workpiece mass production mode makes the positioning of the component combination more accurate, and can improve the quality of the finished product. The stability of rate and quality. In addition, all surfaces, four peripheral surfaces and end corners of the touch substrate have been glass-strengthened in advance, which has high mechanical strength, impact resistance and surface rigidity, which can increase the service life of the product.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何熟習此技術者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之發明申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be subject to the definition of the appended invention application patent scope.

1‧‧‧玻璃基材12‧‧‧溝槽13‧‧‧肋14‧‧‧壓應力層2‧‧‧觸控基板21‧‧‧可瞻區22‧‧‧遮蔽區28‧‧‧孔3‧‧‧裝飾邊框圖案層4‧‧‧觸控感應電極圖案層41‧‧‧感應電極42‧‧‧電接點5‧‧‧跳線絕緣層51‧‧‧貫穿孔6‧‧‧訊號導線61‧‧‧訊號導線91‧‧‧光罩92‧‧‧光罩93‧‧‧光罩95‧‧‧玻璃裂片壓板S1‧‧‧玻璃基材預分割步驟S2‧‧‧玻璃基材強化步驟S3‧‧‧裝飾邊框圖案層設置步驟S4‧‧‧觸控感應電極圖案層設置步驟S5‧‧‧跳線絕緣層設置步驟S6‧‧‧訊號導線層設置步驟S7‧‧‧裂片步驟W‧‧‧截面寬度BM‧‧‧光阻薄膜BMa‧‧‧已曝光固化部分BMb‧‧‧未曝光固化部分ITO‧‧‧氧化銦錫薄膜層PF‧‧‧光阻薄膜PFa‧‧‧已曝光固化部分PFb‧‧‧未曝光固化部分MA‧‧‧　鉬鋁金屬鍍膜1‧‧‧Glass substrate 12‧‧‧Trench 13‧‧‧Rib 14‧‧‧Compressive stress layer 2‧‧‧Touch substrate 21‧‧‧Visible area 22‧‧‧Masked area 28‧‧‧Hole 3‧‧‧Decorative frame pattern layer 4‧‧‧Touch sensor electrode pattern layer 41‧‧‧Sense electrode 42‧‧‧Electrical contact Wire 61‧‧‧Signal wire 91‧‧‧Reticle 92‧‧‧Reticle 93‧‧‧Reticle 95‧‧‧Glass splinter platen S1‧‧‧Glass substrate pre-segmentation step S2‧‧‧Glass substrate strengthening Step S3‧‧‧Decorative frame pattern layer setting step S4‧‧‧Touch sensing electrode pattern layer setting step S5‧‧‧Jumper wire insulation layer setting step S6‧‧‧Signal wire layer setting step S7‧‧‧Splitting step W‧ ‧‧Section width BM‧‧‧Photoresist film BMa‧‧‧Exposed and cured part BMb‧‧‧Unexposed cured part of ITO Part of PFb‧‧‧Unexposed curing part of MA‧‧‧　Molybdenum aluminum metal coating

圖1為本發明方法的加工步驟示意圖；圖2為本發明製成觸控面板結構的疊層組合示意圖；圖3為本發明製成觸控面板結構的構件組合平面圖；圖4為本發明製成觸控面板結構的構件分離示意圖；圖5為本發明的玻璃基材的平面圖，顯示在玻璃基材劃設有溝槽、肋及孔洞構造；圖6係圖5在B部位的玻璃基材側面剖示圖，顯示溝槽與肋的構造；圖7為本發明的觸控基板的側面部份剖視圖，顯示在觸控基板2表面上塗佈一層光阻薄膜BM；圖8為本發明的觸控基板的側面部份剖視圖，顯示以一光罩91對光阻薄膜BM進行曝光，顯影後使光阻薄膜BM形成已曝光固化部分BMa與未曝光固化部分BMb；圖9為本發明的觸控基板的側面部份剖視圖，顯示在觸控基板2的邊緣部位形成一層固化的裝飾邊框圖案層3；圖10為本發明的觸控基板的平面示意圖，顯示在觸控基板2的邊緣部位形成一層固化的裝飾邊框圖案層3；圖11為本發明的觸控基板的側面部份剖視圖，顯示在裝飾邊框圖案層3表面上依序疊設一氧化銦錫薄膜層ITO以及塗佈一層光阻薄膜PF；圖12為本發明的觸控基板的側面部份剖視圖，顯示以一光罩92對光阻薄膜PF進行曝光固化，顯影後使光阻薄膜PF形成已曝光固化部分PFa與未曝光固化部分PFb；圖13為本發明的觸控基板的側面部份剖視圖，顯示在氧化銦錫薄膜層ITO上面形成一層該光阻薄膜的已曝光固化部分PFa；圖14為本發明的觸控基板的側面部份剖視圖，顯示未受該光阻薄膜的已曝光固化部分PFa遮蔽的氧化銦錫薄膜層ITO材料已被蝕刻移除的態樣；圖15為本發明的觸控基板的側面部份剖視圖，顯示該光阻薄膜的已曝光固化部分PFa已被剝離移除，在裝飾邊框圖案層3上面形成一觸控感應電極圖案層4；圖16為本發明的觸控基板的側面部份剖視圖，顯示在觸控感應電極圖案層4表面上依序疊設一跳線絕緣層5、一鉬鋁金屬鍍膜MA以及塗佈一層光阻薄膜PF；圖17為本發明的觸控基板的側面部份剖視圖，顯示以一光罩93對光阻薄膜PF進行曝光固化，顯影後使光阻薄膜PF形成已曝光固化部分PFa與未曝光固化部分PFb；圖18為本發明的觸控基板的側面部份剖視圖，顯示在鉬鋁金屬鍍膜MA上面形成一層該光阻薄膜的已曝光固化部分PFa；圖19為本發明的觸控基板的側面部份剖視圖，顯示未受該光阻薄膜的已曝光固化部分PFa遮蔽的鉬鋁金屬鍍膜MA材料已被蝕刻移除的態樣；圖20為本發明的觸控基板的側面部份剖視圖，顯示該光阻薄膜的已曝光固化部分PFa已被剝離移除，在跳線絕緣層5上面形成一訊號導線層6；圖21為本發明的觸控基板的側面部份剖視圖，顯示以一玻璃裂片壓板95對溝槽12進行沖壓以便將肋13截斷之示意圖。Fig. 1 is a schematic diagram of the processing steps of the method of the present invention; Fig. 2 is a schematic diagram of the laminated assembly made of the touch panel structure of the present invention; Fig. 3 is a plan view of the component assembly made of the touch panel structure of the present invention; Figure 5 is a plan view of the glass substrate of the present invention, showing the structure of grooves, ribs, and holes on the glass substrate; Figure 6 is the glass substrate in position B in Figure 5 Side sectional view showing the structure of grooves and ribs; Fig. 7 is a partial sectional side view of the touch substrate of the present invention, showing a layer of photoresist film BM is coated on the surface of the touch substrate 2; Fig. 8 is a diagram of the present invention A partial cross-sectional view of the side of the touch substrate, showing that the photoresist film BM is exposed by a photomask 91, and after development, the photoresist film BM forms an exposed cured part BMa and an unexposed cured part BMb; Figure 9 is the touch panel of the present invention A partial cross-sectional view of the side of the control substrate, showing that a cured decorative frame pattern layer 3 is formed on the edge of the touch substrate 2; A layer of cured decorative frame pattern layer 3; FIG. 11 is a side partial cross-sectional view of the touch substrate of the present invention, showing that an indium tin oxide film layer ITO is sequentially stacked on the surface of the decorative frame pattern layer 3 and a layer of photoresist is coated Film PF; FIG. 12 is a partial cross-sectional view of the side surface of the touch substrate of the present invention, showing that the photoresist film PF is exposed and cured by a photomask 92. After development, the photoresist film PF is formed into an exposed and cured part of PCa and unexposed and cured Part PFb; Figure 13 is a partial cross-sectional view of the side of the touch substrate of the present invention, showing the exposed and cured part of the photoresist film PCa formed on the indium tin oxide film layer ITO; Figure 14 is the touch substrate of the present invention The side partial cross-sectional view showing the state that the ITO material of the indium tin oxide film layer that is not shielded by the exposed and cured part PCa of the photoresist film has been etched and removed; FIG. 15 is a side partial cross-sectional view of the touch substrate of the present invention , Showing that the exposed and cured part of the photoresist film PCa has been peeled off and removed, and a touch sensing electrode pattern layer 4 is formed on the decorative frame pattern layer 3; FIG. 16 is a side partial cross-sectional view of the touch substrate of the present invention. It shows that a jumper insulating layer 5, a molybdenum aluminum metal coating MA and a photoresist film PF are sequentially stacked on the surface of the touch sensing electrode pattern layer 4; FIG. 17 is a side view of the touch substrate of the present invention A cross-sectional view showing the photoresist film PF is exposed and cured by a photomask 93. After development, the photoresist film PF is formed into an exposed cured portion PCa and an unexposed cured portion PFb; Figure 18 is a side view of the touch substrate of the present invention Cross-sectional view showing the exposed and cured part PCa of the photoresist film formed on the molybdenum-aluminum metal coating MA; FIG. 19 is a partial cross-sectional view of the touch substrate of the present invention, showing the exposed and cured part of the photoresist film Molybdenum aluminum metal coating MA material shielded by PCa has been etched and removed; FIG. 20 is a side view of the touch substrate of the present invention Partial cross-sectional view showing that the exposed and cured part of the photoresist film PCa has been stripped and removed, and a signal wire layer 6 is formed on the jumper insulating layer 5; FIG. 21 is a side partial cross-sectional view of the touch substrate of the present invention. It shows a schematic diagram of punching the groove 12 with a glass split pressing plate 95 to cut off the rib 13.

S1‧‧‧玻璃基材預分割步驟 S1‧‧‧Glass substrate pre-segmentation step

S2‧‧‧玻璃基材強化步驟 S2‧‧‧Glass substrate strengthening step

S3‧‧‧裝飾邊框圖案層設置步驟 S3‧‧‧Decorative border pattern layer setting steps

S4‧‧‧觸控感應電極圖案層設置步驟 S4‧‧‧Setting steps of touch sensing electrode pattern layer

S5‧‧‧跳線絕緣層設置步驟 S5‧‧‧Steps for setting jumper insulation layer

S6‧‧‧訊號導線層設置步驟 S6‧‧‧Signal wire layer setting steps

S7‧‧‧裂片步驟 S7‧‧‧Splitting step

Claims

一種觸控面板的製造方法，包含： a)玻璃基材預分割步驟：提供一大面積的薄板狀玻璃基材，所述玻璃基材為具有鹼金屬離子的玻璃材料，並在所述玻璃基材設有複數溝槽以界定出至少一觸控基板，複數所述溝槽係貫穿所述玻璃基材的上、下表面，並在所述溝槽中設有至少一肋，所述肋係橫向連接所述溝槽的二相對側牆之間； b)玻璃基材強化步驟：將所述玻璃基材浸漬在熔態的鉀鹽浴池中進行化學離子強化處理，使各個所述觸控基板表面形成一壓應力層； c)裝飾邊框圖案層設置步驟：在各個所述觸控基板的一表面均勻塗布絕緣性的感光型油墨，通過一黃光製程形成裝飾邊框圖案層，所述裝飾邊框圖案層係設置在所述觸控基板四周邊緣部位，據此在所述觸控基板上界定出可瞻區及遮蔽區的範圍； d)觸控感應電極圖案層設置步驟：在各個所述裝飾邊框圖案層上設置一透明導電薄膜，對所述透明導電薄膜進行黃光製程及蝕刻製程以形成觸控感應電極圖案層，所述觸控感應電極圖案層在所述可瞻區範圍形成複數感應電極，以及在所述遮蔽區具有複數電接點分別連接各個所述感應電極； e)跳線絕緣層設置步驟：在各個所述觸控感應電極圖案層上且在所述遮蔽區範圍設置一跳線絕緣層，所述跳線絕緣層上設有複數貫穿孔，複數所述貫穿孔恰可分別對應於各個所述電接點的位置； f)訊號導線層設置步驟：在各個所述跳線絕緣層上且在所述遮蔽區範圍設置一導電薄膜，對所述導電薄膜進行黃光製程及蝕刻製程以形成訊號導線層，所述訊號導線層具有複數訊號導線，且複數所述訊號導線分別通過所述貫穿孔電性連接所述電接點；以及 g)裂片步驟：分別順沿各個所述溝槽進行***施作，以截斷各個所述肋，自所述玻璃基材分離出各個所述觸控基板。A method for manufacturing a touch panel includes: a) a glass substrate pre-segmentation step: a large area of thin plate-shaped glass substrate is provided, the glass substrate is a glass material with alkali metal ions, and the glass substrate is The material is provided with a plurality of grooves to define at least one touch substrate, the plurality of grooves penetrate the upper and lower surfaces of the glass substrate, and at least one rib is provided in the groove, and the rib is Between the two opposite side walls that connect the grooves laterally; b) glass substrate strengthening step: immersing the glass substrate in a molten potassium salt bath for chemical ion strengthening treatment, so that each of the touch substrates A compressive stress layer is formed on the surface; c) the decorative frame pattern layer setting step: uniformly coat insulating photosensitive ink on a surface of each of the touch substrates, and form a decorative frame pattern layer through a yellow light manufacturing process, the decorative frame The pattern layer is arranged on the peripheral edge of the touch substrate, and the range of the visible area and the shielding area is defined on the touch substrate according to this; d) the touch sensing electrode pattern layer setting step: in each decoration A transparent conductive film is disposed on the frame pattern layer, and the transparent conductive film is subjected to a yellowing process and an etching process to form a touch sensing electrode pattern layer, and the touch sensing electrode pattern layer forms a plurality of sensors in the visible area. Electrodes, and a plurality of electrical contacts in the shielded area to connect to each of the sensing electrodes; e) jumper insulation layer setting step: set one on each of the touch sensing electrode pattern layers and in the range of the shielded area Jumper insulation layer, the jumper insulation layer is provided with a plurality of through holes, and the plurality of through holes correspond to the positions of each of the electrical contacts; f) The signal conductor layer setting step: in each of the jumpers A conductive film is arranged on the wire insulation layer and in the range of the shielding area, and the conductive film is subjected to a yellowing process and an etching process to form a signal wire layer, the signal wire layer has a plurality of signal wires, and a plurality of the signal wires The electrical contacts are electrically connected through the through holes respectively; and g) the splitting step: splitting is performed along each of the grooves respectively to cut off each of the ribs, and separate each from the glass substrate. The touch substrate.

如請求項1所述的製造方法，其中，所述玻璃基材材料選自於鈉鈣矽酸鹽玻璃、鋁矽酸鹽玻璃或鋁硼矽酸鹽玻璃。The manufacturing method according to claim 1, wherein the glass substrate material is selected from soda lime silicate glass, aluminosilicate glass or aluminoborosilicate glass.

如請求項1所述的製造方法，其中，所述肋的截面寬度在1mm以下。The manufacturing method according to claim 1, wherein the cross-sectional width of the rib is 1 mm or less.

如請求項1所述的製造方法，其中，還包含在所述玻璃基材預分割步驟中，於所述玻璃基材上設置孔、凹穴或缺口。The manufacturing method according to claim 1, further comprising, in the pre-dividing step of the glass substrate, providing holes, recesses, or notches on the glass substrate.

如請求項1所述的製造方法，其中，所述壓應力層深度範圍在5µm以上。The manufacturing method according to claim 1, wherein the depth range of the compressive stress layer is 5 μm or more.

如請求項1所述的製造方法，其中，所述觸控感應電極圖案層的透明導電薄膜材料選自於金屬氧化物薄膜或石墨烯薄膜。The manufacturing method according to claim 1, wherein the transparent conductive film material of the touch sensing electrode pattern layer is selected from a metal oxide film or a graphene film.

如請求項6所述的製造方法，其中，所述金屬氧化物薄膜的材料選自於氧化銦錫、氧化銦鋅、氧化鋅鋁、氧化錫銻或聚乙撐二氧噻吩。The manufacturing method according to claim 6, wherein the material of the metal oxide film is selected from indium tin oxide, indium zinc oxide, zinc aluminum oxide, antimony tin oxide, or polyethylene dioxythiophene.

如請求項1所述的製造方法，其中，所述訊號導線層的導電薄膜材料選自於金、銀、銅、鋁、鎳或前述材料合金。The manufacturing method according to claim 1, wherein the conductive film material of the signal wire layer is selected from gold, silver, copper, aluminum, nickel, or alloys of the foregoing materials.

如請求項1所述的製造方法，其中，所述訊號導線層的導電薄膜為鉬鋁金屬鍍膜。The manufacturing method according to claim 1, wherein the conductive film of the signal wire layer is a molybdenum aluminum metal plating film.

如請求項1所述的製造方法，其中，所述***施作是以切割工具對所述肋進行裁切，或是以沖壓模具對所述肋施予壓應力，使所述肋斷裂。The manufacturing method according to claim 1, wherein the splitting operation is to cut the ribs with a cutting tool, or to apply a compressive stress to the ribs with a stamping die to break the ribs.