CN106483691B

CN106483691B - Substrate alignment mechanism

Info

Publication number: CN106483691B
Application number: CN201611234417.XA
Authority: CN
Inventors: 师令
Original assignee: Wuhan China Star Optoelectronics Technology Co Ltd
Current assignee: Wuhan China Star Optoelectronics Technology Co Ltd
Priority date: 2016-12-28
Filing date: 2016-12-28
Publication date: 2019-12-10
Anticipated expiration: 2036-12-28
Also published as: CN106483691A

Abstract

the invention provides a substrate aligning mechanism, which comprises a plurality of guide rails, a plurality of sliding blocks respectively matched with the guide rails in a sliding way, and a plurality of aligning columns respectively fixed on the sliding blocks; in the alignment process, the plurality of alignment columns respectively clamp the substrate from two sides, so that the substrate is aligned; each guide rail is provided with a sensor, the sensors react to the deflection condition of the substrate by sensing the force from the substrate on the corresponding sliding blocks in the alignment process, and when the substrate to be aligned has too large deflection angle and generates a skew sheet, the sensors send alarm information, so that the substrate is prevented from being clamped by the alignment columns in the alignment process.

Description

Substrate alignment mechanism

Technical Field

The invention relates to the field of panel production equipment and technology, in particular to a substrate alignment mechanism.

Background

In the field of Display technology, flat panel displays such as Liquid Crystal Displays (LCDs) have been widely used in LCD televisions, mobile phones, personal digital assistants, digital cameras, computer screens, notebook computer screens, and the like.

Generally, a Liquid Crystal display panel is composed of a Color Filter (CF) substrate, a Thin Film Transistor (TFT) substrate, a Liquid Crystal (Liquid Crystal) sandwiched between the Color Filter substrate and the TFT substrate, and a Sealant (Sealant); the molding process generally comprises: front Array (Array) process (thin film, yellow light, etching and stripping), middle Cell (TFT substrate and CF substrate) process and back module assembly process (drive Integrated Circuit (IC) and printed circuit board pressing); wherein, the front-stage Array process mainly forms a TFT substrate to control the movement of liquid crystal molecules; the middle Cell process is mainly to add liquid crystal between the TFT substrate and the CF substrate; the back module assembly process mainly drives the integration of IC pressing and printed circuit board, and further drives the liquid crystal molecules to rotate and display images. A process of adding liquid crystal between the CF substrate and the TFT substrate is called an One Drop Filling (ODF) process, and mainly includes: coating sealing frame glue, injecting liquid crystal, vacuum assembling and curing.

Among them, vacuum assembly is one of the important links of the ODF production line, and it is necessary to send the glass substrate into the machine of the vacuum alignment apparatus with high precision before vacuum assembly to ensure the alignment precision, and if the alignment is poor, serious defects such as light leakage of the liquid crystal panel occur, so the alignment before vacuum assembly also becomes very important.

Fig. 1 is a schematic structural diagram of a conventional substrate alignment mechanism. The substrate alignment mechanism includes a plurality of support columns 10 and a plurality of alignment columns 20 located at two sides of the plurality of support columns 10. The plurality of supporting columns 10 are used for bearing a substrate 30 in an aligning process, the bottom surface of the substrate 30 is directly contacted with the plurality of supporting columns 10, the plurality of aligning columns 20 respectively push the substrate 30 which is possibly inclined from two sides of the substrate 30 to the middle, so that the substrate 30 is aligned, wherein the aligning columns 20 are arranged on the sliding block 21, and the driving device drives the sliding block 21 to move along the guide rail 22 so as to drive the aligning columns 20 to move.

At present, in the alignment process, the walking distance of the alignment column 20 is performed according to the size of the substrate 30, as shown in fig. 2, when the substrate 30 has horizontal deviation or a deviation angle is small (less than 5 degrees), the alignment column 20 walks according to set parameters, so that the substrate 30 can be well corrected, and the alignment of the substrate 30 is realized; as shown in fig. 3, since the alignment post 20 is usually a hard plastic cylinder, and the contact point with the substrate 30 is the force application point, when the substrate 30 is tilted due to an excessively large deflection angle, the alignment post 20 will continue to move according to the parameters set by the machine, and thus the substrate 30 is easily damaged.

Disclosure of Invention

the invention aims to provide a substrate alignment mechanism, which sends alarm information by arranging a sensor to prevent an alignment column from clamping the substrate to break the substrate due to excessive clamping of the substrate in the alignment process.

In order to achieve the above object, the present invention provides a substrate alignment mechanism, which includes a plurality of guide rails, a plurality of sliders respectively sliding-fitted on the plurality of guide rails, and a plurality of alignment posts respectively fixed on the plurality of sliders;

In the alignment process, the alignment columns respectively clamp a substrate from two sides, so that the substrate is aligned;

each guide rail is provided with a sensor, and in the alignment process, the sensors respond to the deflection condition of the substrate by sensing the force from the substrate on the corresponding sliding blocks, so that alarm information is sent out according to the deflection condition of the substrate, and the substrate is prevented from being broken by the corresponding alignment columns in the alignment process.

The sensor is the trigger formula sensor, receives when the corresponding slider receives the power of coming from the base plate in the corresponding guide rail extending direction of perpendicular to when the sensor senses to be triggered promptly to send alarm information, in order to avoid corresponding counterpoint post to press from both sides broken base plate at the counterpoint in-process.

The substrate alignment mechanism further comprises a control unit connected with the sensor and the sliding block, and the control unit outputs a control signal for stopping working according to the received alarm information, so that the situation that the corresponding alignment column continues to move along the guide rail to clamp the substrate is avoided.

The alignment column is a rigid rod body.

the number of the alignment columns is four, and the four alignment columns are arranged in a pairwise opposite mode.

The base plate alignment mechanism further comprises a driving device, wherein the driving device drives each sliding block to move along the extending direction of the corresponding guide rail, and then drives the corresponding alignment column to move along the extending direction of the corresponding guide rail.

The substrate alignment mechanism further comprises a plurality of support columns arranged among the plurality of alignment columns, and the plurality of support columns are used for bearing the substrate in the alignment process.

The support column comprises a body and a ball arranged at the top of the body;

in the alignment process, the bottom surface of the base plate is in contact with the balls of the supporting columns.

the hardness of the ball is less than that of the substrate.

the invention has the beneficial effects that: the invention provides a substrate alignment mechanism, which comprises a plurality of guide rails, a plurality of slide blocks respectively matched with the guide rails in a sliding way, and a plurality of alignment columns respectively fixed on the slide blocks; in the alignment process, the plurality of alignment columns respectively clamp the substrate from two sides, so that the substrate is aligned; each guide rail is provided with a sensor, the sensors react to the deflection condition of the substrate by sensing the force from the substrate on the corresponding sliding blocks in the alignment process, and when the substrate to be aligned has too large deflection angle and generates a skew sheet, the sensors send alarm information, so that the substrate is prevented from being clamped by the alignment columns in the alignment process.

For a better understanding of the nature and technical aspects of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description and are not intended to limit the invention.

Drawings

The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.

In the drawings, there is shown in the drawings,

Fig. 1 is a schematic structural diagram of a conventional substrate alignment mechanism;

FIG. 2 is a schematic view illustrating alignment of a substrate with a small deflection angle by using the substrate alignment mechanism of FIG. 1;

FIG. 3 is a schematic view of the substrate alignment mechanism of FIG. 1 for aligning a substrate with an excessive skew angle;

Fig. 4 is a schematic structural diagram of a substrate alignment mechanism according to the present invention.

Detailed Description

To further illustrate the technical means and effects of the present invention, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.

Referring to fig. 4, the present invention provides a substrate alignment mechanism, which includes a plurality of guide rails 210, a plurality of sliders 220 respectively sliding-fitted on the plurality of guide rails 210, and a plurality of alignment posts 200 respectively fixed on the plurality of sliders 220;

in the alignment process, the alignment posts 200 respectively clamp a substrate 300 from two sides, so as to align the substrate 300;

each guide rail 210 is provided with a sensor (sensor)215, and in the alignment process, the sensor 215 senses the force applied to the corresponding slider 220 from the substrate 300 to react to the deflection condition of the substrate 300, so as to send out alarm information according to the deflection condition of the substrate 300, thereby preventing the corresponding alignment column 200 from clamping the substrate 300 in the alignment process.

Specifically, the sensor 215 is a trigger sensor 215, and when the substrate 300 to be aligned is inclined at an excessively large angle to cause a wafer warping, in the alignment process, when the alignment post 200 clamps the substrate 300 with a tilted piece, the contact point position between the alignment post 200 and the substrate 300 receives a force reacting from the substrate 300, since the base plate 300 is deflected, the reaction force has a component in the extending direction of the guide rail 210 and is transmitted to the slider 220 to push the alignment pin 200 and the slider 220 backward along the guide rail 210, and also has a component in the extending direction perpendicular to the corresponding guide rail 210 and is transmitted to the slider 220 to push the alignment pin 200 and the slider 220 toward the side of the guide rail 210, and then, when the sensor 215 senses that the corresponding slider 220 receives a force from the base plate 300 in a direction perpendicular to the extension direction of the corresponding guide rail 210, i.e., triggered, to send alarm information to prevent the corresponding alignment posts 200 from pinching the substrate 300 during the alignment process.

Specifically, the substrate alignment mechanism of the present invention further includes a control unit 500 connected to the sensor 215 and the slider 220, wherein the control unit 500 outputs a control signal for stopping working according to the received alarm information, so as to prevent the substrate 300 from being damaged by the corresponding alignment column 200 moving along the guide rail 210.

Specifically, the alignment post 200 is a rigid rod.

Specifically, the number of the alignment posts 200 is four, and the four alignment posts 200 are arranged in pairs.

specifically, the substrate alignment mechanism of the present invention further includes a driving device 250, wherein the driving device 250 drives each sliding block 220 to move along the extending direction of the corresponding guide rail 210, so as to drive the corresponding alignment column 200 to move along the extending direction of the corresponding guide rail 210.

Specifically, the substrate alignment mechanism of the present invention further includes a plurality of supporting pillars 100 disposed between the plurality of alignment pillars 200, and the plurality of supporting pillars 100 are used for carrying the substrate 300 during the alignment process.

Specifically, the supporting column 100 includes a body 101 and a ball 102 disposed on the top of the body 101; in the alignment process, the bottom surface of the substrate 300 contacts the balls 102 of the supporting post 100, so that the friction force generated by the relative position movement between the substrate 300 and the supporting post 100 in the alignment process is reduced, and the back surface of the substrate 300 is prevented from being scratched.

Specifically, the hardness of the ball 102 is less than that of the substrate 300.

In summary, the substrate alignment mechanism provided by the present invention includes a plurality of guide rails, a plurality of sliders respectively slidably engaged with the plurality of guide rails, and a plurality of alignment posts respectively fixed to the plurality of sliders; in the alignment process, the plurality of alignment columns respectively clamp the substrate from two sides, so that the substrate is aligned; each guide rail is provided with a sensor, the sensors react to the deflection condition of the substrate by sensing the force from the substrate on the corresponding sliding blocks in the alignment process, and when the substrate to be aligned has too large deflection angle and generates a skew sheet, the sensors send alarm information, so that the substrate is prevented from being clamped by the alignment columns in the alignment process.

As described above, it will be apparent to those skilled in the art that other various changes and modifications may be made based on the technical solution and concept of the present invention, and all such changes and modifications are intended to fall within the scope of the appended claims.

Claims

1. A substrate aligning mechanism is characterized by comprising a plurality of guide rails (210), a plurality of sliding blocks (220) which are respectively matched with the guide rails (210) in a sliding way, and a plurality of aligning columns (200) which are respectively fixed on the sliding blocks (220);

In the alignment process, the alignment columns (200) respectively clamp a substrate (300) from two sides, so that the substrate (300) is aligned;

Each guide rail (210) is provided with a sensor (215), and in the alignment process, the sensors (215) react to the deflection condition of the substrate (300) by sensing the force from the substrate (300) on the corresponding sliding blocks (220), so that alarm information is sent according to the deflection condition of the substrate (300) to avoid the corresponding alignment columns (200) from clamping the substrate (300) in the alignment process;

The sensor (215) is a trigger type sensor (215), and when the sensor (215) senses that the corresponding sliding block (220) is subjected to a force from the base plate (300) in a direction perpendicular to the extending direction of the corresponding guide rail (210), the sensor is triggered to send out alarm information so as to prevent the corresponding alignment column (200) from clamping the base plate (300) in the alignment process.

2. The substrate alignment mechanism of claim 1, further comprising a control unit (500) connected to the sensor (215) and the slider (220), wherein the control unit (500) outputs a control signal to stop working according to the received alarm information, so as to prevent the corresponding alignment column (200) from moving along the guide rail (210) and breaking the substrate (300).

3. The substrate alignment mechanism of claim 1, wherein the alignment post (200) is a rigid rod.

4. The substrate alignment mechanism of claim 1, wherein the number of the alignment posts (200) is four, and the four alignment posts (200) are disposed opposite to each other in pairs.

5. The substrate alignment mechanism according to claim 1, further comprising a driving device (250), wherein the driving device (250) drives each sliding block (220) to move along the extending direction of the corresponding guide rail (210), so as to drive the corresponding alignment column (200) to move along the extending direction of the corresponding guide rail (210).

6. the substrate alignment mechanism of claim 1, further comprising a plurality of support columns (100) disposed between the plurality of alignment columns (200), wherein the plurality of support columns (100) are used for carrying the substrate (300) during the alignment process.

7. The substrate alignment mechanism of claim 6, wherein the supporting column (100) comprises a body (101) and a ball (102) disposed on the top of the body (101);

During the alignment process, the bottom surface of the base plate (300) is in contact with the balls (102) of the support column (100).

8. The substrate alignment mechanism of claim 7, wherein the balls (102) have a hardness less than a hardness of the substrate (300).