CN106449623A - 一种smd发光二极管 - Google Patents
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Abstract
本发明公开了一种SMD发光二极管,包括基底、发光晶片体、支架、引脚、合成树脂胶层、焊盘,所述基底为长方体状且外壁上设有电极,所述基底的上端设有支架,所述支架上端设有发光晶片体,所述发光晶片体的两侧均设有焊盘,所述发光晶片体与支架通过焊盘固定,所述发光晶片体远离支架的一侧的焊盘与引脚连接,所述引脚与电极的正极连接,所述支架通过引脚与电极的负极连接,所述发光晶片体上端涂有一层合成树脂胶层。本发明通过焊盘对接的方式,不仅去掉了贴片灯珠制作中最重要的连接导线环节,更是同样达到了连接导通发光发亮的目的,成功的迎合了市场的需求。
Description
技术领域
本发明涉及集成电子产品技术领域,尤其涉及一种SMD发光二极管。
背景技术
SMD发光二极管又称贴片晶体二极管,是一种具有单向传导电流的电子器件,在半导体二极管内部有一个PN结两个引线端子,这种电子器件按照外加电压的方向,具备单向电流的转导性,贴片晶体二极管是一个由P型半导体和N型半导体烧结形成的P-N结界面;在其界面的两侧形成空间电荷层,构成自建电场,当外加电压等于零时,由于P-N结两边载流子的浓度差引起扩散电流和由自建电场引起的漂移电流相等而处于电平衡状态,这也是常态下的二极管特性。
现有的SMD发光二极管产品普遍采用留焊点,打线导电连接再封装,灯珠采用了支架,晶圆芯片,金线连接导电,封胶烘烤,等常规步逐,经多年技术沉淀,集成电子的步逐已非常成熟,几乎是缺一不可;一个集成电路通常都会有很多条引线组成,少则三五条,多则几十条,比如中国专利,申请号:201320756433.0,公开号:203631606U,发明名称:一种高光效SMD发光二极管,公开了一种高光效SMD发光二极管,其特征在于:包括方形的支架,支架相对的两角处设有负极接线端和正极接线端,支架另两角处各设有一个安装孔,支架中央设有圆形的镜面基板,镜面基板内安装有芯片,芯片正极通过引线与正极接线端连接,芯片负极通过引线与负极接线端连接;虽然改善了SMD发光二极管的功能,但是引线还需连接,引线的选择需要导电性强的导线,一般选择金线连接,使得电子集成产品成本昂贵,工艺复杂,故障率较高。
发明内容
本发明的目的是为了解决现有技术中存在的缺点,而提出的一种SMD发光二极管。
为了实现上述目的,本发明采用了如下技术方案:
一种SMD发光二极管,包括基底、发光晶片体、支架、引脚、合成树脂胶层、焊盘,所述基底为长方体状且外壁上设有电极,所述基底上端中部设有支架,所述支架上端的一侧设有发光晶片体,所述发光晶片体的两侧均设有焊盘,所述发光晶片体与支架通过焊盘焊接固定,所述发光晶片体远离支架的一侧的焊盘与引脚焊接,所述引脚与电极的正极电性连接,所述支架通过引脚与电极的负极电性连接,所述发光晶片体上端涂有一层合成树脂胶层。
优选的,所述发光晶片体由红芯片、绿芯片、蓝芯片构成。
优选的,所述发光晶片体与支架连接处涂有一层银胶层。
优选的,所述基底采用加布胶木板材料所制。
优选的,所述红芯片、绿芯片、蓝芯片发出光的波长分别为:608-642nm、401-427nm、66-86nm。
本发明中的有益效果是:发光晶片体采用的是模板倒扣连接导电的原理,就是将发光晶片体需要焊接导线的地方制作成特定焊盘的方式,然后把支架也制作成特定焊盘的方式,然后在固定发光晶片体的时候按照预先设定好需要相互导通的焊盘直接对接连接来达到导通的目的,这样在生产的时候便可省掉打线导电这个环节,因为是直接倒扣上去的,简单直观,也不会有导线打错或者虚焊等故障,所以采用这种方式不仅节省了成本,使工艺变得简洁化,更是大大的提升了良品率。本发明通过焊盘对接的方式,不仅去掉了贴片灯珠制作中最重要的连接导线环节,更是同样达到了连接导通发光发亮的目的,成功的迎合了市场的需求。
附图说明
图1为本发明提出的一种SMD发光二极管的结构示意图。
图2为本发明提出的一种SMD发光二极管的结构侧视图。
图3为本发明提出的一种SMD发光二极管焊盘连接放大图。
图中:1基底、2发光晶片体、3支架、4引脚、5合成树脂胶层、6焊盘、7电极。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。
参照图1-3,一种SMD发光二极管,包括基底1、发光晶片体2、支架3、引脚4、合成树脂胶层5、焊盘6,基底1为长方体状且外壁上设有电极7,基底1的上端中部设有支架3,支架3上端的一侧设有发光晶片体2,发光晶片体2的两侧均设有焊盘6,发光晶片体2与支架3通过焊盘6焊接固定,发光晶片体2远离支架3的一侧的焊盘6与引脚4焊接,引脚4与电极7的正极电性连接,支架3通过引脚4与电极的负极电性连接,发光晶片体2上端涂有一层合成树脂胶层5,合成树脂胶层5具有硬度大、附着力强及较强的耐热性,光泽度好等特点;发光晶片体2的型号为DGM,发光晶片体2由红芯片、绿芯片、蓝芯片构成;发光晶片体2与支架3连接处涂有一层银胶层,增加导电性;基底1采用加布胶木板材料所制;红芯片、绿芯片、蓝芯片发出光的波长分别为:608nm、401nm、66nm。
优选地,红芯片、绿芯片、蓝芯片发出光的波长分别为:642nm、427nm、86nm。
优选地,红芯片、绿芯片、蓝芯片发出光的波长分别为:635nm、418nm、84nm。
发光晶片体2采用的是模板倒扣连接导电的原理,就是将发光晶片体2需要焊接导线的地方制作成特定焊盘6的方式,然后把支架3也制作成特定焊盘6的方式,然后在固定发光晶片体2的时候按照预先设定好需要相互导通的焊盘6直接焊接连接来达到导通的目的,这样在生产的时候便可省掉打线导电这个环节,因为是直接倒扣上去的,简单直观,也不会有导线打错或者虚焊等故障,所以采用这种方式不仅节省了成本,使工艺变得简洁化,更是大大的提升了良品率。本发明通过焊盘6对接的方式,不仅去掉了贴片灯珠制作中最重要的连接导线环节,更是同样达到了连接导通发光发亮的目的,成功的迎合了市场的需求。
本发明的原理是:在制作生产集成电路时通过设计出特定的跟集成芯片焊点相吻合的集成电路支架3,然后把芯片倒扣在支架3上面,每一个焊点设计制作到刚刚吻合能够通电导电,最后通过引脚4与电极7连接,如此在生产的时候便可省掉打线导电这个环节,因为是直接倒扣上去的,简单直观,采用这种方式不仅使得电子集成产品成本大大缩减,使工艺变得简洁化,故障率明显较少,更是大大的提升了电子集成产品的合格率。
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。
Claims (5)
1.一种SMD发光二极管,其特征在于:包括基底、发光晶片体、支架、引脚、合成树脂胶层、焊盘,所述基底为长方体状且外壁上设有电极,所述基底上端中部设有支架,所述支架上端的一侧设有发光晶片体,所述发光晶片体的两侧均设有焊盘,所述发光晶片体与支架通过焊盘焊接固定,所述发光晶片体远离支架的一侧的焊盘与引脚焊接,所述引脚与电极的正极电性连接,所述支架通过引脚与电极的负极电性连接,所述发光晶片体上端涂有一层合成树脂胶层。
2.根据权利要求1所述的一种SMD发光二极管,其特征在于:所述发光晶片体由红芯片、绿芯片、蓝芯片构成。
3.根据权利要求1所述的一种SMD发光二极管,其特征在于:所述发光晶片体与支架连接处涂有一层银胶层。
4.根据权利要求1所述的一种SMD发光二极管,其特征在于:所述基底采用加布胶木板材料所制。
5.根据权利要求2所述的一种SMD发光二极管,其特征在于:所述红芯片、绿芯片、蓝芯片发出光的波长范围分别为:608-642nm、401-427nm、66-86nm。
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CN101350381A (zh) * | 2007-07-18 | 2009-01-21 | 晶科电子(广州)有限公司 | 凸点发光二极管及其制造方法 |
CN102479909A (zh) * | 2010-11-24 | 2012-05-30 | 展晶科技(深圳)有限公司 | 发光二极管 |
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CN102479909A (zh) * | 2010-11-24 | 2012-05-30 | 展晶科技(深圳)有限公司 | 发光二极管 |
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CN108767093A (zh) * | 2018-08-15 | 2018-11-06 | 张辉 | 一种镜像发光结构的led smd发光管 |
CN108767093B (zh) * | 2018-08-15 | 2024-03-19 | 张辉 | 一种镜像发光结构的led smd发光管 |
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