CN106370134A - Substrate flatness monitoring device - Google Patents
Substrate flatness monitoring device Download PDFInfo
- Publication number
- CN106370134A CN106370134A CN201610951757.8A CN201610951757A CN106370134A CN 106370134 A CN106370134 A CN 106370134A CN 201610951757 A CN201610951757 A CN 201610951757A CN 106370134 A CN106370134 A CN 106370134A
- Authority
- CN
- China
- Prior art keywords
- substrate
- flatness
- light
- signal processing
- substrate flatness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610951757.8A CN106370134A (en) | 2016-10-27 | 2016-10-27 | Substrate flatness monitoring device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610951757.8A CN106370134A (en) | 2016-10-27 | 2016-10-27 | Substrate flatness monitoring device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106370134A true CN106370134A (en) | 2017-02-01 |
Family
ID=57894525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610951757.8A Pending CN106370134A (en) | 2016-10-27 | 2016-10-27 | Substrate flatness monitoring device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106370134A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108680126A (en) * | 2018-04-27 | 2018-10-19 | 上海集成电路研发中心有限公司 | A kind of device and method of detection pipeline inner wall roughness |
CN114384770A (en) * | 2020-10-22 | 2022-04-22 | 中国科学院微电子研究所 | Wafer alignment method, wafer alignment device and semiconductor device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020013058A1 (en) * | 1992-12-28 | 2002-01-31 | Applied Materials, Inc., A Delaware Corporation | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
CN1916610A (en) * | 2005-08-15 | 2007-02-21 | 中华映管股份有限公司 | Method for detecting foreign matter in procedure for producing display faceplate |
CN104568973A (en) * | 2015-02-09 | 2015-04-29 | 京东方科技集团股份有限公司 | Device and method for detecting substrate |
CN104634789A (en) * | 2014-04-24 | 2015-05-20 | 东旭集团有限公司 | System and method for performing foreign matter inspection on upper surface of ultrathin glass substrate |
CN104808213A (en) * | 2015-05-11 | 2015-07-29 | 合肥京东方光电科技有限公司 | Foreign matter detecting device and coating system |
CN105655267A (en) * | 2016-01-04 | 2016-06-08 | 京东方科技集团股份有限公司 | Early-warning system for detecting substrates, and production equipment |
-
2016
- 2016-10-27 CN CN201610951757.8A patent/CN106370134A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020013058A1 (en) * | 1992-12-28 | 2002-01-31 | Applied Materials, Inc., A Delaware Corporation | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
CN1916610A (en) * | 2005-08-15 | 2007-02-21 | 中华映管股份有限公司 | Method for detecting foreign matter in procedure for producing display faceplate |
CN104634789A (en) * | 2014-04-24 | 2015-05-20 | 东旭集团有限公司 | System and method for performing foreign matter inspection on upper surface of ultrathin glass substrate |
CN104568973A (en) * | 2015-02-09 | 2015-04-29 | 京东方科技集团股份有限公司 | Device and method for detecting substrate |
CN104808213A (en) * | 2015-05-11 | 2015-07-29 | 合肥京东方光电科技有限公司 | Foreign matter detecting device and coating system |
CN105655267A (en) * | 2016-01-04 | 2016-06-08 | 京东方科技集团股份有限公司 | Early-warning system for detecting substrates, and production equipment |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108680126A (en) * | 2018-04-27 | 2018-10-19 | 上海集成电路研发中心有限公司 | A kind of device and method of detection pipeline inner wall roughness |
CN114384770A (en) * | 2020-10-22 | 2022-04-22 | 中国科学院微电子研究所 | Wafer alignment method, wafer alignment device and semiconductor device |
CN114384770B (en) * | 2020-10-22 | 2024-04-02 | 中国科学院微电子研究所 | Wafer alignment method and device and semiconductor device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7576849B2 (en) | Method and apparatus for optically controlling the quality of objects having a circular edge | |
CN104808213A (en) | Foreign matter detecting device and coating system | |
CN107133725B (en) | Automatic production management system of circuit board | |
CN213302033U (en) | Alarm system for detecting defects of glass substrate and glass production equipment | |
CN110694922A (en) | Glass defect on-line measuring equipment | |
CN106370134A (en) | Substrate flatness monitoring device | |
CN104359923A (en) | Detection device and detection method | |
CN102221560A (en) | Automatic detection equipment of laser paper and laser membranes | |
CN105004734A (en) | Circuit board online double-sided detection method and system thereof | |
CN103076345A (en) | Detection method and full-automatic optical detection system for ITO conductive glass | |
CN104808586A (en) | Coating machine | |
CN111326433A (en) | Semiconductor detection device and detection method | |
CN105080855A (en) | Detection device and method for marks of substrates | |
CN111324007B (en) | Automatic optical detector for mask plate | |
CN204287062U (en) | The online defect detecting system of WIS | |
CN105665919B (en) | The system and method for on-line automatic repairing substrate defect | |
CN105655267A (en) | Early-warning system for detecting substrates, and production equipment | |
US8610889B2 (en) | Automated optical inspection device and calibration method thereof | |
CN218830193U (en) | Image acquisition device, macroscopic defect detection equipment and automatic control system | |
CN202013722U (en) | Electric property detecting device | |
JP5648185B2 (en) | Particle detecting optical device and particle detecting device | |
CN218847146U (en) | Guide wheel detection device | |
CN108573886B (en) | Crystal edge deviation detection method and system and machine | |
CN110836761B (en) | Detection device and method | |
US9140655B2 (en) | Mother glass inspection device and mother glass inspection method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Zeng Xiangbo Inventor after: Di Yunhua Inventor after: Zhao Hui Inventor after: Wang Lei Inventor before: Zeng Xiangbo |
|
CB03 | Change of inventor or designer information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170329 Address after: A city road Nanjing city Jiangsu province 210033 Qixia Xianlin University No. 7 Applicant after: Nanjing Huadong Electronics Information Technology Co.,Ltd. Applicant after: Nanjing CLP panda flat panel display technology Co., Ltd. Address before: A city road Nanjing city Jiangsu province 210033 Qixia Xianlin University No. 7 Applicant before: Nanjing Huadong Electronics Information Technology Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170201 |
|
RJ01 | Rejection of invention patent application after publication |