CN106370134A - Substrate flatness monitoring device - Google Patents
Substrate flatness monitoring device Download PDFInfo
- Publication number
- CN106370134A CN106370134A CN201610951757.8A CN201610951757A CN106370134A CN 106370134 A CN106370134 A CN 106370134A CN 201610951757 A CN201610951757 A CN 201610951757A CN 106370134 A CN106370134 A CN 106370134A
- Authority
- CN
- China
- Prior art keywords
- substrate
- flatness
- light
- signal processing
- substrate flatness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention discloses a substrate flatness monitoring device which comprises a light path system, a signal processing system and a display monitoring system. The light path system comprises a line light source and a light receiving system. The line light source is used for emitting a light beam to irradiate the substrate surface. The light receiving system is used for receiving a light signal reflected by a substrate. The signal processing system is used for analyzing the light signal received by the light receiving system to determine whether the flatness of the substrate is normal. The display monitoring system is used for displaying the result of the signal processing system and issuing an alarm when the substrate flatness is abnormal. The monitoring device monitors the substrate flatness in real time, and can timely find substrate flatness anomalies and issue an alarm without affecting the equipment operation. Processing is timely carried out to avoid the production of adverse products and reduce the production cost.
Description
Technical field
The present invention relates to a kind of substrate flatness supervising device, more particularly, to a kind of independent real-time substrate flatness prison
Control device.
Background technology
In the manufacture process of Thin Film Transistor-LCD or organic light emitting diode display, scanning type exposure sets
The glass chip that standby substrate can be fallen pollutes, or by other foreign substance pollutions, can lead to the flatness of substrate that trickle change occurs
Change, thus leading to ill-exposed.When ill-exposed, exposure image obscures, thus leading to product quality bad.
Abnormal situation not good monitoring meanss in flatness currently for substrate, can only be by final
Product quality bad reflecting the irregular situation of substrate.Because the exception finding substrate flatness, meeting cannot be monitored in time
Lead to large batch of bad products, reduce product yield, increase cost.Current solution is after finding that product is bad,
Again substrate flatness is tested, the testing time is longer, the subsequent production of impact equipment.
Content of the invention
Goal of the invention: for problem above, the present invention proposes a kind of independent real-time substrate flatness supervising device.
A kind of technical scheme: for realizing the purpose of the present invention, the technical solution adopted in the present invention is: substrate flatness prison
Control device, including light path system, signal processing system and display monitoring system, light path system includes line source and receiving system；
Line source is used for launching light beam irradiation substrate surface；Receiving system is used for receiving the optical signal through substrate reflection；Signal processing system
Unite for analyzing the optical signal that receiving system receives, judge that substrate flatness whether there is abnormal；Display monitoring system is used for
The result of display signal processing system simultaneously sends alarm when substrate flatness has abnormal.
In order to realize the monitoring to substrate Zone Full, the width of line source is more than the width of substrate, also greater than by spectrum
The width of system.
Beneficial effect: the supervising device monitor in real time substrate flatness of the present invention, in the case that the equipment that do not affect runs,
The exception of substrate flatness can be found in time and send alarm, can be processed in time, it is to avoid the generation of bad products,
Reduce production cost.
Brief description
Fig. 1 is substrate flatness supervising device schematic diagram.
Specific embodiment
With reference to the accompanying drawings and examples technical scheme is further described.
As shown in figure 1, substrate flatness supervising device of the present invention includes light path system, signal processing system and shows
Show monitoring system, light path system is made up of line source and receiving system.In exposure process, substrate is placed on baseplate carrier, light
The line source transmitting light beam of road system irradiates substrate surface, and light beam reflects through substrate surface, and receiving system receives the light letter of reflection
Number.The line source of light path system is that wavelength is coated with the insensitive light source of photoresistance to substrate surface.If substrate flatness is abnormal, such as
Substrate surface has glass chip or foreign body etc., and the corresponding position of substrate just has projection, and light beam will be deposited through substrate surface reflection
In deflection, the corresponding optical signal that receiving system receives will reduce or disappear.Signal processing system processes receiving system and connects
The optical signal receiving, according to the power change of optical signal, analyzing and processing can be obtained by the result of substrate surface flatness, judges
Substrate flatness whether there is extremely, and will determine irregular region and result is exported display monitoring system, display prison
Control system is shown and is sent alarm, to realize monitor in real time.
The projection optical system of light path system and exposure sources be arranged in parallel, while scan exposure, synchronous real-time
Substrate is scanned monitor.In order to realize the monitoring to substrate Zone Full, the width of line source is greater than the width of substrate,
Also it is greater than the width of receiving system simultaneously.
Claims (2)
1. a kind of substrate flatness supervising device it is characterised in that: include light path system, signal processing system and display monitoring system
System；Wherein, light path system includes line source and receiving system；Line source is used for launching light beam irradiation substrate surface；Receiving system
For receiving the optical signal through substrate reflection；Signal processing system is used for analyzing the optical signal that receiving system receives, and judges base
Plate flatness whether there is abnormal；Display monitoring system is used for showing the result of signal processing system and existing in substrate flatness
Alarm is sent when abnormal.
2. substrate flatness supervising device according to claim 1 it is characterised in that: the width of described line source be more than base
The width of the width of plate, simultaneously greater than receiving system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610951757.8A CN106370134A (en) | 2016-10-27 | 2016-10-27 | Substrate flatness monitoring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610951757.8A CN106370134A (en) | 2016-10-27 | 2016-10-27 | Substrate flatness monitoring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106370134A true CN106370134A (en) | 2017-02-01 |
Family
ID=57894525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610951757.8A Pending CN106370134A (en) | 2016-10-27 | 2016-10-27 | Substrate flatness monitoring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106370134A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108680126A (en) * | 2018-04-27 | 2018-10-19 | 上海集成电路研发中心有限公司 | A kind of device and method of detection pipeline inner wall roughness |
| CN114384770A (en) * | 2020-10-22 | 2022-04-22 | 中国科学院微电子研究所 | Wafer alignment method, wafer alignment device and semiconductor device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020013058A1 (en) * | 1992-12-28 | 2002-01-31 | Applied Materials, Inc., A Delaware Corporation | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| CN1916610A (en) * | 2005-08-15 | 2007-02-21 | 中华映管股份有限公司 | Method for detecting foreign matter in procedure for producing display faceplate |
| CN104568973A (en) * | 2015-02-09 | 2015-04-29 | 京东方科技集团股份有限公司 | Device and method for detecting substrate |
| CN104634789A (en) * | 2014-04-24 | 2015-05-20 | 东旭集团有限公司 | System and method for performing foreign matter inspection on upper surface of ultrathin glass substrate |
| CN104808213A (en) * | 2015-05-11 | 2015-07-29 | 合肥京东方光电科技有限公司 | Foreign matter detecting device and coating system |
| CN105655267A (en) * | 2016-01-04 | 2016-06-08 | 京东方科技集团股份有限公司 | Early-warning system for detecting substrates, and production equipment |
-
2016
- 2016-10-27 CN CN201610951757.8A patent/CN106370134A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020013058A1 (en) * | 1992-12-28 | 2002-01-31 | Applied Materials, Inc., A Delaware Corporation | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| CN1916610A (en) * | 2005-08-15 | 2007-02-21 | 中华映管股份有限公司 | Method for detecting foreign matter in procedure for producing display faceplate |
| CN104634789A (en) * | 2014-04-24 | 2015-05-20 | 东旭集团有限公司 | System and method for performing foreign matter inspection on upper surface of ultrathin glass substrate |
| CN104568973A (en) * | 2015-02-09 | 2015-04-29 | 京东方科技集团股份有限公司 | Device and method for detecting substrate |
| CN104808213A (en) * | 2015-05-11 | 2015-07-29 | 合肥京东方光电科技有限公司 | Foreign matter detecting device and coating system |
| CN105655267A (en) * | 2016-01-04 | 2016-06-08 | 京东方科技集团股份有限公司 | Early-warning system for detecting substrates, and production equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108680126A (en) * | 2018-04-27 | 2018-10-19 | 上海集成电路研发中心有限公司 | A kind of device and method of detection pipeline inner wall roughness |
| CN114384770A (en) * | 2020-10-22 | 2022-04-22 | 中国科学院微电子研究所 | Wafer alignment method, wafer alignment device and semiconductor device |
| CN114384770B (en) * | 2020-10-22 | 2024-04-02 | 中国科学院微电子研究所 | Wafer alignment method and device and semiconductor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zeng Xiangbo Inventor after: Di Yunhua Inventor after: Zhao Hui Inventor after: Wang Lei Inventor before: Zeng Xiangbo |
|
| CB03 | Change of inventor or designer information | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170329 Address after: A city road Nanjing city Jiangsu province 210033 Qixia Xianlin University No. 7 Applicant after: Nanjing Huadong Electronics Information Technology Co.,Ltd. Applicant after: Nanjing CLP panda flat panel display technology Co., Ltd. Address before: A city road Nanjing city Jiangsu province 210033 Qixia Xianlin University No. 7 Applicant before: Nanjing Huadong Electronics Information Technology Co.,Ltd. |
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| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170201 |
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| RJ01 | Rejection of invention patent application after publication |