CN106364880B - A kind of semiconductor laser product quickly arranges transfer device and transfer method - Google Patents
A kind of semiconductor laser product quickly arranges transfer device and transfer method Download PDFInfo
- Publication number
- CN106364880B CN106364880B CN201610936768.9A CN201610936768A CN106364880B CN 106364880 B CN106364880 B CN 106364880B CN 201610936768 A CN201610936768 A CN 201610936768A CN 106364880 B CN106364880 B CN 106364880B
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- Prior art keywords
- initial
- pallet
- terminal
- semiconductor laser
- positioning column
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/26—Devices influencing the relative position or the attitude of articles during transit by conveyors arranging the articles, e.g. varying spacing between individual articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/912—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rectilinear movements only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The present invention relates to a kind of semiconductor laser products quickly to arrange transfer device and transfer method,Belong to semiconductor laser permutation technology field,Device includes pedestal,Sliding rail is connected by column with pedestal,Pedestal is equipped with initial alignment device and terminal locator,Initial pallet and terminal tray are respectively equipped on initial alignment device and terminal locator,It is equipped with circular hole on initial pallet and terminal tray,Semiconductor laser is set in circular hole,Sliding rail is equipped with suction nozzle,Initial alignment device and terminal locator are equipped with positioning column,It replaces having been manually done displacement of the semiconductor from initial pallet to terminal tray using the present apparatus,Solves the slow-footed work drawback of unarmed swing seat,Avoid pollution of the manual swing seat to its tube socket,Marshalling,It works good with cap sealing machine,The quantity of primary pendulum cap is big,It ensure that the continue working of cap sealing machine,Greatly improve operating rate,Save time and manpower,It greatly improves work efficiency.
Description
Technical field
The present invention relates to a kind of for making the quick arrangement of semiconductor laser in order to cap sealing machine noise spectra of semiconductor lasers
The device and method of sealing cap belong to semiconductor laser permutation technology field.
Background technology
After decades of development, semiconductor laser is increasingly known to society, and is obtained in many places field
To application, the photoelectric conversion efficiency of semiconductor laser is in 60% or more, significantly larger than the opto-electronic conversion effect of other similar products
Rate, low energy consumption, and heat accumulation is few in device, long lifespan, the advantages that collimation is good, illumination distances are remote are made in the similar industry of society
It is a kind of emerging technology using more and more extensive.All kinds of advantages possessed by semiconductor laser determine its it is higher and higher by
The extensive attention of various circles of society.The work of semiconductor laser mainly by be inside chip, chip projects sharp after powered up
Light, and chip price is expensive, used material is more special, is fine in texture, and the laser that arrangement is manually operated can be to surface
Certain pollution is caused, causes itself more fragile, easy breakage of chip, and chip is relatively high to extraneous environmental requirement,
It must be dustfree environment, the performance of entire semiconductor laser is influenced whether once being contaminated or having breakage.Chip is made
For the core component of semiconductor laser, once be contaminated or have breakage will be brought to entire device it is unexpected after
Fruit seriously can be such that entire device scraps.It can be seen that in production process to the protection of laser be in entire production process it is mostly important
A link.
There is miscellaneous safeguard measure in this industry at present, but excellent scarce different, practical at present and application
More guard method mainly uses manual alignment, this Protection Code to protect laser well because the direct of hand touches
Touch, and make laser pollution etc. influence its quality external issues.But to playing protection semiconductor laser in reproduction
Effect must fit into suitable position.Special process, this process main purpose are equipped in entire encapsulation work at present
It will be exactly put on suitable position with semiconductor laser, it is made to play due effect.Transplanting work at present is mainly
Laser is fixed in place by special personnel.But the work characteristics transplanted manually requires semiconductor laser
The positioning that puts in order, if not just influence whether the duration for entirely arranging work, product matter can be damaged if serious
Amount.Thus amplify out a problem：It needs to carry out tube socket special sequence.
The device of tube socket arrangement is not exclusively carried out at present, operator can only be manually automatic by tube socket being placed in one by one
On the scratch diskette of cap sealing machine, so that automatic cap sealing machine takes semiconductor laser away.Speed of production is not only affected in this way, and is consumed
Take manpower.Secondly the peculiar protective position for being exactly semiconductor laser determines that it cannot be contaminated.Manually tube socket is arranged one by one
Semiconductor laser can be inevitably touched, certain pollution can be caused to tube socket to a certain extent, can be influenced to a certain extent
To the quality of entire semiconductor laser.
Invention content
For existing semiconductor laser permutation technology there are the problem of, the present invention provides a kind of semiconductor laser row
Row are neat, work good with the tube socket pallet of cap sealing machine, the quick collating unit for the semiconductor laser that work efficiency is high and method.
Technical scheme is as follows：
A kind of semiconductor laser product quickly arranges transfer device, including pedestal, and sliding rail is connected by column with pedestal,
Pedestal is equipped with initial alignment device and terminal locator, and initial pallet and end are respectively equipped on initial alignment device and terminal locator
Pallet to be held, circular hole is equipped on initial pallet and terminal tray, semiconductor laser is set in circular hole, sliding rail is equipped with suction nozzle,
Initial alignment device and terminal locator are equipped with positioning column.Suction nozzle is moved horizontally along sliding rail, is drawn semiconductor from initial pallet and is swashed
Light device is simultaneously moved to terminal tray along sliding rail.
According to currently preferred, at least two location holes, positioning column are equipped on initial alignment device and terminal locator
One end matches connection with location hole.Using at least two location holes, fixed initial pallet and terminal tray.
It is further preferred that the location hole on location hole and terminal locator on initial alignment device is located at same horizontal line
On.So as to draw precisely errorless.
It is further preferred that positioning column is taper positioning column, positioning column tip is connected with location hole.
It is further preferred that positioning column surface is equipped with rubber layer.Make positioning column that can closely be connect with location hole interference, avoids
Inadvertently falling off influences precision, damage product quality.
It is further preferred that suction nozzle is suction nozzle made of silica gel.The suction nozzle that silica gel makes has relatively good elasticity, resistance to
Mill property and heat-resisting quantity etc., such material play the role of the success rate for drawing tube socket better.
A kind of transfer method quickly being arranged transfer device using above-mentioned semiconductor laser product, is included the following steps：
(1) semiconductor laser for being soldered line is put on initial pallet, circular hole, circular hole arrangement is distributed on initial pallet
Neat to be used to fix semiconductor laser, the outer diameter of circular hole is matched with the outer diameter of semiconductor laser；
(2) initial pallet is placed on initial alignment device, initial alignment device is connected with pedestal, and positioning column is inserted into location hole
In, fixed initial pallet,
(3) terminal tray is placed on terminal locator, terminal locator is connected with pedestal, and positioning column is inserted into location hole
In, fixed terminal pallet；
(4) pedestal is equipped with column, and column is connected with sliding rail, and sliding rail is equipped with suction nozzle, sets suction nozzle motion track, utilizes
Suction nozzle draws the semiconductor on initial pallet, and moves on terminal tray, avoid occur in moving process pollute, be full
Foot position accurately requires.
According to currently preferred, in step (2), two positioning columns, twin fixed guide-vane are inserted at initial pallet both ends.
According to currently preferred, in step (3), two positioning columns, twin fixed guide-vane are inserted at terminal tray both ends.
According to currently preferred, in step (4), when the semiconductor of first row on initial pallet moves to terminal tray knot
Shu Hou takes the positioning column on initial alignment device away, and mobile initial pallet makes the second row of initial pallet be moved to below suction nozzle,
Positioning column is inserted at initial pallet both ends to fix, after the discharge of terminal tray one is full, movement and again fixed terminal pallet repeat
Semiconductor whole displacement in step (4) to initial pallet is completed, return to step (1), filling, the next initial pallet of displacement.
It replaces having been manually done displacement of the semiconductor from initial pallet to terminal tray using the present apparatus, increases positioning device
The suction nozzle made with the suction nozzle of special material, silica gel has relatively good elasticity, wearability and heat-resisting quantity etc., such material
It verifies and draws the success rate of tube socket and play the role of better, keep displacement of the semiconductor from initial pallet to terminal tray more accurate
Really, it is not easy to occur polluting and because collision leads to the damage phenomenon of semiconductor, the qualification rate so as to reach product improves,
The requirement of cost reduction.
Beneficial effects of the present invention are as follows：
1, the present invention solves the slow-footed work drawback of unarmed swing seat, makes semiconductor laser marshalling, with sealing cap
Machine semiconductor laser pallet is worked good, and the quantity for once putting cap is larger, ensure that the continue working of cap sealing machine, greatly
Operating rate is improved, the time is saved, is greatly improved work efficiency.
2, pollution that can be to avoid manual swing seat to its tube socket using technical scheme of the present invention.
3, the quantity that can reduce swing seat personnel using technical scheme of the present invention, saves manpower, reduces artificial
Amount, achievees the effect that get twice the result with half the effort.
4, the pallet that the present invention uses is small, simple in structure, and processing is simple, and cost of manufacture is cheap.
Description of the drawings
Fig. 1 is apparatus of the present invention overall structure diagram；
In figure, 1, initial pallet, 2, suction nozzle, 3, terminal tray, 4, initial alignment device；5, terminal locator, 6, sliding rail, 7,
Positioning column.
Specific implementation mode
The present invention will be further described by way of example and in conjunction with the accompanying drawings, but not limited to this.
Embodiment 1
A kind of semiconductor laser product quickly arranges transfer device, including pedestal, and sliding rail is connected by column with pedestal,
Pedestal is equipped with initial alignment device and terminal locator, and initial pallet and end are respectively equipped on initial alignment device and terminal locator
Pallet to be held, circular hole is equipped on initial pallet and terminal tray, semiconductor laser is set in circular hole, sliding rail is equipped with suction nozzle,
Initial alignment device and terminal locator are equipped with positioning column.Suction nozzle is moved horizontally along sliding rail, is drawn semiconductor from initial pallet and is swashed
Light device is simultaneously moved to terminal tray along sliding rail.
Embodiment 2
A kind of semiconductor laser product quickly arranges transfer device, and structure is as described in Example 1, the difference is that
20 location holes are equipped on initial alignment device and terminal locator, positioning column one end matches connection with location hole.20 positioning
Hole is in line setting successively, and the length connected is more than the width of initial pallet or terminal tray, after being moved easily pallet
Continue to position by location hole, fixed initial pallet and terminal tray.On location hole and terminal locator on initial alignment device
Positioning hole number it is equal, and respective location hole is located in same horizontal line, so as to draw precisely errorless.
Embodiment 3
A kind of semiconductor laser product quickly arranges transfer device, and structure is as described in Example 2, the difference is that
Positioning column is taper positioning column, and positioning column tip is connected with location hole.
Embodiment 4
A kind of semiconductor laser product quickly arranges transfer device, and structure is as described in Example 3, the difference is that
Positioning column surface is equipped with rubber layer.Make positioning column that can closely be connect with location hole interference, avoiding inadvertently falling off influences precision, damage
Product quality.
Embodiment 5
A kind of semiconductor laser product quickly arranges transfer device, and structure is as described in Example 1, the difference is that
Suction nozzle is suction nozzle made of silica gel.Silica gel make suction nozzle, have relatively good elasticity, wearability and heat-resisting quantity etc., in this way
Material to draw tube socket success rate play the role of it is better.
Embodiment 6
A kind of transfer method quickly arranging transfer device using semiconductor laser product described in embodiment 2, including with
Lower step：
(1) semiconductor laser for being soldered line is put on initial pallet, circular hole, circular hole arrangement is distributed on initial pallet
Neat to be used to fix semiconductor laser, as shown in Figure 1, initial pallet is cuboid, initial pallet uses the arrangement of 14*5, circle
The outer diameter in hole is matched with the outer diameter of semiconductor laser, and semiconductor laser can be placed in circular hole；
(2) initial pallet is placed on initial alignment device, initial alignment device is connected with pedestal, is inserted at initial pallet both ends
Two positioning columns, the initial pallet of twin fixed guide-vane,
(3) terminal tray is placed on terminal locator, terminal tray is finally that cap sealing machine uses, and is distributed on terminal tray
The circular hole for having marshalling, unlike initial pallet, the circular hole on terminal tray uses the series arrangement of 14*10, terminal
Locator is connected with pedestal, and two positioning columns, twin fixed guide-vane terminal tray are inserted at terminal tray both ends；
(4) pedestal is equipped with column, and column is connected with sliding rail, and sliding rail is equipped with suction nozzle, sets suction nozzle motion track, will inhale
Mouth is moved to the surface for the semiconductor laser that the needs of initial pallet are transplanted, and partly leading on initial pallet is drawn using suction nozzle
Body, and move to above terminal tray, the semiconductor laser of absorption is positioned in terminal tray, is avoided in moving process
The pollution of middle appearance meets position and accurately requires.
After the semiconductor of first row on initial pallet moves to terminal tray, the positioning on initial alignment device is taken away
Column, mobile initial pallet, makes the second row of initial pallet be moved to below suction nozzle, and it is solid to be inserted into positioning column at initial pallet both ends
Fixed, after the discharge of terminal tray one is full, movement and again fixed terminal pallet repeat partly leading in step (4) to initial pallet
Body whole displacement is completed, return to step (1), filling, the next initial pallet of displacement.
Claims (4)
1. a kind of semiconductor laser product quickly arranges the transfer method of transfer device, wherein semiconductor laser product is quick
It includes pedestal to arrange transfer device, and sliding rail is connected by column with pedestal, and pedestal is equipped with initial alignment device and terminal locator,
It is respectively equipped with initial pallet and terminal tray on initial alignment device and terminal locator, is equipped on initial pallet and terminal tray
Circular hole, circular hole is interior to be arranged semiconductor laser, and sliding rail is equipped with suction nozzle, and initial alignment device and terminal locator are equipped with positioning
Column is equipped at least two location holes on initial alignment device and terminal locator, and positioning column one end matches connection with location hole, just
The location hole on location hole and terminal locator on beginning locator is located in same horizontal line；Positioning column is taper positioning column,
Positioning column tip is connected with location hole, and positioning column surface is equipped with rubber layer, and suction nozzle is suction nozzle made of silica gel；
Include the following steps：
(1) semiconductor laser for being soldered line is put on initial pallet, is distributed with circular hole on initial pallet, the outer diameter of circular hole with
The outer diameter of semiconductor laser matches；
(2) initial pallet being placed on initial alignment device, initial alignment device is connected with pedestal, and positioning column is inserted into location hole,
Fixed initial pallet,
(3) terminal tray being placed on terminal locator, terminal locator is connected with pedestal, and positioning column is inserted into location hole,
Fixed terminal pallet；
(4) pedestal is equipped with column, and column is connected with sliding rail, and sliding rail is equipped with suction nozzle, sets suction nozzle motion track, utilizes suction nozzle
The semiconductor on initial pallet is drawn, and is moved on terminal tray.
2. transfer method according to claim 1, which is characterized in that in step (2), two are inserted at initial pallet both ends
Positioning column.
3. transfer method according to claim 1, which is characterized in that in step (3), two are inserted at terminal tray both ends
Positioning column.
4. transfer method according to claim 1, which is characterized in that in step (4), when half of first row on initial pallet
After conductor moves to terminal tray, the positioning column on initial alignment device is taken away, mobile initial pallet makes the of initial pallet
Two rows are moved to below suction nozzle, are inserted into positioning column at initial pallet both ends and fix, and after the discharge of terminal tray one is full, movement is laid equal stress on
New fixed terminal pallet, the semiconductor whole displacement repeated in step (4) to initial pallet are completed, return to step (1), filling,
The next initial pallet of displacement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610936768.9A CN106364880B (en) | 2016-10-25 | 2016-10-25 | A kind of semiconductor laser product quickly arranges transfer device and transfer method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610936768.9A CN106364880B (en) | 2016-10-25 | 2016-10-25 | A kind of semiconductor laser product quickly arranges transfer device and transfer method |
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| CN106364880A CN106364880A (en) | 2017-02-01 |
| CN106364880B true CN106364880B (en) | 2018-09-25 |
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| CN107010400A (en) * | 2017-04-07 | 2017-08-04 | 东莞六鼎智能科技有限公司 | A kind of materials and parts of vision positioning arrange plate method automatically |
| CN109149353B (en) * | 2017-06-28 | 2020-07-14 | 山东华光光电子股份有限公司 | Rapid concentric fixing device and fixing method for semiconductor laser sealing cap and application |
| KR102581147B1 (en) * | 2018-07-12 | 2023-09-25 | (주)테크윙 | Apparatus for relocating electronic components |
| CN109455501B (en) * | 2018-12-20 | 2024-04-09 | 苏州祥龙嘉业电子科技股份有限公司 | Connector steel pipe arranging machine |
| CN111169979B (en) * | 2019-12-10 | 2021-06-15 | 苏州市创怡盛实业有限公司 | Robot transfer method and system |
| CN113911721A (en) * | 2021-10-15 | 2022-01-11 | 上海精澄科技有限公司 | Feeding and discharging machine |
| CN114992205B (en) * | 2022-04-25 | 2024-02-06 | 山东华光光电子股份有限公司 | Full-automatic laser shell bonding equipment and using method |
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