CN106364880A - Fast arranging and transferring device for semiconductor laser products and transferring method - Google Patents
Fast arranging and transferring device for semiconductor laser products and transferring method Download PDFInfo
- Publication number
- CN106364880A CN106364880A CN201610936768.9A CN201610936768A CN106364880A CN 106364880 A CN106364880 A CN 106364880A CN 201610936768 A CN201610936768 A CN 201610936768A CN 106364880 A CN106364880 A CN 106364880A
- Authority
- CN
- China
- Prior art keywords
- initial
- terminal
- semiconductor laser
- pallet
- locating dowel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/26—Devices influencing the relative position or the attitude of articles during transit by conveyors arranging the articles, e.g. varying spacing between individual articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/912—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rectilinear movements only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention relates to a fast arranging and transferring device for semiconductor laser products and a transferring method, and belongs to the technical field of arrangement of semiconductor lasers. The device comprises a base. A slide rail is connected with the base through a stand column. An initial locator and a terminal locator are arranged on the base. An initial tray and a terminal tray are arranged on the initial locator and the terminal locator correspondingly. Round holes are formed in the initial tray and the terminal tray. Semiconductor lasers are arranged in the round holes. A suction nozzle is arranged on the slide rail. The initial locator and the terminal locator are each provided with locating posts. The fast arranging and transferring device instead of manual operation is adopted for transferring the semiconductors from the initial tray to the terminal tray, the work defect of low speed of manual arrangement of tube sockets is overcome, pollution of manual arrangement to the tube sockets is avoided, arrangement is tidy, matching with a cap sealing machine is good, a large number of tube sockets are arranged at a time, it is guaranteed that the cap sealing machine operates continuously, the working speed is greatly increased, time and labor are reduced, and the working efficiency is greatly improved.
Description
Technical field
The present invention relates to a kind of quick arrangement for making semiconductor laser is in order to cap sealing machine noise spectra of semiconductor lasers
The apparatus and method of sealing cap, belong to semiconductor laser permutation technology field.
Background technology
Through the development of decades, semiconductor laser is increasingly known to society, and obtains in many places field
To application, the photoelectric transformation efficiency of semiconductor laser more than 60%, imitate by the opto-electronic conversion being significantly larger than other like products
Rate, its energy consumption is low, makees the advantages of in device, heat accumulation is few, life-span length, collimation are good, illumination distances are remote in social similar industry
More and more extensive for a kind of emerging technology application.All kinds of advantages that semiconductor laser has determine that its more and more higher is subject to
The extensive attention of various circles of society.Semiconductor laser work mainly by be inside chip, chip projects sharp after powered up
Light, and chip price is expensive, used material is more special, is fine in texture, and the laser instrument of manual operation arrangement can be to surface
Cause certain pollution, causing chip, itself is more fragile, easily damaged, and chip environmental requirement is higher to external world,
Must be dustfree environment, once being contaminated or have breakage just to influence whether the performance of whole semiconductor laser.Chip is made
For the core component of semiconductor laser, once be contaminated or have breakage will bring to whole device unexpected after
Really, whole device seriously can be made to scrap.It can be seen that being mostly important in whole production process to the protection of laser instrument in production process
A link.
There is protective measure miscellaneous in this industry at present, but excellent scarce different, practical at present and application
Relatively more guard methods mainly use manual alignment, and this Protection Code protects laser instrument directly touching because of handss well
Touch, and make laser instrument pollution etc. affect the external issues of its quality.But want in reproduction to play protection semiconductor laser
Effect must fit into suitable position.It is provided with special operation in whole encapsulation work at present, this operation main purpose
Exactly will be put on suitable position with semiconductor laser so as to play due effect.Transplant work at present to be mainly
By special personnel, laser instrument is fixed in place.But the manual work characteristics transplanted requires semiconductor laser
The positioning that puts in order, if not just influence whether entirely to arrange the persistence of work, serious if can damage product matter
Amount.Thus amplify out a problem: need to carry out special sequence to base.
Do not exclusively carry out at present the device of base arrangement, operator can only free-hand by base being placed in automatically one by one
On the scratch diskette of cap sealing machine, so that automatic cap sealing machine takes semiconductor laser away.So not only have impact on speed of production, and consume
Take manpower.Next is exactly that the peculiar protective position of semiconductor laser determines that it can not be contaminated.Free-hand base is arranged one by one
Semiconductor laser can be touched unavoidably, certain pollution can be caused to base to a certain extent, can affect to a certain extent
Quality to whole semiconductor laser.
Content of the invention
The problem existing for the permutation technology of existing semiconductor laser, the present invention provides a kind of semiconductor laser row
Neat and cap sealing machine the base pallet of row is worked good, the quick collating unit of the semiconductor laser of high working efficiency and method.
Technical scheme is as follows:
A kind of semiconductor laser product quickly arranges transfer device, and including base, slide rail is connected with base by column,
Base is provided with initial alignment device and terminal locator, and initial alignment device and terminal locator are respectively equipped with initial pallet and end
End pallet, initial pallet and terminal tray are equipped with circular hole, setting semiconductor laser in circular hole, and slide rail is provided with suction nozzle,
Initial alignment device and terminal locator are equipped with locating dowel.Suction nozzle moves horizontally along slide rail, draws quasiconductor from initial pallet and swashs
Light device along slide rail movement to terminal tray.
According to currently preferred, initial alignment device and terminal locator are equipped with least two location holes, locating dowel
One end is connected with location hole coupling.Using at least two location holes, fix initial pallet and terminal tray.
It is further preferred that the location hole on location hole and terminal locator on initial alignment device is located at same horizontal line
On.So that drawing precisely errorless.
It is further preferred that locating dowel is taper locating dowel, locating dowel tip is connected with location hole.
It is further preferred that locating dowel surface is provided with rubber layer.So that locating dowel closely can be connected with location hole interference, it is to avoid
Inadvertently fall off impact precision, damage product quality.
It is further preferred that the suction nozzle that suction nozzle is made for silica gel.The suction nozzle that silica gel makes, has reasonable elasticity, resistance to
Mill property and heat-resisting quantity etc., such material plays more preferable effect to the success rate drawing base.
A kind of transfer method quickly being arranged transfer device using above-mentioned semiconductor laser product, is comprised the following steps:
(1) semiconductor laser being soldered line is put on initial pallet, circular hole is distributed with initial pallet, circular hole arranges
Neatly it is used for fixing semiconductor laser, the external diameter of circular hole is matched with the external diameter of semiconductor laser；
(2) initial pallet is placed on initial alignment device, initial alignment device is connected with base, and locating dowel is inserted location hole
In, fixing initial pallet,
(3) terminal tray is placed on terminal locator, terminal locator is connected with base, locating dowel is inserted location hole
In, fixed terminal pallet；
(4) base is provided with column, and column is connected with slide rail, and slide rail is provided with suction nozzle, sets suction nozzle motion track, utilizes
Suction nozzle draws the quasiconductor on initial pallet, and moves on terminal tray, it is to avoid the pollution occurring in moving process, full
Foot position accurately requires.
According to currently preferred, in step (2), insert two locating dowels, twin fixed guide-vane at initial pallet two ends.
According to currently preferred, in step (3), insert two locating dowels, twin fixed guide-vane at terminal tray two ends.
According to currently preferred, in step (4), when the quasiconductor of first row on initial pallet moves to terminal tray knot
Shu Hou, takes the locating dowel on initial alignment device away, mobile initial pallet, so that the second row of initial pallet is moved to below suction nozzle,
At initial pallet two ends, insertion locating dowel is fixed, after terminal tray one discharge is full, mobile and fixed terminal pallet again, and repetition
The whole displacement of quasiconductor to initial pallet for the step (4) completes, return to step (1), filling, the next initial pallet of displacement.
Replace having been manually done the displacement from initial pallet to terminal tray for the quasiconductor using this device, increased positioner
The suction nozzle making with the suction nozzle of special material, silica gel, has reasonable elasticity, wearability and heat-resisting quantity etc., such material
The success rate that base is drawn in confrontation plays more preferable effect, makes quasiconductor more accurate from the displacement of initial pallet to terminal tray
Really it is not easy to pollution occur and because collision leads to the damage phenomenon of quasiconductor, the qualification rate such that it is able to reach product improves,
The requirement that cost reduces.
Beneficial effects of the present invention are as follows:
1st, the present invention solves free-hand swing seat slow-footed work drawback, makes semiconductor laser marshalling, with sealing cap
Machine semiconductor laser pallet is worked good, and once the quantity of pendulum cap larger it is ensured that the continuous firing of cap sealing machine, greatly
Improve operating rate, save the time, substantially increase work efficiency.
2nd, the pollution to its base for the manual swing seat can be avoided using technical scheme.
3rd, the quantity of swing seat personnel can be decreased using technical scheme, save manpower, decrease artificial
Amount, reaches the effect got twice the result with half the effort.
4th, the pallet small volume that the present invention uses, structure is simple, and processing is simple, and cost of manufacture is cheap.
Brief description
Fig. 1 is apparatus of the present invention overall structure diagram；
In figure, 1, initial pallet, 2, suction nozzle, 3, terminal tray, 4, initial alignment device；5th, terminal locator, 6, slide rail, 7,
Locating dowel.
Specific embodiment
Below by embodiment and combine accompanying drawing the present invention will be further described, but not limited to this.
Embodiment 1
A kind of semiconductor laser product quickly arranges transfer device, and including base, slide rail is connected with base by column,
Base is provided with initial alignment device and terminal locator, and initial alignment device and terminal locator are respectively equipped with initial pallet and end
End pallet, initial pallet and terminal tray are equipped with circular hole, setting semiconductor laser in circular hole, and slide rail is provided with suction nozzle,
Initial alignment device and terminal locator are equipped with locating dowel.Suction nozzle moves horizontally along slide rail, draws quasiconductor from initial pallet and swashs
Light device along slide rail movement to terminal tray.
Embodiment 2
A kind of semiconductor laser product quickly arranges transfer device, its structure as described in Example 1, except that,
20 location holes are equipped with initial alignment device and terminal locator, locating dowel one end is connected with location hole coupling.20 positioning
Hole is in line setting successively, and the length that it couples together is more than the width of initial pallet or terminal tray, after being moved easily pallet
Positioning is continued by location hole, fixes initial pallet and terminal tray.On location hole and terminal locator on initial alignment device
Positioning hole number equal, and respective location hole be located at same horizontal line on so that draw precisely errorless.
Embodiment 3
A kind of semiconductor laser product quickly arranges transfer device, its structure as described in Example 2, except that,
Locating dowel is taper locating dowel, and locating dowel tip is connected with location hole.
Embodiment 4
A kind of semiconductor laser product quickly arranges transfer device, its structure as described in Example 3, except that,
Locating dowel surface is provided with rubber layer.So that locating dowel closely can be connected with location hole interference, it is to avoid to inadvertently fall off impact precision, damage
Product quality.
Embodiment 5
A kind of semiconductor laser product quickly arranges transfer device, its structure as described in Example 1, except that,
The suction nozzle that suction nozzle is made for silica gel.The suction nozzle that silica gel makes, has reasonable elasticity, wearability and heat-resisting quantity etc., so
Material the success rate drawing base is played with more preferable effect.
Embodiment 6
Semiconductor laser product described in a kind of utilization embodiment 2 quickly arranges the transfer method of transfer device, including with
Lower step:
(1) semiconductor laser being soldered line is put on initial pallet, circular hole is distributed with initial pallet, circular hole arranges
Neatly it is used for fixing semiconductor laser, as shown in figure 1, initial pallet is cuboid, initial pallet adopts the arrangement of 14*5, circle
The external diameter in hole is matched with the external diameter of semiconductor laser, and semiconductor laser can be placed in circular hole；
(2) initial pallet is placed on initial alignment device, initial alignment device is connected with base, in the insertion of initial pallet two ends
Two locating dowels, the initial pallet of twin fixed guide-vane,
(3) terminal tray is placed on terminal locator, terminal tray finally uses for cap sealing machine, terminal tray is distributed
There is the circular hole of marshalling, from unlike initial pallet, the circular hole on terminal tray adopts the series arrangement of 14*10, terminal
Localizer is connected with base, inserts two locating dowels, twin fixed guide-vane terminal tray at terminal tray two ends；
(4) base is provided with column, and column is connected with slide rail, and slide rail is provided with suction nozzle, sets suction nozzle motion track, will inhale
Mouth moves to the surface of the semiconductor laser needing to transplant of initial pallet, draws partly leading on initial pallet using suction nozzle
Body, and moving to above terminal tray, the semiconductor laser of absorption is positioned in terminal tray, it is to avoid in moving process
The pollution of middle appearance, meet position and accurately require.
After the quasiconductor of first row on initial pallet moves to terminal tray and terminates, take the positioning on initial alignment device away
Post, mobile initial pallet, so that the second row of initial pallet is moved to below suction nozzle, insertion locating dowel is solid at initial pallet two ends
Calmly, after terminal tray one discharge is full, movement again fixed terminal pallet, partly leading in repeat step (4) to initial pallet
The whole displacement of body completes, return to step (1), filling, the next initial pallet of displacement.
Claims (10)
1. a kind of semiconductor laser product quickly arrange transfer device it is characterised in that include base, slide rail pass through column with
Base is connected, and base is provided with initial alignment device and terminal locator, initial alignment device and terminal locator is respectively equipped with just
Beginning pallet and terminal tray, initial pallet and terminal tray are equipped with circular hole, and setting semiconductor laser in circular hole, on slide rail
It is provided with suction nozzle, initial alignment device and terminal locator are equipped with locating dowel.
2. semiconductor laser product according to claim 1 quickly arranges transfer device it is characterised in that initial alignment
At least two location holes are equipped with device and terminal locator, locating dowel one end is connected with location hole coupling.
3. semiconductor laser product according to claim 2 quickly arranges transfer device it is characterised in that initial alignment
The location hole on location hole and terminal locator on device is located in same horizontal line.
4. semiconductor laser product according to claim 2 quickly arranges transfer device it is characterised in that locating dowel is
Taper locating dowel, locating dowel tip is connected with location hole.
5. semiconductor laser product according to claim 4 quickly arranges transfer device it is characterised in that locating dowel table
Face is provided with rubber layer.
6. semiconductor laser product according to claim 1 quickly arranges transfer device it is characterised in that suction nozzle is silicon
The suction nozzle that glue is made.
7. semiconductor laser product described in a kind of utilization claim 2 quickly arranges the transfer method of transfer device, including with
Lower step:
(1) semiconductor laser being soldered line is put on initial pallet, circular hole is distributed with initial pallet, the external diameter of circular hole with
The external diameter of semiconductor laser matches；
(2) initial pallet is placed on initial alignment device, initial alignment device is connected with base, locating dowel is inserted in location hole,
Fixing initial pallet,
(3) terminal tray is placed on terminal locator, terminal locator is connected with base, locating dowel is inserted in location hole,
Fixed terminal pallet；
(4) base is provided with column, and column is connected with slide rail, and slide rail is provided with suction nozzle, sets suction nozzle motion track, using suction nozzle
Draw the quasiconductor on initial pallet, and move on terminal tray.
8. transfer method according to claim 7 is it is characterised in that in step (2), insert two at initial pallet two ends
Locating dowel.
9. transfer method according to claim 7 is it is characterised in that in step (3), insert two at terminal tray two ends
Locating dowel.
10. transfer method according to claim 7 is it is characterised in that in step (4), when first row on initial pallet
Quasiconductor moves to after terminal tray terminates, and takes the locating dowel on initial alignment device away, and mobile initial pallet makes initial pallet
Second row moves to below suction nozzle, and at initial pallet two ends, insertion locating dowel is fixed, and after terminal tray one discharge is full, moves simultaneously
Retighten terminal tray, the whole displacement of quasiconductor in repeat step (4) to initial pallet completes, return to step (1), dress
Fill out, the next initial pallet of displacement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610936768.9A CN106364880B (en) | 2016-10-25 | 2016-10-25 | A kind of semiconductor laser product quickly arranges transfer device and transfer method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610936768.9A CN106364880B (en) | 2016-10-25 | 2016-10-25 | A kind of semiconductor laser product quickly arranges transfer device and transfer method |
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| CN106364880A true CN106364880A (en) | 2017-02-01 |
| CN106364880B CN106364880B (en) | 2018-09-25 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107010400A (en) * | 2017-04-07 | 2017-08-04 | 东莞六鼎智能科技有限公司 | A kind of materials and parts of vision positioning arrange plate method automatically |
| CN109149353A (en) * | 2017-06-28 | 2019-01-04 | 山东华光光电子股份有限公司 | A kind of semiconductor laser sealing cap quickly fixed device and fixing means and application with one heart |
| CN109455501A (en) * | 2018-12-20 | 2019-03-12 | 苏州祥龙嘉业电子科技股份有限公司 | A kind of connector steel pipe arrangement machine |
| CN110711705A (en) * | 2018-07-12 | 2020-01-21 | 泰克元有限公司 | Electronic component rearrangement apparatus |
| CN111169979A (en) * | 2019-12-10 | 2020-05-19 | 苏州市创怡盛实业有限公司 | Robot transfer method and system |
| CN113911721A (en) * | 2021-10-15 | 2022-01-11 | 上海精澄科技有限公司 | Feeding and discharging machine |
| CN114992205A (en) * | 2022-04-25 | 2022-09-02 | 山东华光光电子股份有限公司 | Full-automatic laser shell bonding equipment and use method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080074559A (en) * | 2007-02-09 | 2008-08-13 | 주식회사 탑 엔지니어링 | Array tester |
| US20110283938A1 (en) * | 2010-05-24 | 2011-11-24 | Hon Hai Precision Industry Co., Ltd. | Lens barrel coating aid apparatus |
| CN202189770U (en) * | 2011-07-22 | 2012-04-11 | 江阴市爱多光伏科技有限公司 | Taking and positioning device of silicon wafer conveyer |
| CN202256742U (en) * | 2011-09-30 | 2012-05-30 | 樊伟超 | Optical filter arranging machine |
| CN102854594A (en) * | 2012-09-29 | 2013-01-02 | 樊伟超 | Placement machine |
| CN204173581U (en) * | 2014-08-28 | 2015-02-25 | 深圳市亚派光电器件有限公司 | Filter automation attachment registration device |
| CN204602657U (en) * | 2014-12-25 | 2015-09-02 | 昆山诚业德通讯科技有限公司 | Radome automatic sorting discharge device |
| CN105356291A (en) * | 2015-11-24 | 2016-02-24 | 山东华光光电子有限公司 | Method for quickly arranging semiconductor laser pipe caps |
| CN206142383U (en) * | 2016-10-25 | 2017-05-03 | 山东华光光电子股份有限公司 | Transfer device is arranged fast to semiconductor laser product |
-
2016
- 2016-10-25 CN CN201610936768.9A patent/CN106364880B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080074559A (en) * | 2007-02-09 | 2008-08-13 | 주식회사 탑 엔지니어링 | Array tester |
| US20110283938A1 (en) * | 2010-05-24 | 2011-11-24 | Hon Hai Precision Industry Co., Ltd. | Lens barrel coating aid apparatus |
| CN202189770U (en) * | 2011-07-22 | 2012-04-11 | 江阴市爱多光伏科技有限公司 | Taking and positioning device of silicon wafer conveyer |
| CN202256742U (en) * | 2011-09-30 | 2012-05-30 | 樊伟超 | Optical filter arranging machine |
| CN102854594A (en) * | 2012-09-29 | 2013-01-02 | 樊伟超 | Placement machine |
| CN204173581U (en) * | 2014-08-28 | 2015-02-25 | 深圳市亚派光电器件有限公司 | Filter automation attachment registration device |
| CN204602657U (en) * | 2014-12-25 | 2015-09-02 | 昆山诚业德通讯科技有限公司 | Radome automatic sorting discharge device |
| CN105356291A (en) * | 2015-11-24 | 2016-02-24 | 山东华光光电子有限公司 | Method for quickly arranging semiconductor laser pipe caps |
| CN206142383U (en) * | 2016-10-25 | 2017-05-03 | 山东华光光电子股份有限公司 | Transfer device is arranged fast to semiconductor laser product |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107010400A (en) * | 2017-04-07 | 2017-08-04 | 东莞六鼎智能科技有限公司 | A kind of materials and parts of vision positioning arrange plate method automatically |
| CN109149353A (en) * | 2017-06-28 | 2019-01-04 | 山东华光光电子股份有限公司 | A kind of semiconductor laser sealing cap quickly fixed device and fixing means and application with one heart |
| CN109149353B (en) * | 2017-06-28 | 2020-07-14 | 山东华光光电子股份有限公司 | Rapid concentric fixing device and fixing method for semiconductor laser sealing cap and application |
| CN110711705A (en) * | 2018-07-12 | 2020-01-21 | 泰克元有限公司 | Electronic component rearrangement apparatus |
| CN110711705B (en) * | 2018-07-12 | 2021-09-24 | 泰克元有限公司 | Electronic component rearrangement apparatus |
| CN109455501A (en) * | 2018-12-20 | 2019-03-12 | 苏州祥龙嘉业电子科技股份有限公司 | A kind of connector steel pipe arrangement machine |
| CN109455501B (en) * | 2018-12-20 | 2024-04-09 | 苏州祥龙嘉业电子科技股份有限公司 | Connector steel pipe arranging machine |
| CN111169979A (en) * | 2019-12-10 | 2020-05-19 | 苏州市创怡盛实业有限公司 | Robot transfer method and system |
| CN111169979B (en) * | 2019-12-10 | 2021-06-15 | 苏州市创怡盛实业有限公司 | Robot transfer method and system |
| CN113911721A (en) * | 2021-10-15 | 2022-01-11 | 上海精澄科技有限公司 | Feeding and discharging machine |
| CN114992205A (en) * | 2022-04-25 | 2022-09-02 | 山东华光光电子股份有限公司 | Full-automatic laser shell bonding equipment and use method |
| CN114992205B (en) * | 2022-04-25 | 2024-02-06 | 山东华光光电子股份有限公司 | Full-automatic laser shell bonding equipment and using method |
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|---|---|
| CN106364880B (en) | 2018-09-25 |
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