CN106328613B - A kind of integrated antenna package mechanism convenient for heat dissipation - Google Patents
A kind of integrated antenna package mechanism convenient for heat dissipation Download PDFInfo
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- CN106328613B CN106328613B CN201610703405.0A CN201610703405A CN106328613B CN 106328613 B CN106328613 B CN 106328613B CN 201610703405 A CN201610703405 A CN 201610703405A CN 106328613 B CN106328613 B CN 106328613B
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- heat sink
- bearing seat
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- heat dissipation
- heat
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- Microelectronics & Electronic Packaging (AREA)
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- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract
The invention discloses a kind of integrated antenna package mechanisms convenient for heat dissipation, including substrate, heat sink is fixed on substrate, multiple radiating frames circular layer by layer are formed on heat sink, the bearing seat for being fixedly arranged in the middle of rectangle of radiating frame, the center of bearing seat forms the placement hole of rectangle, and IC chip is plugged in placement hole；Plugged and fixed has multiple cooling fins on radiating frame on the inside of heat sink, the lower end of cooling fin forms several thermal vias being connected with heat sink upper surface, several connecting holes are formed on bearing seat, heat emission hole is formed on the radiating frame of heat sink both sides, heat sink upper surface forms several and sets groove, it sets groove and crosses corresponding connecting hole, thermal vias and heat emission hole, it sets and is equipped with coolant pipe in groove, thermal conductive ceramic ring is arranged on the middle part outer wall of coolant pipe, IC chip is pressed against on thermal conductive ceramic ring.The present invention can realize rapid cooling, extend the service life of integrated circuit.
Description
Technical field：
The present invention relates to the technical fields of integrated circuit, are specifically related to a kind of integrated antenna package machine convenient for heat dissipation
Structure.
Background technology：
Electronic industry constantly reduces the size of electronic component, and continues to increase function on electronic component so that integrated electricity
The function and complexity on road are constantly promoted.And this trend also drives the encapsulation technology of integrated circuit component towards small size, high foot
The direction of several and high electricity/thermal efficiency is developed, and meets scheduled industrial standard.Since high-effect integrated circuit component generates higher
Heat, and existing compact package technology only provides designer fraction of cooling mechanism, it is therefore desirable in its small-sized envelope
Radiator structure is designed on assembling structure in order to realize heat dissipation, extends the service life of integrated circuit, existing compact package structure
On radiator structure heat dissipation effect it is undesirable.
Invention content：
The purpose of the present invention aims to solve the problem that problem of the existing technology, provide it is a kind of can realize rapid cooling, extend collection
At the integrated antenna package mechanism convenient for heat dissipation of the service life of circuit.
The present invention relates to a kind of integrated antenna package mechanism convenient for heat dissipation, including substrate, it is fixed on the substrate scattered
Hot plate, form multiple radiating frames circular layer by layer on the heat sink, and the radiating frame is fixedly arranged in the middle of rectangle
The center of bearing seat, the bearing seat forms the placement hole of rectangle, and IC chip is plugged in the placement hole, described
It is molded fluted on the radiating frame of heat sink two opposite sides, forms extension board on four sides of the bearing seat, hold
It carries one group of extension board opposite on seat to be plugged in the groove, another group of opposite extension board is plugged on heat sink on bearing seat
On the radiating frame of inside；
Plugged and fixed has multiple vertical cooling fins, the lower end of the cooling fin on radiating frame on the inside of the heat sink
Several thermal vias being connected with heat sink upper surface are formed, several and thermal vias is formed on the bearing seat
Corresponding connecting hole, forms heat emission hole corresponding with thermal vias on the radiating frame of heat sink both sides, on heat sink
End face forms several and sets groove, and the groove of setting crosses corresponding connecting hole, thermal vias and heat emission hole, sets recessed
Coolant pipe is equipped in slot, the lower end of the coolant pipe is set in groove, groove, coolant liquid are set in upper end exposing
Thermal conductive ceramic ring is arranged on the middle part outer wall of pipe, IC chip is pressed against on the thermal conductive ceramic ring, coolant pipe
Both ends are pierced by the radiating frame on heat sink and are connected with buffering connecting tube, and multiple graphite are arranged in the buffering connecting tube and are dissipated
Hot ring.
By above-mentioned technical proposal, in the use of the present invention, IC chip is arranged in the placement hole of bearing seat simultaneously
It is pressed against on thermal conductive ceramic ring, circulating in coolant pipe has coolant liquid, the heat that thermal conductive ceramic ring generates IC chip
The coolant liquid in coolant pipe is passed to, to realize heat dissipation, the coolant liquid outflow coolant pipe cocurrent by heat exchange crosses buffering
Connecting tube, the graphite radiating ring buffered in connecting tube radiate to coolant liquid, and the coolant liquid for restoring cooling flows into coolant liquid again
Cycle radiates to IC chip in pipe, to improve radiating efficiency.Cooling fin is located at the heat sink on the inside of heat sink
On body, the heat further generated to IC chip radiates.The radiating frame of " returning " character form structure on heat sink,
Improve radiating efficiency, while the radiating frame of thermal vias unplugged " time " the font mechanism on heat emission hole and cooling fin thereon
Channel for heat dissipation realize high efficiency and heat radiation to realize air circulation.
Through the above scheme, integrated antenna package mechanism of the invention can realize the rapid cooling to IC chip,
To extend the service life of integrated circuit.
As a preference of the above scheme, one group of extension board opposite on the bearing seat is plugged in the groove simultaneously
Two opposite side plates are formed, the side plate is fixed on substrate and is resisted against the outer wall of the radiating frame of heat sink periphery
On, several stitch are fixed on the lateral wall of side plate.
As a preference of the above scheme, it is plugged with capping on the side plate, grafting is formed on the upper surface of side plate
Slot, molding is there are two grafting item on the bottom surface of the capping, and the grafting item distinguishes sleeve in corresponding inserting groove, grafting item
The first protection board is formed on the closure skirt of side, first protection board is located at outside the stitch, the both ends of capping at
There are two the second protection board, second protection boards to be located at outside heat sink for type, and the bottom of the second protection board forms several arcs
Shape card slot, the coolant pipe holding is in corresponding arc-shaped slot.
As a preference of the above scheme, the buffering connecting tube is in " Fang " shape, buffers the both ends difference of connecting tube
The both ends that heat sink is stretched out with coolant pipe are connected, and the graphite radiating ring is uniformly set in buffering connecting tube, and graphite dissipates
The inner wall of hot ring is close to buffer the outer wall of connecting tube, and the one end for buffering connecting tube is equipped with cooling liquid inlet, the other end is equipped with cycle
Force (forcing) pump.By said program, coolant liquid can be added into buffering connecting tube and coolant pipe by the cooling liquid inlet, institute
Stating cycle force (forcing) pump makes coolant liquid circulate in circulation in coolant pipe and buffering connecting tube.
As a preference of the above scheme, it is fixed with stem grafting if being set on the bearing seat of the IC chip both sides
Point, the stitch and contact are located on the two sides of bearing seat, stitch and contact electrical connection, the upper end of IC chip
If forming dry contact on face, the contact is electrically connected by conducting wire with the contact.
As a preference of the above scheme, the thermal vias on the cooling fin is disposed side by side on the longitudinal direction side of cooling fin
Upwards.
As a preference of the above scheme, the innermost cooling fin on the radiating frame on the inside of the heat sink against
On the extension board of bearing seat.
As a preference of the above scheme, the bottom surface of the extension board of the bearing seat side is located in the same horizontal plane,
And the bottom surface of bearing seat is less than the bottom surface of extension board.
Above description is only the general introduction of technical solution of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, below with presently preferred embodiments of the present invention and after coordinating attached drawing to be described in detail such as.
Description of the drawings：
The following drawings are only intended to schematically illustrate and explain the present invention, not delimit the scope of the invention.Wherein：
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the sectional view of Fig. 1；
Fig. 3 be the present invention without bearing seat when partial structural diagram；
Fig. 4 is the structural schematic diagram covered in the present invention；
Fig. 5 is the partial structural diagram between the second protection cap and coolant pipe in the present invention；
Fig. 6 is the sectional view of line A-A in Fig. 1.
Specific implementation mode：
With reference to the accompanying drawings and examples, the specific implementation mode of the present invention is described in further detail.Implement below
Example is not limited to the scope of the present invention for illustrating the present invention.
Referring to Fig. 1 to Fig. 3, a kind of integrated antenna package mechanism convenient for heat dissipation of the present invention, including substrate 10, institute
It states and is fixed with heat sink 20 on substrate, multiple radiating frames 21 circular layer by layer, the heat sink are formed on the heat sink
The center of the bearing seat 30 for being fixedly arranged in the middle of rectangle of body, the bearing seat forms the placement hole 31 of rectangle, ic core
Piece 1 is plugged in the placement hole 31, is molded fluted 211 on the radiating frame 21 of 20 two opposite sides of the heat sink, described
Extension board 32 is formed on four sides of bearing seat 30, the bottom surface of the extension board is located in the same horizontal plane, and is carried
The bottom surface of seat 30 is less than the bottom surface of extension board 32, and one group of opposite extension board 32 is plugged in the groove 211 on bearing seat 30,
Another group of opposite extension board 32 is plugged on the radiating frame 21 of 20 inside of heat sink on bearing seat 30.
Referring to Fig. 1, Fig. 2, plugged and fixed has multiple vertical cooling fins on the radiating frame 21 of 20 inside of the heat sink
40, the innermost cooling fin 40 is resisted against on the extension board 32 of bearing seat 30, if the lower end of the cooling fin 40 forms
The dry thermal vias 41 being connected with 20 upper surface of heat sink, the thermal vias are disposed side by side on the longitudinal direction of cooling fin 40
On, several connecting holes 33 corresponding with the thermal vias 41 are formed on the bearing seat 30,20 both sides of heat sink dissipate
Heat emission hole 212 corresponding with thermal vias 41 is formed in hot framework 21,20 upper surface of heat sink forms several and sets
Groove 22, the groove of setting cross corresponding connecting hole 33, thermal vias 41 and heat emission hole 212, set in groove 22 and set
There is coolant pipe 50, the lower end of the coolant pipe is set in groove 22, groove 22, coolant pipe are set in upper end exposing
Thermal conductive ceramic ring 60 is arranged on 50 middle part outer wall, IC chip 1 is pressed against on the thermal conductive ceramic ring 60, coolant liquid
Radiating frame 21 that the both ends of pipe 50 are pierced by heat sink 20 is simultaneously connected with buffering connecting tube 70, is arranged in the buffering connecting tube
There are multiple graphite radiating rings 80.
Referring to Fig. 1, Fig. 2, one group of opposite extension board 32 is plugged in the groove 211 and is molded on the bearing seat 30
There are two opposite side plates 34, the side plate to fix on the substrate 10 and be resisted against the outer of the radiating frame 21 of 20 periphery of heat sink
On wall, it is fixed with several stitch 90 on the lateral wall of side plate 34, is set on the bearing seat 30 of 1 both sides of the IC chip solid
If there is dry contact 91 surely, the stitch 90 and contact 91 are located on the two sides of bearing seat 30,91 electricity of stitch 90 and contact
Connection, if forming dry contact 11 on the upper surface of IC chip 1, the contact is electrically connected by conducting wire and the contact 91
It connects.
Referring to Fig. 1, Fig. 4, Fig. 5, it is plugged with capping 100 on the side plate 34, grafting is formed on the upper surface of side plate 34
Slot 341, there are two grafting item 101, the grafting item distinguishes sleeve in corresponding inserting groove for molding on the bottom surface of the capping 100
In 341, the first protection board 102 is formed on 100 side of capping of 101 side of grafting item, first protection board is located at institute
It states outside stitch 90, covers the second protection board 103 there are two 100 both ends moldings, second protection board is located at heat sink 20
Outside, the bottom of the second protection board 103 forms several arc-shaped slots 104, and 50 holding of the coolant pipe is in corresponding arc card
In slot 104.
Referring to Fig. 1, Fig. 6, the buffering connecting tube 70 be in " Fang " shape, buffer connecting tube 70 both ends respectively with coolant liquid
The both ends that pipe 50 stretches out heat sink 20 are connected, and the graphite radiating ring 80 is uniformly set in buffering connecting tube 70, and graphite dissipates
The inner wall of hot ring 80 is close to buffer the outer wall of connecting tube 70, and one end of buffering connecting tube 70 is equipped with cooling liquid inlet 71, the other end
Equipped with cycle force (forcing) pump 72.
In the specific implementation, IC chip 1 is arranged in the placement hole 31 of bearing seat 30 and is pressed against leads the present invention
On thermal Ceramics ring 60, the inner circulation of coolant pipe 50 has coolant liquid, the heat that thermal conductive ceramic ring 60 generates IC chip 1 to pass
The coolant liquid in coolant pipe 50 is passed, to realize heat dissipation, coolant liquid outflow 50 cocurrent of coolant pipe by heat exchange is too slow
Connecting tube 70 is rushed, the graphite radiating ring 80 buffered in connecting tube 70 radiates to coolant liquid, and the coolant liquid for restoring cooling flows again
Enter cycle in coolant pipe 50 to radiate to IC chip 1, to improve radiating efficiency.Cooling fin 40 is located at heat sink
On the radiating frame 21 of 20 insides, the heat further generated to IC chip 1 radiates." returning " on heat sink 20
The radiating frame 21 of character form structure improves radiating efficiency, while the thermal vias 41 on heat emission hole 212 and cooling fin 40 thereon
The channel for heat dissipation of the radiating frame 21 of unplugged " time " font mechanism realizes high efficiency and heat radiation to realize air circulation.
In conclusion the integrated antenna package mechanism of the present invention can realize the rapid cooling to IC chip, to
Extend the service life of integrated circuit.
Integrated antenna package mechanism provided by the present invention convenient for heat dissipation, only specific implementation mode of the invention, but
Scope of protection of the present invention is not limited thereto, any one skilled in the art the invention discloses technology model
In enclosing, it can easily think of the change or the replacement, should all cover within the scope of the present invention.Therefore, protection scope of the present invention
It should be based on the protection scope of the described claims.
Claims (8)
1. a kind of integrated antenna package mechanism convenient for heat dissipation, including substrate (10), it is characterised in that：
It is fixed with heat sink (20) on the substrate (10), multiple radiating frames circular layer by layer are formed on the heat sink
(21), the bearing seat (30) for being fixedly arranged in the middle of rectangle of the radiating frame, the center of the bearing seat forms the peace of rectangle
Hole (31) is set, IC chip (1) is plugged in the placement hole (31), the heat sink of heat sink (20) two opposite sides
It is molded on body (21) fluted (211), extension board (32), bearing seat is formed on four sides of the bearing seat (30)
(30) one group of opposite extension board (32) is plugged in the groove (211) on, another group of opposite extension on bearing seat (30)
Plate (32) is plugged on the radiating frame (21) on the inside of heat sink (20)；
Plugged and fixed has multiple vertical cooling fins (40), the heat dissipation on radiating frame (21) on the inside of the heat sink (20)
The lower end of piece forms several thermal vias (41) being connected with heat sink (20) upper surface, is molded on the bearing seat (30)
There are several connecting holes (33) corresponding with the thermal vias (41), is molded on the radiating frame (21) of heat sink (20) both sides
There are heat emission hole (212) corresponding with thermal vias (41), heat sink (20) upper surface to form several and set groove (22),
The groove of setting crosses corresponding connecting hole (33), thermal vias (41) and heat emission hole (212), sets in groove (22) and sets
There is coolant pipe (50), the lower end of the coolant pipe is set in groove (22), groove (22) is set in upper end exposing, cold
But thermal conductive ceramic ring (60) is arranged on the middle part outer wall of liquid pipe (50), IC chip (1) is pressed against the thermal conductive ceramic
On ring (60), radiating frame (21) that the both ends of coolant pipe (50) are pierced by heat sink (20) is simultaneously connected with buffering connecting tube
(70), multiple graphite radiating rings (80) are arranged in the buffering connecting tube.
2. the integrated antenna package mechanism according to claim 1 convenient for heat dissipation, it is characterised in that：The bearing seat (30)
Upper one group of opposite extension board (32) is plugged in the groove (211) and forms two opposite side plates (34), the side
Plate is fixed on substrate (10) and is resisted against on the outer wall of the radiating frame (21) of heat sink (20) periphery, the outside of side plate (34)
Several stitch (90) are fixed on wall.
3. the integrated antenna package mechanism according to claim 2 convenient for heat dissipation, it is characterised in that：On the side plate (34)
It is plugged with capping (100), inserting groove (341) is formed on the upper surface of side plate (34), is molded on the bottom surface of the capping (100)
There are two grafting item (101), the grafting item difference sleeve is in corresponding inserting groove (341), the envelope of grafting item (101) side
Lid forms the first protection board (102) on (100) side, and first protection board is located at the stitch (90) outside, capping
(100) there are two the second protection board (103), second protection board is located at heat sink (20) outside for both ends molding, and second protects
The bottom of backplate (103) forms several arc-shaped slots (104), and coolant pipe (50) holding is in corresponding arc-shaped slot
(104) in.
4. the integrated antenna package mechanism according to claim 1 convenient for heat dissipation, it is characterised in that：The buffering connecting tube
(70) it is in " Fang " shape, the both ends of buffering connecting tube (70) are connected with the both ends of coolant pipe (50) stretching heat sink (20) respectively
It connects, the graphite radiating ring (80) is uniformly set in buffering connecting tube (70), and the inner wall of graphite radiating ring (80) is close to buffer
The outer wall of connecting tube (70), one end of buffering connecting tube (70) is equipped with cooling liquid inlet (71), the other end is equipped with cycle force (forcing) pump
(72)。
5. the integrated antenna package mechanism according to claim 2 convenient for heat dissipation, it is characterised in that：The ic core
(1) piece both sides bearing seat (30) if on set and be fixed with dry contact (91), the stitch (90) and contact (91) are located at
On the two sides of bearing seat (30), stitch (90) and contact (91) are electrically connected, and are formed on the upper surface of IC chip (1)
If dry contact (11), the contact is electrically connected by conducting wire with the contact (91).
6. the integrated antenna package mechanism according to claim 1 convenient for heat dissipation, it is characterised in that：The cooling fin (40)
On thermal vias (41) be disposed side by side on the longitudinal direction of cooling fin (40).
7. the integrated antenna package mechanism according to claim 1 convenient for heat dissipation, it is characterised in that：The heat sink (20)
Innermost cooling fin (40) on the radiating frame (21) of inside is resisted against on the extension board (32) of bearing seat (30).
8. the integrated antenna package mechanism according to claim 1 convenient for heat dissipation, it is characterised in that：The bearing seat (30)
The bottom surface of the extension board (32) of side is located in the same horizontal plane, and the bottom surface of bearing seat (30) is less than the bottom of extension board (32)
Face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610703405.0A CN106328613B (en) | 2016-08-22 | 2016-08-22 | A kind of integrated antenna package mechanism convenient for heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610703405.0A CN106328613B (en) | 2016-08-22 | 2016-08-22 | A kind of integrated antenna package mechanism convenient for heat dissipation |
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| Publication Number | Publication Date |
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| CN106328613A CN106328613A (en) | 2017-01-11 |
| CN106328613B true CN106328613B (en) | 2018-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610703405.0A Active CN106328613B (en) | 2016-08-22 | 2016-08-22 | A kind of integrated antenna package mechanism convenient for heat dissipation |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993990A (en) * | 2017-12-12 | 2018-05-04 | 王孝裕 | A kind of 16 pin high-density integrated circuit package structures |
| CN109346418B (en) * | 2018-10-10 | 2020-11-17 | 高劲(广东)芯片科技有限公司 | Embedded chip package and packaging method |
| CN109378301B (en) * | 2018-10-10 | 2020-08-25 | 江门市久欣光电有限公司 | Chip packaging body and preparation method |
| CN110203494B (en) * | 2019-06-03 | 2021-04-09 | 正大饲料东营有限公司 | Heat abstractor for feed production |
| WO2023129092A1 (en) * | 2021-12-31 | 2023-07-06 | Sabanci Üniversitesi | Integrated circuit systems cooled by embedded microtubes |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06275752A (en) * | 1993-03-18 | 1994-09-30 | Hitachi Ltd | Cooling device for semiconductor device |
| CN100543974C (en) * | 2005-09-02 | 2009-09-23 | 富准精密工业(深圳)有限公司 | Heat radiation module and manufacture method thereof |
| TW201218468A (en) * | 2010-10-26 | 2012-05-01 | Bridge Semiconductor Corp | Semiconductor chip assembly with bump/base heat spreader and cavity in bump |
| CN204516749U (en) * | 2015-04-15 | 2015-07-29 | 江苏晟芯微电子有限公司 | A kind of semiconductor package of pin type heat radiation |
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2016
- 2016-08-22 CN CN201610703405.0A patent/CN106328613B/en active Active
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Effective date of registration: 20180829 Address after: 314000 188 Tea Garden Road, tanker town, Xiuzhou District, Jiaxing, Zhejiang Applicant after: ZHEJIANG JINYUAN INDUSTRIAL Co.,Ltd. Address before: 523000 A1112, Huai Kai square, Yuan Mei Road, Nancheng District, Dongguan, Guangdong Applicant before: Wang Wenqing |
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Effective date of registration: 20230814 Address after: No. 1 Electronic Information Industry Park, Qingzhen Economic Development Zone, Xiagaojian Group, Zhanjie Town, Qingzhen City, Guiyang City, Guizhou Province, 551404 Patentee after: Guizhou Zhongxin Microelectronics Technology Co.,Ltd. Address before: 314000 188 Tea Garden Road, tanker town, Xiuzhou District, Jiaxing, Zhejiang Patentee before: ZHEJIANG JINYUAN INDUSTRIAL Co.,Ltd. |