CN106281175A - A kind of PET film epoxyn - Google Patents
A kind of PET film epoxyn Download PDFInfo
- Publication number
- CN106281175A CN106281175A CN201610842045.2A CN201610842045A CN106281175A CN 106281175 A CN106281175 A CN 106281175A CN 201610842045 A CN201610842045 A CN 201610842045A CN 106281175 A CN106281175 A CN 106281175A
- Authority
- CN
- China
- Prior art keywords
- parts
- pet film
- epoxyn
- epoxy resin
- toughener
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/16—Fibres; Fibrils
Abstract
The invention discloses a kind of PET film epoxyn, in terms of weight fraction, comprise following component: epoxy resin 40 65 parts, phenoxy resin 12 18 parts, soybean fibrillarin 59 parts, nano-calcium carbonate 7 12 parts, boron nitride 25 parts, MDA 15 22 parts, maleic anhydride 8 14 parts, toughener 39 parts, solvent 30 55 parts.Main component epoxy resin bond properties is strong, curing rate is fast, resistance to water is strong, it is aging to be difficult to.Using soybean fibrillarin and nano-calcium carbonate is filler, can effectively improve the pliability of adhesive, flexibility.
Description
Technical field
The present invention relates to adhesive area, particularly relate to a kind of PET film epoxyn.
Background technology
PET film is that a kind of various aspects of performance all compares excellent packing film, and it is high that it has transparency, and glossiness is good
Advantage, has again good air-tightness and fragrance protectiveness simultaneously;Additionally, the toughness of PET film is very strong, it is in all of thermoplasticity
In plastics the strongest, dimensionally stable.PET film also has extraordinary thermostability, tolerance to cold, oil resistivity and chemical-resistant resistance
Property, it is a kind of preferable packaging film of combination property.PET film is bonded in wooden boards, plastic plate or sheet metal
On be a kind of more conventional PET film using method, the adhesive wherein used in adhesion process is the patch affecting PET film
Right and the key in service life.
Epoxy resin and unsaturated polyester resin, phenolic resin are referred to as three big universal thermosetting resins, and they are mesh
Front consumption is most widely used, the thermosetting resin that consumption is maximum.The unique epoxy radicals contained in its epoxy resin, and
Ether, hydroxyl isopolarity group and active group, thus there is more excellent properties.Additionally, with other class thermosetting resins
Compare, the abundant species of epoxy resin, different properties, diversified combination can be carried out and assemble thus obtain various
The epoxy curing systems of various kinds excellent performance.Hydroxyl, amino, ester group or epoxy etc. that in epoxy curing systems, activity is bigger are permissible
Give the bonding strength that curable epoxide thing is higher.Thus epoxide resin type adhesive is that a class is functional, the glue of feature richness
Stick.But, due to epoxy resin structures shape its there is excellent mechanical property, but the resin after solidification there will be
The shortcoming that toughness is poor, fragility is big, thus still need to when being applied in the bonding of PET film make improvements, improve ring
The toughness of epoxy resins adhesive so that it is be difficult to that the problems such as chip occur.
Summary of the invention
It is an object of the invention to provide a kind of PET film epoxyn, this adhesive be applicable to PET film with
The laminating of all kinds of sheet materials, bond properties is strong, and PET film can be made on a small quantity to be firmly bonded on wooden boards.And this is gluing
Agent toughness is strong, and brittleness is low.It is difficult to the problems such as cracking, chip.
For achieving the above object, the present invention is by the following technical solutions:
A kind of PET film epoxyn, in terms of weight fraction, comprises following component:
Epoxy resin 40-65 part, phenoxy resin 12-18 part, soybean fibrillarin 5-9 part, nano-calcium carbonate 7-12 part, nitrogen
Change boron 2-5 part, MDA 15-22 part, maleic anhydride 8-14 part, toughener 3-9 part, solvent 30-55 part.
Preferably, described epoxy resin be bisphenol S, butyl acrylate be polymerized in the basic conditions with triethylene tetramine and
Become.
Preferably, the molecular weight of described epoxy resin is 340-1000.
Preferably, the molecular weight of described phenoxy resin is 15000-50000.
Preferably, the one or many during described toughener is LNBR, polyvinyl butyral resin or polyvinyl alcohol
Plant mixture.
Preferably, described solvent is the mixture of butyl glycidyl ether and glycol propyl ether.
Preferably, described adhesive is applicable to the bonding use of PET film and plank, metallic plate or plastic plate.
The invention have the advantages that, employing epoxy resin is main component, and bond properties is strong, and curing rate is fast,
Resistance to water is strong, is difficult to aging.This adhesive uses soybean fibrillarin and nano-calcium carbonate to be filler simultaneously, can effectively carry
The pliability of high adhesive, flexibility, use this adhesive bond PET film and sheet material, higher stability can be kept,
Construction is difficult to the phenomenons such as chip, cracking occur when cutting out.
Detailed description of the invention
In order to be better understood from the present invention, below by embodiment, the present invention is further described, and embodiment is served only for solving
Release the present invention, the present invention will not be constituted any restriction.
Embodiment 1
A kind of PET film epoxyn, in terms of weight fraction, comprises following component: epoxy resin 40 parts, phenol
Epoxy resins 12 parts, soybean fibrillarin 5 parts, nano-calcium carbonate 7 parts, boron nitride 2 parts, MDA 15 parts, maleic acid
Acid anhydride 8 parts, toughener 3 parts, solvent 30 parts.Epoxy resin is that bisphenol S, butyl acrylate gather in the basic conditions with triethylene tetramine
Conjunction forms, and its molecular weight is 340-700.The molecular weight of phenoxy resin is 15000-20000.Toughener be LNBR,
Polyvinyl butyral resin mixture.Solvent is the mixture of butyl glycidyl ether and glycol propyl ether.This adhesive is applicable to
PET film uses with the bonding of plank, metallic plate or plastic plate.
Embodiment 2
A kind of PET film epoxyn, in terms of weight fraction, comprises following component: epoxy resin 65 parts, phenol
Epoxy resins 18 parts, soybean fibrillarin 9 parts, nano-calcium carbonate 12 parts, boron nitride 5 parts, MDA 22 parts, maleic acid
Acid anhydride 14 parts, toughener 9 parts, solvent 55 parts.Epoxy resin be bisphenol S, butyl acrylate and triethylene tetramine in the basic conditions
Being polymerized, its molecular weight is 500-1000.The molecular weight of phenoxy resin is 40000-50000.Toughener is nitrile (HTBN) rubber
Mixture in glue, polyvinyl butyral resin, polyvinyl alcohol.Solvent is the mixing of butyl glycidyl ether and glycol propyl ether
Thing.This adhesive is applicable to the bonding use of PET film and plank, metallic plate or plastic plate.
Embodiment 3
A kind of PET film epoxyn, in terms of weight fraction, comprises following component: epoxy resin 55 parts, phenol
Epoxy resins 15 parts, soybean fibrillarin 7 parts, nano-calcium carbonate 10 parts, boron nitride 3 parts, MDA 18 parts, maleic acid
Acid anhydride 10 parts, toughener 6 parts, solvent 40 parts.Epoxy resin be bisphenol S, butyl acrylate and triethylene tetramine in the basic conditions
Being polymerized, its molecular weight is 400-600.The molecular weight of phenoxy resin is 25000-40000.Toughener is liquid fourth polyethylene
Butyral, the mixture of polyvinyl alcohol.Solvent is the mixture of butyl glycidyl ether and glycol propyl ether.This adhesive is fitted
Bonding for PET film with plank, metallic plate or plastic plate uses.
Embodiment 4
A kind of PET film epoxyn, in terms of weight fraction, comprises following component: epoxy resin 40 parts, phenol
Epoxy resins 18 parts, soybean fibrillarin 5 parts, nano-calcium carbonate 12 parts, boron nitride 2 parts, MDA 22 parts, maleic acid
Acid anhydride 8 parts, toughener 9 parts, solvent 30 parts.Epoxy resin is that bisphenol S, butyl acrylate gather in the basic conditions with triethylene tetramine
Conjunction forms, and its molecular weight is 500-800.The molecular weight of phenoxy resin is 35000-45000.Toughener is the contracting of liquid polyethylene alcohol
Butyraldehyde.Solvent is the mixture of butyl glycidyl ether and glycol propyl ether.This adhesive is applicable to PET film and plank, gold
The bonding belonging to plate or plastic plate uses.
Embodiment 5
A kind of PET film epoxyn, in terms of weight fraction, comprises following component: epoxy resin 65 parts, phenol
Epoxy resins 12 parts, soybean fibrillarin 9 parts, nano-calcium carbonate 7 parts, boron nitride 5 parts, MDA 15 parts, maleic acid
Acid anhydride 14 parts, toughener 3 parts, solvent 55 parts.Epoxy resin be bisphenol S, butyl acrylate and triethylene tetramine in the basic conditions
Being polymerized, its molecular weight is 400-800.The molecular weight of phenoxy resin is 15000-20000.Toughener is liquid polyethylene alcohol
Butyral.Solvent is the mixture of butyl glycidyl ether and glycol propyl ether.This adhesive be applicable to PET film and plank,
The bonding of metallic plate or plastic plate uses.
Embodiment 6
A kind of PET film epoxyn, in terms of weight fraction, comprises following component: epoxy resin 55 parts, phenol
Epoxy resins 16 parts, soybean fibrillarin 6 parts, nano-calcium carbonate 7 parts, boron nitride 5 parts, MDA 22 parts, maleic acid
Acid anhydride 8 parts, toughener 5 parts, solvent 35 parts.Epoxy resin is that bisphenol S, butyl acrylate gather in the basic conditions with triethylene tetramine
Conjunction forms, and its molecular weight is 800-1000.The molecular weight of phenoxy resin is 15000-25000.Toughener is liquid polyethylene alcohol.
Solvent is the mixture of butyl glycidyl ether and glycol propyl ether.This adhesive be applicable to PET film and plank, metallic plate or
The bonding of plastic plate uses.
Claims (7)
1. a PET film epoxyn, it is characterised in that in terms of weight fraction, comprise following component: asphalt mixtures modified by epoxy resin
Fat 40-65 part, phenoxy resin 12-18 part, soybean fibrillarin 5-9 part, nano-calcium carbonate 7-12 part, boron nitride 2-5 part, diamino
Base diphenyl-methane 15-22 part, maleic anhydride 8-14 part, toughener 3-9 part, solvent 30-55 part.
PET film epoxyn the most according to claim 1, it is characterised in that: described epoxy resin is double
Phenol S, butyl acrylate are polymerized in the basic conditions with triethylene tetramine.
PET film epoxyn the most according to claim 1, it is characterised in that: dividing of described epoxy resin
Son amount is 340-1000.
PET film epoxyn the most according to claim 1, it is characterised in that: dividing of described phenoxy resin
Son amount is 15000-50000.
PET film epoxyn the most according to claim 1, it is characterised in that: described toughener is liquid
One or more mixture in nitrile rubber, polyvinyl butyral resin or polyvinyl alcohol.
PET film epoxyn the most according to claim 1, it is characterised in that: described solvent is butyl contracting
Water glycerin ether and the mixture of glycol propyl ether.
PET film epoxyn the most according to claim 1, it is characterised in that: described adhesive is applicable to
PET film uses with the bonding of plank, metallic plate or plastic plate.
Priority Applications (1)
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CN201610842045.2A CN106281175A (en) | 2016-09-22 | 2016-09-22 | A kind of PET film epoxyn |
Applications Claiming Priority (1)
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CN201610842045.2A CN106281175A (en) | 2016-09-22 | 2016-09-22 | A kind of PET film epoxyn |
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CN106281175A true CN106281175A (en) | 2017-01-04 |
Family
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CN201610842045.2A Pending CN106281175A (en) | 2016-09-22 | 2016-09-22 | A kind of PET film epoxyn |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09143445A (en) * | 1995-11-21 | 1997-06-03 | Hitachi Chem Co Ltd | Connecting member for circuit |
CN101654605A (en) * | 2008-08-21 | 2010-02-24 | 中山市东溢新材料有限公司 | Modified epoxy resin adhesive and preparation method thereof |
CN101921557A (en) * | 2010-08-30 | 2010-12-22 | 新高电子材料(中山)有限公司 | Halogen-free flame-retardant adhesive composition and flexible copper-clad plate using same |
CN103045143A (en) * | 2012-11-14 | 2013-04-17 | 浙江华正新材料股份有限公司 | Halogen-free epoxy adhesive and cover film prepared by using halogen-free epoxy adhesive |
JP2014019869A (en) * | 2012-07-18 | 2014-02-03 | Toray Advanced Materials Korea Inc | Adhesive composition improved in electric reliability at high voltage, and adhesive tape for semiconductor packaging using the same |
US20140187674A1 (en) * | 2012-12-28 | 2014-07-03 | Samsung Electro-Mechanics Co., Ltd. | Resin composition with enhanced heat-releasing properties, heat-releasing film, insulating film, and prepreg |
-
2016
- 2016-09-22 CN CN201610842045.2A patent/CN106281175A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09143445A (en) * | 1995-11-21 | 1997-06-03 | Hitachi Chem Co Ltd | Connecting member for circuit |
CN101654605A (en) * | 2008-08-21 | 2010-02-24 | 中山市东溢新材料有限公司 | Modified epoxy resin adhesive and preparation method thereof |
CN101921557A (en) * | 2010-08-30 | 2010-12-22 | 新高电子材料(中山)有限公司 | Halogen-free flame-retardant adhesive composition and flexible copper-clad plate using same |
JP2014019869A (en) * | 2012-07-18 | 2014-02-03 | Toray Advanced Materials Korea Inc | Adhesive composition improved in electric reliability at high voltage, and adhesive tape for semiconductor packaging using the same |
CN103045143A (en) * | 2012-11-14 | 2013-04-17 | 浙江华正新材料股份有限公司 | Halogen-free epoxy adhesive and cover film prepared by using halogen-free epoxy adhesive |
US20140187674A1 (en) * | 2012-12-28 | 2014-07-03 | Samsung Electro-Mechanics Co., Ltd. | Resin composition with enhanced heat-releasing properties, heat-releasing film, insulating film, and prepreg |
Non-Patent Citations (3)
Title |
---|
李子东等: "《实用胶粘剂原材料手册》", 31 July 1999, 国防工业出版社 * |
李子东等: "《现代胶粘技术手册》", 31 January 2002, 新时代出版社 * |
隋春霞、于国萍: "大豆蛋白非食品应用研究", 《价值工程》 * |
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