CN105925228A - Multi-purpose modified epoxy resin adhesive - Google Patents

Multi-purpose modified epoxy resin adhesive Download PDF

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Publication number
CN105925228A
CN105925228A CN201610394184.3A CN201610394184A CN105925228A CN 105925228 A CN105925228 A CN 105925228A CN 201610394184 A CN201610394184 A CN 201610394184A CN 105925228 A CN105925228 A CN 105925228A
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China
Prior art keywords
parts
component
agent
epoxy resin
white carbon
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CN201610394184.3A
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Chinese (zh)
Inventor
王学振
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Beijing Zhongdexinya Architecture Technology Co Ltd
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Beijing Zhongdexinya Architecture Technology Co Ltd
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Priority to CN201610394184.3A priority Critical patent/CN105925228A/en
Publication of CN105925228A publication Critical patent/CN105925228A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C08G59/60—Amines together with other curing agents with amides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/02—Heterophasic composition

Abstract

The invention discloses a multi-purpose modified epoxy resin adhesive which comprises a component A and a component B, and the mass ratio of the component A to the component B is 3:1; the component A comprises the following components in parts by weight: 100 parts of bisphenol A-type epoxy resin, 10-15 parts of a toughening agent, 5-10 parts of an active diluent, 2-4 parts of a thixotropic agent and 100-150 parts of a filler; the component B comprises the following components in parts by weight: 30-55 parts of a composite curing agent, 1-3 parts of an accelerator, 1-3 parts of a coupling agent, 1-3 parts of a thixotropic agent and 30-50 parts of an active filler. The multi-purpose modified epoxy resin adhesive disclosed by the invention is excellent in thixotropic property, good in construction performance and free from flowing during construction on sunny sides, resistant to acid and alkali medium erosion, high in normal temperature curing speed, free from volatile matters contained, non-toxic and harmless, high in bonding strength and good in toughness and impact resistance.

Description

A kind of multi-function modified epoxy repair sheets
Technical field
The invention belongs to engineering material technical field, relate to a kind of multi-function modified epoxy repair sheets.
Background technology
Epoxy resin repair sheets are a kind of levelling glue of structural strengthening, and prior art there is problems in that 1, similar There is stagnant viscosity in repair sheets, construction is smooth, or face upward appearance trickling phenomenon when constructing, both shadow waste engineering material Material rings again construction environment.2, generally there is the problems such as filler is too much, toughness of material is not enough in similar repair sheets.3、 Use not in wet environment.4, function is single.
Summary of the invention
In order to solve problems of the prior art.The invention provides a kind of multi-function modified epoxy to repair Glue.
The purpose of the present invention is achieved through the following technical solutions: a kind of multi-function modified epoxy repair sheets, Including component A and B component, and the mass ratio of A, B component is 3: 1, and described component A includes following heavy Amount part component: bisphenol A type epoxy resin 100 parts, toughener 10～15 parts, reactive diluent 5～ 10 parts, thixotropic agent 2～4 parts, filler 100～150 parts；Described B component includes the group of following weight portion Part: composite curing agent 30～55 parts, accelerator 1～3 parts, coupling agent 1～3 parts, thixotropic agent 1～3 parts, Active filler 30～50.
Preferably, described bisphenol A type epoxy resin is E-51, and described toughener is strange scholar's toughener, described Reactive diluent is benzyl glycidyl ether, and described thixotropic agent is white carbon, and described filler is silicon powder, described Firming agent is ester cyclammonium and low molecular polyamides compounds firming agent in specific proportions, and described accelerator is 2,4,6- Trimethylamino phenol, described coupling agent is silane coupler.
Preferably, described bisphenol A type epoxy resin E-51 100 parts, strange scholar's toughener 14 parts, benzyl Glycidyl ether 6 parts, white carbon 3 parts, silicon powder 120 parts；Compounding 35 parts of firming agent, DMP-30 1.5 parts, KH-550 2 parts, white carbon 2 parts, active micro silicon powder 40 parts.
Preferably, described bisphenol A type epoxy resin E-51 100 parts, strange scholar's toughener 13 parts, benzyl Glycidyl ether 7 parts, white carbon 3 parts, silicon powder 120 parts；Compounding 35 parts of firming agent, DMP-30 2 parts, KH-550 2 parts, white carbon 2 parts, active micro silicon powder 40 parts.
Preferably, described bisphenol A type epoxy resin E-51 100 parts, strange scholar's toughener 12 parts, benzyl Glycidyl ether 8 parts, white carbon 2.5 parts, silicon powder 120 parts；Compounding 40 parts of firming agent, DMP-30 1.5 parts, KH-550 2 parts, white carbon 2 parts, active micro silicon powder 40 parts.
Preferably, described bisphenol A type epoxy resin E-51 100 parts, strange scholar's toughener 15 parts, benzyl Glycidyl ether 5 parts, white carbon 2.5 parts, silicon powder 120 parts；Compounding 40 parts of firming agent, DMP-30 1.5 parts, KH-550 2 parts, white carbon 2 parts, active micro silicon powder 40 parts.
The operation principle of the present invention and process prescription:
Bisphenol A epoxide resin is by bisphenol-A (diphenol propane) and epoxychloropropane, in alkaline medium The glycidyl ether macromolecular material of polycondensation, owing to its performance is good, source is wide, and price is low, handling ease, Shrinkage factor little and solidification after product nontoxic, tasteless.Therefore, select compounding bisphenol A epoxide resin as many The host of function modified epoxy repair sheets.Toughener is that one passes through ester bond or ammonia with different activities end group The polymeric blends that different types of segment is coupled together by ester bond, toughening agent C C (main polymer chain) molecule In react containing the active group in active group, with epoxy resin, formed with CC dispersion phase for " island ", company Knot phase epoxy resin is " island structure " of " extra large ", reaches toughness reinforcing purpose, shows as tensile shear strength significantly Degree improves, and energy to failure is by 1006J/m2Bring up to 1220J/m2；Hot strength improves 27.8%.Benzyl shrinks Glycerin ether, as reactive diluent, both can reduce the viscosity of repair sheets, improves its fluidity and wellability, again Epoxy resin cure reaction can be participated in because of group active in structure, become the network structure that main fat eventually forms A part, do not exist because of solvent volatilize make glue-line cohesive force decline defect.Firming agent uses low-molecular-weight to gather Amide and ester cyclammonium compound, and remain the big proportional quantity of polyamide, low exothermic peak, and formula range is wide, and good rigidly, intensity is tough Degree advantages of higher, aliphatic cyclic amine and low molecular polyamides can be learnt from other's strong points to offset one's weaknesses, and both reduced the viscosity of system, protected again Hold its lasting caloric value and promote sub-molecular weight polyamide solidification, filler can be added again more, reduce cost and property Can not decline, improve thermostability, it is also possible to apply in-10 DEG C of environment, be greatly expanded answering of construction structure glue Use scope.White carbon (aerosil) is as the introducing of thixotropic agent so that high thixotroping modified epoxy Steel bonding glue, viscosity reduces under external force, it is simple to smear, and time static, viscosity increases, and glue will not arbitrarily flow Drop down, can thin layer construction equably.Compounding firming agent liquefied mixes with epoxy resin easily, and intermiscibility is good； Proportioning need not be the strictest, moreover it is possible to improves resin and former, the affinity of adjuvant.The addition of altax P-30, Further improve fixed line ability, coupling agent is the compound that heterogeneity group is contained at molecule two ends, two end groups Can be combined with adhesive molecule and adhesive respectively, play " bridge " effect, substantially increase glue-line with mixed Molecule cohesive force between solidifying soil (waiting base material).Active micro silicon powder is even with compound silane with refined silicon powder Connection agent prescription, carries out activity process by special process and forms.The viscous of epoxy resin and silicon powder can be effectively improved Knot power and interface hydrophobicity performance, and resin curing agent cross-linking reaction, thus improve cured product mechanical strength, Elastic modelling quantity, heat aging performance, weather resistance etc..
The medicine have the advantages that this multi-function modified epoxy repair sheets, thixotropy is excellent, application property Can be good, construction of facing upward is not trickled；Acid and alkali-resistance erosion medium resistance, normal temperature cure speed is fast, without fugitive constituent, nontoxic Harmless；Adhesion strength is high, has good toughness and impact resistance；It is mainly used in building structure strengthening to look for Flat, it may also be used for the anti-carbonization of concrete surface/corrosion-protected surface protection, defects of concrete structure are repaired, coagulation Soil structure glued crack joint seal and the field such as edge sealing pasted in adhesive pouring nozzle, perfusion steel-bonded reinforcement.
Detailed description of the invention
The present invention is described further in conjunction with the embodiments.
A kind of multi-function modified epoxy repair sheets, including component A and B component, and the quality of A, B component Ratio is 3: 1, and described component A includes the component of following weight portion: bisphenol A type epoxy resin 100 parts, increases Tough dose 10～15 parts, reactive diluent 5～10 parts, thixotropic agent 2～4 parts, filler 100～150 parts； Described B component includes the component of following weight portion: composite curing agent 30～55 parts, accelerator 1～3 parts, Coupling agent 1～3 parts, thixotropic agent 1～3 parts, active filler 30～50.
Wherein, described bisphenol A type epoxy resin is E-51, and described toughener is strange scholar's toughener, described work Property diluent is benzyl glycidyl ether, and described thixotropic agent is white carbon (aerosil), described filler For silicon powder (400 mesh), described firming agent be ester cyclammonium and low molecular polyamides compounding solid in specific proportions Agent, described accelerator is 2,4,6-trimethylamino phenol, and described coupling agent is silane coupler (γ ammonia Propyl-triethoxysilicane).The mass ratio of described component A and B component is 3:1, and normal temperature cure is constructed.
Example one
A kind of multi-function modified epoxy repaiies glue, and it is formed by llowing group of materials proportioning in mass ratio:
Component A:
Host: bisphenol A type epoxy resin E-51 100 parts
Toughener: strange scholar's toughener 14 parts
Reactive diluent: benzyl glycidyl ether 6 parts
Thixotropic agent: white carbon (aerosil) 3 parts
Filler: 400 mesh silicon powders 120 parts
B component:
Firming agent: compounding 35 parts of firming agent
Accelerator: DMP-30 1.5 parts
Coupling agent: KH-550 2 parts
Thixotropic agent: white carbon (aerosil) 2 parts
Active filler: active micro silicon powder 40 parts
The mass ratio of component A and B component is 3:1
Result of implementation: Product checking the results are shown in Table 1
Example two:
A kind of multi-function modified epoxy repaiies glue, and it is formed by llowing group of materials proportioning in mass ratio:
Component A:
Host: bisphenol A type epoxy resin E-51 100 parts
Toughener: strange scholar's toughener 13 parts
Reactive diluent: benzyl glycidyl ether 7 parts
Thixotropic agent: white carbon (aerosil) 3 parts
Filler: 400 mesh silicon powders 120 parts
B component:
Firming agent: compounding 35 parts of firming agent
Accelerator: DMP-30 2 parts
Coupling agent: KH-550 2 parts
Thixotropic agent: white carbon (aerosil) 2 parts
Active filler: active micro silicon powder 40 parts
The mass ratio of component A and B component is 3:1
Result of implementation: Product checking the results are shown in Table 1
Example three:
A kind of multi-function modified epoxy repaiies glue, and it is formed by llowing group of materials proportioning in mass ratio:
Component A:
Host: bisphenol A type epoxy resin E-51 100 parts
Toughener: strange scholar's toughener 12 parts
Reactive diluent: benzyl glycidyl ether 8 parts
Thixotropic agent: white carbon (aerosil) 2.5 parts
Filler: 400 mesh silicon powders 120 parts
B component:
Firming agent: compounding 40 parts of firming agent
Accelerator: DMP-30 1.5 parts
Coupling agent: KH-550 2 parts
Thixotropic agent: white carbon (aerosil) 2 parts
Active filler: active micro silicon powder 40 parts
The mass ratio of component A and B component is 3:1
Result of implementation: Product checking the results are shown in Table 1
Example four:
A kind of multi-function modified epoxy repaiies glue, and it is formed by llowing group of materials proportioning in mass ratio:
Component A:
Host: bisphenol A type epoxy resin E-51 100 parts
Toughener: strange scholar's toughener 15 parts
Reactive diluent: benzyl glycidyl ether 5 parts
Thixotropic agent: white carbon (aerosil) 2.5 parts
Filler: 400 mesh silicon powders 120 parts
B component:
Firming agent: compounding 40 parts of firming agent
Accelerator: DMP-30 1.5 parts
Coupling agent: KH-550 2 parts
Thixotropic agent: white carbon (aerosil) 2 parts
Active filler: active micro silicon powder 40 parts
The mass ratio of component A and B component is 3:1
Result of implementation: Product checking the results are shown in Table 1
Table 1 Product checking result
In this description, the present invention is described with reference to its specific embodiment.But it is clear that Still various modifications may be made and conversion is without departing from the spirit and scope of the present invention.Therefore, description should It is considered as illustrative and not restrictive.

Claims (6)

1. multi-function modified epoxy repair sheets, it is characterised in that include component A and B component, and A, The mass ratio of B component is 3: 1, and described component A includes the component of following weight portion: bisphenol type epoxy Resin 100 parts, toughener 10～15 parts, reactive diluent 5～10 parts, thixotropic agent 2～4 parts, Filler 100～150 parts；Described B component includes the component of following weight portion: composite curing agent 30～ 55 parts, accelerator 1～3 parts, coupling agent 1～3 parts, thixotropic agent 1～3 parts, active filler 30～ 50。
Multi-function modified epoxy repair sheets the most according to claim 1, it is characterised in that described bis-phenol A type epoxy resin is E-51, and described toughener is strange scholar's toughener, and described reactive diluent is benzyl contracting Water glycerin ether, described thixotropic agent is white carbon, and described filler is silicon powder, and described firming agent is ester cyclammonium Compound firming agent in specific proportions with low molecular polyamides, described accelerator is 2,4,6-trimethylamino Phenol, described coupling agent is silane coupler.
Multi-function modified epoxy repair sheets the most according to claim 1 and 2, it is characterised in that described Bisphenol A type epoxy resin E-51 100 parts, strange scholar's toughener 14 parts, benzyl glycidyl ether 6 Part, white carbon 3 parts, silicon powder 120 parts；Compounding 35 parts of firming agent, DMP-30 1.5 parts, KH-550 2 parts, white carbon 2 parts, active micro silicon powder 40 parts.
Multi-function modified epoxy repair sheets the most according to claim 1 and 2, it is characterised in that described Bisphenol A type epoxy resin E-51 100 parts, strange scholar's toughener 13 parts, benzyl glycidyl ether 7 Part, white carbon 3 parts, silicon powder 120 parts；Compounding 35 parts of firming agent, DMP-30 2 parts, KH-550 2 parts, white carbon 2 parts, active micro silicon powder 40 parts.
Multi-function modified epoxy repair sheets the most according to claim 1 and 2, it is characterised in that described Bisphenol A type epoxy resin E-51 100 parts, strange scholar's toughener 12 parts, benzyl glycidyl ether 8 Part, white carbon 2.5 parts, silicon powder 120 parts；Compounding 40 parts of firming agent, DMP-30 1.5 parts, KH-550 2 parts, white carbon 2 parts, active micro silicon powder 40 parts.
Multi-function modified epoxy repair sheets the most according to claim 1 and 2, it is characterised in that described Bisphenol A type epoxy resin E-51 100 parts, strange scholar's toughener 15 parts, benzyl glycidyl ether 5 Part, white carbon 2.5 parts, silicon powder 120 parts；Compounding 40 parts of firming agent, DMP-30 1.5 parts, KH-550 2 parts, white carbon 2 parts, active micro silicon powder 40 parts.
CN201610394184.3A 2016-06-06 2016-06-06 Multi-purpose modified epoxy resin adhesive Pending CN105925228A (en)

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CN106499065A (en) * 2016-10-13 2017-03-15 常州华东人防设备有限公司 Punch after civil air defense constructions and installations fast plugging device and the steel bonding glue for plugging device
CN106883733A (en) * 2017-03-29 2017-06-23 湖北武大珞珈工程结构检测咨询有限公司 A kind of freeze-thawing resistant epoxy protective coating and preparation method thereof
CN106916417A (en) * 2017-03-29 2017-07-04 湖北武大珞珈工程结构检测咨询有限公司 A kind of hydraulic steel gate epoxy resin mortar bedding and padding and preparation method thereof
CN108048009A (en) * 2017-12-11 2018-05-18 王建东 A kind of bi-component epoxide-resin steel bonding glue
CN108585617A (en) * 2018-05-28 2018-09-28 武汉百协力科技有限公司 A kind of aqueous epoxy resin mortar of freeze thawing resistance and preparation method thereof
CN109897342A (en) * 2019-03-07 2019-06-18 海南必凯水性新材料有限公司 A kind of enhancing clay for ship repairing
CN110628337A (en) * 2019-09-30 2019-12-31 常州斯威克光伏新材料有限公司 Preparation method of thixotropic epoxy resin adhesive film
CN111592846A (en) * 2019-09-12 2020-08-28 石家庄广科新材料有限公司 Epoxy adhesive for preparing prefabricated wallboard mold and preparation method thereof
CN112280514A (en) * 2020-11-06 2021-01-29 福建省昌德胶业科技有限公司 Low-temperature-humidity-resistant rapid repair adhesive and preparation method thereof
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CN114933782A (en) * 2022-05-07 2022-08-23 中南大学 Epoxy resin grouting material and preparation method thereof
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CN116179134A (en) * 2023-03-10 2023-05-30 中德新亚建筑材料有限公司 Ultralow Wen Deping repair adhesive and preparation method thereof

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106499065A (en) * 2016-10-13 2017-03-15 常州华东人防设备有限公司 Punch after civil air defense constructions and installations fast plugging device and the steel bonding glue for plugging device
CN106883733A (en) * 2017-03-29 2017-06-23 湖北武大珞珈工程结构检测咨询有限公司 A kind of freeze-thawing resistant epoxy protective coating and preparation method thereof
CN106916417A (en) * 2017-03-29 2017-07-04 湖北武大珞珈工程结构检测咨询有限公司 A kind of hydraulic steel gate epoxy resin mortar bedding and padding and preparation method thereof
CN108048009A (en) * 2017-12-11 2018-05-18 王建东 A kind of bi-component epoxide-resin steel bonding glue
CN108585617B (en) * 2018-05-28 2021-01-22 武汉百协力科技有限公司 Freeze-thaw resistant water-based epoxy mortar and preparation method thereof
CN108585617A (en) * 2018-05-28 2018-09-28 武汉百协力科技有限公司 A kind of aqueous epoxy resin mortar of freeze thawing resistance and preparation method thereof
CN109897342A (en) * 2019-03-07 2019-06-18 海南必凯水性新材料有限公司 A kind of enhancing clay for ship repairing
CN111592846A (en) * 2019-09-12 2020-08-28 石家庄广科新材料有限公司 Epoxy adhesive for preparing prefabricated wallboard mold and preparation method thereof
CN110628337A (en) * 2019-09-30 2019-12-31 常州斯威克光伏新材料有限公司 Preparation method of thixotropic epoxy resin adhesive film
CN112280514A (en) * 2020-11-06 2021-01-29 福建省昌德胶业科技有限公司 Low-temperature-humidity-resistant rapid repair adhesive and preparation method thereof
CN112280515A (en) * 2020-11-06 2021-01-29 福建省昌德胶业科技有限公司 Industrial repair ceramic primer coating and preparation method thereof
CN112940655A (en) * 2021-02-05 2021-06-11 南京曼卡特科技有限公司 High-temperature type bar planting adhesive
CN112942889A (en) * 2021-02-05 2021-06-11 南京曼卡特科技有限公司 Construction method for adhering fiber cloth to underwater impregnated adhesive
CN114958261A (en) * 2021-07-08 2022-08-30 四川省承华建固防水材料有限公司 Modified epoxy bridge floor ultrathin material interface binder and preparation method thereof
CN114958261B (en) * 2021-07-08 2024-03-22 四川省承华建固防水材料有限公司 Modified epoxy bridge deck ultra-thin material interface binder and preparation method thereof
CN114933782A (en) * 2022-05-07 2022-08-23 中南大学 Epoxy resin grouting material and preparation method thereof
CN116179134A (en) * 2023-03-10 2023-05-30 中德新亚建筑材料有限公司 Ultralow Wen Deping repair adhesive and preparation method thereof

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