CN106252495A - A kind of LED encapsulation and fluorescent material housing thereof - Google Patents
A kind of LED encapsulation and fluorescent material housing thereof Download PDFInfo
- Publication number
- CN106252495A CN106252495A CN201610809138.5A CN201610809138A CN106252495A CN 106252495 A CN106252495 A CN 106252495A CN 201610809138 A CN201610809138 A CN 201610809138A CN 106252495 A CN106252495 A CN 106252495A
- Authority
- CN
- China
- Prior art keywords
- fluorescent material
- material housing
- led encapsulation
- angle
- corner angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 68
- 238000005538 encapsulation Methods 0.000 title claims abstract description 22
- 239000000843 powder Substances 0.000 abstract description 15
- 239000010409 thin film Substances 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000741 silica gel Substances 0.000 description 5
- 229910002027 silica gel Inorganic materials 0.000 description 5
- 239000011521 glass Substances 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000005385 borate glass Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- TXKMVPPZCYKFAC-UHFFFAOYSA-N disulfur monoxide Inorganic materials O=S=S TXKMVPPZCYKFAC-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses a kind of LED encapsulation and fluorescent material housing thereof, the outer surface of described fluorescent material housing is distributed multiple corner angle being sequentially connected.The light exitance of this fluorescent material housing is higher than the luminous efficiency that long-distance fluorescent powder thin film luminous intensity distribution technology LED of prior art encapsulates.
Description
[technical field]
The present invention relates to a kind of LED encapsulation and fluorescent material housing thereof.
[background technology]
Along with the development of LED technology, LED chip is utilized to coordinate fluorescent material to make the mode of white light source also constantly
Improvement.The technology of fluorescent powder packaging is coordinated gradually to have developed into the investigative technique of current main flow the most remotely from traditional silica gel
Fluorescent powder film luminous intensity distribution technology.From the point of view of this technology is relative to traditional silica gel packaging, LED chip is isolated with light-emitting phosphor layer
Come so that being generated heat by chip with fluorescent material mixing material such as silica gel etc. is affected and will reduce, so can be the most permissible
Prevent the aging of these materials, increase the service life.Meanwhile, from the point of view of traditional packaged type, long-range thin-film package
Luminous efficiency can be higher.But, also there is a big difference, equally away from its theoretical value for the luminous efficiency reached currently with this technology
The most still a segment distance is had from high-volume popularization and application.
[summary of the invention]
In order to so improving the luminous efficiency of long-distance fluorescent powder thin film luminous intensity distribution technology LED encapsulation, the invention provides one
LED encapsulation and fluorescent material housing thereof.
The fluorescent material housing of a kind of LED encapsulation, the outer surface of described fluorescent material housing is distributed multiple rib being sequentially connected
Angle.
Preferably,
Described fluorescent material housing is hemispherical shell.
Preferably,
The longitudinal section through the summit of each corner angle of described fluorescent material housing is series of parallel semicircle, and described one is
Arrange parallel semicircle parallel with the semicircle of the maximum longitudinal section of described fluorescent material housing.
Preferably,
In described series of parallel semicircle, the angle of the corner angle that semicircle that radius is the biggest is corresponding is the least.Preferably,
The cross section through the summit of each corner angle of described fluorescent material housing is series of parallel circle, described a series of
Parallel circle is parallel with the circle of the maximum cross section of described fluorescent material housing.Preferably,
In described series of parallel circle, the angle of the corner angle of the circle correspondence that radius is the biggest is the biggest.Preferably,
The inner surface of described fluorescent material housing is sphere.
Preferably,
The angle of described corner angle is between 90 °～160 °.
Present invention also offers a kind of LED encapsulation, including reflector, also include described fluorescent material housing, described fluorescence
Powder housing is fixed on the top of described reflector.
Preferably,
The inner surface of described reflector and the angle of vertical direction are between 30 °～45 °.
The invention has the beneficial effects as follows:
The luminescence that the light exitance of this fluorescent material housing encapsulates than long-distance fluorescent powder thin film luminous intensity distribution technology LED of prior art
Efficiency is high.
[accompanying drawing explanation]
Fig. 1 is the structural representation of the LED encapsulation of an embodiment of the present invention
Fig. 2 is the structural representation of the fluorescent material housing of Fig. 1 LED encapsulation
Fig. 3 is the front elevational schematic of the fluorescent material housing of another kind of embodiment
Fig. 4 is the schematic side view of the fluorescent material housing of Fig. 3
Fig. 5 be the fluorescent material housing of another kind embodiment of the present invention face structural representation
Fig. 6 is the schematic top plan view of the fluorescent material housing of Fig. 5
[detailed description of the invention]
Preferred embodiment to invention is described in further detail below.
As shown in figures 1 to 6, the LED encapsulation of a kind of embodiment, including LED light source 2, reflector 3 and fluorescent material housing 1, LED
Light source 2 is fixed in reflector 3, and fluorescent material housing 1 is fixed on the open top of reflector 3, and the wire of LED light source 2 can be from
The through hole of reflector 3 is drawn.The light that LED light source 2 sends penetrates after fluorescent material housing 1.
The outer surface of described fluorescent material housing 1 is distributed multiple corner angle 11 being sequentially connected, by arranging this corner angle 11,
Compared with the fluorescent material housing 1 of the spherical of smooth outer surface or plane, this fluorescent material housing 1 so that the exitance of light more
High.
The number of corner angle can be selected according to different situations, and the angle value that each corner angle are corresponding can change, and angle is at 90 °
～the exitance level of light can control in preferable level between 160 °.
Described fluorescent material housing 1 can be in hemispherical shell, and the inner surface of described fluorescent material housing 1 is smooth sphere.
As illustrated in fig. 1 and 2, in one embodiment, the longitudinal section on the summit through each corner angle 11 of fluorescent material housing 1
It it is series of parallel circle.Equally, in the another kind of embodiment shown in Fig. 5 and 6, fluorescent material housing 1 through each corner angle 11
The longitudinal section on summit be also series of parallel circle.So corner angle 11 are symmetrically dispersed in the surface of fluorescent material housing 1, permissible
In the case of the exitance ensureing light so that go out light more uniform.Certainly corner angle 11 can also be asymmetrically distributed with at fluorescence
The surface of powder housing 1.In one embodiment, the angle justifying corresponding corner angle that radius is the biggest in series of parallel circle is more
Greatly, so so that the exitance of light more preferably.As it is shown in figure 1, the angle beta 1 of corner angle increases successively to β 7, can be respectively
103°、117°、135°、139°、146°、151°、154°。
As shown in Figures 3 and 4, the fluorescent material housing 1 of a kind of embodiment, described fluorescent material housing 1 through each corner angle 11
The longitudinal section on summit be series of parallel semicircle, the maximum of described series of parallel semicircle and described fluorescent material housing is indulged
The semicircle in cross section is parallel.
.In one embodiment, in series of parallel semicircle, the angle that the longest corner angle of radius have is the least, this
Sample so that the exitance of light more preferably.
The thickness of the edges and corners of the fluorescent material housing 1 i.e. numerical value of R3-R1 is more than the junction thickness between adjacent corner angle i.e.
(R2-R1) numerical value, can choose different numerical value according to different application.
In one embodiment, the inner surface 31 of described reflector 3 and the angle of vertical direction between 30 °～45 °,
The whole metal cladding of inner surface 31 (silver or aluminum), to increase reflection.
LED light source can be LED chip light source module or LED lamp bead, and LED light source can be blue-light LED chip, ultraviolet
LED chip etc. can be with the LED chip of excitated fluorescent powder luminescence；LED light source can be single LEDs chip, it is also possible to be one group of LED
Chip array, array format can be with rectangle, square, circular, oval and other shapes.LED light source module can also simultaneously
For.Described LED chip is potted directly on circuit board by COB encapsulation.
Fluorescent material housing 1 can be fabricated by with some material mixing with fluorescent material, and these materials can be low glass powder, glass
The other materials such as glass powder, silica gel, organic resin and plastics.Fluorescent material can be variety classes fluorescent material, including sulfide, sulfur
Oxide, nitride and nitric oxide fluorescent powder etc., and the most common Huang of different colours, green and red light fluorescent powder etc..
In one embodiment, the raw material employing YAG yellow fluorescent powder of fluorescent material housing 1 and aluminium borate glass dust, two
Person's 1:49 mix homogeneously by mass percentage, inserts in graphite grinding tool by mixed composite granule afterwards, is placed in high temperature furnace
Middle liter of high-temperature carries out high temperature sintering to 700 DEG C, cools down afterwards.Sintered body is taken out removal redundance and is processed into fluorescent material shell
Body 1.
In another embodiment, the raw material of fluorescent material housing 1 uses YAG yellow fluorescent powder and silica gel, and both press quality
Put into after percentage ratio 1:49 mix homogeneously in high-speed mixer and stir, afterwards mixed complex is inserted equipped with having designed
In the injection machine of good mould, cool down after pressurize a period of time, die sinking.Molded body takes out and removes redundance and is processed into glimmering
Light powder housing 1.
Above content is to combine concrete preferred implementation further description made for the present invention, it is impossible to assert
Being embodied as of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of present inventive concept, it is also possible to make some simple deduction or replace, all should be considered as belonging to the present invention by
The scope of patent protection that the claims submitted to determine.
Claims (10)
1. a fluorescent material housing for LED encapsulation, is characterized in that, the outer surface of described fluorescent material housing is distributed multiple phase successively
Corner angle even.
2. the fluorescent material housing of LED encapsulation as claimed in claim 1, is characterized in that,
Described fluorescent material housing is hemispherical shell.
3. the fluorescent material housing of LED encapsulation as claimed in claim 2, is characterized in that,
The longitudinal section through the summit of each corner angle of described fluorescent material housing is series of parallel semicircle, described a series of flat
The semicircle of row is parallel with the semicircle of the maximum longitudinal section of described fluorescent material housing.
4. the fluorescent material housing of LED encapsulation as claimed in claim 3, is characterized in that,
In described series of parallel semicircle, the angle of the corner angle that semicircle that radius is the biggest is corresponding is the least.
5. the fluorescent material housing of LED encapsulation as claimed in claim 2, is characterized in that,
The cross section through the summit of each corner angle of described fluorescent material housing is series of parallel circle, described series of parallel
Circle parallel with the circle of the maximum cross section of described fluorescent material housing
6. the fluorescent material housing of LED encapsulation as claimed in claim 5, is characterized in that,
In described series of parallel circle, the angle of the corner angle of the circle correspondence that radius is the biggest is the biggest..
7. the fluorescent material housing of the LED encapsulation as described in claim 2 to 6 is arbitrary, is characterized in that,
The inner surface of described fluorescent material housing is sphere.
8. the fluorescent material housing of LED encapsulation as claimed in claim 7, is characterized in that,
The angle of described corner angle is between 90 °～160 °.
9. a LED encapsulation, including reflector, is characterized in that, also includes the fluorescent material housing as described in claim 1 is arbitrary,
Described fluorescent material housing is fixed on the top of described reflector.
10. LED encapsulation as claimed in claim 9, is characterized in that, the inner surface of described reflector is situated between with the angle of vertical direction
Between 30 °～45 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610809138.5A CN106252495A (en) | 2016-09-05 | 2016-09-05 | A kind of LED encapsulation and fluorescent material housing thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610809138.5A CN106252495A (en) | 2016-09-05 | 2016-09-05 | A kind of LED encapsulation and fluorescent material housing thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106252495A true CN106252495A (en) | 2016-12-21 |
Family
ID=57599153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610809138.5A Pending CN106252495A (en) | 2016-09-05 | 2016-09-05 | A kind of LED encapsulation and fluorescent material housing thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106252495A (en) |
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|---|---|---|---|---|
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| CN201025617Y (en) * | 2007-03-06 | 2008-02-20 | 亿光电子工业股份有限公司 | Lighting device |
| CN201060876Y (en) * | 2007-04-26 | 2008-05-14 | 蔡桦欣 | Light shield structure of luminous element |
| CN201146197Y (en) * | 2007-12-21 | 2008-11-05 | 亿光电子工业股份有限公司 | Led device and fluorescence casing thereof |
| CN101320774A (en) * | 2008-05-05 | 2008-12-10 | 陆耘 | Light emitting diode with good light radiation and color development |
| WO2011126027A1 (en) * | 2010-04-07 | 2011-10-13 | 久豊技研株式会社 | Light-emitting device and light-emitting panel apparatus |
| EP2448021A2 (en) * | 2004-11-15 | 2012-05-02 | Philips Lumileds Lighting Company, LLC. | Molding a lens over a LED die |
| CN203242659U (en) * | 2013-03-01 | 2013-10-16 | 上海嘉塘电子有限公司 | A LED white light module with a fluorescent lamp cover |
| CN103672462A (en) * | 2012-09-13 | 2014-03-26 | 常州阿拉丁照明电器有限公司 | Novel LED fluorescent lamp |
| CN205535156U (en) * | 2015-12-14 | 2016-08-31 | 上海查尔斯电子有限公司 | LED (light -emitting diode) light bulb |
| CN206236706U (en) * | 2016-09-05 | 2017-06-09 | 清华大学深圳研究生院 | A kind of LED encapsulation and its fluorescent material housing |
-
2016
- 2016-09-05 CN CN201610809138.5A patent/CN106252495A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060034082A1 (en) * | 2004-08-12 | 2006-02-16 | Samsung Electro-Mechanics Co., Ltd. | Multi-lens light emitting diode |
| EP2448021A2 (en) * | 2004-11-15 | 2012-05-02 | Philips Lumileds Lighting Company, LLC. | Molding a lens over a LED die |
| US20060289885A1 (en) * | 2005-06-24 | 2006-12-28 | Shi-Ming Chen | Light-emitting diode |
| CN201025617Y (en) * | 2007-03-06 | 2008-02-20 | 亿光电子工业股份有限公司 | Lighting device |
| CN201060876Y (en) * | 2007-04-26 | 2008-05-14 | 蔡桦欣 | Light shield structure of luminous element |
| CN201146197Y (en) * | 2007-12-21 | 2008-11-05 | 亿光电子工业股份有限公司 | Led device and fluorescence casing thereof |
| CN101320774A (en) * | 2008-05-05 | 2008-12-10 | 陆耘 | Light emitting diode with good light radiation and color development |
| WO2011126027A1 (en) * | 2010-04-07 | 2011-10-13 | 久豊技研株式会社 | Light-emitting device and light-emitting panel apparatus |
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Address after: 518000 Guangdong city in Shenzhen Province, Nanshan District City Xili street Shenzhen University Tsinghua Campus A building two floor Applicant after: Shenzhen International Graduate School of Tsinghua University Address before: 518055 Guangdong city of Shenzhen province Nanshan District Xili of Tsinghua Applicant before: GRADUATE SCHOOL AT SHENZHEN, TSINGHUA University |
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Effective date of registration: 20200623 Address after: Room 2101-2108, 21 / F, Kerong Chuangye building, No. 666, Zhongkai Avenue (Huihuan section), Zhongkai high tech Zone, Huizhou City, Guangdong Province Applicant after: Huizhou Frant Photoelectric Technology Co.,Ltd. Address before: 518000 Guangdong city in Shenzhen Province, Nanshan District City Xili street Shenzhen University Tsinghua Campus A building two floor Applicant before: Shenzhen International Graduate School of Tsinghua University |
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Application publication date: 20161221 |