CN102800795A - White light LED light emitting device based on fluorescent resin - Google Patents
White light LED light emitting device based on fluorescent resin Download PDFInfo
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- CN102800795A CN102800795A CN2012102948033A CN201210294803A CN102800795A CN 102800795 A CN102800795 A CN 102800795A CN 2012102948033 A CN2012102948033 A CN 2012102948033A CN 201210294803 A CN201210294803 A CN 201210294803A CN 102800795 A CN102800795 A CN 102800795A
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Abstract
The utility model provides a white light LED light emitting device based on fluorescent resin. The white light LED light emitting device comprises a base, a blue light LED chip and a fluorescent resin element, wherein the blue light LED chip is a single chip or a group of chips in series, parallel or series-parallel connection; the blue light LED chip is a up-mounted chip or an inverted chip; the fluorescent resin element is obtained by sufficiently mixing or granulating a phosphor powder, a resin powder, an ultraviolet absorbent powder and other additive powders and then hot-pressing and molding the mixture. A fluorescent resin cover can be designed and machined into different geometric shapes according to needs. According to the invention, white lights are obtained by irradiating the fluorescent resin cover by using blue lights emitted by the blue light LED chip, so that the heat radiation problem is relieved and the phenomena such as light emitting wavelength drift and light emitting efficiency drop caused by the heat radiation problem of the device can be avoided for the phosphor; and the phosphor is not in direct contact with a light emitting surface of the blue light chip, so that the light emitting loss caused by a fact that partial lights emitted by the excited phosphor reenter the chip to be absorbed is reduced.
Description
Technical field
The present invention relates to White LED light-emitting device, especially based on the white light emitting device of fluorescence resin.
Background technology
The LED white-light illuminating is a kind of efficient green lighting technology, has plurality of advantages such as energy-saving and environmental protection and long-life, and its operation principle is to utilize blue chip and yellow phosphor combination (or other compound mode) to obtain white light.
The encapsulation of traditional white light LED part be with silica gel or resin with directly be coated in the blue chip surface after fluorescent material mixes, this encapsulation technology has its inherent defect.Because silica gel (or resin) directly contacts with blue chip with fluorescent material, when causing blue chip to be worked scattering not smooth, the higher working temperature of chip makes the emission wavelength of fluorescent material to squint, and luminous intensity decline.Fluorophor is close to light portion that the blue chip light-emitting area causes fluorophor to be excited to send and is got into chip again and be absorbed and cause luminous loss.
Summary of the invention
The present invention provides a kind of white light emitting device based on fluorescence resin, and this light-emitting device can effectively solve the problem of the white light LEDs appearance of above-mentioned utilization conventional package technology.
Technical scheme of the present invention is: a kind of White LED light-emitting device based on fluorescence resin comprises base, blue-light LED chip and fluorescence resin element (cover etc.); Wherein blue-light LED chip is the chip of single chips, one group of series, parallel or series-parallel connection; Wherein blue-light LED chip is positive cartridge chip or flip-chip.Described fluorescence resin element is with comprising that fluorophor powder fully mixes or granulation with transparent or semitransparent resin, obtains through hot press mold shaping.The fluorescence resin element is typically the fluorescence resin cover.
The structure and the preparation method of the fluorescence resin element that the present invention relates to comprise, with fluorophor powder and resin, can comprise that also ultra-violet absorber powder and other additive powders fully mix or granulation, obtain through hot press mold shaping.
Said fluorescence resin element is that powder and the powder of fluorophor of the resin of 100:1 ~ 100:150 fully mixes with mass ratio; Utilize heating and mould pressing thermoplastic process such as (all can) injection mouldings with the mixture of transparent or semitransparent resin and fluorophor or after making material, the cooling back just can obtain the material of fluorescence resin sheet material or other shapes; Transparent or semitransparent resin is PMMA or the MS resin that acrylic (PMMA), PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC strengthen.The content that patent application is arranged specially.
Wherein fluorophor powder can be the LED yellow fluorescent powder.In order to improve the color rendering index of white light, fluorophor also can be the mixture of LED green emitting phosphor and LED red fluorescence powder, or the mixture of LED yellow fluorescent powder and a small amount of LED red fluorescence powder;
Wherein the LED blue chip can be jewel (Al
2O
3) blue chip of growing on the substrate, also can be the blue chip of growing on the SiC substrate, or the blue chip of growing on the Si substrate, or be transferred on other substrates after the growth in above-mentioned three kinds of substrates any one.Said LED blue chip can use single LEDs chip, also can use many or organize led chip more, and its objective is provides the blue light emitting light source.
Wherein fluorescence resin is covered with the different geometric shape, has the function of regulating the light transmission path and improving the luminescent device heat radiation;
Wherein the fluorescence resin cover can be the hollow cubic build, or the hollow cylinder build, and the blue chip side can contact, also can not contact (break away from, refer to gapped structure) with the fluorescence resin cover; Wherein the fluorescence resin cover can be hollow trapezoidal cubic type, or hollow circular platform type;
Wherein the fluorescence resin cover can be the composite structured of hollow cylinder and arc body, and Lower Half is a hollow cylinder, and blue chip is close in the side, and the cross section of first half arc body is circular arc or parabolic type or other arc line type.The blue chip side can contact with the fluorescence resin cover, also can not contact (disengaging).
Wherein fluorescence resin cover lateral surface can be hollow cubic type, and the interior camber line in the cross section of hollow parts is circular arc or parabolic type or other arc line type, and blue chip does not contact with the fluorescence resin cover.
Wherein the fluorescence resin cover can be the hollow contour body of strip, and its cross section is circular arc or parabolic type or other arc line type.
Wherein the fluorescence resin cover can be half barrel shape, and its cross section is circular arc or parabolic type or other arc line type.
Wherein the fluorescence resin cover can be a plane, blue chip and the heat sink type structure of caving in that is.
Wherein the fluorescence resin cover can be hollow contour body, and its cross section is camber line shape, like parabolic type or other arc line type, blue chip and the heat sink type structure of caving in that is.Above-mentioned resin cover wall thickness can be even, also can be inhomogeneous.
The wide range of camber line can be circular arc or conic section, avette part line segment, comprise camber line, especially parabola that other cannot analytic representation.
Above-mentioned fluorescence resin cover with heat sink between can be connected or connect through link through certain binding agent.
In this device, fluorescence resin does not directly contact with LED blue chip light-emitting area, and radiating effect is better, and the ambient temperature of fluorophor is low, so the problems such as luminescent properties deterioration that the elevated operating temperature because of device causes can not take place.
The invention has the beneficial effects as follows: have the function of regulating light transmission path (can be prepared into the light source of specific light-emitting area or concentrated light) and improving the luminescent device heat radiation; The fluorescence resin cover can design and be processed into the different geometric shape as required.The blue light illumination fluorescence resin cover that the present invention utilizes blue-light LED chip to send obtains white light, has alleviated heat dissipation problem, degradation phenomenon under emission wavelength drift that causing because of the device heat dissipation problem can not appear in fluorophor yet and the luminous efficiency.Fluorophor does not directly contact with the blue chip light-emitting area, can reduce the light portion of being excited to send because of fluorophor and get into chip again and be absorbed the luminous loss that causes.The present invention overcomes the inherent defect of the encapsulation of traditional white light LED part.Make life-span of emission wavelength operate as normal of fluorescent material prolong, and guarantee luminous intensity.Light-emitting device can effectively solve the problem of the white light LEDs appearance of above-mentioned utilization conventional package technology.Simultaneously can avoid using in the conventional art encapsulated LED luminescent device because rotten jaundice of silica gel or resin and the reflective device light efficiency decline problem that causes.Light efficiency can obviously improve.
Description of drawings
Fig. 1 is the sketch map of the White LED light-emitting device of the embodiment of the invention 1.
Fig. 2 is the sketch map of the White LED light-emitting device of the embodiment of the invention 2.
Fig. 3 is the sketch map of the White LED light-emitting device of the embodiment of the invention 3.
Fig. 4 is the sketch map of the White LED light-emitting device of the embodiment of the invention 4.
Fig. 5 is the sketch map of the White LED light-emitting device of the embodiment of the invention 5.
Fig. 6 is the sketch map of the White LED light-emitting device of the embodiment of the invention 6.
Fig. 7 is the sketch map of the White LED light-emitting device of the embodiment of the invention 7.
Fig. 8 is the sketch map of the White LED light-emitting device of the embodiment of the invention 8.
Fig. 9 is the sketch map of the White LED light-emitting device of the embodiment of the invention 9.
Figure 10 is the sketch map of the White LED light-emitting device of the embodiment of the invention 10.
Embodiment
All with reference to accompanying drawing, in these accompanying drawings, identical Reference numeral is represented identical parts in whole specification, among the figure: the 1st, heat sink (support), the 2nd, blue-light LED chip, the 3rd, the air gap of fluorescence resin cover and chip chamber or silica gel.Because this luminescent device need not to change the connected mode of the blue-light LED chip in the conventional package technology, electrode and contact conductor are omitted in the drawings.。
Fig. 1 is the sketch map of the White LED light-emitting device of the embodiment of the invention 1.White LED light-emitting device comprises: heat sink 1, blue-light LED chip 2 and fluorescence resin cover 4,3 is the air gap or the silica gel of fluorescence resin cover and chip chamber among the figure.
Resin in the fluorescence resin cover 4 is acrylic (PMMA), and fluorophor is the YAG bloom, and particle diameter is 10 microns.
The blue light illumination fluorescence resin cover 4 that blue-light LED chip 2 sends, the fluorophor in the fluorescence resin cover 4 receives the blue-light excited gold-tinted that sends, and the part blue light that gold-tinted that sends and blue-light LED chip 2 send obtains white light.
Fig. 2 is the sketch map of the White LED light-emitting device of the embodiment of the invention 2.
The difference of this embodiment and embodiment 1 is that the side of blue chip does not contact with fluorescence resin cover 5.
Fig. 3 is the sketch map of the White LED light-emitting device of the embodiment of the invention 3.
The difference of this embodiment and embodiment 1 is that fluorescence resin cover 6 is hollow trapezoidal cubic types, or hollow circular platform type, and wall thickness is adjustable, and the blue chip side does not contact with fluorescence resin cover 6.
Fig. 4 is the sketch map of the White LED light-emitting device of the embodiment of the invention 4.
The difference of this embodiment and embodiment 1 is; Fluorescence resin cover 7 is the composite structured of hollow cylinder and arc body; Lower Half is a hollow cylinder, and fluorescence resin cover 7 is close in the blue chip side, and the cross section of first half arc body is circular arc or parabolic type or other arc line type; The line style of inside and outside camber line can be consistent, also can be inconsistent.
Embodiment 5
Fig. 5 is the sketch map of the White LED light-emitting device of the embodiment of the invention 5.
The difference of this embodiment and embodiment 1 is; Fluorescence resin cover 8 is the composite structured of hollow cylinder and arc body; Lower Half is a hollow cylinder, and the blue chip side does not contact with fluorescence resin cover 8, and the cross section of first half arc body is circular arc or parabolic type or other arc line type; The line style of inside and outside camber line can be consistent, also can be inconsistent.
Fig. 6 is the sketch map of the White LED light-emitting device of the embodiment of the invention 6.
The difference of this embodiment and embodiment 1 is that fluorescence resin cover 9 is hollow cubic types, and the cross section of hollow parts is circular arc or parabolic type or other arc line type, and fluorescence resin cover 9 does not contact with blue chip.
Fig. 7 is the sketch map of the White LED light-emitting device of the embodiment of the invention 7.
The difference of this embodiment and embodiment 1 is that fluorescence resin cover 10 is hollow contour bodies, and its cross section is circular arc or parabolic type or other arc line type, and the line style of inside and outside camber line can be consistent, also can be inconsistent.
Fig. 8 is the sketch map of the White LED light-emitting device of the embodiment of the invention 8.
The difference of this embodiment and embodiment 1 is that fluorescence resin cover 11 is half barrel shapes, and its cross section is circular arc or parabolic type or other arc line type, and the line style of inside and outside camber line can be consistent, also can be inconsistent.
Be that the fluorescence resin cover is half barrel a cylindrical, the outline line in its cross section can be a part or parabola or the hyperbola or other the camber line of circular arc.
Fig. 9 is the sketch map of the White LED light-emitting device of the embodiment of the invention 9.
The difference of this embodiment and embodiment 1 is that fluorescence resin cover 12 is planes, blue chip and the heat sink type structure of caving in that is.
Figure 10 is the sketch map of the White LED light-emitting device of the embodiment of the invention 10.
The difference of this embodiment and embodiment 1 is; (multiple transparent or semitransparent resin all can prepare the fluorescence resin cover; But the REFERENCE TO RELATED people's related application) the 13rd, hollow contour body, its cross section is circular arc or parabolic type or other arc line type, the line style of inside and outside camber line can be consistent; Also can be inconsistent, blue chip and the heat sink type structure of caving in that is.
Further improvement of the present invention also comprises: can also add a small amount of ultra-violet absorber or oxidation inhibitor in the mixed-powder of fluorophor and resin and prevent that resin is aging.In step (1), add an amount of SiO
2, ZrO
2, Al
2O
3Deng ceramic particle; Strengthen the mixed effect of light.Can take the method for post forming to prepare fluorescence resin, earlier the mixed-powder hot pressing of resin and fluorophor or injection moulding (extrusion molding) become sheet material (also directly mould molding), again the sheet material secondary is thermoformed into the fluorescence resin element of required form.
Claims (10)
1. the White LED light-emitting device based on fluorescence resin is characterized in that, comprises base, blue-light LED chip and fluorescence resin element; Wherein blue-light LED chip is the chip of single chips, one group of series, parallel or series-parallel connection, and blue-light LED chip is positive cartridge chip or flip-chip; Described fluorescence resin element is with comprising that fluorophor powder fully mixes or granulation with transparent or semitransparent resin, obtains through hot press mold shaping.
2. the White LED light-emitting device based on fluorescence resin according to claim 1 is characterized in that the fluorescence resin element is the fluorescence resin cover, and the fluorescence resin cover is gapped apart from blue-light LED chip; Transparent or semitransparent resin is PMMA or the MS resin that acrylic (PMMA), PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC strengthen.
3. the White LED light-emitting device based on fluorescence resin according to claim 2; It is characterized in that; Wherein the fluorescence resin cover is hollow cubic build or hollow cylinder build, and wall thickness is adjustable, the blue chip side be close to the fluorescence resin cover or with fluorescence resin cover or gapped.
4. the White LED light-emitting device based on fluorescence resin according to claim 1 is characterized in that the fluorescence resin cover is hollow trapezoidal, cubic type or hollow circular platform type, and wall thickness is adjustable, and blue chip side and fluorescence resin cover are close to or are gapped.
5. the White LED light-emitting device based on fluorescence resin according to claim 1; It is characterized in that; Wherein the fluorescence resin cover is the composite structured of hollow cylinder and cambered surface body; Lower Half is a hollow cylinder, and blue chip side fluorescence resin cover is close to or is gapped, and the cross section of first half cambered surface body is camber line shape, parabolic type or other arc line type.
6. White LED light-emitting device according to claim 1; It is characterized in that; Wherein fluorescence resin cover lateral surface is hollow cubic type, and the inner arc in the cross section of hollow parts is camber line shape, parabolic type or other arc line type, and the fluorescence resin cover contacts with blue chip or be gapped.
7. the White LED light-emitting device based on fluorescence resin according to claim 1; It is characterized in that; Wherein the fluorescence resin cover is hollow contour body, and its cross section is circular arc or parabolic type or other arc line type, and the line style of inside and outside camber line is consistent or different.
8. White LED light-emitting device according to claim 1 is characterized in that, wherein fluorescence resin is half barrel shape, and its cross section is circular arc or parabolic type or other arc line type, and the line style of the inside and outside camber line of cover is consistent or different.
9. the White LED light-emitting device based on fluorescence resin according to claim 1; It is characterized in that; Wherein the fluorescence resin cover is plane or hollow contour body; Hollow contour body cross section is circular arc or parabolic type or other arc line type,, blue chip and the heat sink type structure of caving in that is.
10. the White LED light-emitting device based on fluorescence resin according to claim 1 is characterized in that, the fluorescence resin cover with heat sink between can be connected or connect through link through certain binding agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102948033A CN102800795A (en) | 2012-08-17 | 2012-08-17 | White light LED light emitting device based on fluorescent resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102948033A CN102800795A (en) | 2012-08-17 | 2012-08-17 | White light LED light emitting device based on fluorescent resin |
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| Publication Number | Publication Date |
|---|---|
| CN102800795A true CN102800795A (en) | 2012-11-28 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102948033A Pending CN102800795A (en) | 2012-08-17 | 2012-08-17 | White light LED light emitting device based on fluorescent resin |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103094461A (en) * | 2013-01-08 | 2013-05-08 | 南通脉锐光电科技有限公司 | Optics wavelength conversion module, preparation method of optics wavelength conversion module and white light light-emitting device |
| CN103165796A (en) * | 2013-03-01 | 2013-06-19 | 上海嘉塘电子有限公司 | Fluorescent lampshade type light-emitting diode (LED) white light module |
| CN103885275A (en) * | 2012-12-21 | 2014-06-25 | 卡西欧计算机株式会社 | Light source unit and projector |
| US10505086B2 (en) | 2017-09-29 | 2019-12-10 | Au Optronics Corporation | Light source device |
| TWI688806B (en) * | 2018-03-23 | 2020-03-21 | 行家光電股份有限公司 | Linear beam shaped light emitting device, backlight module using the same |
| US10797102B2 (en) | 2018-03-23 | 2020-10-06 | Maven Optronics Co., Ltd. | Chip-scale linear light-emitting device |
| CN112133810A (en) * | 2020-10-29 | 2020-12-25 | 深圳市广社照明科技有限公司 | Long-range phosphor powder large-angle scattering patch LED |
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| CN2729907Y (en) * | 2004-10-08 | 2005-09-28 | 陈天宇 | Improved structure of white light LED |
| CN1710724A (en) * | 2004-06-18 | 2005-12-21 | 江苏稳润光电有限公司 | Method for making white-light light-emitting diode |
| CN1858920A (en) * | 2006-06-05 | 2006-11-08 | 江苏奥雷光电有限公司 | Packaging method for white light LED lamp |
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| CN1710724A (en) * | 2004-06-18 | 2005-12-21 | 江苏稳润光电有限公司 | Method for making white-light light-emitting diode |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103885275A (en) * | 2012-12-21 | 2014-06-25 | 卡西欧计算机株式会社 | Light source unit and projector |
| CN103094461A (en) * | 2013-01-08 | 2013-05-08 | 南通脉锐光电科技有限公司 | Optics wavelength conversion module, preparation method of optics wavelength conversion module and white light light-emitting device |
| CN103094461B (en) * | 2013-01-08 | 2016-03-30 | 江苏脉锐光电科技有限公司 | Optical wavelength transition components, its preparation method and white light emitting device |
| CN103165796A (en) * | 2013-03-01 | 2013-06-19 | 上海嘉塘电子有限公司 | Fluorescent lampshade type light-emitting diode (LED) white light module |
| US10505086B2 (en) | 2017-09-29 | 2019-12-10 | Au Optronics Corporation | Light source device |
| TWI688806B (en) * | 2018-03-23 | 2020-03-21 | 行家光電股份有限公司 | Linear beam shaped light emitting device, backlight module using the same |
| US10797102B2 (en) | 2018-03-23 | 2020-10-06 | Maven Optronics Co., Ltd. | Chip-scale linear light-emitting device |
| US11227891B2 (en) | 2018-03-23 | 2022-01-18 | Maven Optronics Co., Ltd. | Chip-scale linear light-emitting device |
| CN112133810A (en) * | 2020-10-29 | 2020-12-25 | 深圳市广社照明科技有限公司 | Long-range phosphor powder large-angle scattering patch LED |
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Application publication date: 20121128 |