CN106197104A - 3 D stereo hot superconductive temperature equalizing radiator and preparation method thereof - Google Patents
3 D stereo hot superconductive temperature equalizing radiator and preparation method thereof Download PDFInfo
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- CN106197104A CN106197104A CN201610532707.6A CN201610532707A CN106197104A CN 106197104 A CN106197104 A CN 106197104A CN 201610532707 A CN201610532707 A CN 201610532707A CN 106197104 A CN106197104 A CN 106197104A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/42—Forced cooling
- F21S45/43—Forced cooling using gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to technical field of heat dissipation, especially relate to a kind of 3 D stereo hot superconductive temperature equalizing radiator and preparation method thereof.This 3 D stereo hot superconductive temperature equalizing radiator includes: the evaporation cavity of hollow long slab shape and the plate shaped condensation chamber of hollow；Evaporation cavity is fixing with condensation chamber to be connected, and composition cross section is "T"-shaped stereochemical structure, and evaporation cavity is vacuum chamber with condensation chamber and fills coolant；Evaporation cavity arranges wick layer with the inwall of condensation chamber.Temperature-uniforming plate is made up of at least two pieces of housings, and prepares respectively；Then the inner surface at housing covers copper powder particle, and is sintered forming wick layer；Case weld is connected, injects coolant, and by frit seal at hand-hole, obtain 3 D stereo hot superconductive temperature equalizing radiator.The present invention expands erection space and area of dissipation, can more effectively utilize space；Shortening the circulation process of coolant, expand contact surface and connect, thus improve radiating efficiency, radiating effect is more preferable.
Description
Technical field
The present invention relates to technical field of heat dissipation, especially relate to a kind of 3 D stereo hot superconductive temperature equalizing radiator and preparation thereof
Method.
Background technology
Due to temperature-uniforming plate (Vapor Chamber) have high heat transmission, high thermoconductivity, lightweight, simple in construction and
The characteristics such as multipurpose, can transmit substantial amounts of heat and the most not consume the advantages such as electric power, the most be widely used in electronic building brick
Heat conduction, thus carries out the quick diversion of heat, sends out with effective solution heat generating component (such as electronic devices and components, LED chip etc.)
The heat accumulation phenomenon of hot assembly.
Existing temperature uniforming heat radiation body, owing to it uses the restriction in space, the area causing radiator portion is less, have impact on scattered
The size of thermal device, radiating mode and installation, thus cause radiating efficiency the highest.
Summary of the invention
It is an object of the invention to provide a kind of 3 D stereo hot superconductive temperature equalizing radiator and preparation method thereof, existing to solve
Have that area of dissipation present in technology is little, radiating element is difficult to the technical problem installed.
The 3 D stereo hot superconductive temperature equalizing radiator that the present invention provides, including: the evaporation cavity of hollow long slab shape and hollow
Plate shaped condensation chamber；
Described evaporation cavity is vertically fixed on the surface of condensation chamber, and composition cross section is "T"-shaped stereochemical structure, and evaporation
Chamber and condensation chamber are vacuum chamber and fill coolant, and the two is interconnected；Described evaporation cavity is arranged with the inwall of condensation chamber
Wick layer.
Phase-change heat mode and the principle of capillary structure transmission is used: coolant is filled into temperature-uniforming plate in temperature uniforming heat radiation body
In, receive in wick layer；When evaporation ends is heated, coolant endothermic gasification, overflow from wick layer, and along evaporation
Chamber flow to condensation chamber exothermic condensation, is inhaled into the wick layer of condensation end, and is transported to evaporation by capillarity after liquefaction
The wick layer of end, completes a heat radiation circulation.
The 3 D stereo hot superconductive temperature equalizing radiator of "T"-shaped structure, the flow process of coolant is shorter, and circulation rate is faster；Steam
Send out chamber bigger with the area of condensation chamber, it is easier to install with thermal source and other radiating elements, and heat radiator effect is more preferable；Structure
More stable, shockproof effect is good.
In the alternative of the present invention, described evaporation cavity is rectangle, and condensation chamber is circular；And the thickness of described condensation chamber
Degree is more than the thickness of evaporation cavity.
In the alternative of the present invention, described evaporation cavity and condensation chamber use rose copper or aluminum standby, described wick layer
Use copper or aluminum standby.
Temperature-uniforming plate the most all uses the rose copper of low thermal resistance or aluminum to prepare, and can improve its thermal diffusivity further
Energy.
In the alternative of the present invention, the material of described coolant is water.
In the alternative of the present invention, the thickness of described wick layer is 0.1mm～100mm, and hole ratio is 50%.
The preparation method of the described 3 D stereo hot superconductive temperature equalizing radiator that the present invention provides, comprises the following steps:
Prepare the housing of condensation chamber, and cover copper powder or aluminum particle at the inner surface of the housing of described condensation chamber, or
Person covers copper mesh or aluminium wire netting, and is sintered, and is formed and has capillary wick layer；
Prepare the housing of evaporation cavity:
Oxygen-free copper pipe or anaerobic aluminum pipe are cut into pieces according to design length, obtain pipe fitting, and insert center bar, make center
Form the gap of reserved thickness between rod and tube wall, and in described gap, fill compacting copper powder particle or aluminum particle, then enter
Row sintering, forms wick layer；The one end having sintered the pipe fitting of wick layer is closed up into coniform, and solder up；Then
It is squeezed into flat, obtains the housing of evaporation cavity；Or
Copper powder is covered respectively at the oxygen-free copper housing of two panels stamping or the inner surface compacting of anaerobic aluminum enclosure
Grain or aluminum particle, or suppress copper mesh or aluminium wire netting, sintering forms wick layer；The ring that two panels housing is protected at nitrogen
Border is welded, obtains the housing of evaporation cavity；
The housing of the housing of condensation chamber with evaporation cavity is welded to connect in the environment that nitrogen is protected, and carries out internal capillary
The link of sandwich layer；Note liquid head of bleeding is welded in the hole that condensation cavity is reserved, a copper pipe is inserted in the hole and carries out high temperature reduction
Deoxygenation；
Carry out evacuation at note liquid head of bleeding, inject extruding bending sealing after coolant, and carry out frit seal,
To 3 D stereo hot superconductive temperature equalizing radiator.
In the alternative of the present invention, in the sintering process of described wick layer, copper powder particle and the sintering of copper mesh
Temperature is 800 DEG C～1050 DEG C, and sintering time is 1h～6h.
In the alternative of the present invention, in the sintering process of described wick layer, the sintering temperature of copper mesh and aluminium wire netting
Degree is 400 DEG C～550 DEG C, and sintering time is 1h～6h.
In the alternative of the present invention, during the protection of described nitrogen, nitrogen protection is gradually cooled to 80 ° from 1050 °,
Time is 5min～30min.
In the alternative of the present invention, described copper powder particle or a diameter of 10 microns～1000 microns of aluminum particle,
Cladding thickness is 0.1 millimeter～100 millimeters.
In the alternative of the present invention, the preparation method of described temperature-uniforming plate also includes:
Described housing is carried out the step of decontamination cleaning；
Before injecting coolant, the housing after welding is carried out the step of performing leak test；
Described temperature-uniforming plate is carried out the step of outward appearance trimming；
Described temperature-uniforming plate is carried out the step of high temperature ageing test and performance test；
Described temperature-uniforming plate is carried out the step of surface process.
In the alternative of the present invention, described surface processes and includes that blasting craft processes and electroplating technology processes.
The invention have the benefit that
Expand erection space and area of dissipation, can more effectively utilize space；Shorten the circulation process of coolant,
Expanding contact surface to connect, thus improve radiating efficiency, radiating effect is more preferable.
Accompanying drawing explanation
In order to be illustrated more clearly that the specific embodiment of the invention or technical scheme of the prior art, below will be to specifically
In embodiment or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that, in describing below
Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not paying creative work
Put, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
The schematic diagram of the 3 D stereo hot superconductive temperature equalizing radiator that Fig. 1 provides for the embodiment of the present invention；
Fig. 2 is the cross section view of the hot superconductive temperature equalizing radiator of the 3 D stereo described in the embodiment of the present invention；
Reference:
101-evaporation ends；102-condensation end；
103-evaporation cavity；104-condensation chamber；
105-wick layer；106-housing；
107-gas phase coolant；108-liquid phase coolant.
Detailed description of the invention
Below in conjunction with accompanying drawing, technical scheme is clearly and completely described, it is clear that described enforcement
Example is a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under not making creative work premise, broadly falls into the scope of protection of the invention.
In describing the invention, it should be noted that term " " center ", " on ", D score, "left", "right", " vertically ",
Orientation or the position relationship of the instruction such as " level ", " interior ", " outward " they are based on orientation shown in the drawings or position relationship, merely to
Be easy to describe the present invention and simplifying describe rather than instruction or the hint device of indication or element must have specific orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.Additionally, term " first ", " second ",
" the 3rd " is only used for describing purpose, and it is not intended that indicate or hint relative importance.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " is installed ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be fixing connection, it is also possible to be to removably connect, or be integrally connected；Can
To be mechanical connection, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, Ke Yishi
The connection of two element internals.For the ordinary skill in the art, can understand that above-mentioned term is at this with concrete condition
Concrete meaning in invention.
The schematic diagram of the 3 D stereo hot superconductive temperature equalizing radiator that Fig. 1 provides for the embodiment of the present invention；Fig. 2 is that the present invention is real
Execute the cross section view of the hot superconductive temperature equalizing radiator of the 3 D stereo described in example.
In this embodiment, 3 D stereo hot superconductive temperature equalizing radiator includes rectangular evaporation ends 101 and circular plate type
Condensation end 102, the two is mutually perpendicular to, and forms "T"-shaped stereochemical structure.
Specifically, 3 D stereo hot superconductive temperature equalizing radiator includes evaporation ends 101 and the hollow circle of hollow long slab shape
The condensation end 102 of plate shape.Evaporation ends 101 is fixed on the upper surface center of condensation end 102 in vertical manner, thus forms horizontal stroke
Cross section is "T"-shaped stereochemical structure.
The cavity of evaporation ends 101 constitutes evaporation cavity 103, and the cavity of condensation end 102 constitutes condensation chamber 104, and evaporation
Chamber 103 and condensation chamber 104 are vacuum chamber, and both are interconnected.
Filling coolant in evaporation cavity 103 with condensation chamber 104, the inwall of evaporation cavity 103 and condensation chamber 104 is all laid
Wick layer 105, arranges housing 106 at its outer wall.
Employing phase-change heat mode and the principle of capillary structure transmission in 3 D stereo hot superconductive temperature equalizing radiator: coolant
Receive in wick layer 105；When evaporation ends 101 absorbs the heat that thermal source distributes, make the wick layer at evaporation ends 101
Coolant endothermic gasification in 105, gas phase coolant 107 is overflowed from wick layer 105, along evaporation cavity 103 to condensation chamber
104 direction flowings, and exothermic condensation liquefaction in condensation chamber 104, liquid phase coolant 108 is inhaled into the capillary wick of condensation end 102
In layer 105, then carried to the wick layer of evaporation ends 101 by the capillarity of wick layer 105, thus complete a heat radiation
Cooling circulation.
Use the 3 D stereo hot superconductive temperature equalizing radiator of "T"-shaped structure, the contact of evaporation ends and condensation end can be increased
Area such that it is able to make more effectively to contact between temperature uniforming heat radiation body with thermal source and thermal component, it is easier to thermal source and other
Radiating element is installed, and heat radiator effect is more preferable；Meanwhile, the flow process of coolant is shorter, and circulation rate is faster；Structure is more steady
Fixed, shockproof effect is good.
In the preferred version of the present embodiment, the thickness (caliber size) of condensation chamber 104 is more than the thickness of evaporation cavity 103
(caliber size).So, condensation chamber 104 is relatively big, evaporation cavity 103 is less, can between condensation chamber 104 and evaporation cavity 103 shape
Become pressure reduction, such that it is able to accelerate the flowing velocity of gas phase coolant 107, increase circulation rate and radiating efficiency.
In the preferred version of the present embodiment, 3 D stereo hot superconductive temperature equalizing radiator (includes wick layer from inside to outside
105 and housing 106) all use the rose copper of low thermal resistance or aluminum to prepare, its heat dispersion can be improved further.
In the preferred version of the present embodiment, in the evaporation cavity 103 of 3 D stereo hot superconductive temperature equalizing radiator, hair can be used
Thin sandwich layer 105 is separated into plurality of passages, makes gas phase coolant 107 flow in each bar passage, increases flowing velocity.Meanwhile, as
When really the phase change efficiency of evaporation ends 101 both sides of temperature uniforming heat radiation body is unbalanced, can be by constituting the wick layer 105 of passage
Effect to regulation.
In the preferred version of the present embodiment, coolant uses water.Certainly, what coolant can also use other has gas
The material of the biphase phase transition performance of liquid, such as ethanol, acetone etc., can be according to the phase alternating temperature of the heating temp of thermal source and phase-change material
Degree selects.
In the preferred version of the present embodiment, wick layer 105 is formed by copper powder particle sintering, unilateral wick layer
The thickness of 105 is 0.1mm～100mm, and hole ratio is 50%.
For ensureing the gas-liquid cycle process of coolant, and accelerating heat conduction efficiency, evaporation cavity 103 and condensation chamber 104 should be protected
Hold suitable thickness.
In other embodiments of the invention, 3 D stereo hot superconductive temperature equalizing radiator it can also be provided that other shapes,
Coordinate with thermal source, thermal component and installing space to facilitate.Such as, evaporation ends is that hollow long slab shape, hollow circular plate type, hollow are curved
Plate shape and hollow many side plates shape etc. are variously-shaped, and accordingly, condensation end can also be hollow long slab shape, hollow circular plate type, hollow
Bent plate shape and hollow many side plates shape etc. are variously-shaped.Evaporation ends is also not limited to right angle setting with condensation end or orthoscopic is connected,
The connected mode of inclination can be used, as long as evaporation cavity can be made to connect with condensation chamber.
This 3 D stereo hot superconductive temperature equalizing radiator can be widely used in LED light source according to the difference of design shape
Or the heat radiation of electronic product.
Such as, when dispelling the heat LED-COB light source, LED-COB light source is two, is sticked respectively in the evaporation of temperature-uniforming plate
The both side surface of end 101；
Outer surface at condensation end 102 installs thermal component, such as fin radiator etc..Fin radiator is close to temperature-uniforming plate
The single side surface of condensation end 102 or side, both sides so that it is the condensation end 102 of temperature-uniforming plate can be carried out cooling.
Fan can also be set in the rear end of fin radiator and condensation end 102, for fin radiator air feed, to accelerate wing
The cooling of sheet heat radiator.
This 3 D stereo hot superconductive temperature equalizing radiator is prepared according to the following steps:
Prepare condensation chamber:
Condensation cavity is according to the oxygen-free copper of dimensions stamping or anaerobic aluminum enclosure by upper and lower two parts；Up and down
Two parts can in respectively in upper shell according to the hole of size punching press certain size shape of evaporation cavity, for and evaporation cavity
Connect；Drain pan or upper casing require to be stamped with the hole of certain size and interconnective Contact welding edge fit according to design, is used for
Welding copper pipe or aluminum pipe, in product later stage preparation section, evacuation injects the hole of liquid；
Inner surface thickness compacting as required at upper and lower two housing sections covers copper powder particle or aluminium powder respectively
Grain, or suppress copper mesh or aluminium wire netting, carry out high temperature sintering according to product specific requirement, form the capillary wick storing conducting liquid
Layer；
Prepare evaporation cavity:
Evaporation cavity is to be prepared through processing by oxygen-free copper pipe or anaerobic aluminum pipe, or by two parts according to stamping
Oxygen-free copper housing or anaerobic aluminum enclosure be formed by connecting, concrete:
When preparing evaporation cavity with the oxygen-free copper pipe of certain specification Diameter Wall or aluminum pipe, first require choosing according to specific product
With or well cutting length；Copper pipe or aluminum pipe are inserted in the graphite fixture preparing certain diameter height, at the bottom of copper pipe or aluminum pipe
Portion is according to being highly fixed in graphite fixture；The wick layer thickness storing conducting liquid required according to specific product inserts copper
Pipe or the internal center rod iron of aluminum pipe, then fill at the gap of center bar and copper pipe or aluminum pipe inwall compacting anaerobic copper powder or
Anaerobic aluminium powder；Then populated anaerobic copper powder or the copper pipe of anaerobic aluminium powder will be suppressed or aluminum pipe moves and is placed into high temperature sintering furnace
In, it being sintered, temperature range was sintered according to metal is different with the time with liquid storage sandwich layer different temperatures with the time；Will sintering
Good copper pipe or aluminum pipe one end carry out closing up into coniform, carry out solder up by bonding machine；Then by solder up one
End is put into according to carrying out high temperature oxygen reduction treatment in high temperature furnace, and oxide layer when removing welding is removed and deoxygenation；Last according to product
Product require on extrusion equipment, are squeezed into the flat evaporation cavity of certain altitude thickness shape up and down；
Or by two panels according to the oxygen-free copper of certain specification dimensional thickness stamping or anaerobic aluminum enclosure, respectively two
The thickness compacting as required of the inner surface of partial shell covers copper powder or aluminum particle, or the copper of compacting certain specification thickness
Silk screen aluminium wire netting, carries out high temperature sintering according to product specific requirement, forms the wick layer storing conducting liquid；Sinter capillary
The two panels housing of sandwich layer, at chain junction type metal copper or aluminum soldering paste solder, fixes in fixture connecting and being placed on, will be fixing
Good connector is placed in tunnel nitrogen soldering furnace according to carrying out nitrogen protection welding；
Connection evaporation cavity and condensation chamber:
The evaporation cavity prepared is inserted in the upper cover preformed hole of the condensation cavity prepared, exist with metal soldering paste solder
According to being attached nitrogen protection welding in tunnel nitrogen protection soldering furnace；
Maybe the evaporation cavity prepared is inserted in the upper cover preformed hole of the condensation cavity prepared, is placed in fixture,
Place solder copper ring or the aluminum ring of definite shape at external connections, be attached welding by high-frequency argon arc-welding；
Both being put in the graphite fixture designing scale styling representation, compacting loads certain granules diameter and thickness
Copper powder particle or aluminum particle, or certain thickness copper mesh or aluminium wire netting, carry out the link of inner vertical surface wick layer；So
After be placed in high temperature welding furnace sintering, the upper cover of evaporation cavity and condensation cavity completes after sintered copper powder connects, to become vertically to connect
Logical fixing；
Or by vertical for the upper cover of evaporation cavity connector and the condensation cavity lower house sintered, placement is played a supporting role
On copper post or aluminum post, and smear brazing metal soldering paste at contact surface, smear metallic copper soldering paste solder in both chain junction printings, right
Connect and be placed in fixture fixing；The connector fixed is placed in tunnel nitrogen soldering furnace and carries out nitrogen protection weldering
Connect；
Inject coolant and seal:
The evaporation cavity welded and condensation cavity connector are reserved in the upper cover body or lower cover of condensation cavity
Hole on welding bleed note liquid head, the copper pipe of certain diameter shape is inserted in the hole, outside copper ring aluminum boxing material of placing is at argon
Carry out link welding on arc-welding machine, after welding, carry out high temperature reduction deoxygenation, carry out taking out very at note liquid head of then bleeding
Sky, injects coolant extruding bending sealing, and is on argon arc welding machine by hand-hole and carries out frit seal, obtain 3 D stereo
Hot superconductive temperature equalizing radiator.
In the sintering process of wick layer, the sintering temperature of copper powder particle and copper mesh is 800 DEG C～1050 DEG C, during sintering
Between be 1h～6h；The sintering temperature of copper mesh and aluminium wire netting is 400 DEG C～550 DEG C, and sintering time is 1h～6h.
During nitrogen protection, nitrogen protection is gradually cooled to 80 ° from 1050 °, and the time is 5min～30min.
Copper powder particle or a diameter of 10 microns～1000 microns of aluminum particle, cladding thickness is 0.1 millimeter～100 millis
Rice.
This 3 D stereo hot superconductive temperature equalizing radiator achieves thermal source from a direction solid in minimum solid space
The condensation heat radiation of another one three-dimensional surface is vertically arrived in face.3 D stereo hot superconductive temperature equalizing radiator technology is similar to heat from principle
Pipe, but otherwise varied on conduction pattern: heat pipe is one-dimensional linear conduction of heat, and in 3 D stereo hot superconductive temperature equalizing radiator
Heat is then to conduct on a three-dimensional three-dimensional surface, the most in hgher efficiency.Evaporation cavity two sides is heated, and thermal source heating evaporation chamber is inhaled
Heat, coolant (pure water or coolant) rapid evaporation of being heated under vacuum ultralow pressure environment is hot-air (< 104Tor or more
Few) heat absorption Vapor Chamber uses vacuum design, and hot-air is rapid heat conduction in evaporation cavity, and hot-air is heated rising
Arrive condensation chamber, condensation chamber is welded with radiating fin heat and passes on radiating fin, and again condense into liquid, after condensation
Coolant is passed back into by copper micro-shape structure capillary channel and forms backflow at the evaporation cavity of 3 D stereo superconductive temperature equalizing body, backflow
Coolant is gasified after being heated by evaporation cavity and again by condensing body of wall heat absorption, heat conduction, heat radiation, and such repeated action is permissible
More effectively utilize space；Form inner loop flow process, expand contact surface and connect, thus improve radiating efficiency, radiating effect
More preferably.
In the preferred version of the present embodiment, the preparation method of this temperature-uniforming plate can also comprise the following steps:
The housing of preparation molding is placed in surface each to housing in ultrasonic waves for cleaning pond and carries out ultrasonic waves for cleaning, to remove work
Greasy dirt that in part production process, surface attaches and impurity；
Before injecting coolant, the housing after welding is placed in water, and by reserved hand-hole injecting compressed air,
Carry out air tightness test；
After preparing temperature-uniforming plate, use shaping tool, correct the deformation that temperature-uniforming plate produces in process of production, to outside it
Sight is rebuild；
The temperature-uniforming plate prepared is placed in calorstat, and is passed through high temperature gas flow, carry out hot environment burn-in test；
The evaporation ends of the temperature-uniforming plate prepared is heated, and carries out temperature test, the heat conduction of detection product at condensation end
Effect；
The surface including blasting craft processes and electroplating technology processes, the surface of temperature-uniforming plate is processed, improves table
Face intensity and Corrosion Protection, make product more attractive in appearance simultaneously.
Last it is noted that various embodiments above is only in order to illustrate technical scheme, it is not intended to limit；To the greatest extent
The present invention has been described in detail by pipe with reference to foregoing embodiments, it will be understood by those within the art that: it depends on
So the technical scheme described in foregoing embodiments can be modified, or the most some or all of technical characteristic is entered
Row equivalent；And these amendments or replacement, do not make the essence of appropriate technical solution depart from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
1. a 3 D stereo hot superconductive temperature equalizing radiator, it is characterised in that including: the evaporation cavity of hollow long slab shape and hollow
Plate shaped condensation chamber；
Described evaporation cavity is vertically fixed on the surface of condensation chamber, composition cross section be "T"-shaped stereochemical structure, and evaporation cavity with
Condensation chamber is vacuum chamber and fills coolant, and the two is interconnected；Described evaporation cavity arranges capillary with the inwall of condensation chamber
Sandwich layer.
3 D stereo the most according to claim 1 hot superconductive temperature equalizing radiator, it is characterised in that described evaporation cavity is rectangular
Shape, condensation chamber is circular；And the thickness of described condensation chamber is more than the thickness of evaporation cavity.
3 D stereo the most according to claim 1 and 2 hot superconductive temperature equalizing radiator, it is characterised in that described evaporation cavity and
Condensation chamber uses rose copper or aluminum standby, and described wick layer uses copper or aluminum standby.
3 D stereo the most according to claim 1 and 2 hot superconductive temperature equalizing radiator, it is characterised in that described coolant
Material is water.
3 D stereo the most according to claim 1 and 2 hot superconductive temperature equalizing radiator, it is characterised in that described wick layer
Thickness be 0.1mm～100mm, hole ratio is 50%.
6. a preparation method for the 3 D stereo hot superconductive temperature equalizing radiator described in any one of Claims 1 to 5, its feature exists
In, comprise the following steps:
Prepare the housing of condensation chamber, and cover copper powder or aluminum particle at the inner surface of the housing of described condensation chamber, or cover
Lid copper mesh or aluminium wire netting, and be sintered, formed and there is capillary wick layer；
Prepare the housing of evaporation cavity:
Oxygen-free copper pipe or anaerobic aluminum pipe are cut into pieces according to design length, obtain pipe fitting, and insert center bar, make center bar with
Form the gap of reserved thickness between tube wall, and in described gap, fill compacting copper powder particle or aluminum particle, then burn
Knot, forms wick layer；The one end having sintered the pipe fitting of wick layer is closed up into coniform, and solder up；Then extrude
Become flat, obtain the housing of evaporation cavity；Or
Respectively the inner surface compacting in the oxygen-free copper housing of two panels stamping or anaerobic aluminum enclosure cover copper powder particle or
Aluminum particle, or suppress copper mesh or aluminium wire netting, sintering forms wick layer；By two panels housing in the environment that nitrogen is protected
Weld, obtain the housing of evaporation cavity；
The housing of the housing of condensation chamber with evaporation cavity is welded to connect in the environment that nitrogen is protected, and carries out internal capillary sandwich layer
Link；Note liquid head of bleeding is welded in the hole that condensation cavity is reserved, a copper pipe is inserted in the hole and carries out high temperature reduction deoxygenation；
Carry out evacuation at note liquid head of bleeding, inject extruding bending sealing after coolant, and carry out frit seal, obtain three
Tie up three-dimensional hot superconductive temperature equalizing radiator.
Preparation method the most according to claim 6, it is characterised in that in the sintering process of described wick layer, copper powder
The sintering temperature of grain and copper mesh is 800 DEG C～1050 DEG C, and sintering time is 1h～6h.
Preparation method the most according to claim 6, it is characterised in that in the sintering process of described wick layer, copper mesh
Being 400 DEG C～550 DEG C with the sintering temperature of aluminium wire netting, sintering time is 1h～6h.
Preparation method the most according to claim 6, it is characterised in that described nitrogen protection during, nitrogen protection from
1050 ° are gradually cooled to 80 °, and the time is 5min～30min.
Preparation method the most according to claim 6, it is characterised in that described copper powder particle or aluminum particle a diameter of
10 microns～1000 microns, cladding thickness is 0.1 millimeter～100 millimeters.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016567901A JP6407307B2 (en) | 2015-12-16 | 2016-08-15 | Vapor chamber, manufacturing method thereof, and vehicle headlight |
| PCT/CN2016/095322 WO2017101473A1 (en) | 2015-12-16 | 2016-08-15 | Planar vapor chamber and manufacturing method therefor, and automotive headlamp |
| PCT/CN2016/095323 WO2017101474A1 (en) | 2015-12-16 | 2016-08-15 | 三维立体均温板及其制备方法及汽车头灯 three-dimensional vapor chamber, and manufacturing method therefor, and automotive headlamp |
| JP2017505090A JP6407404B2 (en) | 2015-12-16 | 2016-08-15 | Planar vapor chamber, manufacturing method thereof, and vehicle headlight |
| TW105127450A TWI633268B (en) | 2015-12-16 | 2016-08-26 | Three-dimensional three-dimensional uniform temperature plate, preparation method thereof and automobile headlight |
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| CN201510947095.2A CN105371214A (en) | 2015-12-16 | 2015-12-16 | LED automobile head lamp |
| CN2015109470952 | 2015-12-16 |
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| CN106197104A true CN106197104A (en) | 2016-12-07 |
| CN106197104B CN106197104B (en) | 2019-03-01 |
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| CN201510947095.2A Pending CN105371214A (en) | 2015-12-16 | 2015-12-16 | LED automobile head lamp |
| CN201610346070.1A Active CN105972535B (en) | 2015-12-16 | 2016-05-20 | A kind of LED automobile head lamp |
| CN201610532707.6A Active CN106197104B (en) | 2015-12-16 | 2016-07-06 | Hot superconductive temperature equalizing radiator of 3 D stereo and preparation method thereof |
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| CN201610346070.1A Active CN105972535B (en) | 2015-12-16 | 2016-05-20 | A kind of LED automobile head lamp |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP2017112087A (en) |
| CN (3) | CN105371214A (en) |
| TW (1) | TWI633268B (en) |
| WO (1) | WO2017101474A1 (en) |
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| CN117950471B (en) * | 2024-03-27 | 2024-06-11 | 楚岳(惠州)热传科技有限公司 | Air-cooled radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106197104B (en) | 2019-03-01 |
| TW201723412A (en) | 2017-07-01 |
| CN105972535A (en) | 2016-09-28 |
| CN105972535B (en) | 2018-11-27 |
| TWI633268B (en) | 2018-08-21 |
| JP6407307B2 (en) | 2018-10-17 |
| JP2018506163A (en) | 2018-03-01 |
| WO2017101474A1 (en) | 2017-06-22 |
| JP2017112087A (en) | 2017-06-22 |
| CN105371214A (en) | 2016-03-02 |
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Address after: 510000 Room 502, building 7, No.188 Kaiyuan Avenue, Huangpu District, Guangzhou City, Guangdong Province Patentee after: GUANGZHOU GONGZHU TECHNOLOGY CO., LTD. Address before: Ke Feng Lu Science City high tech Industrial Development Zone of Guangzhou City, Guangdong province 510000 No. 31 Southern China new material innovation park G5 building fifth layer Patentee before: GUANGZHOU GONGZHU TECHNOLOGY CO., LTD. |
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