CN106189083A - The copper-clad plate that a kind of glass fabric strengthens - Google Patents
The copper-clad plate that a kind of glass fabric strengthens Download PDFInfo
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- CN106189083A CN106189083A CN201610544164.XA CN201610544164A CN106189083A CN 106189083 A CN106189083 A CN 106189083A CN 201610544164 A CN201610544164 A CN 201610544164A CN 106189083 A CN106189083 A CN 106189083A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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Abstract
The invention discloses the copper-clad plate that a kind of glass fabric strengthens, including prepreg, described prepreg is impregnated post-drying in epoxy resin adhesive by glass fabric and obtains, described epoxy resin adhesive is prepared from by the raw material of following weight parts: dicyclopentadiene type novolac epoxy resin 45 55 parts, four phenolic group ethane type epoxy resin 15 25 parts, N, N dimethyl benzylamine 0.3 3 parts, zinc octoate 0.3 3 parts, ethyl acetate 20 80 parts, high-k filler 200 300 parts, fire retardant 5 15 parts.The copper-clad plate that the glass fabric of the present invention strengthens, glass fabric is used to strengthen, and by rational proportioning, preferably go out applicable high-k filler, the kind of fire retardant and consumption, improve dielectric constant, fire resistance and peel strength, combination property is the most excellent, and filler dispersion effect is good, with low cost, environment friendliness.
Description
Technical field
The present invention relates to copper-clad plate technical field, particularly relate to the copper-clad plate that a kind of glass fabric strengthens.
Background technology
Along with the developing trend multifunction of electronic product, the parts of electronic product are also constantly to light, thin, short, little etc.
Aspect develops, especially the extensive application of high density integrated circuit technology, and consumer electronic product proposes high performance, highly reliable
Property and the requirement of high security；Industrial electronic product is proposed that technical performance is good, low cost, the requirement of low energy consumption.Therefore
The base material copper-clad plate face of the core material printed circuit board (Printed Circuit Board is called for short PCB) of electronic product
Face the requirement of higher technology, severeer use environment and higher environmental requirement.
Copper-clad plate (Copper Clad Laminate is called for short CCL), mainly for the production of printed circuit board, is with fiber
Paper, glass fabric or glass fibre non-woven (being commonly called as glass felt) etc. are as reinforcing material, and leaching is with resin, and single or double covers
With Copper Foil, through a kind of product of hot pressing.Existing copper-clad plate is owing to manufacturing raw material and manufacturing the diversity of structure, CCL
The technical performance of base material is each variant.
The use of politef (Poly Tetra Fluoro Ethylene is called for short PTFE) copper-clad plate is also increasingly subject to
Favor.Due to PTFE have outstanding dielectric properties (low-k and low dielectric loss) and good chemical stability and
Heat stability, thus PTFE copper-clad plate be mainly used in satellite communication, mobile radio communication, satellite broadcasting television radar equipment with
And the field such as computer.
Generally, PTFE copper-clad plate generally includes PTFE composite medium substrate, is positioned at relative the two of PTFE composite medium substrate
The layers of copper on surface and being arranged between PTFE composite medium substrate and layers of copper and for improving PTFE copper-clad plate high frequency performance
Adhesive linkage, this adhesive linkage is made up of inert material.Owing in this adhesive linkage, the strand of inert material is relatively big, adhesion performance is good,
It is not easy cutting.When using plain cutter to process plated-through-hole (Plated through hole, PTH) in PTFE copper-clad plate,
Easily produce a large amount of burrs in finished surface, and owing to these burrs are softer, it is not easy to remove.
Technological process is all there is complicated without in the preparation method of the PTFE composite medium substrate of reinforcing material existing, and
Need to add all kinds of organic additive, to improve the dispersion effect of PTFE and filler.During removing organic additive, the most all
Need long-time (more than 4h) high temperature (more than 200 DEG C) to process to remove organic additive, and also still there may be machine aided
The residual of agent, dielectric properties and water absorption to PTFE composite medium substrate have an impact.
Therefore, those skilled in the art is devoted to develop that a kind of comprehensive technical performance is excellent, possess good machinery again
Intensity and dimensional stability, the simultaneously lower-cost copper-clad plate of production cost, energy consumption and environmental protection.
Summary of the invention
For above-mentioned deficiency present in prior art, the technical problem to be solved is to provide a kind of glass fibers
The copper-clad plate that Wei Bu strengthens.
The present invention seeks to be achieved through the following technical solutions:
A kind of glass fabric strengthen copper-clad plate, including prepreg, described prepreg by glass fabric at asphalt mixtures modified by epoxy resin
Fat adhesive impregnates post-drying obtain.
Preferably, described epoxy resin adhesive is prepared from by the raw material of following weight parts: dicyclopentadiene type phenolic aldehyde
Epoxy resin 45-55 part, four phenolic group ethane type epoxy resin 15-25 parts, N, N-dimethyl benzylamine 0.3-3 part, zinc octoate 0.3-3
Part, ethyl acetate 20-80 part, high-k filler 200-300 part, fire retardant 5-15 part.
Preferably, described dicyclopentadiene type novolac epoxy resin can use commercially available Japanese ink chemical industry strain
The dicyclopentadiene type novolac epoxy resin of HP-7200L, HP-7200, HP-7200H, HP-7200HH that formula commercial firm produces.
Preferably, four described phenolic group ethane type epoxy resin can use commercially available MOMENTIVE company of the U.S. to produce
The four phenolic group ethane type epoxy resin of EPON1031.
Preferably, described high-k filler is the mixing of one or more in strontium titanates, SrNb2 O6, strontium zirconate
Thing.
It is highly preferred that described high-k filler is mixed by strontium titanates, SrNb2 O6, strontium zirconate, described metatitanic acid
Strontium, SrNb2 O6, the mass ratio of strontium zirconate are (1-3): (1-3): (1-3).
Preferably, described fire retardant is triethyl phosphate, three (2-chloroethyl) phosphate ester, tricresyl phosphate (the chloro-2-of 1-third
Base) mixture of one or more in ester.
It is highly preferred that described fire retardant is by triethyl phosphate, three (2-chloroethyl) phosphate ester, tricresyl phosphate (the chloro-2-of 1-third
Base) ester mixes, described triethyl phosphate, three (2-chloroethyl) phosphate ester, the mass ratio of tricresyl phosphate (1-chloro-2-propyl group) ester
For (1-3): (1-3): (1-3).
Preferably, the particle diameter of described high-k filler is 0.01-20 μm.
Preferably, described glass fabric is E grade fiberglass cloth, and grammes per square metre is 20-300g/m2, thickness is 0.01-
0.3mm, the E grade fiberglass cloth that commercially available model can be used to be 106,1080,2116,7628.
Preferably, described prepreg is impregnated in epoxy resin adhesive by glass fabric and obtains substrate, described base
In plate, the mass fraction of glass fabric is 75-95%, and the mass fraction of described substrate epoxy resin adhesive is 5-25%,
Then being placed in the baking oven of 80-120 DEG C by substrate, baking 1-3h obtains.
Preferably, the copper-clad plate that described glass fabric strengthens is opened after prepreg is superimposed with each other facing two by 1-10
Surface or a surface cover layers of copper, and then in hot press, hot pressing obtains.
Preferably, the thickness of described layers of copper is 3-150 μm.
The copper-clad plate that the glass fabric of the present invention strengthens, uses glass fabric to strengthen, and by reasonably joining
Ratio, preferably goes out applicable high-k filler, the kind of fire retardant and consumption, improves dielectric constant, fire resistance and stripping
From intensity, combination property is the most excellent, and filler dispersion effect is good, with low cost, environment friendliness.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is described further, the following stated, is only the preferable enforcement to the present invention
Example, not does the restriction of other forms to the present invention, and any those skilled in the art are possibly also with the disclosure above
Technology contents be changed to the Equivalent embodiments that changes on an equal basis.Every without departing from the present invention program content, according to the present invention
Technical spirit any simple modification that following example are done or equivalent variations, all fall within protection scope of the present invention.
Each raw material introduction in embodiment:
Dicyclopentadiene type novolac epoxy resin, uses the HP-7200L's that Japanese ink chemical industry Co., Ltd. produces
Dicyclopentadiene type novolac epoxy resin, epoxide equivalent 247g/eq.
Four phenolic group ethane type epoxy resin, use the four phenolic group ethane of the EPON1031 of MOMENTIVE company of U.S. production
Type epoxy resin, epoxide equivalent 210g/eq.
N, N-dimethyl benzylamine, No. CAS: 103-83-3.
Zinc octoate, No. CAS: 557-09-5.
Ethyl acetate, No. CAS: 141-78-6.
Strontium titanates, No. CAS: 12060-59-2, particle diameter 0.1 μm.
SrNb2 O6, No. CAS: 12034-89-8, particle diameter 0.1 μm.
Strontium zirconate, No. CAS: 12036-39-4, particle diameter 0.1 μm.
Triethyl phosphate, No. CAS: 78-40-0.
Three (2-chloroethyl) phosphate ester, No. CAS: 115-96-8.
Tricresyl phosphate (1-chloro-2-propyl group) ester, No. CAS: 13674-84-5.
Embodiment 1
Epoxy resin adhesive raw material (weight portion): dicyclopentadiene type novolac epoxy resin 50 parts, four phenolic group ethane types
Epoxy resin 20 parts, N, N-dimethyl benzylamine 0.6 part, zinc octoate 0.6 part, ethyl acetate 45 parts, high-k filler 250
Part, fire retardant 7.2 parts.
Described high-k filler is uniformly mixed for 1:1:1 in mass ratio by strontium titanates, SrNb2 O6, strontium zirconate
Obtain.
Described fire retardant is pressed matter by triethyl phosphate, three (2-chloroethyl) phosphate ester, tricresyl phosphate (1-chloro-2-propyl group) ester
Amount is uniformly mixed than for 1:1:1 and obtains.
Prepared by epoxy resin adhesive:
Dicyclopentadiene type novolac epoxy resin, four phenolic group ethane type epoxy resin, ethyl acetate are stirred with 400 revs/min
Mix 5 minutes, be subsequently adding N, N-dimethyl benzylamine, zinc octoate with 300 revs/min stir 10 minutes, be eventually adding high-k
Filler, fire retardant stir 60 minutes with 300 revs/min.Obtain the epoxy resin adhesive of embodiment 1 preparation.
Prepared by the copper-clad plate that glass fabric strengthens: (glass fabric is used the Dongguan City extensively letter limited public affairs of composite
The E grade fiberglass cloth 106 that department provides, grammes per square metre is 25g/m2, thickness is 0.03mm) and it is immersed in asphalt mixtures modified by epoxy resin prepared by embodiment 1
Obtaining impregnated cloth in fat adhesive, the content controlling glass fabric is 10wt% (the i.e. content of glass fabric in impregnated cloth
For 10wt%, the content of epoxy resin adhesive is 90wt%), then impregnated cloth is placed in the baking oven of 100 DEG C, toasts 2h,
Remove solvent, obtain prepreg；Using five prepregs to be superimposed with each other and obtain substrate, at substrate two, facing surfaces covers 30 μm
Thick layers of copper (using the Copper Foil that model is TU25 that the golden one hundred product of rubber and plastic factory of Dongguan City end of the bridge provides), then enters in hot press
Row hot pressing, applies pressure 400PSI, and minimum temperature is 50 DEG C, and maximum temperature is 380 DEG C, is that 3 DEG C/min heats up with speed, reaches
40min is kept after maximum temperature 380 DEG C.Obtain the copper-clad plate that the glass fabric of embodiment 1 strengthens.
Embodiment 2
Substantially the same manner as Example 1, differ only in: described high-k filler by SrNb2 O6, strontium zirconate by matter
Amount is uniformly mixed than for 1:1 and obtains.Obtain the copper-clad plate that the glass fabric of embodiment 2 strengthens.
Embodiment 3
Substantially the same manner as Example 1, differ only in: described high-k filler by strontium titanates, strontium zirconate by matter
Amount is uniformly mixed than for 1:1 and obtains.Obtain the copper-clad plate that the glass fabric of embodiment 3 strengthens.
Embodiment 4
Substantially the same manner as Example 1, differ only in: described high-k filler by strontium titanates, SrNb2 O6 by matter
Amount is uniformly mixed than for 1:1 and obtains.Obtain the copper-clad plate that the glass fabric of embodiment 4 strengthens.
Embodiment 5
Substantially the same manner as Example 1, differ only in: described fire retardant is by three (2-chloroethyl) phosphate ester, tricresyl phosphate
(1-chloro-2-propyl group) ester is uniformly mixed for 1:1 in mass ratio and obtains.Obtain embodiment 5 glass fabric strengthen cover
Copper coin.
Embodiment 6
Substantially the same manner as Example 1, differ only in: described fire retardant is by triethyl phosphate, tricresyl phosphate (the chloro-2-of 1-
Propyl group) ester is uniformly mixed for 1:1 in mass ratio and obtains.Obtain the copper-clad plate that the glass fabric of embodiment 6 strengthens.
Embodiment 7
Substantially the same manner as Example 1, differ only in: described fire retardant is by triethyl phosphate, three (2-chloroethyl) phosphorus
Acid esters is uniformly mixed for 1:1 in mass ratio and obtains.Obtain the copper-clad plate that the glass fabric of embodiment 7 strengthens.
Test case 1
Respectively by the dielectric constant (Dk) of copper-clad plate of glass fabric enhancing prepared for embodiment 1-7, peel strength, resistance
Combustion performance is tested.Method of testing is as follows: dielectric constant (Dk): test uses IPC-TM-6502.5.5.9 method；Peel off strong
Degree: test uses IPC-TM-6502.4.8 method；Limited oxygen index uses SH5706 plastic burning oxygen index measurer (wide
Zhou Xin standing grain Electronics Equipment Co., Ltd) test according to the method for GB/T2406-2009.Concrete outcome is shown in Table 1.
Table 1: test result table
The dielectric loss Df test result of the embodiment of the present invention 1 is 0.0013, can reach high-k, low Jie simultaneously
The performance such as electrical loss, high-peeling strength, combination property is the most excellent.Comparing embodiment 1 and embodiment 2-4, embodiment 1 (metatitanic acid
Strontium, SrNb2 O6, strontium zirconate are compounding) test result be substantially better than embodiment 2-4 (in strontium titanates, SrNb2 O6, strontium zirconate arbitrarily the two
Compounding)；Comparing embodiment 1 and embodiment 5-7, embodiment 1 (triethyl phosphate, three (2-chloroethyl) phosphate ester, tricresyl phosphate (1-
Chloro-2-propyl group) ester compounds) test result is substantially better than embodiment 5-7 (triethyl phosphate, three (2-chloroethyl) phosphate ester, phosphoric acid
In three (1-chloro-2-propyl group) ester, arbitrarily the two is compounding).
Test case 2
The resistance to electric arc of the copper-clad plate strengthened by the glass fabric that embodiment 1-7 prepares respectively is tested.Resistance to electric arc: press
Standard Q/GDSY6050-20122.5.1 is tested.Concrete test result is shown in Table 2.
Table 2: insulating properties test result table
| Sample | Resistance to electric arc, Kv |
| Embodiment 1 | 150 |
| Embodiment 2 | 146 |
| Embodiment 3 | 144 |
| Embodiment 4 | 148 |
| Embodiment 5 | 142 |
| Embodiment 6 | 140 |
| Embodiment 7 | 139 |
Comparing embodiment 1 and embodiment 2-4, embodiment 1 (strontium titanates, SrNb2 O6, strontium zirconate are compounding) insulating properties are obvious
It is better than embodiment 2-4 (in strontium titanates, SrNb2 O6, strontium zirconate, arbitrarily the two is compounding)；Comparing embodiment 1 and embodiment 5-7, implement
Example 1 (triethyl phosphate, three (2-chloroethyl) phosphate ester, tricresyl phosphate (1-chloro-2-propyl group) ester are compounding) insulating properties are substantially better than
Embodiment 5-7 (in triethyl phosphate, three (2-chloroethyl) phosphate ester, tricresyl phosphate (1-chloro-2-propyl group) ester, arbitrarily the two is compounding).
Claims (10)
1. glass fabric strengthen a copper-clad plate, including prepreg, described prepreg by glass fabric at epoxy resin
Adhesive impregnates post-drying obtain；
Described epoxy resin adhesive is prepared from by the raw material of following weight parts: dicyclopentadiene type novolac epoxy resin 45-
55 parts, four phenolic group ethane type epoxy resin 15-25 parts, N, N-dimethyl benzylamine 0.3-3 part, zinc octoate 0.3-3 part, ethyl acetate
20-80 part, high-k filler 200-300 part, fire retardant 5-15 part.
2. the copper-clad plate that glass fabric as claimed in claim 1 strengthens, it is characterised in that: described high-k filler
For the mixture of one or more in strontium titanates, SrNb2 O6, strontium zirconate.
3. the copper-clad plate that glass fabric as claimed in claim 2 strengthens, it is characterised in that: described high-k filler
Being mixed by strontium titanates, SrNb2 O6, strontium zirconate, described strontium titanates, SrNb2 O6, the mass ratio of strontium zirconate are (1-3): (1-3):
(1-3)。
4. the copper-clad plate that the glass fabric as according to any one of claim 1-3 strengthens, it is characterised in that: described is fire-retardant
Agent is the mixture of one or more in triethyl phosphate, three (2-chloroethyl) phosphate ester, tricresyl phosphate (1-chloro-2-propyl group) ester.
5. the copper-clad plate that glass fabric as claimed in claim 4 strengthens, it is characterised in that: described fire retardant is by tricresyl phosphate
Ethyl ester, three (2-chloroethyl) phosphate ester, tricresyl phosphate (1-chloro-2-propyl group) ester mix, described triethyl phosphate, three (2-chlorine
Ethyl) phosphate ester, the mass ratio of tricresyl phosphate (1-chloro-2-propyl group) ester be (1-3): (1-3): (1-3).
6. the copper-clad plate that the glass fabric as according to any one of claim 1-3 strengthens, it is characterised in that: described Gao Jie
The particle diameter of electric constant filler is 0.01-20 μm.
7. the copper-clad plate that the glass fabric as according to any one of claim 1-3 strengthens, it is characterised in that: described glass
Fiber cloth is E grade fiberglass cloth, and grammes per square metre is 20-300g/m2, thickness is 0.01-0.3mm.
8. the copper-clad plate that the glass fabric as according to any one of claim 1-3 strengthens, it is characterised in that: described preimpregnation
Material is impregnated in epoxy resin adhesive by glass fabric and obtains substrate, and in described substrate, the mass fraction of glass fabric is
75-95%, the mass fraction of described substrate epoxy resin adhesive is 5-25%, and then substrate is placed in the baking of 80-120 DEG C
In case, baking 1-3h obtains.
9. the copper-clad plate that the glass fabric as according to any one of claim 1-3 strengthens, it is characterised in that: described glass
The copper-clad plate that fiber cloth strengthens is opened by 1-10 and is covered layers of copper, so two facing surfaces or a surface after prepreg is superimposed with each other
After in hot press hot pressing obtain.
10. the copper-clad plate that the glass fabric as according to any one of claim 1-3 strengthens, it is characterised in that: described copper
The thickness of layer is 3-150 μm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610544164.XA CN106189083B (en) | 2016-07-12 | 2016-07-12 | A kind of copper-clad plate of glass fabric enhancing |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610544164.XA CN106189083B (en) | 2016-07-12 | 2016-07-12 | A kind of copper-clad plate of glass fabric enhancing |
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| CN106189083A true CN106189083A (en) | 2016-12-07 |
| CN106189083B CN106189083B (en) | 2018-05-15 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107603544A (en) * | 2017-09-06 | 2018-01-19 | 深圳市峰泳科技有限公司 | A kind of fexible film capacitor high dielectric substance electronics adhesive and preparation method thereof |
| CN109397521A (en) * | 2018-10-19 | 2019-03-01 | 德阳科吉高新材料有限责任公司 | A kind of manufacturing process of high-speed rail plate |
| JP6870778B1 (en) * | 2020-12-11 | 2021-05-12 | 昭和電工マテリアルズ株式会社 | Resin composition for molding and electronic component equipment |
| CN113597121A (en) * | 2021-07-29 | 2021-11-02 | 江西倍韬新材料科技有限公司 | Manufacturing method of glass fiber cloth reinforced copper-clad plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101914265A (en) * | 2010-07-24 | 2010-12-15 | 广州美嘉伟华电子材料有限公司 | A kind of non-halogen phosphorus-containing flame retardant high-frequency epoxy resin based composition and the application in bonding sheet and copper-clad plate thereof |
| CN103351581A (en) * | 2013-07-19 | 2013-10-16 | 广东生益科技股份有限公司 | High-dielectric-constant resin composition and application thereof |
| CN104817823A (en) * | 2015-05-19 | 2015-08-05 | 广州宏仁电子工业有限公司 | Halogen resin composition and application thereof |
-
2016
- 2016-07-12 CN CN201610544164.XA patent/CN106189083B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101914265A (en) * | 2010-07-24 | 2010-12-15 | 广州美嘉伟华电子材料有限公司 | A kind of non-halogen phosphorus-containing flame retardant high-frequency epoxy resin based composition and the application in bonding sheet and copper-clad plate thereof |
| CN103351581A (en) * | 2013-07-19 | 2013-10-16 | 广东生益科技股份有限公司 | High-dielectric-constant resin composition and application thereof |
| CN104817823A (en) * | 2015-05-19 | 2015-08-05 | 广州宏仁电子工业有限公司 | Halogen resin composition and application thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107603544A (en) * | 2017-09-06 | 2018-01-19 | 深圳市峰泳科技有限公司 | A kind of fexible film capacitor high dielectric substance electronics adhesive and preparation method thereof |
| CN109397521A (en) * | 2018-10-19 | 2019-03-01 | 德阳科吉高新材料有限责任公司 | A kind of manufacturing process of high-speed rail plate |
| JP6870778B1 (en) * | 2020-12-11 | 2021-05-12 | 昭和電工マテリアルズ株式会社 | Resin composition for molding and electronic component equipment |
| WO2022123799A1 (en) * | 2020-12-11 | 2022-06-16 | 昭和電工マテリアルズ株式会社 | Molding resin composition and electronic component device |
| JP2022092991A (en) * | 2020-12-11 | 2022-06-23 | 昭和電工マテリアルズ株式会社 | Molding resin composition and electronic component device |
| CN113597121A (en) * | 2021-07-29 | 2021-11-02 | 江西倍韬新材料科技有限公司 | Manufacturing method of glass fiber cloth reinforced copper-clad plate |
| CN113597121B (en) * | 2021-07-29 | 2022-07-05 | 江西倍韬新材料科技有限公司 | Manufacturing method of glass fiber cloth reinforced copper-clad plate |
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