CN106065162A - A kind of Halogen-free antibacterial composition epoxy resin and application thereof - Google Patents
A kind of Halogen-free antibacterial composition epoxy resin and application thereof Download PDFInfo
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- CN106065162A CN106065162A CN201610562103.6A CN201610562103A CN106065162A CN 106065162 A CN106065162 A CN 106065162A CN 201610562103 A CN201610562103 A CN 201610562103A CN 106065162 A CN106065162 A CN 106065162A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
- B32B2307/7145—Rot proof, resistant to bacteria, mildew, mould, fungi
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a kind of Halogen-free antibacterial composition epoxy resin and application thereof, described Halogen-free antibacterial composition epoxy resin is prepared from by the raw material of following weight parts: phosphorous epoxy resin 45 55 parts, rubber modified epoxy resin 15 25 parts, phenol type novolac epoxy resin 23 33 parts, amine terminated polyether 10 20 parts, 1 amino 5 naphthols 15 parts, propylene glycol methyl ether acetate 15 45 parts, curing accelerator 0.01 1 parts, inorganic antiseptic 1 10 parts.The Halogen-free antibacterial composition epoxy resin of the present invention, by rational proportioning, preferably goes out applicable inorganic antiseptic, the kind of curing accelerator and consumption, improve anti-microbial property and peel strength, combination property is the most excellent, and filler dispersion effect is good, with low cost, environment friendliness.
Description
Technical field
The present invention relates to chemical technology field, particularly relate to a kind of Halogen-free antibacterial composition epoxy resin and application thereof.
Background technology
Along with the developing trend multifunction of electronic product, the parts of electronic product are also constantly to light, thin, short, little etc.
Aspect develops, especially the extensive application of high density integrated circuit technology, and consumer electronic product proposes high performance, highly reliable
Property and the requirement of high security；Industrial electronic product is proposed that technical performance is good, low cost, the requirement of low energy consumption.Therefore
The base material copper-clad plate face of the core material printed circuit board (Printed Circuit Board is called for short PCB) of electronic product
Face the requirement of higher technology, severeer use environment and higher environmental requirement.
Copper-clad plate (Copper Clad Laminate is called for short CCL), mainly for the production of printed circuit board, is with fiber
Paper, glass fabric or glass fibre non-woven (being commonly called as glass felt) etc. are as reinforcing material, and leaching is with resin, and single or double covers
With Copper Foil, through a kind of product of hot pressing.Existing copper-clad plate is owing to manufacturing raw material and manufacturing the diversity of structure, CCL
The technical performance of base material is each variant.
Resin liquid in copper-clad plate generally uses compositions of thermosetting resin.Thermosetting resin refers to that resin is heating, adding
Depressing or under firming agent, action of ultraviolet light, carry out chemical reaction, crosslinking curing becomes a big class synthesis tree of not fusant matter
Fat.Conventional thermosetting resin have phenolic resin, Lauxite, melamine formaldehyde resin, epoxy resin, unsaturated-resin,
Polyurethane, polyimides etc..The composition compositions of thermosetting resin such as thermosetting resin and firming agent, accelerator, filler, then through adjusting
It is made for resin liquid to use in metal-clad foil plate.In order to make metal-clad foil plate have preferable insulating properties, generally at resin
Liquid can add filler.
Epoxy resin refers to containing two or more epoxide groups in molecule, with aliphatic, alicyclic or aromatic series
It is skeleton Deng organic compound, and generation three can be reacted in the presence of suitable chemical reagent (firming agent) by epoxide group
Tie up the general name of the compound of netted solidfied material.Epoxy resin is owing to having good chemical stability, electrical insulating property, corrosion-resistant
Property, caking property and mechanical strength, be widely used in the material of printed circuit board (PCB) as binding agent.
Therefore, those skilled in the art is devoted to develop that a kind of comprehensive technical performance is excellent, possess relatively high-vitrification again
The antimicrobial composite material of transition temperature and relatively high-peeling strength.
Summary of the invention
For above-mentioned deficiency present in prior art, the technical problem to be solved is to provide a kind of Halogen and resists
Collarium epoxy resin composition and application thereof.
The present invention seeks to be achieved through the following technical solutions:
A kind of Halogen-free antibacterial composition epoxy resin, is prepared from by the raw material of following weight parts: phosphorous epoxy resin 45-
55 parts, rubber modified epoxy resin 15-25 part, phenol type novolac epoxy resin 23-33 part, amine terminated polyether 10-20 part, 1-ammonia
Base-5-naphthols 1-5 part, propylene glycol methyl ether acetate 15-45 part, curing accelerator 0.01-1 part, inorganic antiseptic 1-10 part.
Preferably, described inorganic antiseptic is the mixture of one or more in wolframic acid silver, silver iodide, silver phosphate.
It is highly preferred that described inorganic antiseptic is mixed by wolframic acid silver, silver iodide, silver phosphate, described wolframic acid silver, iodine
Change silver, the mass ratio of silver phosphate is (1-3): (1-3): (1-3).
Preferably, described curing accelerator be 4-methyl-2-phenylimidazole, 1-1-cyanoethyl-2-methylimidazole, 1-(β-
Ethoxy) mixture of one or more in-2-methylimidazole.
It is highly preferred that described curing accelerator is by 4-methyl-2-phenylimidazole, 1-1-cyanoethyl-2-methylimidazole, 1-
(beta-hydroxyethyl)-2-methylimidazole mixes, described 4-methyl-2-phenylimidazole, 1-1-cyanoethyl-2-methylimidazole, 1-(β-
Ethoxy) mass ratio of-2-methylimidazole is (1-3): (1-3): (1-3).
Preferably, the particle diameter of described inorganic antiseptic is 0.01-20 μm.
Preferably, described phosphorous epoxy resin can use commercially available rivers and mountains Jiang Huanhua Industrial Co., Ltd to produce
Model is the phosphorous epoxy resin of G-24, epoxide equivalent 340g/eq, phosphorus content 2.4wt%.
Preferably, described rubber modified epoxy resin can use commercially available Hexion Specialty
The rubber modified epoxy resin that model is Epon Resin58005 that Chemicals, Inc. produce, elastomer content 40wt%.
Preferably, described phenol type novolac epoxy resin can use commercially available Changchun, Taiwan artificial resin factory to produce
The trade mark is the phenol type novolac epoxy resin of PNE177, epoxide equivalent 177g/eq.
Preferably, described amine terminated polyether can use commercially available HUNTSMAN company to provide
T3000 amine terminated polyether, relative molecular mass is 3000.
Present invention also offers the application in preparation copper-clad plate of the above-mentioned Halogen-free antibacterial composition epoxy resin.
The preparation method of copper-clad plate can be: by glass fabric in the Halogen-free antibacterial composition epoxy resin of the present invention
Dipping, dries the most at a certain temperature, removes solvent and carries out semi-solid preparation, obtaining prepreg；Then above-mentioned prepreg is taken
One or more is superimposed together according to a definite sequence, is covered by Copper Foil in the prepreg both sides being superimposed with each other respectively, in hot pressing
In machine, solidification prepares copper-clad plate.
The Halogen-free antibacterial composition epoxy resin of the present invention, by rational proportioning, preferably go out applicable inorganic antiseptic,
The kind of curing accelerator and consumption, improve anti-microbial property and peel strength, and combination property is the most excellent, filler dispersion effect
Good, with low cost, environment friendliness.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is described further, the following stated, is only the preferable enforcement to the present invention
Example, not does the restriction of other forms to the present invention, and any those skilled in the art are possibly also with the disclosure above
Technology contents be changed to the Equivalent embodiments that changes on an equal basis.Every without departing from the present invention program content, according to the present invention
Technical spirit any simple modification that following example are done or equivalent variations, all fall within protection scope of the present invention.
Each raw material introduction in embodiment:
Phosphorous epoxy resin, uses the phosphorous asphalt mixtures modified by epoxy resin that model is G-24 that rivers and mountains Jiang Huanhua Industrial Co., Ltd produces
Fat, epoxide equivalent 340g/eq, phosphorus content 2.4wt%.
Rubber modified epoxy resin, the model using Hexion Specialty Chemicals, Inc. to produce is Epon
The rubber modified epoxy resin of Resin58005, elastomer content 40wt%.
Phenol type novolac epoxy resin, uses the phenol type phenol that the trade mark is PNE177 that Changchun, Taiwan artificial resin factory produces
Formaldehyde epoxy resin, epoxide equivalent 177g/eq.
Amine terminated polyether, uses HUNTSMAN company to provideT3000 amine terminated polyether, divides relatively
Protonatomic mass is 3000.
1-amino-5-naphthols, No. CAS: 83-55-6.
Propylene glycol methyl ether acetate, No. CAS: 108-65-6.
Wolframic acid silver, No. CAS: 13465-93-5, particle diameter 0.1 μm.
Silver iodide, No. CAS: 7783-96-2, particle diameter 0.1 μm.
Silver phosphate, No. CAS: 7784-09-0, particle diameter 0.1 μm.
4-methyl-2-phenylimidazole, No. CAS: 827-43-0.
1-1-cyanoethyl-2-methylimidazole, No. CAS: 23996-55-6.
1-(beta-hydroxyethyl)-2-methylimidazole, No. CAS: 1615-15-2.
Embodiment 1
Halogen-free antibacterial composition epoxy resin raw material (weight portion): phosphorous epoxy resin 50 parts, rubber modified epoxy resin
20 parts, phenol type novolac epoxy resin 28 parts, amine terminated polyether 15 parts, 1-amino-5-naphthols 2.5 parts, propylene glycol monomethyl ether acetic acid
Ester 20 parts, curing accelerator 0.3 part, inorganic antiseptic 3 parts.
Described inorganic antiseptic is uniformly mixed for 1:1:1 in mass ratio by wolframic acid silver, silver iodide, silver phosphate
Arrive.
Described curing accelerator by 4-methyl-2-phenylimidazole, 1-1-cyanoethyl-2-methylimidazole, 1-(beta-hydroxyethyl)-
2-methylimidazole is uniformly mixed for 1:1:1 in mass ratio and obtains.
Prepared by Halogen-free antibacterial composition epoxy resin:
By phosphorous epoxy resin, rubber modified epoxy resin, amine terminated polyether, propylene glycol methyl ether acetate with 400 revs/min
Stir 5 minutes, be subsequently adding phenol type novolac epoxy resin, 1-amino-5-naphthols, curing accelerator with 300 revs/min of stirrings 10
Minute, it is eventually adding inorganic antiseptic and stirs 60 minutes with 300 revs/min.Obtain the Halogen-free antibacterial epoxy resin of embodiment 1 preparation
Compositions.
Prepared by copper-clad plate: (glass fabric is used the E level glass fibers that Dongguan City Guang Hong composite company limited provides
Dimension cloth 106, grammes per square metre is 25g/m2, thickness is 0.03mm) it is immersed in the Halogen-free antibacterial composition epoxy resin of embodiment 1 preparation
Obtaining impregnated cloth, the content controlling glass fabric is that (i.e. in impregnated cloth, the content of glass fabric is 10wt% to 10wt%, nothing
The content of the antibacterial composition epoxy resin of halogen is 90wt%), then impregnated cloth is placed in the baking oven of 100 DEG C, toasts 2h, remove
Solvent, obtains prepreg；Using five prepregs to be superimposed with each other and obtain substrate, at substrate two, facing surfaces covers 30 μ m-thick
Layers of copper (using the Copper Foil that model is TU25 that the golden one hundred product of rubber and plastic factory of Dongguan City end of the bridge provides) is laminated, and applies pressure
400PSI, minimum temperature is 50 DEG C, and maximum temperature is 380 DEG C, is that 3 DEG C/min heats up, after reaching maximum temperature 380 DEG C with speed
Keep 40min.Obtain the copper-clad plate of embodiment 1.
Embodiment 2
Substantially the same manner as Example 1, differ only in: described inorganic antiseptic is by silver iodide, silver phosphate in mass ratio
It is uniformly mixed for 1:1 and obtains.Obtain Halogen-free antibacterial composition epoxy resin and the copper-clad plate of embodiment 2.
Embodiment 3
Substantially the same manner as Example 1, differ only in: described inorganic antiseptic is by wolframic acid silver, silver phosphate in mass ratio
It is uniformly mixed for 1:1 and obtains.Obtain Halogen-free antibacterial composition epoxy resin and the copper-clad plate of embodiment 3.
Embodiment 4
Substantially the same manner as Example 1, differ only in: described inorganic antiseptic is by wolframic acid silver, silver iodide in mass ratio
It is uniformly mixed for 1:1 and obtains.Obtain Halogen-free antibacterial composition epoxy resin and the copper-clad plate of embodiment 4.
Embodiment 5
Substantially the same manner as Example 1, differ only in: described curing accelerator is by 1-1-cyanoethyl-2-methylimidazole, 1-
(beta-hydroxyethyl)-2-methylimidazole is uniformly mixed for 1:1 in mass ratio and obtains.Obtain the Halogen-free antibacterial epoxy of embodiment 5
Resin combination and copper-clad plate.
Embodiment 6
Substantially the same manner as Example 1, differ only in: described curing accelerator is by 4-methyl-2-phenylimidazole, 1-
(beta-hydroxyethyl)-2-methylimidazole is uniformly mixed for 1:1 in mass ratio and obtains.Obtain the Halogen-free antibacterial epoxy of embodiment 6
Resin combination and copper-clad plate.
Embodiment 7
Substantially the same manner as Example 1, differ only in: described curing accelerator is by 4-methyl-2-phenylimidazole, 1-cyanogen
Ethyl-2-Methyl imidazoles is uniformly mixed for 1:1 in mass ratio and obtains.Obtain the Halogen-free antibacterial epoxy resin group of embodiment 7
Compound and copper-clad plate.
Test case 1
The glass transition temperature of copper-clad plate, the peel strength that embodiment 1-7 are prepared respectively are tested.Method of testing
As follows: glass transition temperature Tg: to be measured according to the DMA method of IPC-TM-6502.4.24 defined.Peel strength PS:
According to experiment condition " after thermal stress " in IPC-TM-6502.4.8 method, the peel strength of test sheet material.Concrete outcome is shown in Table 1.
Table 1: glass transition temperature, peel strength test result table
Comparing embodiment 1 and embodiment 2-4, embodiment 1 (wolframic acid silver, silver iodide, silver phosphate are compounding) glass transition temperature
Degree, peel strength test result are substantially better than embodiment 2-4 (in wolframic acid silver, silver iodide, silver phosphate, arbitrarily the two is compounding)；Relatively
Embodiment 1 and embodiment 5-7, embodiment 1 (4-methyl-2-phenylimidazole, 1-1-cyanoethyl-2-methylimidazole, 1-(β-hydroxyl second
Base)-2-methylimidazole compounds) glass transition temperature, peel strength test result be substantially better than embodiment 5-7 (4-methyl-2-
In phenylimidazole, 1-1-cyanoethyl-2-methylimidazole, 1-(beta-hydroxyethyl)-2-methylimidazole, arbitrarily the two is compounding).
Test case 2
The anti-microbial property of prepreg embodiment 1-7 prepared respectively is tested.Carry out by QB/T2591-2003 method
Measure.Escherichia coli ATYCC 25922, staphylococcus aureus ATCC6538.Concrete test result is shown in Table 2.
Table 2: anti-microbial property test result table
Comparing embodiment 1 and embodiment 2-4, embodiment 1 (wolframic acid silver, silver iodide, silver phosphate are compounding) anti-microbial property is obvious
It is better than embodiment 2-4 (in wolframic acid silver, silver iodide, silver phosphate, arbitrarily the two is compounding)；Comparing embodiment 1 and embodiment 5-7, implement
Example 1 (4-methyl-2-phenylimidazole, 1-1-cyanoethyl-2-methylimidazole, 1-(beta-hydroxyethyl)-2-methylimidazole are compounding) antibiotic property
Embodiment 5-7 (4-methyl-2-phenylimidazole, 1-1-cyanoethyl-2-methylimidazole, 1-(beta-hydroxyethyl)-2-methyl can be substantially better than
In imidazoles, arbitrarily the two is compounding).
Test case 3
The resistance to electric arc of copper-clad plate embodiment 1 prepared with embodiment 5-7 respectively is tested.Resistance to electric arc: by standard Q/
GDSY6050-20122.5.1 tests.Concrete test result is shown in Table 3.
Table 3: insulating properties test result table
| Sample | Resistance to electric arc, Kv |
| Embodiment 1 | 146 |
| Embodiment 5 | 135 |
| Embodiment 6 | 139 |
| Embodiment 7 | 138 |
Comparing embodiment 1 and embodiment 5-7, embodiment 1 (4-methyl-2-phenylimidazole, 1-1-cyanoethyl-2-methylimidazole,
1-(beta-hydroxyethyl)-2-methylimidazole compounds) insulating properties are substantially better than embodiment 5-7 (4-methyl-2-phenylimidazole, 1-cyanogen
In Ethyl-2-Methyl imidazoles, 1-(beta-hydroxyethyl)-2-methylimidazole, arbitrarily the two is compounding).
Claims (7)
1. a Halogen-free antibacterial composition epoxy resin, it is characterised in that: it is prepared from by the raw material of following weight parts: phosphorous ring
Epoxy resins 45-55 part, rubber modified epoxy resin 15-25 part, phenol type novolac epoxy resin 23-33 part, amine terminated polyether 10-
20 parts, 1-amino-5-naphthols 1-5 part, propylene glycol methyl ether acetate 15-45 part, curing accelerator 0.01-1 part, inorganic antiseptic
1-10 part.
2. Halogen-free antibacterial composition epoxy resin as claimed in claim 1, it is characterised in that: described inorganic antiseptic is tungsten
The mixture of one or more in acid silver, silver iodide, silver phosphate.
3. Halogen-free antibacterial composition epoxy resin as claimed in claim 2, it is characterised in that: described inorganic antiseptic is by tungsten
Acid silver, silver iodide, silver phosphate mix, and described wolframic acid silver, silver iodide, the mass ratio of silver phosphate are (1-3): (1-3): (1-
3)。
4. the Halogen-free antibacterial composition epoxy resin as according to any one of claim 1-3, it is characterised in that: described solidification
Accelerator be a kind of in 4-methyl-2-phenylimidazole, 1-1-cyanoethyl-2-methylimidazole, 1-(beta-hydroxyethyl)-2-methylimidazole or
Multiple mixture.
5. Halogen-free antibacterial composition epoxy resin as claimed in claim 4, it is characterised in that: described curing accelerator is by 4-
Methyl-2-phenylimidazole, 1-1-cyanoethyl-2-methylimidazole, 1-(beta-hydroxyethyl)-2-methylimidazole mix, described 4-first
Base-2-phenylimidazole, 1-1-cyanoethyl-2-methylimidazole, the mass ratio of 1-(beta-hydroxyethyl)-2-methylimidazole are (1-3): (1-
3): (1-3).
6. the Halogen-free antibacterial composition epoxy resin as according to any one of claim 1-3, it is characterised in that: described is inorganic
The particle diameter of antibacterial is 0.01-20 μm.
7. the application in preparation copper-clad plate of the Halogen-free antibacterial composition epoxy resin as according to any one of claim 1-6.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113717497A (en) * | 2021-09-13 | 2021-11-30 | 贵溪奥泰铜业有限公司 | Production method of high-flexibility copper-clad plate |
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| CN1432753A (en) * | 2002-01-15 | 2003-07-30 | 黄振群 | Drinking water pipeline of efficient antiseptic composite material |
| CN102558765A (en) * | 2010-12-15 | 2012-07-11 | 新高电子材料（中山）有限公司 | Halogen-free fire-retardant high heat conducting insulating resin composition and heat dissipation metal-base copper clad plate |
| CN103694639A (en) * | 2013-12-19 | 2014-04-02 | 广东生益科技股份有限公司 | Halogen-free anti-aging epoxy resin composition and method for preparing cover film by using same |
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2016
- 2016-07-18 CN CN201610562103.6A patent/CN106065162B/en active Active
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|---|---|---|---|---|
| CN1432753A (en) * | 2002-01-15 | 2003-07-30 | 黄振群 | Drinking water pipeline of efficient antiseptic composite material |
| CN102558765A (en) * | 2010-12-15 | 2012-07-11 | 新高电子材料（中山）有限公司 | Halogen-free fire-retardant high heat conducting insulating resin composition and heat dissipation metal-base copper clad plate |
| CN103694639A (en) * | 2013-12-19 | 2014-04-02 | 广东生益科技股份有限公司 | Halogen-free anti-aging epoxy resin composition and method for preparing cover film by using same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113717497A (en) * | 2021-09-13 | 2021-11-30 | 贵溪奥泰铜业有限公司 | Production method of high-flexibility copper-clad plate |
| CN113717497B (en) * | 2021-09-13 | 2023-07-18 | 贵溪奥泰铜业有限公司 | Production method of high-flexibility copper-clad plate |
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