CN106189083B - A kind of copper-clad plate of glass fabric enhancing - Google Patents
A kind of copper-clad plate of glass fabric enhancing Download PDFInfo
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- CN106189083B CN106189083B CN201610544164.XA CN201610544164A CN106189083B CN 106189083 B CN106189083 B CN 106189083B CN 201610544164 A CN201610544164 A CN 201610544164A CN 106189083 B CN106189083 B CN 106189083B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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Abstract
The invention discloses a kind of copper-clad plate of glass fabric enhancing, including prepreg, the prepreg to dry after being impregnated by glass fabric in epoxy resin adhesive and obtain, and the epoxy resin adhesive is prepared by the raw material of following weight parts：45 55 parts of dicyclopentadiene type novolac epoxy resin, four 15 25 parts of phenolic group ethane type epoxy resin, N, 0.3 3 parts of N dimethyl benzylamines, 0.3 3 parts of zinc octoate, 20 80 parts of ethyl acetate, 200 300 parts of high-k filler, 5 15 parts of fire retardant.The copper-clad plate of the glass fabric enhancing of the present invention, strengthened using glass fabric, and by reasonably matching, it is preferred that go out the species and dosage of suitable high-k filler, fire retardant, dielectric constant, fire resistance and peel strength are improved, comprehensive performance is very excellent, and filler dispersion effect is good, it is of low cost, it is environment friendliness.
Description
Technical field
The present invention relates to copper-clad plate technical field, more particularly to a kind of copper-clad plate of glass fabric enhancing.
Background technology
With the developing trend multifunction of electronic product, the parts of electronic product are also constantly to light, thin, short, small etc.
Aspect develops, the especially extensive use of high density integrated circuit technology, and high performance, highly reliable is proposed to consumer electronic product
The requirement of property and high security；Good technical performance, low cost, the requirement of low energy consumption are proposed to industrial electronic product.Therefore
The base material copper-clad plate face of the core material of electronic product --- printed circuit board (Printed Circuit Board, abbreviation PCB)
Face the environmental requirement of the technical requirements of higher, severeer use environment and higher.
Copper-clad plate (Copper Clad Laminate, abbreviation CCL) is with fiber mainly for the production of printed circuit board
Paper, glass fabric or glass fibre non-woven (being commonly called as glass felt) etc. are used as reinforcing material, soak and are covered with resin, single or double
With copper foil, a kind of product formed through hot pressing.Existing copper-clad plate is due to manufacture raw material and the otherness of manufacture structure, CCL
The technical performance of base material is different.
The use of polytetrafluoroethylene (PTFE) (Poly Tetra Fluoro Ethylene, abbreviation PTFE) copper-clad plate is also increasingly subject to
Favor.Due to PTFE have outstanding dielectric properties (low-k and low dielectric loss) and good chemical stability and
Heat endurance, thus PTFE copper-clad plates be mainly used for satellite communication, mobile radio communication, satellite broadcasting television radar equipment with
And the field such as computer.
In general, PTFE copper-clad plates generally include PTFE composite medium substrates, opposite two positioned at PTFE composite medium substrates
The layers of copper on surface and it is arranged between PTFE composite medium substrates and layers of copper and for improving PTFE copper-clad plate high frequency performances
Adhesive linkage, the adhesive linkage are made of inert material.Since the strand of inert material in the adhesive linkage is larger, adhesion performance is good,
It is not easy to cut.When processing plated-through-hole (Plated through hole, PTH) in PTFE copper-clad plates using plain cutter,
A large amount of burrs easily are produced in finished surface, and since these burrs are softer, it is not easy to remove.
It is all complicated there are technological process in the preparation method of the PTFE composite medium substrates of existing no reinforcing material, and
Need to add all kinds of organic additives, to improve the dispersion effect of PTFE and filler.During organic additive is removed, generally all
(more than 200 DEG C) processing of (more than 4h) high temperature for a long time are needed to remove organic additive, and also still there may be machine aided
The residual of agent, has an impact the dielectric properties and water imbibition of PTFE composite medium substrates.
Therefore, those skilled in the art be directed to developing a kind of comprehensive technical performance it is excellent, but also with good machinery
Intensity and dimensional stability, while production cost, energy consumption and the lower-cost copper-clad plate of environmental protection.
The content of the invention
For above-mentioned deficiency existing in the prior art, the technical problems to be solved by the invention are to provide a kind of glass fibers
The copper-clad plate of Wei Bu enhancings.
The present invention seeks to what is be achieved through the following technical solutions：
A kind of copper-clad plate of glass fabric enhancing, including prepreg, the prepreg is by glass fabric in asphalt mixtures modified by epoxy resin
Dry and obtain after being impregnated in fat adhesive.
Preferably, the epoxy resin adhesive is prepared by the raw material of following weight parts：Dicyclopentadiene type phenolic aldehyde
45-55 parts of epoxy resin, four 15-25 parts of phenolic group ethane type epoxy resin, N, 0.3-3 parts of N- dimethyl benzylamines, zinc octoate 0.3-3
Part, 20-80 parts of ethyl acetate, 200-300 parts of high-k filler, 5-15 parts of fire retardant.
Preferably, the dicyclopentadiene type novolac epoxy resin can use commercially available Japanese ink chemical industry strain
The dicyclopentadiene type novolac epoxy resin of HP-7200L, HP-7200, HP-7200H, HP-7200HH of the production of formula commercial firm.
Preferably, the four phenolic group ethane type epoxy resin can use commercially available U.S. MOMENTIVE companies to produce
EPON1031 four phenolic group ethane type epoxy resin.
Preferably, the high-k filler is mixing one or more in strontium titanates, SrNb2 O6, strontium zirconate
Thing.
It is highly preferred that the high-k filler is mixed by strontium titanates, SrNb2 O6, strontium zirconate, the metatitanic acid
Strontium, SrNb2 O6, the mass ratio of strontium zirconate are (1-3)：(1-3)：(1-3).
Preferably, the fire retardant is triethyl phosphate, three (2- chloroethyls) phosphates, tricresyl phosphate (the chloro- 2- third of 1-
Base) mixture one or more in ester.
It is highly preferred that the fire retardant is by triethyl phosphate, three (2- chloroethyls) phosphates, tricresyl phosphate (the chloro- 2- third of 1-
Base) ester mixes, the triethyl phosphate, three (2- chloroethyls) phosphates, the mass ratio of tricresyl phosphate (the chloro- 2- propyl group of 1-) ester
For (1-3)：(1-3)：(1-3).
Preferably, the particle diameter of the high-k filler is 0.01-20 μm.
Preferably, the glass fabric is E grade fiberglass cloths, grammes per square metre 20-300g/m2, thickness 0.01-
0.3mm, can use the E grade fiberglass cloths of commercially available model 106,1080,2116,7628.
Preferably, the prepreg is impregnated by glass fabric in epoxy resin adhesive obtains substrate, the base
The mass fraction of glass fabric is 75-95% in plate, and the mass fraction of the substrate epoxy resin adhesive is 5-25%,
Then substrate is placed in 80-120 DEG C of baking oven, baking 1-3h is obtained.
Preferably, the copper-clad plate of glass fabric enhancing is facing two after being superimposed with each other by 1-10 prepregs
Surface or a surface covering layers of copper, then hot pressing obtains in hot press.
Preferably, the thickness of the layers of copper is 3-150 μm.
The copper-clad plate of the glass fabric enhancing of the present invention, is strengthened using glass fabric, and by reasonably matching somebody with somebody
Than preferably going out the species and dosage of suitable high-k filler, fire retardant, improving dielectric constant, fire resistance and stripping
From intensity, comprehensive performance is very excellent, and filler dispersion effect is good, of low cost, environment friendliness.
Embodiment
With reference to embodiment, the present invention is described further, as described below, is only that the preferable of the present invention is implemented
Example, not limits the present invention, any person skilled in the art is possibly also with the disclosure above
Technology contents be changed to the equivalent embodiment changed on an equal basis.It is every of the invention without departing from the present invention program content, foundation
Technical spirit any simple modification that following embodiments are made or equivalent variations, all fall within protection scope of the present invention.
Each raw material introduction in embodiment：
Dicyclopentadiene type novolac epoxy resin, the HP-7200L's produced using Japanese ink chemical industry Co., Ltd.
Dicyclopentadiene type novolac epoxy resin, epoxide equivalent 247g/eq.
Four phenolic group ethane type epoxy resin, using the four phenolic group ethane of the EPON1031 of MOMENTIVE companies of U.S. production
Type epoxy resin, epoxide equivalent 210g/eq.
N, N- dimethyl benzylamine, No. CAS：103-83-3.
Zinc octoate, No. CAS：557-09-5.
Ethyl acetate, No. CAS：141-78-6.
Strontium titanates, No. CAS：12060-59-2,0.1 μm of particle diameter.
SrNb2 O6, No. CAS：12034-89-8,0.1 μm of particle diameter.
Strontium zirconate, No. CAS：12036-39-4,0.1 μm of particle diameter.
Triethyl phosphate, No. CAS：78-40-0.
Three (2- chloroethyls) phosphates, No. CAS：115-96-8.
Tricresyl phosphate (the chloro- 2- propyl group of 1-) ester, No. CAS：13674-84-5.
Embodiment 1
Epoxy resin adhesive raw material (parts by weight)：50 parts of dicyclopentadiene type novolac epoxy resin, four phenolic group ethane types
20 parts of epoxy resin, N, 0.6 part of N- dimethyl benzylamines, 0.6 part of zinc octoate, 45 parts of ethyl acetate, high-k filler 250
Part, 7.2 parts of fire retardant.
The high-k filler is 1 in mass ratio by strontium titanates, SrNb2 O6, strontium zirconate:1:1 is uniformly mixed
Obtain.
The fire retardant presses matter by triethyl phosphate, three (2- chloroethyls) phosphates, tricresyl phosphate (the chloro- 2- propyl group of 1-) ester
Amount is than being 1:1:1 is uniformly mixed to obtain.
It is prepared by epoxy resin adhesive：
Dicyclopentadiene type novolac epoxy resin, four phenolic group ethane type epoxy resin, ethyl acetate are stirred with 400 revs/min
Mix 5 minutes, then add N, N- dimethyl benzylamines, zinc octoate are stirred 10 minutes with 300 revs/min, are eventually adding high-k
Filler, fire retardant are stirred 60 minutes with 300 revs/min.Obtain the epoxy resin adhesive of the preparation of embodiment 1.
It is prepared by the copper-clad plate of glass fabric enhancing：Glass fabric (is used into the Dongguan City extensively limited public affairs of great composite material
The E grade fiberglass cloths 106 provided, grammes per square metre 25g/m are provided2, thickness 0.03mm) and it is immersed in the asphalt mixtures modified by epoxy resin of the preparation of embodiment 1
Impregnated cloth is obtained in fat adhesive, controls the content of glass fabric as 10wt% (contents of glass fabric i.e. in impregnated cloth
For 10wt%, the content of epoxy resin adhesive is 90wt%), then dipping is arranged in 100 DEG C of baking oven, toasts 2h,
Solvent is removed, obtains prepreg；It is superimposed with each other to obtain substrate using five prepregs, 30 μm is covered in two facing surfaces of substrate
Thick layers of copper (copper foil of the model TU25 provided using the golden one hundred product of rubber and plastic factory of Dongguan City end of the bridge), then in hot press into
Row hot pressing, applies pressure 400PSI, and minimum temperature is 50 DEG C, and maximum temperature is 380 DEG C, heats up, reaches by 3 DEG C/min of speed
40min is kept after 380 DEG C of maximum temperature.Obtain the copper-clad plate of the glass fabric enhancing of embodiment 1.
Embodiment 2
It is substantially the same manner as Example 1, differ only in：The high-k filler presses matter by SrNb2 O6, strontium zirconate
Amount is than being 1:1 is uniformly mixed to obtain.Obtain the copper-clad plate of the glass fabric enhancing of embodiment 2.
Embodiment 3
It is substantially the same manner as Example 1, differ only in：The high-k filler presses matter by strontium titanates, strontium zirconate
Amount is than being 1:1 is uniformly mixed to obtain.Obtain the copper-clad plate of the glass fabric enhancing of embodiment 3.
Embodiment 4
It is substantially the same manner as Example 1, differ only in：The high-k filler presses matter by strontium titanates, SrNb2 O6
Amount is than being 1:1 is uniformly mixed to obtain.Obtain the copper-clad plate of the glass fabric enhancing of embodiment 4.
Embodiment 5
It is substantially the same manner as Example 1, differ only in：The fire retardant is by three (2- chloroethyls) phosphates, tricresyl phosphate
(the chloro- 2- propyl group of 1-) ester is 1 in mass ratio:1 is uniformly mixed to obtain.Obtain covering for the glass fabric enhancing of embodiment 5
Copper coin.
Embodiment 6
It is substantially the same manner as Example 1, differ only in：The fire retardant is by triethyl phosphate, tricresyl phosphate (the chloro- 2- of 1-
Propyl group) ester in mass ratio be 1:1 is uniformly mixed to obtain.Obtain the copper-clad plate of the glass fabric enhancing of embodiment 6.
Embodiment 7
It is substantially the same manner as Example 1, differ only in：The fire retardant is by triethyl phosphate, three (2- chloroethyls) phosphorus
Acid esters is 1 in mass ratio:1 is uniformly mixed to obtain.Obtain the copper-clad plate of the glass fabric enhancing of embodiment 7.
Test case 1
The dielectric constant (Dk) for the copper-clad plate that glass fabric made from embodiment 1-7 is strengthened respectively, peel strength, resistance
Combustion performance is tested.Test method is as follows：Dielectric constant (Dk)：Test uses IPC-TM-6502.5.5.9 methods；Peel off strong
Degree：Test uses IPC-TM-6502.4.8 methods；Limited oxygen index is (wide using SH5706 plastics burning oxygen index measurer
Zhou Xin standing grain Electronics Equipment Co., Ltd) tested according to the method for GB/T2406-2009.Concrete outcome is shown in Table 1.
Table 1：Test result table
The dielectric loss Df test results of the embodiment of the present invention 1 are 0.0013, can reach high-k, low Jie at the same time
The performances such as electrical loss, high-peeling strength, comprehensive performance are very excellent.Comparing embodiment 1 and embodiment 2-4,1 (metatitanic acid of embodiment
Strontium, SrNb2 O6, strontium zirconate compounding) test result be substantially better than embodiment 2-4 (in strontium titanates, SrNb2 O6, strontium zirconate it is any the two
Compounding)；Comparing embodiment 1 and embodiment 5-7, embodiment 1 (triethyl phosphate, three (2- chloroethyls) phosphates, tricresyl phosphate (1-
Chloro- 2- propyl group) ester compounding) test result is substantially better than embodiment 5-7 (triethyl phosphate, three (2- chloroethyls) phosphates, phosphoric acid
The two any compounding in three (the chloro- 2- propyl group of 1-) esters).
Test case 2
The resistance to electric arc by the copper-clad plate that glass fabric made from embodiment 1-7 strengthens is tested respectively.Resistance to electric arc：Press
Standard Q/GDSY6050-20122.5.1 is tested.Specific test result is shown in Table 2.
Table 2：Insulation performance test result table
| Sample | Resistance to electric arc, Kv |
| Embodiment 1 | 150 |
| Embodiment 2 | 146 |
| Embodiment 3 | 144 |
| Embodiment 4 | 148 |
| Embodiment 5 | 142 |
| Embodiment 6 | 140 |
| Embodiment 7 | 139 |
Comparing embodiment 1 and embodiment 2-4, embodiment 1 (strontium titanates, SrNb2 O6, strontium zirconate compounding) insulation performance are obvious
Better than embodiment 2-4 (the two any compounding in strontium titanates, SrNb2 O6, strontium zirconate)；Comparing embodiment 1 and embodiment 5-7, implements
Example 1 (triethyl phosphate, three (2- chloroethyls) phosphates, tricresyl phosphate (the chloro- 2- propyl group of 1-) ester compounding) insulation performance is substantially better than
Embodiment 5-7 (the two any compounding in triethyl phosphate, three (2- chloroethyls) phosphates, tricresyl phosphate (the chloro- 2- propyl group of 1-) ester).
Claims (8)
1. a kind of copper-clad plate of glass fabric enhancing, including prepreg, the prepreg is by glass fabric in epoxy resin
Dry and obtain after being impregnated in adhesive；
The epoxy resin adhesive is prepared by the raw material of following weight parts：Dicyclopentadiene type novolac epoxy resin 45-
55 parts, four 15-25 parts of phenolic group ethane type epoxy resin, N, 0.3-3 parts of N- dimethyl benzylamines, 0.3-3 parts of zinc octoate, ethyl acetate
20-80 parts, 200-300 parts of high-k filler, 5-15 parts of fire retardant；
The high-k filler is mixed by strontium titanates, SrNb2 O6, strontium zirconate, the strontium titanates, SrNb2 O6, zirconic acid
The mass ratio of strontium is (1-3)：(1-3)：(1-3).
2. the copper-clad plate of glass fabric enhancing as claimed in claim 1, it is characterised in that：The fire retardant is tricresyl phosphate
One or more mixture in ethyl ester, three (2- chloroethyls) phosphates, tricresyl phosphate (the chloro- 2- propyl group of 1-) ester.
3. the copper-clad plate of glass fabric enhancing as claimed in claim 2, it is characterised in that：The fire retardant is by tricresyl phosphate
Ethyl ester, three (2- chloroethyls) phosphates, tricresyl phosphate (the chloro- 2- propyl group of 1-) ester mix, the triethyl phosphate, three (2- chlorine
Ethyl) phosphate, the mass ratio of tricresyl phosphate (the chloro- 2- propyl group of 1-) ester be (1-3)：(1-3)：(1-3).
4. the copper-clad plate of glass fabric enhancing as claimed in claim 1, it is characterised in that：The high-k filler
Particle diameter be 0.01-20 μm.
5. the copper-clad plate of glass fabric enhancing as claimed in claim 1, it is characterised in that：The glass fabric is E
Grade fiberglass cloth, grammes per square metre 20-300g/m2, thickness 0.01-0.3mm.
6. the copper-clad plate of glass fabric enhancing as claimed in claim 1, it is characterised in that：The prepreg is by glass fibers
Wei Bu impregnates in epoxy resin adhesive obtains substrate, and the mass fraction of glass fabric is 75-95% in the substrate, institute
The mass fraction for stating substrate epoxy resin adhesive is 5-25%, and then substrate is placed in 80-120 DEG C of baking oven, baking
1-3h is obtained.
7. the copper-clad plate of glass fabric enhancing as claimed in claim 1, it is characterised in that：The glass fabric enhancing
Copper-clad plate be superimposed with each other by 1-10 prepregs after in two facing surfaces or a surface covering layers of copper, then in hot press
Middle hot pressing obtains.
8. the copper-clad plate of glass fabric enhancing as claimed in claim 1, it is characterised in that：The thickness of the layers of copper is 3-
150μm。
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|---|---|---|---|
| CN201610544164.XA CN106189083B (en) | 2016-07-12 | 2016-07-12 | A kind of copper-clad plate of glass fabric enhancing |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610544164.XA CN106189083B (en) | 2016-07-12 | 2016-07-12 | A kind of copper-clad plate of glass fabric enhancing |
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| CN106189083B true CN106189083B (en) | 2018-05-15 |
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| CN107603544A (en) * | 2017-09-06 | 2018-01-19 | 深圳市峰泳科技有限公司 | A kind of fexible film capacitor high dielectric substance electronics adhesive and preparation method thereof |
| CN109397521B (en) * | 2018-10-19 | 2021-03-16 | 德阳科吉高新材料有限责任公司 | Manufacturing process of high-speed rail track plate |
| JP6870778B1 (en) * | 2020-12-11 | 2021-05-12 | 昭和電工マテリアルズ株式会社 | Resin composition for molding and electronic component equipment |
| CN113597121B (en) * | 2021-07-29 | 2022-07-05 | 江西倍韬新材料科技有限公司 | Manufacturing method of glass fiber cloth reinforced copper-clad plate |
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| CN103351581A (en) * | 2013-07-19 | 2013-10-16 | 广东生益科技股份有限公司 | High-dielectric-constant resin composition and application thereof |
| CN104817823A (en) * | 2015-05-19 | 2015-08-05 | 广州宏仁电子工业有限公司 | Halogen resin composition and application thereof |
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| CN106189083A (en) | 2016-12-07 |
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