CN106142777A - A kind of polyimides height heat radiation coverlay - Google Patents
A kind of polyimides height heat radiation coverlay Download PDFInfo
- Publication number
- CN106142777A CN106142777A CN201510152629.2A CN201510152629A CN106142777A CN 106142777 A CN106142777 A CN 106142777A CN 201510152629 A CN201510152629 A CN 201510152629A CN 106142777 A CN106142777 A CN 106142777A
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- China
- Prior art keywords
- enhancement layer
- coverlay
- heat radiation
- thin film
- height heat
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Abstract
The present invention relates to a kind of polyimides height heat radiation coverlay, including the first Thermocurable polyimide thin film stacked gradually, first enhancement layer, high heat dissipation film, second enhancement layer and the second Thermocurable polyimide thin film, described first Thermocurable polyimide thin film is covered on the surface with Copper Foil of flexible printed circuit board, described second Thermocurable polyimide thin film is positioned at top layer and comprises colored colorant, the color of described colored colorant is red, yellow, blue, purple, green or orange, the reinforcing fiber that described first enhancement layer and the second enhancement layer are impregnated by thermoplastic polyimide resin is constituted.The polyimides height heat radiation coverlay of the present invention is for protecting the Copper Foil on flexible printed circuit board to be not exposed in air; have that heat-resisting quantity is good, interface binding intensity is high, be difficult to the advantages such as warpage; have simultaneously and cover circuit effect and decorative effect, there is the strongest practicality.
Description
Technical field
The present invention relates to a kind of polyimides height heat radiation coverlay, belong to flexible printed circuit board technical field.
Background technology
Printed circuit board (PCB) is to be composited by macromolecular material and Copper Foil by insulate, forms conductive pattern after being etched Copper Foil,
For installing electronic component, make to couple together between the terminal of electronic component formation circuit.Information, the progressive drive of communication industry
The development of microelectronic industry, flexible printed circuit board (FPC) arises at the historic moment, and obtained fast development, cell phone,
The numerous areas such as notebook computer, LCDs is used widely.Flexible printed circuit board is indispensable in electronic product
Material, and along with consumption electronic products demand grow up, the demand for flexible printed circuit board also grows with each passing day.Due to
Flexible printed circuit board have flexibility and can the characteristic such as three-dimensional space distribution, technicalization electronic product emphasize compact,
The development of flexibility is driven under gesture, and be widely used computer and ancillary equipment, communication product and consumer electronics product at present
Product etc..
In printed circuit board (PCB) manufacturing, especially flexible printed circuit board industry, coverlay uses in a large number at flexible print circuit
In panel products.The Main Function of coverlay is similar with the green paint on printed circuit board (PCB), is covered in circuit surface, and protection Copper Foil is the most sudden and the most violent
Dew is in atmosphere, it is to avoid the oxidation corrosion of Copper Foil or damage, covers, rear as need not gold-plated region coverlay
In continuous manufacturing process, play welding resistance effect.Polyimides has prominent resistance to elevated temperatures, resistance to chemical corrosion, electricity absolutely
Edge performance and mechanical performance, be not only suitable as flexible printed circuit board base material, is also the first-selection of flexible printed circuit board coverlay
Material.Existing flexible printed circuit board polyimides coverlay generally includes Thermocurable polyimide thin film, glue-line and release
Film, glue-line between Thermocurable polyimide thin film and mould release membrance, another table that Thermocurable polyimide thin film is relative with glue-line
Face is used for being covered on flexible printed circuit board, and glue-line typically uses epoxy glue or acrylate glue to make, and uses both materials
Glue-line has respective advantage, but all there is the problem that resistance to elevated temperatures is poor.
It addition, existing coverlay does not have heat dispersion, and heat dispersion is most important for flexible printed circuit board
, reason is: along with electronic equipment develops to compactization, flexible printed circuit board loading member density improves, and makes heat
High aggregation, if heat dissipation design is bad, can make the melts soldering tin of electronic component welding position, cabinet and insulating substrate combustion
Burn, therefore, steady in a long-term in order to ensure the performance of electronic equipment, it is desirable to improve constantly the thermal diffusivity of flexible printed circuit board.
Along with mobile phone, the development of panel computer industry, the design protection for wiring board increasingly comes into one's own, in the market
Most coverlay is light Kapton, even if there is the Kapton with screening effect, also the whitest
Color and black covering film, production firm cannot select the color of different main flow, be formed with oneself characteristic according to the feature of oneself
Circuit sheet material.
For this reason, it is necessary to provide one, heat-resisting quantity is good, interface binding intensity is high, be difficult to warpage, has simultaneously and covers circuit effect
Fruit and the coverlay of decorative effect.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, it is provided that a kind of polyimides height heat radiation coverlay, this polyimides is high
Heat radiation coverlay has that heat-resisting quantity is good, interface binding intensity is high, be difficult to the advantages such as warpage, have simultaneously cover circuit effect and
Decorative effect, has the strongest practicality.
For achieving the above object, the technical scheme that the present invention takes is as follows:
A kind of polyimides height heat radiation coverlay, including the first Thermocurable polyimide thin film (2) stacked gradually, the first enhancing
Layer (3), high heat dissipation film (4), the second enhancement layer (5) and the second Thermocurable polyimide thin film (6), described first thermosetting
Kapton (2) is covered on the surface with Copper Foil of flexible printed circuit board, and described second Thermocurable polyimide is thin
Film (6) is positioned at top layer and comprises colored colorant, the color of described colored colorant be redness, yellow, blueness, purple,
Green or orange, that described first enhancement layer (3) and the second enhancement layer (5) are impregnated by thermoplastic polyimide resin enhancing
Fiber is constituted.
Preferably, described high heat dissipation film (4) is three layers, and three layers are constituted by height heat radiation Graphene, or intermediate layer is by carbon nanometer
Pipe is constituted, and two layers of surface layer is made up of height heat radiation Graphene.Graphene is the material that the heat dispersion found up to now is best,
But owing to its thickness is the thinnest, it is easily damaged, so three-decker, its intensity can be improved to a great extent, but use stone
Ink alkene is relatively costly, so intermediate layer can also be used CNT, to reduce the usage amount of Graphene, thus reduces production
Cost.
Preferably, the reinforcing fiber in described first enhancement layer (3) and the second enhancement layer (5) is long fibre, described long fibre
Dimension any one or a few inorfil in glass fibre, quartz fibre, ceramic fibre, boron fibre, carbon fiber, especially
It preferably employs carbon fiber, utilizes the heat conductivility of carbon fiber can improve the same of described polyimides height heat radiation coverlay intensity
Time improve its heat dispersion further.
Preferably, the reinforcing fiber in described first enhancement layer (3) and the second enhancement layer (5) is one direction arrangement, and
In described first enhancement layer (3) and the second enhancement layer (5), the orientation of reinforcing fiber is mutually perpendicular to.
Preferably, the line density of described reinforcing fiber is 500-1000dtex, a diameter of 100-200 micron.
Preferably, the thermoplastic polyimide resin in described first enhancement layer (3) and the second enhancement layer (5) is selected from fat
Any one in fat adoption imide resin, semi-aromatic polyimide resin and aromatic polyimide resin.
Preferably, the thickness of described first Thermocurable polyimide thin film (2) and the second Thermocurable polyimide thin film (6) is
50-100 micron, the thickness of described first enhancement layer (3) and the second enhancement layer (5) is 100-200 micron, described high heat radiation
The thickness of film (4) is 10-20 micron.
Beneficial effects of the present invention is as follows:
(1) the polyimides height heat radiation coverlay that the two-layer Thermocurable polyimide thin film being positioned at surface is the present invention provides excellent
Heat-resisting quantity, the most common highly heat-conductive material also has electric conductivity, will by the Thermocurable polyimide thin film of Heat stability is good
Flexible printed circuit board separates with high heat dissipation film, can avoid being short-circuited, if it addition, the base material of flexible printed circuit board also
Use polyimide resin, then be also prevented from by the compatibility good between Thermocurable polyimide thin film and circuit substrate
This coverlay peels off from copper foil surface
(2) the second Thermocurable polyimide thin film containing colored colorant provides screening effect for this coverlay especially, and
Colored colorant is only added in the second Thermocurable polyimide thin film, and colorant concentrations is low, does not interferes with the comprehensive of this coverlay
Performance, is particularly applicable to protect the electronic product of circuit pattern.Additionally, the color of colored colorant can be selected from redness, yellow,
Blueness, purple, green or orange, production firm can select the color of different main flow according to the feature of oneself, be formed from
The circuit sheet material of own characteristic.
(3) the polyimides height heat radiation coverlay that the high heat dissipation film being positioned at intermediate layer is the present invention provides excellent radiating effect, greatly
Reduce greatly the melts soldering tin of electronic component welding position and cabinet and the risk of insulating substrate burning, it is ensured that electronics sets
Standby performance is steady in a long-term, extends its service life.
(4) existence of enhancement layer further increases the polyimides height heat radiation covering film strength of the present invention, it is possible to effectively prevent
The generation of warpage, and enhancement layer have employed thermoplastic polyimide resin, with adjacent Thermocurable polyimide thin film and height
Heat dissipation film all has the good compatibility, improves interface binding intensity, it is to avoid can between the generation of delamination, and each layer
It is combined in the way of by hot pressing, it is to avoid use binding agent.
Accompanying drawing illustrates:
Fig. 1: a kind of polyimides height heat radiation covered film structure schematic diagram in the present invention.
Detailed description of the invention:
The invention will be described further with specific embodiment below in conjunction with the accompanying drawings.
Embodiment 1
As it is shown in figure 1, a kind of polyimides height heat radiation coverlay (1), thin including the first Thermocurable polyimide stacked gradually
Film (2), the first enhancement layer (3), high heat dissipation film (4), the second enhancement layer (5) and the second Thermocurable polyimide thin film (6),
First Thermocurable polyimide thin film (2) is covered on the surface with Copper Foil of flexible printed circuit board, and thickness is 50-100
Micron, the second Thermocurable polyimide thin film (6) is positioned at top layer and comprises colored colorant, and thickness is 50-100 micron,
The color of described colored colorant is redness, yellow, blueness, purple, green or orange, and the first enhancement layer (3) and second increases
The reinforcing fiber that strong layer (5) is impregnated by thermoplastic polyimide resin is constituted, and thickness is 100-200 micron, this thermoplastic poly
Imide resin uses semi-aromatic polyimide resin, and this reinforcing fiber uses line density to be 500-1000dtex, a diameter of
Reinforcing fiber in the long carbon fiber of 100-200 micron, and the first enhancement layer (3) and the second enhancement layer (5) is one direction
Arrangement, the direction of its arrangement is mutually perpendicular to, and high heat dissipation film (4) is made up of three floor height heat radiation Graphenes, and thickness is 10-20 micron.
Below being only described the present invention and embodiment thereof, this description does not has restricted, and shown in accompanying drawing is also this
One of embodiment of invention, actual structure is not limited thereto, if those skilled in the art are enlightened by it, without departing from
In the case of the invention objective, design the structure similar to this technical scheme and embodiment thereof without creative,
All should work as and belong to protection scope of the present invention.
Claims (8)
1. a polyimides height heat radiation coverlay, it is characterised in that described polyimides height heat radiation coverlay (1) includes layer successively
Folded the first Thermocurable polyimide thin film (2), the first enhancement layer (3), high heat dissipation film (4), the second enhancement layer (5) and the
Two Thermocurable polyimide thin film (6), described first Thermocurable polyimide thin film (2) is covered on the tool of flexible printed circuit board
Having on the surface of Copper Foil, described second Thermocurable polyimide thin film (6) is positioned at top layer and comprises colored colorant, described in have
The color of chromatic colorant agent is redness, yellow, blueness, purple, green or orange, and described first enhancement layer (3) and second strengthens
The reinforcing fiber that layer (5) is impregnated by thermoplastic polyimide resin is constituted.
2. polyimides height heat radiation coverlay as claimed in claim 1, it is characterised in that described high heat dissipation film (4) is three layers,
Three layers are constituted by height heat radiation Graphene.
3. polyimides height heat radiation coverlay as claimed in claim 1, it is characterised in that described high heat dissipation film (4) is three layers,
Intermediate layer is made up of CNT, and two layers of surface layer is made up of height heat radiation Graphene.
4. polyimides height heat radiation coverlay as claimed in claim 1, it is characterised in that described first enhancement layer (3) and second
Reinforcing fiber in enhancement layer (5) is long fibre, and described long fibre is selected from glass fibre, quartz fibre, ceramic fibre, boron
Any one or a few inorfil in fiber, carbon fiber.
5. polyimides height heat radiation coverlay as claimed in claim 4, it is characterised in that described first enhancement layer (3) and second
Reinforcing fiber in enhancement layer (5) is one direction arrangement, and in described first enhancement layer (3) and the second enhancement layer (5)
The orientation of reinforcing fiber is mutually perpendicular to.
6. polyimides height heat radiation coverlay as claimed in claim 5, it is characterised in that the line density of described reinforcing fiber is
500-1000dtex, a diameter of 100-200 micron.
7. polyimides height heat radiation coverlay as claimed in claim 1, it is characterised in that described first enhancement layer (3) and
Thermoplastic polyimide resin in second enhancement layer (5) is selected from aliphatic polyimide resin, semi-aromatic polyimide resin
With any one in aromatic polyimide resin.
8. polyimides height heat radiation coverlay as claimed in claim 1, it is characterised in that described first Thermocurable polyimide thin film
(2) thickness of and the second Thermocurable polyimide thin film (6) is 50-100 micron, described first enhancement layer (3) and second
The thickness of enhancement layer (5) is 100-200 micron, and the thickness of described high heat dissipation film (4) is 10-20 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510152629.2A CN106142777A (en) | 2015-03-31 | 2015-03-31 | A kind of polyimides height heat radiation coverlay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510152629.2A CN106142777A (en) | 2015-03-31 | 2015-03-31 | A kind of polyimides height heat radiation coverlay |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106142777A true CN106142777A (en) | 2016-11-23 |
Family
ID=57337388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510152629.2A Pending CN106142777A (en) | 2015-03-31 | 2015-03-31 | A kind of polyimides height heat radiation coverlay |
Country Status (1)
| Country | Link |
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| CN (1) | CN106142777A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107227145A (en) * | 2017-05-04 | 2017-10-03 | 中原大学 | Heat dissipation slurry and manufacturing method of heat dissipation structure |
| CN109246997A (en) * | 2018-10-30 | 2019-01-18 | 歌尔科技有限公司 | A kind of flexible heat structure and electronic product |
| WO2021189411A1 (en) * | 2020-03-27 | 2021-09-30 | 鹏鼎控股(深圳)股份有限公司 | Covering film, and circuit board and manufacturing method |
-
2015
- 2015-03-31 CN CN201510152629.2A patent/CN106142777A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107227145A (en) * | 2017-05-04 | 2017-10-03 | 中原大学 | Heat dissipation slurry and manufacturing method of heat dissipation structure |
| CN109246997A (en) * | 2018-10-30 | 2019-01-18 | 歌尔科技有限公司 | A kind of flexible heat structure and electronic product |
| WO2021189411A1 (en) * | 2020-03-27 | 2021-09-30 | 鹏鼎控股(深圳)股份有限公司 | Covering film, and circuit board and manufacturing method |
| CN114287172A (en) * | 2020-03-27 | 2022-04-05 | 鹏鼎控股(深圳)股份有限公司 | Cover film, circuit board and manufacturing method |
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| C06 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20161123 |