CN205755032U - A kind of pcb board - Google Patents
A kind of pcb board Download PDFInfo
- Publication number
- CN205755032U CN205755032U CN201620422699.5U CN201620422699U CN205755032U CN 205755032 U CN205755032 U CN 205755032U CN 201620422699 U CN201620422699 U CN 201620422699U CN 205755032 U CN205755032 U CN 205755032U
- Authority
- CN
- China
- Prior art keywords
- layer
- pcb board
- heat dissipating
- substrate
- radiating core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of pcb board, true tryoff field.Including substrate, conductive layer, insulating barrier, heat dissipating layer, lubricating layer, conductive layer, insulating barrier and heat dissipating layer are sequentially arranged in the upper, middle and lower of substrate, lubricating layer is arranged on substrate bottom surface, it is characterized in that, some radiating cores it are provided with in described substrate, arranging copper coin between adjacent radiating core, described heat dissipating layer is provided with through hole.This utility model uses the radiating core of umbrella to increase the specific surface area of heat dissipating layer, improve thermal diffusivity, set up lubricating layer simultaneously, greatly reduce the friction between plate and plate when pcb board assembles, copper coin is set between radiating core, is to occur when solving to avoid Copper Foil and internal layer circuit plate pressing that fold causes subsequent product batch to scrap.
Description
Technical field
This utility model relates to pcb board field, specifically, is a kind of pcb board.
Background technology
Along with developing rapidly of electron trade, the trend of electronic product miniaturization is day by day obvious, one piece of pcb board except
Outside fixing various little electronic components, its major function is also provided with being electrically connected to each other of various electronic component.Along with letter
The development of breath technology, electronic equipment also becomes increasingly complex, and pcb board have also been obtained extensively application.Existing pcb board
Heat dispersion is poor, needs to utilize labelling point to be marked the position scribbling tin cream, and in use, pcb board
Edge easily occur layering.
When assembling PCB, the frictional resistance between PCB leverages the service life of PCB.Pcb board is such as simultaneously
It is used in antenna to receive, flutters antenna to catch and adjust and the biggest impact in the performance of model, can be caused.
At present, in the bonding processes of pcb board, need to utilize gel to be pressed together with Copper Foil by internal layer circuit plate, and
And Copper Foil need to fit tightly with base material, bubble-free and fold produce.But owing to the printing on substrates of internal layer circuit plate has
Circuit, causes substrate surface uneven, and when causing pressing during gel flowing, the tension force in spacious district and non-spacious district is not
With so that gel can produce fold in the spacious district of substrate, and then it is same when pressing to cause covering the Copper Foil on gel
There is fold in sample, and this fold can be damaged when follow-up outer-layer circuit plate etching, causes batch to be scrapped
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, it is provided that a kind of pcb board.
This utility model relates to a kind of pcb board, including substrate, conductive layer, insulating barrier, heat dissipating layer, lubricating layer, leads
Electric layer, insulating barrier and heat dissipating layer are sequentially arranged in the upper, middle and lower of substrate, and lubricating layer is arranged on substrate bottom surface,
It is characterized in that, in described substrate, be provided with some radiating cores, copper coin, described heat dissipating layer are set between adjacent radiating core
It is provided with through hole.
Preferably, described radiating core is become umbrella by some proof copper-wire braideds.
Preferably, described lubricating layer is Teflon ink layer.
Preferably, described through hole is positioned at the underface of radiating core.
Preferably, described conductive layer uses copper foil layer.
Preferably, described insulating barrier uses layers of kraft paper.
Compared with prior art, good effect of the present utility model is:
This utility model uses the radiating core of umbrella to increase the specific surface area of heat dissipating layer, improves thermal diffusivity, sets up profit simultaneously
Slip layer, greatly reduce pcb board assemble time plate and plate between friction, copper coin is set between radiating core, be for
Solve to avoid when Copper Foil and internal layer circuit plate pressing, occurring that fold causes subsequent product to scrap in batches.
Accompanying drawing explanation
Fig. 1 is this utility model structural representation.
Labelling in accompanying drawing 1 is respectively: 1. substrate；2. side plate is installed；3. conductive layer；4. insulating barrier；5. heat dissipating layer；
6. radiating core；7. copper coin；8. lubricating layer；9. through hole.
Detailed description of the invention
Presently in connection with accompanying drawing, this utility model is described in further detail.These accompanying drawings are the schematic diagram of simplification,
Basic structure of the present utility model is described the most in a schematic way, and therefore it only shows the composition relevant with this utility model.
As it is shown in figure 1, a kind of pcb board, including substrate 1, conductive layer 3, insulating barrier 4, heat dissipating layer 5, lubricating layer
8, conductive layer 3, insulating barrier 4 and heat dissipating layer 5 are sequentially arranged in the upper, middle and lower of substrate 1, lubricating layer 8
Be arranged on substrate 1 bottom surface, it is characterised in that in described substrate 1, be provided with some radiating cores 6, adjacent radiating core it
Between copper coin 7 is set, described heat dissipating layer is provided with through hole 9.
Wherein, described radiating core 6 is become umbrella by some proof copper-wire braideds.
Wherein, described lubricating layer 8 is Teflon ink layer.
Wherein, described through hole 9 is positioned at the underface of radiating core 6.
Wherein, described conductive layer 3 uses copper foil layer.
Wherein, described insulating barrier 4 uses layers of kraft paper.
It is obvious to a person skilled in the art that this utility model is not limited to the details of above-mentioned exemplary embodiment,
And in the case of without departing substantially from spirit or essential attributes of the present utility model, it is possible to realize this in other specific forms
Utility model.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and be unrestricted
Property, scope of the present utility model is limited by claims rather than described above, it is intended that will fall in right
All changes in the implication of the equivalency required and scope are included in this utility model, should be by claim
Any reference be considered as limiting involved claim.
Claims (6)
1. a pcb board, including substrate, conductive layer, insulating barrier, heat dissipating layer, lubricating layer, conductive layer, insulation
Layer and heat dissipating layer are sequentially arranged in the upper, middle and lower of substrate, and lubricating layer is arranged on substrate bottom surface, and its feature exists
In, it being provided with some radiating cores in described substrate, copper coin is set between adjacent radiating core, described heat dissipating layer is provided with logical
Hole.
A kind of pcb board the most according to claim 1, it is characterised in that described radiating core is compiled by some copper wires
It is made into umbrella.
A kind of pcb board the most according to claim 1, it is characterised in that described lubricating layer is Teflon ink
Layer.
A kind of pcb board the most according to claim 1, it is characterised in that described through hole is just being positioned at radiating core
Lower section.
A kind of pcb board the most according to claim 1, it is characterised in that described conductive layer uses copper foil layer.
A kind of pcb board the most according to claim 1, it is characterised in that described insulating barrier uses layers of kraft paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620422699.5U CN205755032U (en) | 2016-05-09 | 2016-05-09 | A kind of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620422699.5U CN205755032U (en) | 2016-05-09 | 2016-05-09 | A kind of pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205755032U true CN205755032U (en) | 2016-11-30 |
Family
ID=57367877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620422699.5U Expired - Fee Related CN205755032U (en) | 2016-05-09 | 2016-05-09 | A kind of pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205755032U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109466909A (en) * | 2018-12-18 | 2019-03-15 | 天津沃翔科技有限公司 | Laser emitter for mine conveying belt detection device |
-
2016
- 2016-05-09 CN CN201620422699.5U patent/CN205755032U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109466909A (en) * | 2018-12-18 | 2019-03-15 | 天津沃翔科技有限公司 | Laser emitter for mine conveying belt detection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20180509 |