CN202319173U - Colored heat-conductive cover film - Google Patents
Colored heat-conductive cover film Download PDFInfo
- Publication number
- CN202319173U CN202319173U CN2011204446189U CN201120444618U CN202319173U CN 202319173 U CN202319173 U CN 202319173U CN 2011204446189 U CN2011204446189 U CN 2011204446189U CN 201120444618 U CN201120444618 U CN 201120444618U CN 202319173 U CN202319173 U CN 202319173U
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- heat conduction
- heat
- conductive insulating
- coloured
- inorganic filler
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Abstract
The utility model discloses a colored heat-conductive cover film. The colored heat-conductive cover film is provided with a heat-conductive insulating base film, wherein a heat-conductive insulating glue layer and a colored heat-conductive insulating polymer layer respectively adhere to the two surfaces of the heat-conductive insulating base film. As each material layer of the colored heat-conductive cover film disclosed by the utility model has heat conduction performance, the colored heat-conductive cover film has better heat conduction performance than ordinary heat-conductive cover films and ordinary colored cover films; and the colored heat-conductive insulating polymer layer adheres to the heat-conductive insulating base film, so that effects of line shielding and light extinction can be achieved and the size stability of the cover film can be improved; and furthermore, circuit boards from different customers can be distinguished from the colors of the circuit boards, namely cover films, so that different customers can have own unique circuit board colors and the effect of recognition and distinction are achieved.
Description
Technical field
The utility model relates to a kind of coverlay of printed circuit board (PCB).
Background technology
The progress of information, communication industry has driven the development of microelectronic industry, and flexible print wiring board (FPC) arises at the historic moment, and has obtained fast development, is used widely at numerous areas such as cell phone, notebook computer, LCDs.Printed circuit board (PCB) is a material indispensable in the electronic product, and along with the consumption electronic products demand is grown up, and also grows with each passing day for the demand of printed circuit board (PCB).Because but flexible print wiring board has characteristics such as flexibility and three-dimensional space distribution; Drive under the gesture in the emphasical development compact, flexibility of technicalization electronic product, computer and ancillary equipment thereof, communication product and consumption electronic products or the like at present are widely used.
Generally speaking, flexible print wiring board mainly is to be made up of copper clad laminate (FCCL) and coverlay (CL).In this board structure of circuit, generally use plastic film as coverlay, perhaps utilize screen printing technology to form one deck thin insulating printing ink.These convention coverlays exist ink lay be full of cracks or problem such as come off.In addition; Most in the market coverlay is the light Kapton, and the function of covering circuit layout for the polyimides diaphragm is had then forms coloured adhesion layer on Kapton; Yet; Though this kind structure reaches the purpose of covering, the glossiness on Kapton surface is still bright excessively, can't satisfy the particular optical demands of applications.In order to offset the demand of optical activity polyimides diaphragm in response to market; Use is added with coloured Kapton of dyestuff; And on this coloured Kapton, form adhesion layer, though the polyimides diaphragm made from this kind mode has extinction effect preferably, yet the cost of coloured Kapton is too high; Be not inconsistent demand during actual volume production, and the anxiety that the polyimides diaphragm that contains additive also has character variation such as tensile strength, dimensional stability is considered.So, obtain low-cost, the racemization photosensitiveness is good and have the coverlay of excellent folding quality, is the problem for remaining unsolved at present.
At present along with the development of mobile phone, panel computer industry, more and more come into one's own for the design protection of wiring board, along with the extensive use of black matt coverlay; Line design has obtained good protection; But each tame mobile phone, panel computer merchant demand is the wiring board material that own characteristic is arranged at present, and big producer of promptly every family all hopes to have the wiring board design of the own characteristic of representative; Therefore; The demand of coloured heat conduction coverlay is just increasing, and each manufacturer can select the color of different main flows according to the characteristics of oneself, is formed with the circuit sheet material of own characteristic; And main sale in the market is white and black coverlay; In order to satisfy client's demand; And the characteristic line plate of each tame producer demand; Demand to red, blue, purple or the like coloured heat conduction coverlay is increasing, seeks the demand point that coloured heat conduction coverlay a kind of cheapness, that be prone to system becomes industry.
Along with directions such as electronic product is short, little, light, thin, high density, multifunction develop; The element packing density promotes greatly on the printed circuit board, forces the thermal energy exchange of circuit bigger, and the lifting of heat energy will make the operating ambient temperature of element raise; Therefore just greatly reduce the service life of electronic devices and components; For head it off, need better heat sink material, so that the heat that electronic devices and components produce in the course of the work better sheds.
The utility model content
In order to overcome above-mentioned defective; The utility model provides a kind of coloured heat conduction coverlay; This coloured heat conduction coverlay not only can reach the effect of covering circuit and delustring when having high thermal conductivity, and can distinguish coloured wiring board of every client of family through the different colours of coverlay; Can also improve the dimensional stability of coverlay, again and simple in structure, easy to implement.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of coloured heat conduction coverlay is provided with the heat conductive insulating basement membrane, and said heat conductive insulating basement membrane has two relative surfaces, is stained with heat conductive insulating glue-line and coloured heat conductive insulating polymeric layer on two surfaces of said heat conductive insulating basement membrane respectively.
Each layer of material of coloured heat conduction coverlay of the utility model all has heat conductivility, therefore has better heat conductivility with respect to common heat conduction coverlay and common coloured coverlay.Said " coloured " of the coloured heat conductive insulating polymeric layer in the utility model is meant the color except that the true qualities of material layer; And except containing conventional black and white two kinds the color; Also comprise colors such as for example red, orange, yellow, green, blue, ingot or purple, also can be on these primary colours printed patterns and customer ID (logo).On the heat conductive insulating basement membrane, adhere to coloured heat conductive insulating polymeric layer and can play the effect of covering circuit and delustring; And can improve the dimensional stability of coverlay; And can play the function of discerning different customer line plates; Require to paste blue coverlay like first client's wiring board, second client's wiring board requires to paste red coverlay, can be that the color of wiring board distinguishes out through coverlay is which client's of family wiring board; Make different clients that the individual character wiring board color of oneself can be arranged, play the effect that identification is distinguished.
The utility model for the further technical scheme that solves its technical problem and adopt is:
Be provided with release layer, said release layer adheres on the said heat conductive insulating glue-line, and said heat conductive insulating glue-line is folded between said heat conductive insulating basement membrane and the said release layer, and this release layer is used to keep the viscosity of said insulation glue-line, is beneficial to successive process.Preferably, the thickness of said release layer is 30～200um.
Said heat conductive insulating basement membrane is that heat conduction polyimides (PI) film, heat conduction polyester (PET) film, heat conduction gather a kind of in naphthalene ester (PEN) film and conducting liquid crystal polymer (LCP) film; Heat conduction polyimides (PI) film preferably, the thickness of said heat conductive insulating basement membrane is 7～100um.Preferably; Said heat conductive insulating basement membrane is the polyimide film, the polyester film that is added with heat conduction inorganic filler that are added with heat conduction inorganic filler, be added with gathering naphthalene ester film or being added with the liquid crystalline polymer film of heat conduction inorganic filler of heat conduction inorganic filler; And with the heat conduction inorganic filler that adds as heat-conducting medium, preferably be added with the polyimide film of heat conduction inorganic filler.Wherein, heat conduction inorganic filler is at least a in carborundum, aluminium oxide, boron nitride, aluminium nitride and the CNT, and the ratio that said heat conduction inorganic filler adds is 20%～90% (percentage by weight) of heat conductive insulating basement membrane solid content.
Said coloured heat conductive insulating polymeric layer is a kind of in coloured heat conduction polyimide layer, coloured heat conduction polyester layer, coloured heat conduction acrylate layer, coloured heat conduction ink lay and the coloured heat-conduction epoxy resin layer, and the thickness of said coloured heat conductive insulating polymeric layer is 1～25um.Preferably, said coloured heat conductive insulating polymeric layer is polyimide layer, the polyester layer that is added with inorganic color and heat conduction inorganic filler, the acrylate layer that is added with inorganic color and heat conduction inorganic filler that are added with inorganic color and heat conduction inorganic filler, is added with the ink lay of inorganic color and heat conduction inorganic filler or is added with inorganic color and the epoxy resin layer of heat conduction inorganic filler.Add the inorganic color of different colours according to the difference of color demand, then add the blue inorganic colorant when the configuration polymer like the blue heat conductive insulating polymeric layer of needs.Wherein, With the heat conduction inorganic filler that adds as heat-conducting medium; Heat conduction inorganic filler is at least a in carborundum, aluminium oxide, boron nitride, aluminium nitride and the CNT, and the ratio that said heat conduction inorganic filler adds is 20%～90% (percentage by weight) of coloured heat conductive insulating polymeric layer solid content.Wherein, As the employed saturated polyester of coloured heat conductive insulating polymeric layer; Its characteristic needs better heat-resisting property and anti-yellowing sex change, therefore selected specific linear saturated polyester, and its employed curing agent is a blocked curing agent; But clad ability deblocking is participated in reaction after need being heated to uniform temperature, and the inorganic color of interpolation is the inorganic filler of respective color.
Said heat conductive insulating glue-line is a kind of in heat-conduction epoxy resin glue-line, heat conduction acrylic acid ester glue-line, heat conduction polyester glue-line, heat-conduction polyurethane glue-line and the heat conduction polyimides glue-line, and the thickness of said heat conductive insulating glue-line is 5～50um.Preferably, said heat conductive insulating glue-line is the epoxy glue layer that is added with heat conduction inorganic filler, the acrylic acid ester glue-line that is added with heat conduction inorganic filler, the polyester glue-line that is added with heat conduction inorganic filler, the polyurethane glue-line that is added with heat conduction inorganic filler or the polyimides glue-line that is added with heat conduction inorganic filler.Wherein, With the heat conduction inorganic filler that adds as heat-conducting medium; Said heat conduction inorganic filler is at least a in carborundum, aluminium oxide, boron nitride, aluminium nitride and the CNT, and the ratio that said heat conduction inorganic filler adds is 20%～90% (percentage by weight) of said heat conductive insulating glue-line solid content.
The beneficial effect of the utility model is: coloured heat conduction coverlay of the utility model; Be provided with the heat conductive insulating basement membrane; Be stained with heat conductive insulating glue-line and coloured heat conductive insulating polymeric layer on two surfaces of said heat conductive insulating basement membrane respectively; Because each layer of material of coloured heat conduction coverlay of the utility model all has heat conductivility, therefore have better heat conductivility, and the coloured heat conductive insulating polymeric layer of adhesion can play the effect of covering circuit and delustring on the heat conductive insulating basement membrane with respect to common heat conduction coverlay and common coloured coverlay; And can improve the dimensional stability of coverlay; Can also be that the color of wiring board distinguishes out through coverlay be which client's of family wiring board, make different clients that the characteristic line plate color of oneself can be arranged, play the effect that identification is distinguished.
Description of drawings
Fig. 1 is coloured heat conduction coverlay generalized section of the utility model.
The specific embodiment
Embodiment: the preferred embodiment of the utility model is set forth in detail below in conjunction with accompanying drawing; Thereby the protection domain of the utility model is made more explicit defining so that advantage of the utility model and characteristic can be easier to it will be appreciated by those skilled in the art that.
A kind of coloured heat conduction coverlay; Be provided with heat conductive insulating basement membrane 1; Said heat conductive insulating basement membrane has two relative surfaces, is stained with heat conductive insulating glue-line 2 and coloured heat conductive insulating polymeric layer 3 on two surfaces of said heat conductive insulating basement membrane respectively, also is provided with release layer 4; Said release layer adheres on the said heat conductive insulating glue-line, and said heat conductive insulating glue-line is folded between said heat conductive insulating basement membrane and the said release layer.
Wherein, Said heat conductive insulating basement membrane 1 for the polyimide film, the polyester film that is added with heat conduction inorganic filler that are added with heat conduction inorganic filler, be added with gathering naphthalene ester film or being added with the liquid crystalline polymer film of heat conduction inorganic filler of heat conduction inorganic filler; And with the heat conduction inorganic filler that adds as heat-conducting medium, preferably be added with the polyimide film of heat conduction inorganic filler.Wherein, heat conduction inorganic filler is at least a in carborundum, aluminium oxide, boron nitride, aluminium nitride and the CNT, and the ratio that said heat conduction inorganic filler adds is 20%～90% (percentage by weight) of heat conductive insulating basement membrane solid content.The thickness of said heat conductive insulating basement membrane is 7～100um.
Wherein, said coloured heat conductive insulating polymeric layer 3 for polyimide layer, the polyester layer that is added with inorganic color and heat conduction inorganic filler, the acrylate layer that is added with inorganic color and heat conduction inorganic filler that are added with inorganic color and heat conduction inorganic filler, be added with the ink lay of inorganic color and heat conduction inorganic filler or be added with inorganic color and the epoxy resin layer of heat conduction inorganic filler.The thickness of said coloured heat conductive insulating polymeric layer 3 is 1～25um.Add the inorganic color of different colours according to the difference of color demand, then add the blue inorganic colorant when the configuration polymer like the blue heat conductive insulating polymeric layer of needs.Wherein, With the heat conduction inorganic filler that adds as heat-conducting medium; Heat conduction inorganic filler is at least a in carborundum, aluminium oxide, boron nitride, aluminium nitride and the CNT, and the ratio that said heat conduction inorganic filler adds is 20%～90% (percentage by weight) of coloured heat conductive insulating polymeric layer solid content.Wherein, As the employed saturated polyester of coloured heat conductive insulating polymeric layer; Its characteristic needs better heat-resisting property and anti-yellowing sex change, therefore selected specific linear saturated polyester, and its employed curing agent is a blocked curing agent; But clad ability deblocking is participated in reaction after need being heated to uniform temperature, and the inorganic color of interpolation is the inorganic filler of respective color.
Wherein, said heat conductive insulating glue-line 2 for epoxy glue layer, the acrylic acid ester glue-line that is added with heat conduction inorganic filler, the polyester glue-line that is added with heat conduction inorganic filler that are added with heat conduction inorganic filler, be added with the polyurethane glue-line of heat conduction inorganic filler or be added with the polyimides glue-line of heat conduction inorganic filler.The thickness of said heat conductive insulating glue-line is 5～50um.Wherein, With the heat conduction inorganic filler that adds as heat-conducting medium; Said heat conduction inorganic filler is at least a in carborundum, aluminium oxide, boron nitride, aluminium nitride and the CNT, and the ratio that said heat conduction inorganic filler adds is 20%～90% (percentage by weight) of said heat conductive insulating glue-line solid content.
Wherein, the thickness of said release layer 4 is 30～200um.
Above-mentioned coloured heat conduction coverlay can make through following method:
One, linear saturated polyester, curing agent are used acetone solvent, stir, add the inorganic color and the heat conduction inorganic filler of respective color, stir, and be milled to the fineness of regulation, mix behind the froth breaking and process coloured heat conductive insulating polymer with sand mill;
Two, use coating machine to be coated on a side of heat conductive insulating basement membrane in coloured heat conductive insulating polymer; Through online baking-curing; Remove the organic solvent that includes, adjustment is produced linear speed and is guaranteed that the coloured heat conductive insulating polymeric layer that is coated with can reach curing when online baking, can not bond each other;
Three, utilize organic solvent dissolution heat conductive insulating glue-line to prepare needed chemical constituent, after mixing, add heat conduction inorganic filler, to the regulation fineness, process the heat conductive insulating glue-line through the sand mill sand milling;
Four, use coating machine to be coated on another side of heat conductive insulating basement membrane the heat conductive insulating glue-line; After the baking through online baking oven; The organic solvent that removal includes, and make the heat conductive insulating glue-line reach the moving state of semi-solid preparation semi-fluid, process coloured heat conduction coverlay behind the applying separated type material.
Coloured heat conduction coverlay (experimental group) of the utility model and prior art coverlay (comparative example) are done thermal conductivity, breakdown voltage resistant, dimensional stability, reflectivity and the test of scolding tin hear resistance, and test result is recorded in table one and table two.
Table one: thermal conductivity and breakdown voltage resistant
Comparison through showing a kind of data can see that each Laminate construction thickness increases can reduce heat transfer efficiency, and the ratio of heat conduction inorganic filler increases can promote thermal conductivity.And can know that by table one data coloured heat conduction coverlay of the utility model has high thermal conductivity and high breakdown voltage resistant.
Table two: dimensional stability, reflectivity and scolding tin hear resistance
| Experimental group | Comparative example 5 | Comparative example 6 | Comparative example 7 | Comparative example 8 | |
| Insulating basement membrane | Heat conduction is yellow | Heat conduction is yellow | Heat conduction is yellow | Heat conduction is yellow | Heat conduction is yellow |
| The insulation glue-line | Transparent | Transparent | Transparent | Transparent | Transparent |
| The insulating polymer layer | Coloured heat conduction | Do not have | Black | White | Do not have |
| Dimensional stability | 0.1％ | 0.2％ | 0.15％ | 0.17％ | 0.2％ |
| The scolding tin hear resistance | 288℃10S | 288℃10S | 288℃10S | 288℃10S | 288℃10S |
| Reflectivity | 82％ | 95％ | 85％ | 87％ | 83％ |
| Cover power | Opaque | Transparent | Opaque | Opaque | Opaque |
Can know that by table two coloured heat conduction coverlay of the utility model has excellent size stability and scolding tin hear resistance, and has antiradar reflectivity (delustring), also has the circuit of covering effect.
Claims (9)
1. coloured heat conduction coverlay; It is characterized in that: be provided with heat conductive insulating basement membrane (1); Said heat conductive insulating basement membrane has two relative surfaces, is stained with heat conductive insulating glue-line (2) and coloured heat conductive insulating polymeric layer (3) on two surfaces of said heat conductive insulating basement membrane respectively.
2. coloured heat conduction coverlay according to claim 1 is characterized in that: be provided with release layer (4), said release layer adheres on the said heat conductive insulating glue-line, and said heat conductive insulating glue-line is folded between said heat conductive insulating basement membrane and the said release layer.
3. coloured heat conduction coverlay according to claim 1; It is characterized in that: said heat conductive insulating basement membrane (1) gathers a kind of in naphthalene ester film and the conducting liquid crystal polymer film for heat conduction polyimide film, heat conduction polyester film, heat conduction, and the thickness of said heat conductive insulating basement membrane (1) is 7～100um.
4. coloured heat conduction coverlay according to claim 3 is characterized in that: said heat conductive insulating basement membrane (1) for the polyimide film, the polyester film that is added with heat conduction inorganic filler that are added with heat conduction inorganic filler, be added with gathering naphthalene ester film and being added with a kind of in the liquid crystalline polymer film of heat conduction inorganic filler of heat conduction inorganic filler.
5. coloured heat conduction coverlay according to claim 1; It is characterized in that: a kind of in coloured heat conduction polyimide layer, coloured heat conduction polyester layer, coloured heat conduction acrylate layer, coloured heat conduction ink lay and the coloured heat-conduction epoxy resin layer of said coloured heat conductive insulating polymeric layer (3), the thickness of said coloured heat conductive insulating polymeric layer (3) is 1～25um.
6. coloured heat conduction coverlay according to claim 5 is characterized in that: said coloured heat conductive insulating polymeric layer (3) for be added with inorganic color and heat conduction inorganic filler polyimide layer, be added with inorganic color and heat conduction inorganic filler polyester layer, be added with inorganic color and heat conduction inorganic filler acrylate layer, be added with the ink lay of inorganic color and heat conduction inorganic filler and be added with inorganic color and the epoxy resin layer of heat conduction inorganic filler in a kind of.
7. coloured heat conduction coverlay according to claim 1; It is characterized in that: a kind of in heat-conduction epoxy resin glue-line, heat conduction acrylic acid ester glue-line, heat conduction polyester glue-line, heat-conduction polyurethane glue-line and the heat conduction polyimides glue-line of said heat conductive insulating glue-line (2), the thickness of said heat conductive insulating glue-line (2) is 5～50um.
8. want 7 described coloured heat conduction coverlays according to right, it is characterized in that: said heat conductive insulating glue-line (2) for epoxy glue layer, the acrylic acid ester glue-line that is added with heat conduction inorganic filler, the polyester glue-line that is added with heat conduction inorganic filler that are added with heat conduction inorganic filler, be added with the polyurethane glue-line of heat conduction inorganic filler and be added with a kind of in the polyimides glue-line of heat conduction inorganic filler.
9. coloured heat conduction coverlay according to claim 2 is characterized in that: the thickness of said release layer (4) is 30～200um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204446189U CN202319173U (en) | 2011-11-11 | 2011-11-11 | Colored heat-conductive cover film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204446189U CN202319173U (en) | 2011-11-11 | 2011-11-11 | Colored heat-conductive cover film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202319173U true CN202319173U (en) | 2012-07-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204446189U Expired - Lifetime CN202319173U (en) | 2011-11-11 | 2011-11-11 | Colored heat-conductive cover film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202319173U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102970820A (en) * | 2012-11-24 | 2013-03-13 | 中山市东溢新材料有限公司 | Covering film for flexible printed circuit board and manufacturing process thereof |
| CN103101263A (en) * | 2011-11-11 | 2013-05-15 | 松扬电子材料(昆山)有限公司 | Colored thermal-conductive cover film |
| CN103619121A (en) * | 2013-11-26 | 2014-03-05 | 苏州城邦达力材料科技有限公司 | Laminating protective ink for circuit board |
| CN103625066A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Colored protective film, and cover film, composite film and stiffening plate containing the colored protective film |
| WO2021189411A1 (en) * | 2020-03-27 | 2021-09-30 | 鹏鼎控股(深圳)股份有限公司 | Covering film, and circuit board and manufacturing method |
-
2011
- 2011-11-11 CN CN2011204446189U patent/CN202319173U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103101263A (en) * | 2011-11-11 | 2013-05-15 | 松扬电子材料(昆山)有限公司 | Colored thermal-conductive cover film |
| CN103625066A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Colored protective film, and cover film, composite film and stiffening plate containing the colored protective film |
| CN102970820A (en) * | 2012-11-24 | 2013-03-13 | 中山市东溢新材料有限公司 | Covering film for flexible printed circuit board and manufacturing process thereof |
| CN103619121A (en) * | 2013-11-26 | 2014-03-05 | 苏州城邦达力材料科技有限公司 | Laminating protective ink for circuit board |
| WO2021189411A1 (en) * | 2020-03-27 | 2021-09-30 | 鹏鼎控股(深圳)股份有限公司 | Covering film, and circuit board and manufacturing method |
| CN114287172A (en) * | 2020-03-27 | 2022-04-05 | 鹏鼎控股(深圳)股份有限公司 | Cover film, circuit board and manufacturing method |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120711 |
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| CX01 | Expiry of patent term |