CN106128956A - 低成本绝缘栅场效应管(igbt)的制备方法 - Google Patents
低成本绝缘栅场效应管(igbt)的制备方法 Download PDFInfo
- Publication number
- CN106128956A CN106128956A CN201610782990.8A CN201610782990A CN106128956A CN 106128956 A CN106128956 A CN 106128956A CN 201610782990 A CN201610782990 A CN 201610782990A CN 106128956 A CN106128956 A CN 106128956A
- Authority
- CN
- China
- Prior art keywords
- oxide layer
- mask
- igbt
- alignment mark
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 13
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 8
- 238000001312 dry etching Methods 0.000 claims abstract description 4
- 238000001259 photo etching Methods 0.000 claims abstract description 4
- 238000007796 conventional method Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610782990.8A CN106128956B (zh) | 2016-08-31 | 2016-08-31 | 绝缘栅场效应管(igbt)的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610782990.8A CN106128956B (zh) | 2016-08-31 | 2016-08-31 | 绝缘栅场效应管(igbt)的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106128956A true CN106128956A (zh) | 2016-11-16 |
CN106128956B CN106128956B (zh) | 2019-07-30 |
Family
ID=57272492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610782990.8A Active CN106128956B (zh) | 2016-08-31 | 2016-08-31 | 绝缘栅场效应管(igbt)的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106128956B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1209650A (zh) * | 1997-08-25 | 1999-03-03 | 三菱电机株式会社 | 半导体装置及其制造方法 |
US6232200B1 (en) * | 1998-10-22 | 2001-05-15 | United Microelectronics Corp. | Method of reconstructing alignment mark during STI process |
US20120202138A1 (en) * | 2011-02-03 | 2012-08-09 | Micrel, Inc. | Single Field Zero Mask For Increased Alignment Accuracy in Field Stitching |
CN105244261A (zh) * | 2014-06-18 | 2016-01-13 | 上海华力微电子有限公司 | 半导体器件的制备方法 |
-
2016
- 2016-08-31 CN CN201610782990.8A patent/CN106128956B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1209650A (zh) * | 1997-08-25 | 1999-03-03 | 三菱电机株式会社 | 半导体装置及其制造方法 |
US6232200B1 (en) * | 1998-10-22 | 2001-05-15 | United Microelectronics Corp. | Method of reconstructing alignment mark during STI process |
US20120202138A1 (en) * | 2011-02-03 | 2012-08-09 | Micrel, Inc. | Single Field Zero Mask For Increased Alignment Accuracy in Field Stitching |
CN105244261A (zh) * | 2014-06-18 | 2016-01-13 | 上海华力微电子有限公司 | 半导体器件的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN106128956B (zh) | 2019-07-30 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 710021 export processing zone, No. twelve, 1 road, Fengcheng, Shaanxi, Xi'an Patentee after: Longteng Semiconductor Co., Ltd. Address before: 710021 export processing zone, No. twelve, 1 road, Fengcheng, Shaanxi, Xi'an Patentee before: Xi'an Lonten Renewable Energy Technology Inc. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 710021 export processing zone, No. twelve, 1 road, Fengcheng, Shaanxi, Xi'an Patentee after: Longteng Semiconductor Co.,Ltd. Address before: 710021 export processing zone, No. twelve, 1 road, Fengcheng, Shaanxi, Xi'an Patentee before: LONTEN SEMICONDUCTOR Co.,Ltd. |