CN106102437B - Feeding of chip mounter device - Google Patents
Feeding of chip mounter device Download PDFInfo
- Publication number
- CN106102437B CN106102437B CN201610775987.3A CN201610775987A CN106102437B CN 106102437 B CN106102437 B CN 106102437B CN 201610775987 A CN201610775987 A CN 201610775987A CN 106102437 B CN106102437 B CN 106102437B
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- China
- Prior art keywords
- burning
- flash
- window
- feeding
- module
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B69/00—Unpacking of articles or materials, not otherwise provided for
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention provides a kind of feeding of chip mounter device, which includes: web feed module, binder lid, burning module and burning connection component.Web feed module includes web feed track, for conveying Flash.Binder is covered on the web feed track, and the binder lid includes dyestripping window, for tearing the encapsulating film in the Flash.Burning connection component is set to the top position of the dyestripping window of the binder lid, after the Flash circulates to the dyestripping window and tears encapsulating film, the burning output end of the burning module is electrically connected by the burning connection component with the burning input terminal of the Flash；And the burning output end of the burning module and the burning input terminal of the Flash are disconnected after the completion of burning.
Description
Technical field
The present invention relates to chip mounter technical field more particularly to a kind of feeding of chip mounter devices.
Background technique
In current encapsulation technology, burning if desired is carried out to Flash, needs from the package to take out Flash, and will
Flash is put into corresponding fixture.After Flash is in place, preset software program is written in Flash replication tool.
After burning finishes, by Flash from taking out and be reentered into packaging in fixture.And subsequent surface mount process still needs
Flash is taken out from the package again.Unpack dress and repacking so repeatedly, the cost is relatively high for consuming, and entire raw
It is also relatively low to produce efficiency.
Summary of the invention
Present invention solves the technical problem that be to provide it is a kind of the burning process of Flash can be incorporated into it is surface-pasted
Feeding stage improves production efficiency, reduces the feeding of chip mounter device of production cost to reduce process.
The technical solution that the present invention solves above-mentioned technical problem is to provide a kind of feeding of chip mounter device, the feeding of chip mounter
Device includes:
Web feed module comprising web feed track, for conveying Flash；
Binder lid is set on the web feed track, and the binder lid includes dyestripping window, is used for the Flash
In encapsulating film tear；
Burning connection component, set on the top position of the dyestripping window of the binder lid, when the Flash circulates to described
Dyestripping window and after tearing encapsulating film, the burning connection component is by the burning input terminal of the Flash and burning module
The electrical connection of burning output end；And it is after the completion of burning that the burning output end of the burning module and the burning of the Flash is defeated
Enter end and disconnects electrical connection.
Preferably, the binder lid is also provided with: for the Flash on burning connection component and the web feed track into
The burning window of row connection, and the feeding window for chip mounter suction nozzle feeding；Conveying direction with the web feed module is
With reference to the feeding window is located at after the dyestripping window, and the burning window is located at the feeding window and tears with described
Between film window.
Preferably, the burning connection component includes: to be electrically connected with the burning output end of the burning module and can be with institute
The burning for stating Flash inputs end in contact or isolated contact pin, for driving the burning input of the contact pin and the Flash to terminate
Touching or isolated contact pin driving assembly.
Preferably, the contact pin driving assembly includes: electromagnetic relay, and after the Flash is by dyestripping described in control
Electromagnetic relay obtains control module electric and that the electromagnetic relay power-off is controlled after the completion of burning；Wherein, the electromagnetism after
The controlled end of electric appliance is connect with the control signal output of the control module, and the output end of the electromagnetic relay is inserted with described
Needle connection；When the electromagnetic relay obtains electric, the output end of electromagnetic relay drives the contact pin close to and with the Flash
Burning input port connection；When electromagnetic relay power-off, the output end of electromagnetic relay drives the contact pin mobile simultaneously
It is disconnected with the burning input port of the Flash.
Preferably, feeding of chip mounter device further includes for by the encapsulating film unreeling mechanism of the encapsulating film backrush；The envelope
Film unreeling mechanism is filled close to the dyestripping window.
Feeding of chip mounter device provided by the invention, the feeding of chip mounter device at binder lid by increasing burning connection group
Part, so that Flash, after dyestripping window is torn encapsulating film, burning connection component can be by the burning output end of burning module
It is electrically connected with the burning input terminal of Flash, is burned onto software so that Flash can be completed on feeding of chip mounter device
In the middle of Flash.After burning is completed, burning connection component is defeated by the burning of the burning output end of burning module and Flash
Enter end and disconnect electrical connection, so that Flash can be by the suction nozzle institute feeding of subsequent chip mounter.The present invention can be in feeding stage
Burning process is completed, carries out software burning without assembly line is in addition opened up, to greatly increase the efficiency of entire production process,
And reduce the cost of equipment.
Detailed description of the invention
Fig. 1 is the module diagram of one embodiment of feeding of chip mounter device of the present invention；
Fig. 2 is the top view of binder lid in feeding of chip mounter device of the present invention；
Fig. 3 is the module diagram of binder lid and burning connection component in feeding of chip mounter device of the present invention；
Fig. 4 is the module diagram of another embodiment of feeding of chip mounter device of the present invention.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
Below by specific embodiment combination attached drawing, invention is further described in detail.
With reference to Fig. 1 ~ 3, Fig. 1 is the module diagram of one embodiment of feeding of chip mounter device of the present invention；Fig. 2 is patch of the present invention
The top view of binder lid in machine feed appliance；Fig. 3 is the module of binder lid and burning connection component in feeding of chip mounter device of the present invention
Schematic diagram.One embodiment of the invention provides a kind of feeding of chip mounter device, which includes: web feed module 1, pressure
Expect lid 2 and burning connection component 3.
Web feed module 1 includes web feed track 11, for conveying Flash.It should be noted that web feed
Web feed track 11 in module 1 is in circulating rolling, and Flash is transported to discharge port by feeding port.The suction of chip mounter
Mouth can draw Flash from discharge outlet, to carry out next step surface mount process.The web feed rail of web feed module 1
Road 11 can be belt or others are able to drive Flash by the transport assembly of feeding port to discharge port.Web feed module 1
Power Component 12 can be the Power Components such as drive motor, as long as its be able to drive endless belt rotation.
Binder lid 2 is positioned approximately at the discharge outlet of feeding of chip mounter device.The main function of binder lid 2 is for by Flash
In encapsulating film tear so that Flash is exposed, in order to which subsequent progress software burning and chip mounter suction nozzle 5 are drawn etc.
Process.In the present embodiment, binder lid 2 offers dyestripping window 21.The encapsulating film of Flash is from dyestripping window 21 and Flash
Separation, so that Flash is exposed, so that burning module 4 can carry out software burning to Flash.Burning completes it
Flash afterwards can draw for chip mounter suction nozzle 5, to carry out the surface mounting operation of next step.In order to enable dyestripping process, burning
Record module can work simultaneously with chip mounter suction nozzle 5, and to improve production efficiency, further, binder lid 2 is also had additional:
For the burning window 22 that the Flash on burning connection component 3 and web feed track 11 is attached, and for chip mounter suction nozzle 5
The feeding window 23 of feeding.It is reference, feeding with the conveying direction of web feed module 1 in the present embodiment for convenience of statement
Window 23 is located at after dyestripping window 21, and burning window 22 is between feeding window 23 and dyestripping window 21.Flash is being torn
After film window 21 and encapsulation UF membrane, as the circulation of web feed track 11 to burning window 22 carries out burning.Burning completes it
Afterwards, Flash is circulated in turn to feeding window 23, for 5 feeding of chip mounter suction nozzle.Binder lid 2 adds two windows, so that dyestripping
Process, burning module and chip mounter suction nozzle 5 can work at the same time, to improve whole working efficiency.
Burning module 4 is used to software program being burned onto Flash.In the present embodiment, burning module 4 is to be located at chip mounter
Controller outside feed appliance.The controller can be dedicated replication tool, and preset software program is burned onto Flash
In the middle.It is connected between the burning output end of burning module 4 and the burning input terminal of Flash by burning connection component 3.?
In the present embodiment, after Flash is torn encapsulating film, burning connection component 3 by the burning output end of burning module 4 with
The burning input terminal of Flash is electrically connected.Then burning module 4 restarts burning program, can be realized and is burned onto software program
In Flash.In order not to interfere subsequent chip mounter to draw Flash, in the present embodiment, after software burning is completed, burn
The burning output end of burning module 4 is then electrically connected by record connection component 3 with the disconnection of the burning input terminal of Flash, so that burning
Flash after the completion, that is, negotiable to feeding window 23, is drawn by chip mounter suction nozzle 5.Specifically, burning connection component 3 wraps
End in contact or isolated contact pin 31 are included: being electrically connected with the burning output end of burning module 4 and can input with the burning of Flash, and
For driving contact pin 31 to input end in contact or isolated contact pin driving assembly 32 with the burning of Flash.It circulates when recognizing Flash
To burning window 22, contact pin driving assembly 32 drive contact pin 31 close to Flash burning input terminal and make burning input terminal with
The burning output end of burning module 4 is electrically connected.After burning module 4 completes burning, contact pin driving assembly 32 drives contact pin 31
The burning input terminal of Flash is left, and is restored to original position, so that the burning of the burning input terminal of Flash and burning module 4
It records output end and disconnects electrical connection, to facilitate subsequent chip mounter feeding.It should be noted that contact pin driving assembly 32 is used as contact pin
31 driving assembly, for driving 31 shift position of contact pin.In the present embodiment, contact pin driving assembly 32 includes: electromagnetism relay
Device 321, and control electromagnetic relay 321 after Flash is by dyestripping and obtain electric and break when burning controls electromagnetic relay 321 after the completion
The control module 322 of electricity.Wherein, the controlled end of electromagnetic relay 321 is connect with the control signal output of control module 322,
The output end of electromagnetic relay 321 is connect with contact pin 31.When electromagnetic relay 321 must be electric, the output end of electromagnetic relay 321
It drives contact pin 31 close and is connect with the burning input port of Flash.When electromagnetic relay 321 powers off, electromagnetic relay 321
Output end drives contact pin 31 mobile and disconnects with the burning input port of Flash.It should be noted that electromagnetic relay 321
Controlled end is low voltage control end, and when control module 322 exports high level, electromagnetic relay 321 obtains electric and generates magnetic field, so that
Sheet metal is sucked, at this point, contact pin 31 also pushes therewith, so that the burning with Flash inputs end in contact, so that burning mould
The burning output end of block 4 is electrically connected with the burning input terminal of Flash.After burning is completed, control module 322 then exports low electricity
It is flat, so that 321 power loss of electromagnetic relay, sheet metal rebound, to drive contact pin 31 to move up, so that the burning of burning module 4
Record output end is electrically connected with the disconnection of the burning input terminal of Flash.
Feeding of chip mounter device provided by the invention, the feeding of chip mounter device at binder lid 2 by increasing burning connection group
Part 3, so that Flash, after dyestripping window 21 is torn encapsulating film, burning connection component 3 can be by the burning of burning module 4
Output end is electrically connected with the burning input terminal of Flash, so that Flash is can be completed on feeding of chip mounter device by software burning
To Flash.After burning is completed, burning connection component 3 is by the burning output end of burning module 4 and the burning of Flash
It records input terminal and disconnects electrical connection, so that Flash can be by the suction nozzle institute feeding of subsequent chip mounter.The present invention can be in feeding
Stage completes burning process, software burning is carried out without assembly line is in addition opened up, to greatly increase entire production process
Efficiency, and reduce the cost of equipment.
With reference to Fig. 4, Fig. 4 is the module diagram of another embodiment of feeding of chip mounter device of the present invention.Further, patch
Machine feed appliance further includes for by the encapsulating film unreeling mechanism 6 of encapsulating film backrush.Encapsulating film unreeling mechanism 6 is close to dyestripping window
21.In order to enable the encapsulating film of Flash can be recycled effectively after being torn, in the present embodiment, in binder lid 2
Encapsulating film unreeling mechanism 6 is nearby arranged in dyestripping window 21.Encapsulating film unreeling mechanism 6 returns the encapsulating film being separated
Volume, to avoid being scattered on assembly line by isolated encapsulating film.
The above content is specific embodiment is combined, further detailed description of the invention, and it cannot be said that this hair
Bright specific implementation is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, it is not taking off
Under the premise of from present inventive concept, a number of simple deductions or replacements can also be made.
Claims (4)
1. a kind of feeding of chip mounter device characterized by comprising
Web feed module comprising web feed track, for conveying Flash；
Binder lid is set on the web feed track, and the binder lid includes dyestripping window, for will be in the Flash
Encapsulating film is torn；
Burning connection component, set on the top position of the dyestripping window of the binder lid, when Flash circulation to the dyestripping
Window and after tearing encapsulating film, the burning connection component is by the burning input terminal of the Flash and the burning of burning module
Output end electrical connection；And by the burning input terminal of the burning output end of the burning module and the Flash after the completion of burning
Disconnect electrical connection；
The binder lid is also provided with: the burning being attached for the Flash on burning connection component and the web feed track
Record window, and the feeding window for chip mounter suction nozzle feeding；It is reference with the conveying direction of the web feed module, it is described to take
Material window is located at after the dyestripping window, and the burning window is between the feeding window and the dyestripping window.
2. feeding of chip mounter device as described in claim 1, which is characterized in that the burning connection component includes: and the burning
It records the burning output end electrical connection of module and end in contact or isolated contact pin can be inputted with the burning of the Flash, for driving
The contact pin inputs end in contact or isolated contact pin driving assembly with the burning of the Flash.
3. feeding of chip mounter device as claimed in claim 2, which is characterized in that the contact pin driving assembly includes: electromagnetism relay
Device, and control the electromagnetic relay after the Flash is by dyestripping and obtain electric and control the electromagnetism relay after the completion of burning
The control module of device power-off；Wherein, the control signal output of the controlled end of the electromagnetic relay and the control module connects
It connects, the output end of the electromagnetic relay is connect with the contact pin；When the electromagnetic relay obtains electric, electromagnetic relay it is defeated
Outlet drives the contact pin close and connect with the burning input port of the Flash；When electromagnetic relay power-off, electromagnetism
The output end of relay drives the contact pin mobile and disconnects with the burning input port of the Flash.
4. feeding of chip mounter device as claimed in any one of claims 1 to 3, which is characterized in that further include for by the encapsulation
The encapsulating film unreeling mechanism of film backrush；The encapsulating film unreeling mechanism is close to the dyestripping window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610775987.3A CN106102437B (en) | 2016-08-31 | 2016-08-31 | Feeding of chip mounter device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610775987.3A CN106102437B (en) | 2016-08-31 | 2016-08-31 | Feeding of chip mounter device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106102437A CN106102437A (en) | 2016-11-09 |
| CN106102437B true CN106102437B (en) | 2019-08-09 |
Family
ID=57224140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610775987.3A Active CN106102437B (en) | 2016-08-31 | 2016-08-31 | Feeding of chip mounter device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106102437B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111056314B (en) * | 2020-01-16 | 2021-10-01 | 深圳市法本电子有限公司 | Automatic chip burning device |
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| JP2006156514A (en) * | 2004-11-26 | 2006-06-15 | Hitachi High-Tech Instruments Co Ltd | Component supplying device |
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| CN101790302A (en) * | 2009-01-27 | 2010-07-28 | 株式会社日立高新技术仪器 | Parts feeder |
| JP4714256B2 (en) * | 2008-11-05 | 2011-06-29 | ヤマハ発動機株式会社 | Parts supply device |
| CN203072310U (en) * | 2012-12-30 | 2013-07-17 | 曹挺 | Feeder gland structure of chip mounter |
| CN203503554U (en) * | 2013-09-10 | 2014-03-26 | 贵州航天电器股份有限公司 | Online programming sequential relay used for sequential control output |
| CN204882811U (en) * | 2015-07-15 | 2015-12-16 | 深圳市华沃表计科技有限公司 | Online quick automatic record, functional test integrated device of burning of PCBA |
| CN105824675A (en) * | 2016-03-24 | 2016-08-03 | 深圳市科美集成电路有限公司 | Circuit board burning tool, system and method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2843018Y (en) * | 2005-09-28 | 2006-11-29 | 雅马哈发动机株式会社 | Electronic component supply device |
| CN101477828B (en) * | 2008-11-18 | 2012-05-23 | 台达电子电源(东莞)有限公司 | Automatic IC burning machine |
| JP6035514B2 (en) * | 2012-11-28 | 2016-11-30 | パナソニックＩｐマネジメント株式会社 | Tape feeder |
| JP6293469B2 (en) * | 2013-12-05 | 2018-03-14 | ヤマハ発動機株式会社 | Electronic component supply device and electronic component mounting device |
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2016
- 2016-08-31 CN CN201610775987.3A patent/CN106102437B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156514A (en) * | 2004-11-26 | 2006-06-15 | Hitachi High-Tech Instruments Co Ltd | Component supplying device |
| JP4714256B2 (en) * | 2008-11-05 | 2011-06-29 | ヤマハ発動機株式会社 | Parts supply device |
| CN101790302A (en) * | 2009-01-27 | 2010-07-28 | 株式会社日立高新技术仪器 | Parts feeder |
| CN101719356A (en) * | 2009-11-27 | 2010-06-02 | 福建捷联电子有限公司 | Programming method for programming EDID simultaneously on liquid crystal display multiinterface |
| CN203072310U (en) * | 2012-12-30 | 2013-07-17 | 曹挺 | Feeder gland structure of chip mounter |
| CN203503554U (en) * | 2013-09-10 | 2014-03-26 | 贵州航天电器股份有限公司 | Online programming sequential relay used for sequential control output |
| CN204882811U (en) * | 2015-07-15 | 2015-12-16 | 深圳市华沃表计科技有限公司 | Online quick automatic record, functional test integrated device of burning of PCBA |
| CN105824675A (en) * | 2016-03-24 | 2016-08-03 | 深圳市科美集成电路有限公司 | Circuit board burning tool, system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106102437A (en) | 2016-11-09 |
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