CN106102437A - Feeding of chip mounter device - Google Patents
Feeding of chip mounter device Download PDFInfo
- Publication number
- CN106102437A CN106102437A CN201610775987.3A CN201610775987A CN106102437A CN 106102437 A CN106102437 A CN 106102437A CN 201610775987 A CN201610775987 A CN 201610775987A CN 106102437 A CN106102437 A CN 106102437A
- Authority
- CN
- China
- Prior art keywords
- burning
- flash
- window
- feeding
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B69/00—Unpacking of articles or materials, not otherwise provided for
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention provides a kind of feeding of chip mounter device, and this feeding of chip mounter device includes: web feed module, binder lid, burning module and burning connect assembly.Web feed module includes web feed track, for conveying Flash.Binder is covered on described web feed track, and described binder lid includes dyestripping window, for being torn by the encapsulating film in described Flash.Burning connects the top position that the dyestripping window of described binder lid is located at by assembly, when described Flash circulates described dyestripping window after tearing encapsulating film, and described burning connects assembly and electrically connected with the burning input of described Flash by the burning outfan of described burning module；And after burning completes, the burning input of the burning outfan of described burning module with described Flash is disconnected.
Description
Technical field
The present invention relates to chip mounter technical field, particularly relate to a kind of feeding of chip mounter device.
Background technology
In current encapsulation technology, if desired Flash is carried out burning, need to take out Flash from the package, and will
Flash is put in corresponding fixture.After Flash is in place, replication tool is by default software program write Flash.
After burning is complete, Flash is taken out from fixture and is reentered in packaging.And follow-up surface mount process need nonetheless remain for
Again Flash is taken out from the package.Unpack dress and repacking the most repeatedly, the cost of consuming is of a relatively high, and whole life
Produce efficiency the most relatively low.
Summary of the invention
Present invention solves the technical problem that to be to provide a kind of can be incorporated into surface-pasted by the burning operation of Flash
In the feeding stage, to reduce operation, improve production efficiency, reduce the feeding of chip mounter device of production cost.
The present invention solves the technical scheme of above-mentioned technical problem and is to provide a kind of feeding of chip mounter device, this feeding of chip mounter
Device includes:
Web feed module, it includes web feed track, for conveying Flash；
Binder lid, is located on described web feed track, and described binder lid includes dyestripping window, for by described Flash
Encapsulating film is torn；
Burning connects assembly, is located at the top position of the dyestripping window of described binder lid, when described Flash circulates described dyestripping
Window after tearing encapsulating film, described burning connects assembly by the burning of the burning input of described Flash Yu burning module
Outfan electrically connects；And by the burning input of the burning outfan of described burning module Yu described Flash after burning completes
Disconnect electrical connection.
Preferably, described binder lid is further opened with: connects assembly for burning and enters with the Flash on described web feed track
The burning window that row connects, and the feeding window for chip mounter suction nozzle feeding；With the conveying direction of described web feed module it is
Reference, after described feeding window is positioned at described dyestripping window, and described burning window is positioned at described feeding window and tears with described
Between film window.
Preferably, described burning connects assembly and includes: electrically connect with the burning outfan of described burning module and can be with institute
The burning input contact stating Flash or the contact pin separated, for driving the burning input termination of described contact pin and described Flash
The contact pin touched or separate drives assembly.
Preferably, described contact pin drives assembly to include: electromagnetic relay, and controls described after described Flash is by dyestripping
Electromagnetic relay obtains control module that is electric and that control described electromagnetic relay power-off after burning completes；Wherein, described electromagnetism continues
The controlled end of electrical equipment is connected with the control signal outfan of described control module, and the outfan of described electromagnetic relay is inserted with described
Pin connects；When described electromagnetic relay obtains electric, the outfan of electromagnetic relay drive described contact pin near and with described Flash
Burning input port connect；When described electromagnetic relay power-off, the outfan of electromagnetic relay drives described contact pin to move also
Disconnect with the burning input port of described Flash.
Preferably, feeding of chip mounter device also includes for the encapsulating film unreeling mechanism by described encapsulating film backrush；Described envelope
Dress film unreeling mechanism is near described dyestripping window.
The feeding of chip mounter device that the present invention provides, this feeding of chip mounter device is by increasing burning connection group at binder lid
Part so that Flash is after dyestripping window is torn encapsulating film, and burning connects assembly can be by the burning outfan of burning module
Electrically connect with the burning input of Flash, so that Flash can complete to be burned onto software on feeding of chip mounter device
In the middle of Flash.After burning completes, burning connects assembly, and the burning outfan of burning module is defeated with the burning of Flash
Enter end and disconnect electrical connection, so that Flash can be by the suction nozzle institute feeding of follow-up chip mounter.The present invention can be in the feeding stage
Complete burning operation, need not additionally offer streamline and carry out software burning, to greatly increase the efficiency of whole production process,
And reduce the cost of equipment.
Accompanying drawing explanation
Fig. 1 is the module diagram of feeding of chip mounter device one embodiment of the present invention；
Fig. 2 is the top view of binder lid in feeding of chip mounter device of the present invention；
Fig. 3 is the module diagram that in feeding of chip mounter device of the present invention, binder lid and burning connect assembly；
Fig. 4 is the module diagram of feeding of chip mounter another embodiment of device of the present invention.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further referring to the drawings.
Detailed description of the invention
Combine accompanying drawing below by detailed description of the invention the present invention is described in further detail.
With reference to Fig. 1 ~ 3, Fig. 1 is the module diagram of feeding of chip mounter device one embodiment of the present invention；Fig. 2 is paster of the present invention
The top view of binder lid in machine feed appliance；Fig. 3 is the module that in feeding of chip mounter device of the present invention, binder lid and burning connect assembly
Schematic diagram.One embodiment of the invention provides a kind of feeding of chip mounter device, and this feeding of chip mounter device includes: web feed module 1, pressure
Material lid 2 and burning connect assembly 3.
Web feed module 1 includes web feed track 11, for conveying Flash.It should be noted that, web feed
Web feed track 11 in module 1 is in circulating rolling, so that Flash is transported to discharging opening by feeding port.The suction of chip mounter
Mouth can draw Flash from discharge outlet, to carry out next step surface mount operation.The web feed rail of web feed module 1
Road 11 can be belt or other Flash can be driven by the transport assembly of feeding port to discharging opening.Web feed module 1
Power Component 12 can be to drive the Power Component such as motor, as long as it can drive endless belt to rotate.
Binder lid 2 is positioned approximately at the discharge outlet of feeding of chip mounter device.The Main Function of binder lid 2 is for by Flash
In encapsulating film tear so that Flash is exposed out, in order to follow-up carries out software burning and chip mounter suction nozzle 5 absorption etc.
Operation.In the present embodiment, binder lid 2 offers dyestripping window 21.The encapsulating film of Flash is at dyestripping window 21 and Flash
Separate, so that Flash is exposed out, so that burning module 4 can carry out software burning to Flash.Burning completes it
After Flash can draw for chip mounter suction nozzle 5, to carry out next step surface mounting operation.So that dyestripping operation, burning
Record module can be operated with chip mounter suction nozzle 5 simultaneously, and to improve production efficiency, further, binder lid 2 also has additional:
The burning window 22 that assembly 3 is attached is connected with the Flash on web feed track 11 for burning, and for chip mounter suction nozzle 5
The feeding window 23 of feeding.For convenience of statement, in the present embodiment, with the conveying direction of web feed module 1 as reference, feeding
After window 23 is positioned at dyestripping window 21, and burning window 22 is between feeding window 23 and dyestripping window 21.Flash is tearing
After film window 21 separates with encapsulating film, carry out burning along with web feed track 11 circulates to burning window 22.Burning completes it
After, Flash and then circulation are to feeding window 23, for chip mounter suction nozzle 5 feeding.Binder lid 2 sets up two windows so that dyestripping
Operation, burning module can work with chip mounter suction nozzle 5 simultaneously, thus improve the work efficiency of entirety.
Burning module 4 is for being burned onto Flash by software program.In the present embodiment, burning module 4 is for being located at chip mounter
Controller outside feed appliance.This controller can be special replication tool, so that default software program is burned onto Flash
In the middle of.It is connected assembly 3 by burning between burning outfan and the burning input of Flash of burning module 4 to couple together.?
In the present embodiment, after Flash is torn encapsulating film, burning connect assembly 3 by the burning outfan of burning module 4 with
The burning input electrical connection of Flash.Then burning module 4 restarts burning program, can realize being burned onto software program
In the middle of Flash.In order to not interfere follow-up chip mounter to draw Flash, in the present embodiment, after software burning completes, burn
Record connects assembly 3 and is then electrically connected with the burning input disconnection of Flash by the burning outfan of burning module 4, so that burning
Flash after completing is the most negotiable to feeding window 23, is drawn by chip mounter suction nozzle 5.Specifically, burning connection assembly 3 wraps
Include: the contact pin 31 electrically connecting with the burning outfan of burning module 4 and can contacting with the burning input of Flash or separate, and
Contact pin for driving contact pin 31 to contact with the burning input of Flash or separate drives assembly 32.When recognizing Flash circulation
To burning window 22, contact pin drive assembly 32 drive contact pin 31 near the burning input of Flash and make burning input with
The burning outfan electrical connection of burning module 4.After burning module 4 completes burning, contact pin drives assembly 32 to drive contact pin 31
Leave the burning input of Flash, and return to original position so that the burning input of Flash and the burning of burning module 4
Record outfan disconnects electrical connection, thus facilitates follow-up chip mounter feeding.It should be noted that, contact pin drives assembly 32 as contact pin
The driving assembly of 31, is used for driving contact pin 31 shift position.In the present embodiment, contact pin drives assembly 32 to include: electromagnetism relay
Device 321, and control after Flash is by dyestripping electromagnetic relay 321 electric and when burning completes after control electromagnetic relay 321 break
The control module 322 of electricity.Wherein, the controlled end of electromagnetic relay 321 is connected with the control signal outfan of control module 322,
The outfan of electromagnetic relay 321 is connected with contact pin 31.When electromagnetic relay 321 obtains electric, the outfan of electromagnetic relay 321
Drive contact pin 31 close and be connected with the burning input port of Flash.When electromagnetic relay 321 power-off, electromagnetic relay 321
Outfan drives contact pin 31 to move and disconnects with the burning input port of Flash.Should be noted that electromagnetic relay 321
Controlled end is low voltage control end, and when control module 322 exports high level, electromagnetic relay 321 obtains electric and produces magnetic field so that
Sheet metal is held, now, contact pin 31 also with under press, thus contact with the burning input of Flash, so that burning mould
The burning outfan of block 4 electrically connects with the burning input of Flash.After burning completes, control module 322 then exports low electricity
Flat so that electromagnetic relay 321 dead electricity, sheet metal resilience, thus drive and move on contact pin 31, so that the burning of burning module 4
Record outfan disconnects with the burning input of Flash and electrically connecting.
The feeding of chip mounter device that the present invention provides, this feeding of chip mounter device is by increasing burning connection group at binder lid 2
Part 3 so that Flash is after dyestripping window 21 is torn encapsulating film, and burning connects assembly 3 can be by the burning of burning module 4
Outfan electrically connects with the burning input of Flash, so that Flash can complete software burning on feeding of chip mounter device
To Flash.After burning completes, burning connects assembly 3 by the burning of the burning outfan of burning module 4 Yu Flash
Record input disconnects electrical connection, so that Flash can be by the suction nozzle institute feeding of follow-up chip mounter.The present invention can be in feeding
Stage completes burning operation, need not additionally offer streamline and carry out software burning, to greatly increase whole production process
Efficiency, and reduce the cost of equipment.
With reference to the module diagram that Fig. 4, Fig. 4 are feeding of chip mounter another embodiment of device of the present invention.Further, paster
Machine feed appliance also includes for by the encapsulating film unreeling mechanism 6 of encapsulating film backrush.Encapsulating film unreeling mechanism 6 is near dyestripping window
21.So that the encapsulating film of Flash can effectively be reclaimed after being torn, in the present embodiment, at binder lid 2
Encapsulating film unreeling mechanism 6 is set near dyestripping window 21.The encapsulating film being separated is carried out back by encapsulating film unreeling mechanism 6
Volume, thus avoid the encapsulating film separated to be scattered on streamline.
Above content is to combine specific embodiment further description made for the present invention, it is impossible to assert this
Bright being embodied as is confined to these explanations.For general technical staff of the technical field of the invention, do not taking off
On the premise of present inventive concept, it is also possible to make some simple deduction or replace.
Claims (5)
1. a feeding of chip mounter device, it is characterised in that including:
Web feed module, it includes web feed track, for conveying Flash；
Binder lid, is located on described web feed track, and described binder lid includes dyestripping window, for by described Flash
Encapsulating film is torn；
Burning connects assembly, is located at the top position of the dyestripping window of described binder lid, when described Flash circulates described dyestripping
Window after tearing encapsulating film, described burning connects assembly by the burning of the burning input of described Flash Yu burning module
Outfan electrically connects；And by the burning input of the burning outfan of described burning module Yu described Flash after burning completes
Disconnect electrical connection.
2. feeding of chip mounter device as claimed in claim 1, it is characterised in that described binder lid is further opened with: connect for burning
The burning window that assembly is attached with the Flash on described web feed track, and the feeding window for chip mounter suction nozzle feeding
Mouthful；With the conveying direction of described web feed module as reference, after described feeding window is positioned at described dyestripping window and described
Burning window is between described feeding window and described dyestripping window.
3. feeding of chip mounter device as claimed in claim 1, it is characterised in that described burning connects assembly and includes: with described burning
The contact pin that the burning outfan of record module electrically connects and can contact with the burning input of described Flash or separate, is used for driving
The contact pin that described contact pin contacts with the burning input of described Flash or separates drives assembly.
4. feeding of chip mounter device as claimed in claim 3, it is characterised in that described contact pin drives assembly to include: electromagnetism relay
Device, and after described Flash is by dyestripping, controls described electromagnetic relay obtains electric and after burning completes, control described electromagnetism relay
The control module of device power-off；Wherein, the controlled end of described electromagnetic relay connects with the control signal outfan of described control module
Connecing, the outfan of described electromagnetic relay is connected with described contact pin；When described electromagnetic relay obtains electric, electromagnetic relay defeated
Go out end drive described contact pin close and be connected with the burning input port of described Flash；When described electromagnetic relay power-off, electromagnetism
The outfan of relay drives described contact pin to move and disconnects with the burning input port of described Flash.
5. the feeding of chip mounter device as described in any one of claim 1 ~ 4, it is characterised in that also include for by described encapsulating film
The encapsulating film unreeling mechanism of backrush；Described encapsulating film unreeling mechanism is near described dyestripping window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610775987.3A CN106102437B (en) | 2016-08-31 | 2016-08-31 | Feeding of chip mounter device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610775987.3A CN106102437B (en) | 2016-08-31 | 2016-08-31 | Feeding of chip mounter device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106102437A true CN106102437A (en) | 2016-11-09 |
| CN106102437B CN106102437B (en) | 2019-08-09 |
Family
ID=57224140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610775987.3A Active CN106102437B (en) | 2016-08-31 | 2016-08-31 | Feeding of chip mounter device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106102437B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111056314A (en) * | 2020-01-16 | 2020-04-24 | 佛山普瑞威尔科技有限公司 | Automatic chip burning device |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156514A (en) * | 2004-11-26 | 2006-06-15 | Hitachi High-Tech Instruments Co Ltd | Component supplying device |
| CN2843018Y (en) * | 2005-09-28 | 2006-11-29 | 雅马哈发动机株式会社 | Electronic component supply device |
| CN101477828A (en) * | 2008-11-18 | 2009-07-08 | 台达电子电源(东莞)有限公司 | Automatic IC burning machine |
| CN101719356A (en) * | 2009-11-27 | 2010-06-02 | 福建捷联电子有限公司 | Programming method for programming EDID simultaneously on liquid crystal display multiinterface |
| CN101790302A (en) * | 2009-01-27 | 2010-07-28 | 株式会社日立高新技术仪器 | Parts feeder |
| JP4714256B2 (en) * | 2008-11-05 | 2011-06-29 | ヤマハ発動機株式会社 | Parts supply device |
| CN203072310U (en) * | 2012-12-30 | 2013-07-17 | 曹挺 | Feeder gland structure of chip mounter |
| CN203503554U (en) * | 2013-09-10 | 2014-03-26 | 贵州航天电器股份有限公司 | Online programming sequential relay used for sequential control output |
| CN203554885U (en) * | 2012-11-28 | 2014-04-16 | 松下电器产业株式会社 | Tape feeder |
| CN204882811U (en) * | 2015-07-15 | 2015-12-16 | 深圳市华沃表计科技有限公司 | Online quick automatic record, functional test integrated device of burning of PCBA |
| CN105684567A (en) * | 2013-12-05 | 2016-06-15 | 雅马哈发动机株式会社 | Electronic component supply device and electronic component mounting device |
| CN105824675A (en) * | 2016-03-24 | 2016-08-03 | 深圳市科美集成电路有限公司 | Circuit board burning tool, system and method |
-
2016
- 2016-08-31 CN CN201610775987.3A patent/CN106102437B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156514A (en) * | 2004-11-26 | 2006-06-15 | Hitachi High-Tech Instruments Co Ltd | Component supplying device |
| CN2843018Y (en) * | 2005-09-28 | 2006-11-29 | 雅马哈发动机株式会社 | Electronic component supply device |
| JP4714256B2 (en) * | 2008-11-05 | 2011-06-29 | ヤマハ発動機株式会社 | Parts supply device |
| CN101477828A (en) * | 2008-11-18 | 2009-07-08 | 台达电子电源(东莞)有限公司 | Automatic IC burning machine |
| CN101790302A (en) * | 2009-01-27 | 2010-07-28 | 株式会社日立高新技术仪器 | Parts feeder |
| CN101719356A (en) * | 2009-11-27 | 2010-06-02 | 福建捷联电子有限公司 | Programming method for programming EDID simultaneously on liquid crystal display multiinterface |
| CN203554885U (en) * | 2012-11-28 | 2014-04-16 | 松下电器产业株式会社 | Tape feeder |
| CN203072310U (en) * | 2012-12-30 | 2013-07-17 | 曹挺 | Feeder gland structure of chip mounter |
| CN203503554U (en) * | 2013-09-10 | 2014-03-26 | 贵州航天电器股份有限公司 | Online programming sequential relay used for sequential control output |
| CN105684567A (en) * | 2013-12-05 | 2016-06-15 | 雅马哈发动机株式会社 | Electronic component supply device and electronic component mounting device |
| CN204882811U (en) * | 2015-07-15 | 2015-12-16 | 深圳市华沃表计科技有限公司 | Online quick automatic record, functional test integrated device of burning of PCBA |
| CN105824675A (en) * | 2016-03-24 | 2016-08-03 | 深圳市科美集成电路有限公司 | Circuit board burning tool, system and method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111056314A (en) * | 2020-01-16 | 2020-04-24 | 佛山普瑞威尔科技有限公司 | Automatic chip burning device |
| CN111056314B (en) * | 2020-01-16 | 2021-10-01 | 深圳市法本电子有限公司 | Automatic chip burning device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106102437B (en) | 2019-08-09 |
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