CN106095195B - Input module and terminal - Google Patents
Input module and terminal Download PDFInfo
- Publication number
- CN106095195B CN106095195B CN201610675796.XA CN201610675796A CN106095195B CN 106095195 B CN106095195 B CN 106095195B CN 201610675796 A CN201610675796 A CN 201610675796A CN 106095195 B CN106095195 B CN 106095195B
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- China
- Prior art keywords
- input module
- support edge
- rosette
- convex portion
- case ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
- G06F3/0487—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser
- G06F3/0488—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
- G06F3/04883—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures for inputting data by handwriting, e.g. gesture or text
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Casings For Electric Apparatus (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention discloses a kind of input module and terminal.Input module includes case ring and fingerprint chip-packaging structure.Case ring includes rosette and support edge.The inwall of support edge self-chambering circlets extends internally.Fingerprint chip-packaging structure is housed in rosette and is supported on support edge.In the input module of embodiment of the present invention, the support edge of case ring can support and location fingerprint chip-packaging structure, so as to improve the efficiency of assembling of fingerprint chip-packaging structure and case ring.
Description
Technical field
The present invention relates to field of terminal, more particularly to a kind of input module and terminal.
Background technology
In the related art, some mobile phones include fingerprint chip-packaging structure and case ring, and fingerprint chip-packaging structure is set
Put in case ring so that the outward appearance for obtaining mobile phone is more attractive in appearance.But fingerprint chip-packaging structure is arranged on the position in case ring
Put and be difficult to determine, cause fingerprint chip-packaging structure to set efficiency of assembling during into case ring relatively low.
The content of the invention
It is contemplated that at least solves one of technical problem present in prior art.Therefore, present invention offer is a kind of defeated
Enter component and a kind of terminal.
The input module of embodiment of the present invention includes case ring and fingerprint chip-packaging structure.Case ring includes rosette
And support edge.The inwall of support edge self-chambering circlets extends internally.Fingerprint chip-packaging structure is housed in rosette and is supported on
On support edge.
In the input module of embodiment of the present invention, the support edge of case ring can support and location fingerprint chip package knot
Structure, so as to improve the efficiency of assembling of fingerprint chip-packaging structure and case ring.
In some embodiments, the rosette includes the roof being connected with the inwall, and the roof includes direction
Guide ramp in the case ring.
In some embodiments, the support edge is formed with avoid holes.
In some embodiments, the rounded rectangle of the avoid holes, the side walls of the avoid holes is along the avoid holes
Axial direction connects formed with escape groove, the escape groove with the avoid holes.
In some embodiments, the rosette includes the flange to stretch out from the outer wall of the rosette.
In some embodiments, the flange includes the second convex portion of the first convex portion and connection first convex portion, institute
The first convex portion is stated including first and second, second connection first and second convex portion, described second
Portion is convexly equipped in described first and second convex portion.
In some embodiments, the top surface of first convex portion and the either flush of second convex portion, described first
The thickness in portion is more than the thickness of second convex portion.
In some embodiments, the rosette is in Long Circle, and the outer wall of the rosette includes parallel two directly
Two bending sections of line segment and the described two straightways of connection, described first is arranged on one of them described described straightway
On, described second is arranged on described two bending sections.
In some embodiments, the fingerprint chip-packaging structure includes:
Packaging body, the packaging body include the side of bottom surface and the connection bottom surface, the company of the bottom surface and the side
Place is met to be housed in the depressed part formed with depressed part, the support edge;And
The fingerprint recognition chip being arranged in the packaging body.
In some embodiments, the packaging body includes the second envelope of the first encapsulation part and connection first encapsulation part
Dress portion, first encapsulation part include the bottom surface, and second encapsulation part includes the side;
Formed with avoid holes, first encapsulation part wears the avoid holes, the second encapsulation part branch for the support edge
Support is on the support edge.
In some embodiments, second encapsulation part includes the top surface being connected with the side, the fingerprint chip
Encapsulating structure includes fixed cover plate on the top surface.
In some embodiments, the depressed part includes second face in the first face and connection first face, and described the
Simultaneously perpendicular to second face, second encapsulation part includes first face, and first encapsulation part includes described second
Face.
In some embodiments, the input module includes seal, and the seal is arranged on second encapsulation
Between portion and the support edge, the seal seals the gap between the support edge and second encapsulation part.
In some embodiments, the input module includes touch panel, and the touch panel offers mounting hole, institute
State case ring to be set in the mounting hole, and be fixedly connected with the touch panel.
The terminal of embodiment of the present invention includes the input module described in any of the above embodiment.
In the input module of embodiment of the present invention, the support edge of case ring can support and location fingerprint chip package knot
Structure, so as to improve the efficiency of assembling of fingerprint chip-packaging structure and case ring.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
Obtain substantially and be readily appreciated that, wherein:
Fig. 1 is the floor map of the terminal of embodiment of the present invention;
Fig. 2 is the diagrammatic cross-section of the input module of embodiment of the present invention;
Fig. 3 is the schematic perspective view of the case ring of embodiment of the present invention;
Fig. 4 is the diagrammatic cross-section of the case ring of embodiment of the present invention;
Fig. 5 is the floor map of the case ring of embodiment of the present invention;
Fig. 6 is the perspective exploded view of the case ring of embodiment of the present invention;
Fig. 7 is another perspective exploded view of the case ring of embodiment of the present invention;
Fig. 8 is the schematic perspective view of the fingerprint chip-packaging structure of embodiment of the present invention;
Fig. 9 is the diagrammatic cross-section of the fingerprint chip-packaging structure of embodiment of the present invention;
Figure 10 is the floor map of the fingerprint chip-packaging structure of embodiment of the present invention.
Embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element is represented to same or similar label eventually or there is the element of same or like function.Below by ginseng
The embodiment for examining accompanying drawing description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
Description is of the invention to be described with simplified, rather than the device or element of instruction or hint meaning must be with specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes one or more feature.
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected;Can
To be mechanical connection or electrical connection or can mutually communicate;Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.Certainly, they are only example, and
And purpose does not lie in the limitation present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiments and/or setting
Relation.In addition, the invention provides various specific techniques and material examples, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Fig. 1 and Fig. 2 is referred to, the input module 100 of embodiment of the present invention includes touch panel 10, case ring 20 and referred to
Line chip-packaging structure 30.
The input module 100 of embodiment of the present invention can be applied to terminal 1000, and terminal 1000 is, for example, mobile phone or flat board
The electronic installations such as computer.It is appreciated that terminal 1000 includes but is not limited to the example of present embodiment.
Specifically, touch panel 10 includes upper surface 12 and lower surface 14.Upper surface 12 is opposite with lower surface 14.It can manage
Solution, the upper surface 12 of touch panel 10 is the appearance of input module 100, towards user.User can be enterprising in upper surface 12
Row gesture operation, such as click on or slide to control terminal 1000 to realize corresponding function.
The material of touch panel 10 can be made up of light transmissive materials such as glass, ceramics or sapphires.Due to touch panel 10
Due to the input part as terminal 1000, touch panel 10 is often subject to collide or the contact such as scratches.For example, user is by terminal
1000 when being put into pocket, and touch panel 10 may be scratched and damaged by the key in user's pocket.
Therefore, the material of touch panel 10 can use the larger material of hardness, such as above-described sapphire material.
It is of course also possible to cover sheet is set up in the upper surface 12 of touch panel 10 to prevent touch panel 10 to be scraped off.
Further, touch panel 10 includes viewing area 15 and non-display area 16.Normally, in touch panel 10
Between region be arranged on as viewing area 15, non-display area 16 around viewing area 15.For example, non-display area 16 is set
In the top side of viewing area 15 or bottom side.
Because touch panel 10 is made up of light transmissive material, therefore, user can check terminal 1000 by viewing area 15
Screen shown by content.
In order that obtaining the more attractive in appearance of terminal 1000, ink, ink can be sprayed in the lower surface 14 of non-display area 16
Color be, for example, that color, the concrete condition such as white, black or blueness can be set according to the actual requirements.Ink not only can be with
Meet demand of the user to the terminal 1000 of different colours, the structure inside terminal 1000 can also be covered to reach beautification terminal
1000 effect.
It is appreciated that the shape of touch panel 10 can be according to the shape specific design of terminal 1000, for example, fillet square
Shape.
Further, touch panel 10 offers mounting hole 17.In present embodiment, mounting hole 17 is through upper surface 12
And the through hole of lower surface 14.In other embodiments, mounting hole 17 can be formed in the blind hole of lower surface 14.
In present embodiment, mounting hole 17 is in the oval bodily form.Certainly, in other embodiments, mounting hole 17 can root
Taken on a different shape according to real needs design, such as circular or ellipse shape.Therefore, the mounting hole 17 of present embodiment
The example of shape is not considered as limiting the invention.
In some embodiments, case ring 20 is set in mounting hole 17, and is fixedly connected with touch panel 10.Refer to
Line chip-packaging structure 30 is housed in case ring 20, and is fixedly connected with case ring 20.
Usually, the receiver of terminal 1000 is arranged on the top area of terminal 1000.Therefore, in order to prevent mounting hole 17
Interfered with receiver, it is preferred that mounting hole 17 is opened in the bottom section of touch panel 10, so as to carrying for mounting hole 17
For larger design space.Further, mounting hole 17 is opened in the non-display area 16 of touch panel 10.
It is preferred that mounting hole 17 is opened in the centre position of the bottom section of touch panel 10 so that touch panel 10 is in big
Cause symmetrical structure.So so that terminal 1000 is more attractive in appearance, two is user-friendly.
, can be first by case ring 20 from touch panel 10 when manufacturing input module 100 when mounting hole 17 is through hole
Lower section loads mounting hole 17, and then glue is clicked and entered in the gap between the inwall and case ring 20 of mounting hole 17, so that case ring
20 are fixedly connected with touch panel 10.
Fingerprint chip-packaging structure 30 is loaded in case ring 20 from the top of touch panel 10 afterwards, and consolidated using colloid
Surely fingerprint chip-packaging structure 30 and case ring 20 are connected.
When mounting hole 17 is blind hole, first fingerprint chip-packaging structure 30 can be loaded in case ring 20, then refer to band
The case ring 20 of line chip-packaging structure 30 loads in mounting hole 17, and usable glue is adhesively fixed case ring 20 and touch panel
10。
It please join Fig. 3-Fig. 5, in some embodiments, case ring 20 includes rosette 21 and support edge 22.Support edge 22
The inwall 211 of self-chambering circlets 21 extends internally.
The support edge 22 of the case ring 20 of embodiment of the present invention can support and location fingerprint chip-packaging structure 30, from
And improve the efficiency of assembling of fingerprint chip-packaging structure 30 and case ring 20.
In other words, fingerprint chip-packaging structure 30 is supported on support edge 22.Fingerprint chip-packaging structure 30 is loaded
When in rosette 21, fingerprint chip-packaging structure 30 can be pressed from top to bottom, if the position of fingerprint chip-packaging structure 30
It can not move again, then it represents that fingerprint chip-packaging structure 30 has been resisted against on support edge 22, and is installed into precalculated position.
It is appreciated that rosette 21 is located in accommodating hole 212 formed with accommodating hole 212, support edge 22.Accommodating hole 212 can
So that in right cylinder shape, in other words, inwall 211 is linearly, in order to which fingerprint chip-packaging structure 30 rapidly loads accommodating hole 212
It is interior.
The material that accommodating hole 212 and support edge 22 can be removed on part by way of machining is formed, can also
Formed by modes such as castings.
In order to ensure the intensity of case ring 20, it is preferred that the material of case ring 20 is metal, such as stainless steel material, from
And meet the intensity requirement of case ring 20, also with corrosion resistance, improve the life-span of case ring 20.Certainly, case ring 20
The other materials such as plastics can be used to be made.
In some embodiments, further, fingerprint chip-packaging structure 30 is housed in rosette 21 and is supported on
On support edge 22.
In some embodiments, inwall 211 of the support edge 22 perpendicular to rosette 21.
In this way, support edge 22 is easily formed, the manufacturing cost of rosette 21 can be reduced.In addition, when manufacture input module
When 100, support edge 22 is horizontally situated, and the inwall 211 of rosette 21 is located at vertical position so that is coordinated with support edge 22
The face of fingerprint chip-packaging structure 30 is horizontal plane, can so simplify the fingerprint chip-packaging structure being supported on support edge 22
30 structure.
In some embodiments, rosette 21 includes the first bottom surface 213 for being connected with inwall 211, under support edge 22
Surface 221 is concordant with the first bottom surface 213.
In the rosette 21 of equal height, such as arrangement above, larger accommodation space can be formed in rosette 21, with
Ensure that fingerprint chip-packaging structure 30 can be housed in rosette 21.
In other words, in the case where the thickness of fingerprint chip-packaging structure 30 is constant, the height of rosette 21 is smaller, so as to
The thickness of input module 100 can be reduced, and then can be the thinned offer design basis of thickness of terminal 1000.
In some embodiments, rosette 21 includes roof 214.Roof 214 is connected with inwall 211.Roof 214 includes
Towards the guide ramp 2142 in case ring 20.
In this way, the finger that guide ramp 2142 can guide user smoothly enters in rosette 21 to carry out fingerprint recognition behaviour
Make, the accuracy rate that user carries out fingerprint recognition operation can be improved.It is shinny it is possible to further be plated in guide ramp 2142
Metal level (such as layers of chrome), so that rosette 21 is more attractive in appearance.
It is appreciated that guide ramp 2142 is ring surface, it can so facilitate user that finger is inserted into decoration from all directions
To press fingerprint chip-packaging structure 30 in ring 21, so as to carry out fingerprint recognition operation.
In some embodiments, support edge 22 is formed with avoid holes 222.
In this way, avoid holes 222 are advantageous to the cabling for the fingerprint flexible PCB 40 being connected with fingerprint chip-packaging structure 30
Layout.For example, fingerprint flexible PCB 40 can pass through avoid holes 222 to be connected with fingerprint chip-packaging structure 30 (such as Fig. 2 institutes
Show).
In some embodiments, 222 rounded rectangle of avoid holes, the side walls 2221 of avoid holes 222 is along avoid holes 222
Axial direction connects formed with escape groove 2222, escape groove 2222 with avoid holes 222.
Such as shown in Fig. 2, after fingerprint flexible PCB 40 is connected with fingerprint chip-packaging structure 30, first to escape groove 2222
Direction extension, then bend roundabout.Therefore, escape groove 2222 can prevent fingerprint flexible PCB 40 from occurring with side wall 2221
Interference, is advantageous to fingerprint flexible PCB 40 and connects up.
In some embodiments, case ring 20 includes the flange 23 that the outer wall of self-chambering circlets 21 stretches out.
In this way, flange 23 can be resisted against the lower surface 14 of touch panel 10, so as to increase case ring 20 and touch surface
The connection area of plate 10, improve the reliability that case ring 20 is fixedly connected with touch panel 10.
In addition, when from the bottom up loading case ring 20 in mounting hole 17, flange 23 is resisted against under touch panel 10
During surface 14, then it represents that case ring 20 is already mounted to precalculated position.Therefore, the setting of flange 23 also improves input module 100
Efficiency of assembling, reduce the manufacturing cost of input module 100.
In some embodiments, diaphragm seal can be set between flange 23 and lower surface 14 to prevent water from case ring 20
Gap between mounting hole 17 enters in terminal 1000, so as to improve the waterproof effect of terminal 1000.
As Fig. 3-Fig. 5 embodiment in, flange 23 and rosette 21 are formed in one structure.And such as Fig. 6 and Fig. 7 reality
Apply in mode, flange 23 and rosette 21 are split molding structure.Specifically, rosette 21 includes socket part 24, socket part 24
Connect support edge 22.Flange 23 is set on socket part 24.Flange 23 can reduce case ring 20 with the split of rosette 21 shaping
Manufacture difficulty so that when producing case ring 20 in batches, the uniformity of each case ring 20 can be improved.
It is pointed out that in some embodiments, socket part 24 can offer to be passed through for fingerprint flexible PCB 40
Via 24a.
Specifically, socket part 24 includes connection side 241 and loading plate 242.Connect side 241 and connect support edge 22 and loading plate
242, connection side 241 is approximately perpendicular to support edge 22.Loading plate 242 is approximately perpendicular to connection side 241.Connection side 241 offers
Via 24a.
Socket part 24 is hollow partly or entirely to house fingerprint chip-packaging structure 30.It should be noted that at certain
In a little embodiments, fingerprint chip-packaging structure 30 can be supported on loading plate 242.
Referring to Fig. 3-Fig. 5, in some embodiments, outer wall 215 of the flange 23 perpendicular to rosette 21.
In this way, the manufacturing process of case ring 20 is simple, the contact area being connected with touch panel 10 can also be increased.
In some embodiments, flange 23 includes the first convex portion 231 and connects the second convex portion 232 of the first convex portion 231,
First convex portion 231 includes first 2311 and second 2312, and second 2312 connects first 2311 and the second convex portion 232,
It is convexly equipped in first 2311 and the second convex portion 232 for second 2312.
After case ring 20 loads mounting hole 17, the longitudinal direction of first 2311 and the second convex portion 232 along touch panel 10
Extension, second 2312 extends along the horizontal direction of touch panel 10.
Because the accommodation space of the horizontal direction of touch panel 10 is larger, therefore, second 2312 is convexly equipped in first 2311
And second convex portion 232 can increase the connection area of flange 23 and touch panel 10.
In addition, the width of first 2311 and the second convex portion 232 is smaller, the non-display area of touch panel 10 can be avoided
16 longitudinal length lengthens because of the width of first 2311 and the second convex portion 232, and reduces the area of viewing area 15 with touching
The area ratio of panel 10 is touched, and then influences the outward appearance of terminal 1000.
In some embodiments, the top surface 231a of the first convex portion 231 is concordant with the top surface 232a of the second convex portion 232, the
The thickness of one 2311 is more than the thickness of the second convex portion 232.
It is appreciated that after case ring 20 loads mounting hole 17, relative to first 2311, the second convex portion 232 is closer to aobvious
Show region 15.In other words, set away from viewing area 15 for first 2311, the second convex portion 232 is set close to viewing area 15.
Because part of the input module 100 close to the position of viewing area 15 is more, therefore, the thickness of the second convex portion 232
It is relatively thin that the second convex portion 232 can be avoided to be interfered (as shown in Figure 2) with the other parts close to viewing area 15.
As shown in Fig. 2 the screen flexible PCB 50 and other parts of screen of the case ring 20 with being connected terminal 1000 exist
Overlapping part be present in the orthographic projection on the lower surface 14 of touch panel 10, the thinner thickness of the second convex portion 232 can avoid with
Screen flexible PCB 50 and other parts are interfered so that case ring 20 can be set closer to viewing area 15, decoration
Circle 20 even can be partly or entirely arranged in the viewing area 15 of touch panel 10, to reduce the area of non-display area 16
With the ratio of the area of touch panel 10, the ratio of the area of increase viewing area 15 and the area of touch panel 10.
In some embodiments, rosette 21 is in Long Circle, and the outer wall 215 of rosette 21 includes two parallel straight lines
Section 2151 and two bending sections 2152 for connecting two straightways 2151, first 2311 is disposed therein a straightway 2151
On, second 2312 is arranged on two bending sections 2152.
In this way, rosette 21 is more attractive in appearance.Specifically, transversely arranged (such as Fig. 1 of two bending sections 2152 along touch panel 10
In left and right to), two straightways 2151 along touch panel 10 longitudinal direction (with laterally it is vertical) arrange.
In some embodiments, the shape of second 2312 is engaged with the shape of bending section 2152.
For example, the outline of second 2312 is also circular arc, and substantially it is arranged concentrically with bending section 2152.So may be used
To cause the structure of case ring 20 compacter.
Also referring to Fig. 8-Figure 10, in some embodiments, fingerprint chip-packaging structure 30 include packaging body 31 and
Fingerprint recognition chip 32.
Packaging body 31 includes the second bottom surface 311 and connects the side 312 of the second bottom surface 311, the second bottom surface 311 and side
312 junction is formed with depressed part 33.Fingerprint recognition chip 32 is arranged in packaging body 31.
In the fingerprint chip-packaging structure 30 of embodiment of the present invention, depressed part 33 can be with the support edge in case ring 20
22 coordinate, and so as to location fingerprint chip-packaging structure 30, and then improve the efficiency of assembling of fingerprint chip-packaging structure 30.
In addition, depressed part 33 coordinates the thickness that can also reduce fingerprint chip-packaging structure 30 with support edge 22, be advantageous to
The terminal 1000 of employing fingerprint chip-packaging structure 30 minimizes.
Specifically, when user carries out the operation of unlocked by fingerprint terminal 1000, finger can be placed on and fingerprint recognition chip
Position corresponding to 32.The signal of fingerprint recognition chip 32 identifies the fingerprint pattern of user through packaging body 31 with collection, by user
Fingerprint pattern matched with the fingerprint pattern to prestore, if the match is successful, unlock terminal 1000.
It is appreciated that the surface of fingerprint recognition chip 32 towards the finger of user is provided with sensor pixel array, with collection
The fingerprint pattern of user.Packaging body 31, which encapsulates fingerprint recognition chip 32, can reduce sensor pixel array when gathering fingerprint pattern
Influenceed by other interference signals, to improve the accuracy rate of identification.
It should be noted that depressed part 33 is used to support edge 22 coordinate so that fingerprint chip-packaging structure 30 passes through depression
Portion 33 is supported on support edge 22.
Depressed part 33 coordinates with support edge 33, and in other words, support edge 22 is housed in depressed part 33.
In the present embodiment, the structure in a ring of depressed part 33, correspondingly, support edge 22 also in a ring structure so that depression
Portion 33 can house support edge 22.
In other embodiments, depressed part 33 can be circumferentially-spaced around the junction of the second bottom surface 311 and side 312
The multiple depressed parts 33 set, correspondingly, support edge 22 are also around circumferentially spaced multiple support edges 22, multiple depressed parts
33 with multiple corresponding matchings of support edge 22.
Such as the quantity of depressed part 33 is 3, two neighboring depressed part 33 is around circumferentially-spaced 120 degree settings, support edge 22
Quantity be also 3, it is and corresponding with 3 depressed parts in locations of structures.
It is pointed out that the shape of depressed part 33 and quantity are not limited to situation discussed above, if depressed part 33 with
Support edge 22 coordinates so that support edge 22 can support fingerprint chip-packaging structure 30, and therefore, example described above is not
It is interpreted as limitation of the present invention.
Certainly, in other embodiments, when the thinner thickness of fingerprint chip-packaging structure 30, fingerprint chip package knot
Structure 30 can also omit depressed part 33.
In some embodiments, packaging body 31 includes the first encapsulation part 313 and connects the second envelope of the first encapsulation part 313
Dress portion 314, the first encapsulation part 313 include the second bottom surface 311, and the second encapsulation part 314 includes side 312.
In this way, the first encapsulation part 313 is connected with the second encapsulation part 314 can form depressed part 33.Packaging body 31 can pass through
The material on packaging body 31 is machined away so as to form depressed part 33, can also be connected by the first encapsulation part 313 and the second encapsulation part 314
Connect to be formed.
It is appreciated that in order to form depressed part 33, the cross-sectional area of the first encapsulation part 313 is less than the second encapsulation part 314
Cross-sectional area.
In some embodiments, the first encapsulation part 313 wears avoid holes 222, and the second encapsulation part 314 is supported on support edge
On 22.
In some embodiments, fingerprint recognition chip 32 is arranged in the first encapsulation part 313.
In this way, the circuit junction of fingerprint recognition chip 32 easily exposes to be connected with fingerprint flexible PCB 40.
In some embodiments, the form and dimension of the first encapsulation part 313 and the shape of fingerprint recognition chip 32 and big
Small cooperation.
In other words, the shape of the shape of fingerprint recognition chip 32 and the first encapsulation part 313 is similar or identical, for example, fingerprint
Identification chip 32 is in cuboid, and the shape of the first encapsulation part 313 is in cuboid or rounded cuboid shape.
The size of first encapsulation part 313 encapsulates fingerprint recognition chip 32 slightly larger than the size of fingerprint recognition chip 32 to realize
Effect.Therefore, it can so cause that the structure of fingerprint chip-packaging structure 30 is compacter.
In some embodiments, the rounded cuboid of shape of the first encapsulation part 313.
In this way, the first encapsulation part 313 can preferably coordinate with fingerprint recognition chip 32.Further, the first encapsulation part
313 shape and the form fit of avoid holes 222, that is to say, that the shape of avoid holes 222 also rounded cuboid.
In some embodiments, the second encapsulation part 314 includes the top surface 3141 being connected with side 312, fingerprint chip envelope
Assembling structure 30 includes the cover plate 34 being fixed on the top surface 3141 of the second encapsulation part 314.For example, cover plate 34 is consolidated by colloid
It is scheduled on the top surface 3141 of the second encapsulation part 314.
When carrying out fingerprint recognition operation, finger can be pressed against in cover plate 34 user.Cover plate 34 can be with tamper seal
It is without damage to fill body 31, to improve the reliability of fingerprint chip-packaging structure 30.
Cover plate 34 is touched due to being often subject to, and therefore, the material that cover plate 34 can be used hardness higher is made, such as with
On the sapphire material that refers to.
In some embodiments, the form and dimension of cover plate 34 and the shape of the top surface 3141 of the second encapsulation part 314
And size coordinates.
For example, the shape of top surface 3141 is in Long Circle, the shape of cover plate 34 is also in Long Circle.The area of cover plate 34 omits
More than the area of the top surface 3141 of the second encapsulation part 314.Therefore, the second encapsulation part 314 can be completely covered in cover plate 34.
In some embodiments, seal 60 is provided between the second encapsulation part 314 and support edge 22, seal 60 is close
The gap sealed between the second encapsulation part 314 and support edge 22.Seal 60 is for example made up (as shown in Figure 2) of silica gel.
In this way, seal 60 can prevent the foreign matters such as water and dust between fingerprint chip-packaging structure 30 and case ring 20
Gap enter in terminal 1000, improve the water proof and dust proof effect of terminal 1000.
In some embodiments, depressed part 33 includes the first face 331 and connects second face 332 in the first face 331, and first
Face 331 is perpendicular to the second face 332.
In this way, depressed part 33 is easily formed, the first face 331 is easily connected with support edge 22.First face 331 and the second face
332 vertically cause packaging body 31 in step-like.
Specifically, seal 60 is arranged between the first face 331 and support edge 22.
In some embodiments, the rounded transition shape in the junction in the first face 331 and the second face 332.
In this way, the defects of crackle is less likely to occur for the junction in the first face 331 and the second face 332, and depressed part 33 holds
Easily formed.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description
Specific features, structure, material or feature are contained at least one embodiment or example of the present invention.In this specification
In, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description
Sign, structure, material or feature can combine in an appropriate manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of changes, modification in the case of not departing from the principle and objective of the present invention, replace and become
Type, the scope of the present invention are limited by claim and its equivalent.
Claims (11)
- A kind of 1. input module, it is characterised in that including:Case ring, the case ring include the support edge that rosette and the inwall from the rosette extend internally;AndFingerprint chip-packaging structure, the fingerprint chip-packaging structure are housed in the rosette and are supported on the support edge On;The case ring includes the flange to stretch out from the outer wall of the rosette, and the flange and the rosette are split Structure, the rosette include socket part, and the socket part connects support edge, and the flange is set on the socket part;The flange includes the second convex portion of the first convex portion and connection first convex portion, first convex portion include first and Second, second connection first and second convex portion, described second is convexly equipped in described first and institute State the second convex portion, the Longitudinal extending of described first and second convex portion along touch panel, described second along the touch Panel extends laterally;The top surface of first convex portion and the either flush of second convex portion, the thickness of described first are convex more than described second The thickness in portion;The fingerprint chip-packaging structure includes:Packaging body, the packaging body include the side of bottom surface and the connection bottom surface, the junction of the bottom surface and the side Formed with depressed part, the support edge is housed in the depressed part;AndThe fingerprint recognition chip being arranged in the packaging body.
- 2. input module as claimed in claim 1, it is characterised in that the rosette includes the top being connected with the inwall Wall, the roof are included towards the guide ramp in the case ring.
- 3. input module as claimed in claim 1, it is characterised in that the support edge is formed with avoid holes.
- 4. input module as claimed in claim 3, it is characterised in that the rounded rectangle of avoid holes, the avoid holes Axial direction of the side wall along the avoid holes connects formed with escape groove, the escape groove with the avoid holes.
- 5. input module as claimed in claim 1, it is characterised in that the rosette is in Long Circle, the rosette it is outer Wall includes two bending sections of parallel two straightways and the described two straightways of connection, described first be arranged on it is described its In on a straightway, described second is arranged on described two bending sections.
- 6. input module as claimed in claim 1, it is characterised in that the packaging body is included described in the first encapsulation part and connection Second encapsulation part of the first encapsulation part, first encapsulation part include the bottom surface, and second encapsulation part includes the side;Formed with avoid holes, first encapsulation part wears the avoid holes for the support edge, and second encapsulation part is supported on On the support edge.
- 7. input module as claimed in claim 6, it is characterised in that the depressed part includes the first face and connection described first Second face in face, first face include first face, first envelope perpendicular to second face, second encapsulation part Dress portion includes second face.
- 8. input module as claimed in claim 6, it is characterised in that the input module includes seal, the seal It is arranged between second encapsulation part and the support edge, the seal seals the support edge and second encapsulation part Between gap.
- 9. input module as claimed in claim 1, it is characterised in that the packaging body includes the top being connected with the side Face, the fingerprint chip-packaging structure include fixed cover plate on the top surface.
- 10. input module as claimed in claim 1, it is characterised in that the input module includes touch panel, the touch Panel offers mounting hole, and the case ring is set in the mounting hole, and is fixedly connected with the touch panel.
- 11. a kind of terminal, it is characterised in that including the input module as described in claim any one of 1-10.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810162035.3A CN108376040B (en) | 2016-08-16 | 2016-08-16 | Input assembly and terminal |
CN201610675796.XA CN106095195B (en) | 2016-08-16 | 2016-08-16 | Input module and terminal |
EP17176611.6A EP3285463B1 (en) | 2016-08-16 | 2017-06-19 | Input assembly and terminal |
ES17176611T ES2705159T3 (en) | 2016-08-16 | 2017-06-19 | Input and terminal assembly |
US15/628,214 US10361861B2 (en) | 2016-08-16 | 2017-06-20 | Input assembly and terminal |
PCT/CN2017/090337 WO2018032881A1 (en) | 2016-08-16 | 2017-06-27 | Input assembly and terminal |
US15/973,951 US10361862B2 (en) | 2016-08-16 | 2018-05-08 | Input assembly and terminal |
Applications Claiming Priority (1)
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CN201610675796.XA CN106095195B (en) | 2016-08-16 | 2016-08-16 | Input module and terminal |
Related Child Applications (1)
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CN201810162035.3A Division CN108376040B (en) | 2016-08-16 | 2016-08-16 | Input assembly and terminal |
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CN106095195A CN106095195A (en) | 2016-11-09 |
CN106095195B true CN106095195B (en) | 2018-03-30 |
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CN201810162035.3A Active CN108376040B (en) | 2016-08-16 | 2016-08-16 | Input assembly and terminal |
CN201610675796.XA Active CN106095195B (en) | 2016-08-16 | 2016-08-16 | Input module and terminal |
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CN201810162035.3A Active CN108376040B (en) | 2016-08-16 | 2016-08-16 | Input assembly and terminal |
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Families Citing this family (13)
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US10565426B2 (en) | 2016-08-16 | 2020-02-18 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint chip package structure, input assembly and terminal |
EP3285463B1 (en) * | 2016-08-16 | 2018-11-14 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Input assembly and terminal |
WO2018120478A1 (en) * | 2016-12-26 | 2018-07-05 | 华为技术有限公司 | Shell assembly, mobile terminal, and method for assembling shell assembly |
WO2018145234A1 (en) * | 2017-02-07 | 2018-08-16 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition device |
CN107016340A (en) * | 2017-03-01 | 2017-08-04 | 广东欧珀移动通信有限公司 | Input module and electronic installation |
WO2018157687A1 (en) * | 2017-03-01 | 2018-09-07 | 广东欧珀移动通信有限公司 | Input component and electronic device |
CN108664081B (en) * | 2017-03-31 | 2024-04-09 | 荣耀终端有限公司 | Fingerprint identification device and terminal equipment |
CN107295128A (en) * | 2017-07-17 | 2017-10-24 | 广东欧珀移动通信有限公司 | Fingerprint recognition case ring fixation kit, assembly method and mobile terminal |
WO2019071603A1 (en) * | 2017-10-13 | 2019-04-18 | 华为技术有限公司 | Structure of electronic device and electronic device |
WO2019075713A1 (en) * | 2017-10-20 | 2019-04-25 | 华为技术有限公司 | Fingerprint package chip and packaging method, fingerprint module and mobile terminal |
CN110197539B (en) * | 2018-02-27 | 2022-07-12 | 江西欧迈斯微电子有限公司 | Fingerprint identification module and fingerprint identification lock |
US11665839B2 (en) | 2020-12-16 | 2023-05-30 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Flexible display device |
CN112466217A (en) * | 2020-12-16 | 2021-03-09 | 武汉华星光电半导体显示技术有限公司 | Flexible display device |
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KR101505993B1 (en) * | 2013-05-01 | 2015-03-27 | 이상대 | Fingerprint recognition sensor package and method for manufacturing fingerprint recognition sensor package |
KR101368804B1 (en) * | 2013-06-26 | 2014-03-03 | (주)드림텍 | Method of manufacturing fingerprint recognition home key having offset structure of deco part and the structure of fingerprint recognition home key thereof |
KR20150099295A (en) * | 2014-02-21 | 2015-08-31 | 삼성전자주식회사 | Electronic device including a physical key |
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CN105810645A (en) * | 2015-07-15 | 2016-07-27 | 维沃移动通信有限公司 | Biological identification chip packaging structure and mobile terminal |
CN105117718A (en) * | 2015-09-25 | 2015-12-02 | 上海箩箕技术有限公司 | Fingerprint sensor decoration ring assembly and use method thereof |
CN105303177B (en) * | 2015-10-21 | 2019-02-01 | Oppo广东移动通信有限公司 | A kind of camera with fingerprint identification function and corresponding terminal |
CN105844237B (en) * | 2016-03-22 | 2018-05-04 | 广东欧珀移动通信有限公司 | For terminal fingerprint sensing component and there is its terminal |
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Also Published As
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CN106095195A (en) | 2016-11-09 |
CN108376040B (en) | 2021-05-14 |
CN108376040A (en) | 2018-08-07 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |