CN206133367U - Input group spare and terminal - Google Patents
Input group spare and terminal Download PDFInfo
- Publication number
- CN206133367U CN206133367U CN201620889021.8U CN201620889021U CN206133367U CN 206133367 U CN206133367 U CN 206133367U CN 201620889021 U CN201620889021 U CN 201620889021U CN 206133367 U CN206133367 U CN 206133367U
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- China
- Prior art keywords
- input module
- case ring
- packaging structure
- fingerprint
- fingerprint chip
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Abstract
The utility model discloses an input group spare and terminal, input group spare is including electrically conductive decoration circle, fingerprint chip packaging structure and flexible circuit board. Fingerprint chip packaging structure sets up decorate in the circle. The flexible circuit board sets up fingerprint chip packaging structure's bottom surface and electricity are connected fingerprint chip packaging structure, the flexible circuit board includes that ground connection is regional, ground connection electrically connected area extremely decorate the circle. In the above -mentioned input group spare, because the ground connection electrically connected area of flexible circuit board decorates the circle, consequently, the circle is decorated in the user's finger contact when fingerprint identification, just makes fingerprint chip packaging structure reach reliable purpose altogether through flexible circuit board and user's finger, and above -mentioned simple structure moreover is favorable to reducing the cost of input group spare.
Description
Technical field
This utility model is related to field of terminal, more particularly to a kind of input module and terminal.
Background technology
In the input module of some mobile phones of correlation technique, case ring is fixed in the through hole of touch panel, fingerprint core
Chip package is arranged in case ring.In fingerprint identification process, fingerprint chip-packaging structure need to be with user's human body altogether.Cause
This, how to reach fingerprint chip-packaging structure reliably becomes altogether problem to be solved with user's human body.
Utility model content
This utility model is intended at least solve one of technical problem present in prior art.For this purpose, this utility model is carried
For a kind of input module and terminal.
A kind of input module of this utility model embodiment, including conductive case ring, fingerprint chip-packaging structure and
Flexible PCB.The fingerprint chip-packaging structure is arranged in the case ring.The flexible PCB is arranged on the finger
The bottom surface of stricture of vagina chip-packaging structure simultaneously electrically connects the fingerprint chip-packaging structure, and the flexible PCB includes ground area,
The ground area is electrically connected to the case ring.
In the input module of this utility model embodiment, because the ground area of flexible PCB electrically connects case ring,
Therefore, the user's finger contacts case ring in fingerprint recognition, just causes fingerprint chip-packaging structure by flexible PCB and use
Family finger reaches reliable purpose altogether, and said structure is simple, advantageously reduces the cost of input module.
In some embodiments, the input module includes touch panel, and the touch panel offers through hole, described
Case ring wears the through hole.
In some embodiments, the input module include conducting resinl, ground area described in the conductive gemel connection and
The case ring.
In some embodiments, the ground area is connected with the case ring by way of welding.
In some embodiments, the ground area is protruded relative to the fingerprint chip-packaging structure.
In some embodiments, the fingerprint chip-packaging structure includes:
Packaging body, the packaging body includes bottom surface and connects the side of the bottom surface, the company of the bottom surface and the side
The place of connecing is formed with depressed part;And it is arranged on the internal fingerprint recognition chip of the encapsulation.
In some embodiments, the packaging body includes the first encapsulation part and connects the second envelope of first encapsulation part
Dress portion, first encapsulation part includes the bottom surface, and second encapsulation part includes the side, and the fingerprint recognition chip sets
Put in first encapsulation part.
In some embodiments, second encapsulation part includes the top surface being connected with the side, the fingerprint chip
Encapsulating structure includes fixed cover plate on the top surface.
In some embodiments, the depressed part includes the first face and connects second face in first face, described the
Simultaneously with the rounded transition shape in the junction in second face.
In some embodiments, the case ring includes:Rosette;And extend internally from the inwall of the rosette
Support edge, the fingerprint chip-packaging structure is supported on the support edge.
In some embodiments, the rosette includes the roof being connected with the inwall, and the roof includes direction
Guide ramp in the case ring.
In some embodiments, the support edge is formed with avoidance hole and escape groove, and the escape groove is along the avoidance
The axial direction in hole is formed on the side wall in the avoidance hole, and the escape groove is connected with the avoidance hole.
In some embodiments, the case ring includes the flange stretched out relative to the outer wall of the rosette.
A kind of terminal of this utility model embodiment, including the input module described in as above any embodiment.
In the terminal of this utility model embodiment, because the ground area of fingerprint flexible PCB electrically connects case ring,
Therefore, the user's finger contacts case ring in fingerprint recognition, just causes fingerprint chip-packaging structure to pass through fingerprint flexible PCB
Reliable purpose altogether is reached with user's finger, and said structure is simple, advantageously reduces the cost of input module and terminal.
Additional aspect of the present utility model and advantage will be set forth in part in the description, partly will be from explained below
In become obvious, or by it is of the present utility model practice recognize.
Description of the drawings
Of the present utility model above-mentioned and/or additional aspect and advantage are from the description with reference to accompanying drawings below to embodiment
Will be apparent from it is easy to understand, wherein:
Fig. 1 is the floor map of the terminal of this utility model embodiment;
Fig. 2 is the partial cutaway schematic view of the terminal of this utility model embodiment;
Fig. 3 is the enlarged diagram of the terminal I part in Fig. 2;
Fig. 4 is the connection diagram of the flexible PCB with conducting resinl of this utility model embodiment;
Fig. 5 is the decomposing schematic representation of the flexible PCB with conducting resinl of this utility model embodiment;
Fig. 6 is the schematic perspective view of the case ring of this utility model embodiment;
Fig. 7 is the generalized section of the case ring of this utility model embodiment;
Fig. 8 is the floor map of the case ring of this utility model embodiment;
Fig. 9 is the perspective exploded view of the case ring of this utility model embodiment;
Figure 10 is another perspective exploded view of the case ring of this utility model embodiment;
Figure 11 is the schematic perspective view of the fingerprint chip-packaging structure of this utility model embodiment;
Figure 12 is the generalized section of the fingerprint chip-packaging structure of this utility model embodiment;
Figure 13 is the floor map of the fingerprint chip-packaging structure of this utility model embodiment.
Specific embodiment
Embodiment of the present utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein
From start to finish same or similar label represents same or similar element or the element with same or like function.Lead to below
It is exemplary to cross the embodiment being described with reference to the drawings, and is only used for explaining this utility model, and it is not intended that to this practicality
New restriction.
In description of the present utility model, it is to be understood that term " " center ", " longitudinal direction ", " horizontal ", " length ", " width
Degree ", " thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward ",
The orientation or position relationship of the instructions such as " clockwise ", " counterclockwise " be based on orientation shown in the drawings or position relationship, be only for
Be easy to describe this utility model and simplify description, rather than indicate or imply indication device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.Additionally, term " first ",
" second " is only used for describing purpose, and it is not intended that indicating or implying relative importance or imply the technology indicated by indicating
The quantity of feature.Thus, " first " is defined, the feature of " second " can be expressed or implicitly include one or more
The feature.In description of the present utility model, " multiple " are meant that two or more, unless otherwise clearly specific
Limit.
In description of the present utility model, it should be noted that unless otherwise clearly defined and limited, term " peace
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected, or be detachably connected, or integratedly
Connection;Can be mechanically connected, or electrically connect or can mutually communicate;Can be joined directly together, it is also possible to by
Between medium be indirectly connected to, can be connection or the interaction relationship of two elements of two element internals.For this area
For those of ordinary skill, concrete meaning of the above-mentioned term in this utility model can be as the case may be understood.
In this utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it
D score can include the first and second feature directly contacts, it is also possible to not be directly contact including the first and second features but logical
The other characterisation contact crossed between them.And, fisrt feature second feature " on ", " top " and " above " include the
One feature is directly over second feature and oblique upper, or is merely representative of fisrt feature level height higher than second feature.First is special
Levy second feature " under ", " lower section " and " below " include fisrt feature immediately below second feature and obliquely downward, or only
Represent that fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing different structure of the present utility model.
In order to simplify disclosure of the present utility model, hereinafter the part and setting of specific examples are described.Certainly, they are only
Example, and purpose does not lie in restriction this utility model.Additionally, this utility model can in different examples repeat reference numerals
And/or reference letter, this repetition is for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relation between arranging.Additionally, the example of the various specific technique that provides of this utility model and material, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
Refer to Fig. 1 to Fig. 3, a kind of input module 100 of this utility model embodiment, including conductive case ring
20th, fingerprint chip-packaging structure 30 and fingerprint flexible PCB 40.
Fingerprint chip-packaging structure 30 is arranged in case ring 20.Fingerprint flexible PCB 40 is arranged on fingerprint chip package
The bottom surface of structure 30 simultaneously electrically connects fingerprint chip-packaging structure 30, and fingerprint flexible PCB 40 includes ground area 41, access area
Domain 41 is electrically connected to case ring 20.
In the input module of this utility model embodiment, because the ground area 41 of fingerprint flexible PCB 40 electrically connects
Case ring 20, therefore, the user's finger contacts case ring 20 in fingerprint recognition just causes fingerprint chip-packaging structure 30 by referring to
Stricture of vagina flexible PCB 40 reaches reliable purpose altogether with user's finger, and said structure is simple, advantageously reduces input group
The cost of part 100.
Specifically, the input module 100 of this utility model embodiment can be applicable to terminal 1000, and terminal 1000 is, for example,
The electronic installation such as mobile phone or panel computer.It is appreciated that terminal 1000 includes but is not limited to the example of present embodiment.
In some embodiments, input module 100 includes touch panel 10, and touch panel 10 offers through hole 17, fills
Decorative circle 20 wears through hole 17.
Specifically, touch panel 10 includes upper surface 12 and lower surface 14.Upper surface 12 is opposite with lower surface 14, through hole 17
Through upper surface 12 and lower surface 14.It is appreciated that appearance of the upper surface 12 of touch panel 10 for input module 100, court
To user.User can carry out gesture operation on upper surface 12, for example, click on or slide and realized accordingly with control terminal 1000
Function.
The material of touch panel 10 can be made up of light transmissive materials such as glass, ceramics or sapphires.Due to touch panel 10
Due to as the input part of terminal 1000, the contact such as touch panel 10 is often subject to collide or scratch.For example, user is by terminal
1000 when being put into pocket, and touch panel 10 may be scratched by the key in user's pocket and damaged.
Therefore, the material of touch panel 10 can adopt the material of hardness is bigger, such as above-described sapphire material.
It is of course also possible to the upper surface 12 in touch panel 10 sets up cover sheet to prevent touch panel 10 to be scraped off.
Further, touch panel 10 includes viewing area 15 and non-display area 16.Normally, in touch panel 10
Between region as viewing area 15, non-display area 16 is arranged on around viewing area 15.For example, non-display area 16 is arranged
In the top side or bottom side of viewing area 15.
Because touch panel 10 is made up of light transmissive material, therefore, user can check terminal 1000 by viewing area 15
Screen shown by content.
In order that terminal 1000 is more attractive in appearance, ink, ink can be sprayed in the lower surface 14 of non-display area 16
Color be, for example, the colors such as white, black or blueness, concrete condition can be arranged according to the actual requirements.Ink not only can
Meet demand of the user to the terminal 1000 of different colours, the structure inside terminal 1000 can also be covered to reach beautification terminal
1000 effect.
It is appreciated that the shape of touch panel 10 can be according to the shape specific design of terminal 1000, for example, fillet square
Shape.
In this utility model example, the receiver of terminal 1000 is arranged on the top area of terminal 1000.Therefore, in order to
Prevent through hole 17 from interfering with receiver, it is preferred that through hole 17 is opened in the bottom section of touch panel 10, so as to for through hole
The 17 larger design space of offer.Further, through hole 17 is opened in the non-display area 16 of touch panel 10.
It is preferred that through hole 17 is opened in the centre position of the bottom section of touch panel 10 so that touch panel 10 is in substantially
Symmetrical structure.So so that terminal 1000 is more attractive in appearance, two is user-friendly.
When input module 100 is manufactured, first case ring 20 can be loaded into through hole 17 from the lower section of touch panel 10, then
Viscose glue is clicked and entered in gap between the inwall and case ring 20 of through hole 17, so that case ring 20 is fixedly connected with touch panel 10.
Fingerprint chip-packaging structure 30 is loaded in case ring 20, and using viscose glue from the top of touch panel 10 afterwards
It is fixedly connected fingerprint chip-packaging structure 30 and case ring 20.
In some embodiments, Fig. 2 and Fig. 3 please be join, input module 100 includes conducting resinl 70, and conducting resinl 70 connects
Ground region 41 and case ring 20.
Thus, reaching the electric connection of ground area 41 and case ring 20, process is simple using conducting resinl 70, it is possible to decrease defeated
Enter the cost of component 100.
Specifically, in one example, the surface of ground area 41 can be provided with naked copper piece.Conducting resinl 70 can adopt different side
Property conductive adhesive film (Anisotropic Conductive Film, ACF) is connecting naked copper piece.Therefore, ACF glue is easily obtained, and is had
Beneficial to the cost for further reducing input module 100.
In this utility model example, Fig. 4 and Fig. 5 please be join, the quantity of ground area 41 is two, the quantity of conducting resinl 70
For one, in the form of sheets, it includes first end 71, the second end 72 and connecting portion 73, the connection of connecting portion 73 first to conducting resinl 70
End 71 and the second end 72, first end 71 partly protrudes with the second end 72 both with respect to connecting portion 73.First end
One of ground area 41 is connected to case ring 20 by 71, and another ground area 41 is connected to case ring by the second end 72
20。
Thus, first end 71 and the second end 72 are larger with the connection area of ground area 41, and the face of connecting portion 73
Product is less, on the premise of the reliability that ground area 41 electrically connects with case ring 20 is ensured, it is also possible to vacate connecting portion 73
More spaces are conducive to the little of input module 100 and terminal 1000 placing other elements of input module 100 or terminal 1000
Type.
Further, two ground areas 41 are connected respectively with first end 71 and the second end 72, and wherein one connects
During the Joint failure of ground region 41 and one of end, fingerprint flexible PCB 40 can also connect with case ring 20 by another
The connection of ground region 41 and another end keeps being electrically connected with, therefore, so can improve input module 100 service life and
Reliability.
In some embodiments, ground area 41 is connected with case ring 20 by way of welding.
Thus, the mode of welding reaches the electrical connection of ground area 41 and case ring 20, ground area 41 can be caused with dress
The reliability of the electrical connection of decorative circle 20 is higher.
In some embodiments, ground area 41 is protruded relative to fingerprint chip-packaging structure 30.
Thus, be easy to ground area 41 to be electrically connected with case ring 20, it is to avoid cause to connect because connecting time space and being less
Connect bad situation to occur.
In this utility model example, two ground areas 41 are protruded both with respect to fingerprint chip-packaging structure 30.Protrusion
The space that can be placed according to needed for other parts of input module 100 and terminal 1000 of distance determining.
Please join Fig. 6 to Fig. 8, in some embodiments, case ring 20 includes rosette 21 and support edge 22.Support edge 22
The inwall 211 of self-chambering circlets 21 extends internally, and fingerprint chip-packaging structure 30 is supported on support edge 22.
Thus, the support edge 22 of the case ring 20 of this utility model embodiment can support and location fingerprint chip package
Structure 30, so as to improve the efficiency of assembling of fingerprint chip-packaging structure 30 and case ring 20.
In other words, fingerprint chip-packaging structure 30 is supported on support edge 22.Fingerprint chip-packaging structure 30 is loaded
When in rosette 21, fingerprint chip-packaging structure 30 can be from top to bottom pressed, if the position of fingerprint chip-packaging structure 30
Can not again move, then it represents that fingerprint chip-packaging structure 30 has been resisted against on support edge 22, and be installed into precalculated position.
It is appreciated that rosette 21 is formed with installing hole 212, support edge 22 is located in installing hole 212.Installing hole 212 can
So that in right cylinder shape, in other words, inwall 211 is linearly, and in order to fingerprint chip-packaging structure 30 installing hole 212 is rapidly loaded
It is interior.
The material that installing hole 212 and support edge 22 can be removed on part by way of machining is formed, it is also possible to
Formed by modes such as castings.
In order to ensure the intensity of case ring 20, it is preferred that the material of case ring 20 is metal, such as stainless steel material, from
And meet the intensity requirement of case ring 20, also with corrosion resistance, improve the life-span of case ring 20.Certainly, case ring 20
Can be made using other conductive materials.
In some embodiments, inwall 211 of the support edge 22 perpendicular to rosette 21.
Thus, support edge 22 is easily formed, the manufacturing cost of rosette 21 can be reduced.In addition, when manufacture input module
When 100, support edge 22 is horizontally situated, and the inwall 211 of rosette 21 is located at vertical position so that with the cooperation of support edge 22
The face of fingerprint chip-packaging structure 30 is horizontal plane, can so simplify the fingerprint chip-packaging structure being supported on support edge 22
30 structure.
In some embodiments, rosette 21 includes the first bottom surface 213 being connected with inwall 211, under support edge 22
Surface 221 is concordant with the first bottom surface 213.
In the rosette 21 of equal height, as larger accommodation space can be formed in arrangement above, rosette 21, with
Ensure that fingerprint chip-packaging structure 30 can be housed in rosette 21.
In other words, in the case where the thickness of fingerprint chip-packaging structure 30 is constant, the height of rosette 21 is less, so as to
The thickness of input module 100 can be reduced, and then can be the thinning offer design basis of thickness of terminal 1000.
In this utility model embodiment, ground area 41 is electrically connected with the first bottom surface 213 of rosette 21 and supports
The lower surface 221 on side 22.So so that ground area 41 is larger with the connection area of case ring 20, it is ensured that fingerprint flexible electrical
Road plate 40 and the reliability altogether of case ring 20.For example, in this utility model example, conducting resinl 70 connection ground area 41 and
First bottom surface 213 of rosette 21 and the lower surface 221 of support edge 22.
In some embodiments, rosette 21 includes roof 214.Roof 214 is connected with inwall 211.Roof 214 includes
Towards the guide ramp 2142 in case ring 20.
Thus, guide ramp 2142 can guide user's finger smoothly in rosette 21 to carry out fingerprint recognition operation,
User can be improved carries out the accuracy rate of fingerprint recognition operation.It is possible to further plate shinny gold in guide ramp 2142
Category layer (such as layers of chrome), so that rosette 21 is more attractive in appearance.
It is appreciated that guide ramp 2142 is ring surface, can so facilitate user that finger is inserted into decoration from all directions
To press fingerprint chip-packaging structure 30 in ring 21, so as to carry out fingerprint recognition operation.
In some embodiments, support edge 22 is formed with avoidance hole 222.
Thus, avoiding the cabling of the fingerprint flexible PCB 40 that hole 222 is conducive to being connected with fingerprint chip-packaging structure 30
Layout.For example, fingerprint flexible PCB 40 can pass through and avoid hole 222 to be connected with fingerprint chip-packaging structure 30 (such as Fig. 2 institutes
Show).In this utility model example, the rounded rectangle in hole 222 is avoided.
In some embodiments, the side wall 2221 for avoiding hole 222 is formed with escape groove along the axial direction for avoiding hole 222
2222, escape groove 2222 is connected with hole 222 is avoided.
For example shown in Fig. 2, after fingerprint flexible PCB 40 is connected with fingerprint chip-packaging structure 30, first to escape groove 2222
Direction extend, then bend roundabout.Therefore, escape groove 2222 can prevent fingerprint flexible PCB 40 from occurring with side wall 2221
Interfere, be conducive to fingerprint flexible PCB 40 to connect up.
In some embodiments, case ring 20 includes the flange 23 stretched out relative to the outer wall of rosette 21.
Thus, flange 23 can be used to position and/or seal, the function of case ring 20 is so enriched.
When for example, for positioning, in this utility model example, flange 23 can be resisted against the lower surface of touch panel 10
14, so as to the connection area of case ring 20 and touch panel 10 can be increased, improve case ring 20 and fix company with touch panel 10
The reliability for connecing.
In addition, when from the bottom up case ring 20 is loaded in through hole 17, flange 23 is resisted against the following table of touch panel 10
During face 14, then it represents that case ring 20 is already mounted to precalculated position.Therefore, the setting of flange 23 also improves input module 100
Efficiency of assembling, reduces the manufacturing cost of input module 100.
When for example, for sealing, in some embodiments, diaphragm seal can be set between flange 23 and lower surface 14 with
Prevent gap of the water between case ring 20 and through hole 17 from entering in terminal 1000, so as to improve the waterproof effect of terminal 1000.
In the embodiment of Fig. 6 to Fig. 8, flange 23 and rosette 21 are formed in one structure.And such as Fig. 9 and Figure 10
In embodiment, flange 23 is split molding structure with rosette 21.Specifically, rosette 21 includes socket part 24, socket part
24 connection support edges 22.Flange 23 is set on socket part 24.Flange 23 can reduce case ring with the split molding of rosette 21
20 manufacture difficulty so that when case ring 20 is produced in batches, the concordance of each case ring 20 can be improved.
It is pointed out that in some embodiments, socket part 24 can offer and be passed through for fingerprint flexible PCB 40
Via 24a.
Specifically, socket part 24 includes connection side 241 and loading plate 242.Connection side 241 connection support edge 22 and loading plate
242, connection side 241 is approximately perpendicular to support edge 22.Loading plate 242 is approximately perpendicular to connection side 241.Connection side 241 offers
Via 24a.
Socket part 24 is hollow partly or entirely to house fingerprint chip-packaging structure 30.It should be noted that at certain
In a little embodiments, fingerprint chip-packaging structure 30 can be supported on loading plate 242.
Referring to Fig. 6 to Fig. 8, in some embodiments, outer wall 215 of the flange 23 perpendicular to rosette 21.
Thus, the manufacturing process of case ring 20 is simple, the contact area being connected with touch panel 10 can also be increased.
In some embodiments, flange 23 includes the second convex portion 232 of the first convex portion 231 of the first convex portion 231 and connection,
First convex portion 231 includes first 2311 and second 2312, and second 2312 connects first 2311 and the second convex portion 232,
It is convexly equipped in first 2311 and the second convex portion 232 for second 2312.
Case ring 20 loads after through hole 17, and first 2311 and the second convex portion 232 are prolonged along the longitudinal direction of touch panel 10
Stretch, second 2312 extends along the horizontal direction of touch panel 10.
Due to the accommodation space of the horizontal direction of touch panel 10 it is larger, therefore, second 2312 is convexly equipped in first 2311
And second convex portion 232 can increase the connection area of flange 23 and touch panel 10.
In addition, the width of first 2311 and the second convex portion 232 is less, the non-display area of touch panel 10 can be avoided
16 longitudinal length is lengthened because of the width of first 2311 and the second convex portion 232, and is reduced the area of viewing area 15 and touched
The area ratio of panel 10 is touched, and then affects the outward appearance of terminal 1000.
In some embodiments, the top surface 231a of the first convex portion 231 is concordant with the top surface 232a of the second convex portion 232, the
Thickness of the thickness of one 2311 more than the second convex portion 232.
It is appreciated that case ring 20 loads after through hole 17, relative to first 2311, the second convex portion 232 is closer to display
Region 15.In other words, first 2311 is arranged away from viewing area 15, and the second convex portion 232 is arranged near viewing area 15.
Due to part of the input module 100 near the position of viewing area 15 it is more, therefore, the thickness of the second convex portion 232
It is relatively thin that the second convex portion 232 can be avoided to interfere (as shown in Figure 2) with the other parts near viewing area 15.
As shown in Fig. 2 case ring 20 exists with the screen flexible PCB 50 and other parts of the screen for being connected terminal 1000
There is the part for overlapping in orthographic projection on the lower surface 14 of touch panel 10, the thinner thickness of the second convex portion 232 can avoid with
Screen flexible PCB 50 and other parts are interfered so that case ring 20 can be arranged closer to viewing area 15, decoration
Circle 20 even can be partly or entirely arranged in the viewing area 15 of touch panel 10, to reduce the area of non-display area 16
With the ratio of the area of touch panel 10, increase the ratio of the area of the area and touch panel 10 of viewing area 15.
In some enforcement embodiments, rosette 21 is in Long Circle, and the outer wall 215 of rosette 21 includes parallel two
Two bending sections 2152 of two straightways 2151 of straightway 2151 and connection, first 2311 is disposed therein a straightway
On 2151, second 2312 is arranged on two bending sections 2152.
Thus, rosette 21 is more attractive in appearance.Specifically, two bending sections 2152 are along the transversely arranged (such as Fig. 1 of touch panel 10
In left and right to), two straightways 2151 are arranged along the longitudinal direction (with laterally vertical) of touch panel 10.
In some embodiments, the shape of second 2312 is closed with the matching form of bending section 2152.
For example, the outline of second 2312 is also circular arc, and is substantially arranged concentrically with bending section 2152.So may be used
So that the structure of case ring 20 is compacter.
Figure 11 to Figure 13 is seen also, in some embodiments, fingerprint chip-packaging structure 30 includes packaging body 31
And fingerprint recognition chip 32.
Packaging body 31 includes the side 312 of the second bottom surface 311 of the second bottom surface 311 and connection, the second bottom surface 311 and side
312 junction is formed with depressed part 33.Fingerprint recognition chip 32 is arranged in packaging body 31.
Thus, the space that depressed part 33 is provided can place other parts of input module 100 and terminal 1000, so that defeated
Enter the more compact structure of component 100 and terminal 1000.Meanwhile, in some embodiments, the setting of depressed part 33 also can be improved
The efficiency of assembling of fingerprint chip-packaging structure 30.
For example, depressed part 33 can coordinate with the support edge 22 in case ring 20 in this utility model example, so as to can
Location fingerprint chip-packaging structure 30, and then improve the efficiency of assembling of fingerprint chip-packaging structure 30.
In addition, depressed part 33 coordinates the thickness that can also reduce fingerprint chip-packaging structure 30 with support edge 22, be conducive to
The miniaturization of terminal 1000 of employing fingerprint chip-packaging structure 30.
Specifically, when user carries out the operation of unlocked by fingerprint terminal 1000, finger can be placed on and fingerprint recognition chip
32 corresponding positions.The signal of fingerprint recognition chip 32 passes through packaging body 31 to gather the fingerprint pattern of identifying user, by user
Fingerprint pattern matched with the fingerprint pattern for prestoring, if the match is successful, unlock terminal 1000.
It is appreciated that fingerprint recognition chip 32 is provided with sensor pixel array towards the surface of the finger of user, to gather
The fingerprint pattern of user.The encapsulation fingerprint recognition of packaging body 31 chip 32 can reduce sensor pixel array when fingerprint pattern is gathered
Affected by other interference signals, to improve the accuracy rate of identification.
It should be noted that depressed part 33 is used to coordinate with support edge 22 so that fingerprint chip-packaging structure 30 is by depression
Portion 33 is supported on support edge 22.
Depressed part 33 coordinates with support edge 33, and in other words, support edge 22 is housed in depressed part 33.
In the present embodiment, the structure in a ring of depressed part 33, correspondingly, support edge 22 also in a ring structure so that depression
Portion 33 can house support edge 22.
In other embodiments, depressed part 33 can be circumferentially-spaced with the junction of side 312 around the second bottom surface 311
The multiple depressed parts 33 for arranging, correspondingly, support edge 22 is also around circumferentially spaced multiple support edges 22, multiple depressed parts
33 with the corresponding matching of multiple support edges 22.
Such as quantity of depressed part 33 is 3, and two neighboring depressed part 33 is around circumferentially-spaced 120 degree settings, support edge 22
Quantity be also 3, it is and corresponding with 3 depressed parts in locations of structures.
It is pointed out that the shape of depressed part 33 and quantity are not limited to situation discussed above, if depressed part 33 with
Support edge 22 coordinates so that support edge 22 can support fingerprint chip-packaging structure 30, therefore, example described above is not
It is interpreted as to restriction of the present utility model.
Certainly, in other embodiments, when the thinner thickness of fingerprint chip-packaging structure 30, fingerprint chip package knot
Structure 30 can also omit depressed part 33.
In some embodiments, packaging body 31 includes the second envelope of the first encapsulation part 313 of the first encapsulation part 313 and connection
Dress portion 314, the first encapsulation part 313 includes the second bottom surface 311, and the second encapsulation part 314 includes side 312.
Thus, the first encapsulation part 313 is connected with the second encapsulation part 314 can form depressed part 33.Packaging body 31 can pass through
The material on packaging body 31 is machined away so as to form depressed part 33, it is also possible to connected with the second encapsulation part 314 by the first encapsulation part 313
Connect to be formed.
It is appreciated that in order to form depressed part 33, the cross-sectional area of the first encapsulation part 313 is less than the second encapsulation part 314
Cross-sectional area.
In some embodiments, the first encapsulation part 313 is arranged in avoidance hole 222, and the second encapsulation part 314 is supported on
On support side 22.
In some embodiments, fingerprint recognition chip 32 is arranged in the first encapsulation part 313.
Thus, the circuit junction of fingerprint recognition chip 32 easily exposes to be connected with fingerprint flexible PCB 40.
In this utility model embodiment, ground area 41 is protruded relative to the first encapsulation part 313.Due to the first encapsulation
Portion 313 is located at the inside of input module 100, therefore, ground area 41 is protruding with beneficial to access area relative to the first encapsulation part 313
Electric connection is reached with case ring 20 in domain 41.Therefore, in some embodiments, ground area 41 is tied relative to fingerprint chip package
Structure 30 protrudes it is to be understood that certain part or certain part protrusion of ground area 41 relative to fingerprint chip-packaging structure 30, only
Being protruding with for such ground area 41 is wanted to be beneficial to reach electric connection with case ring 20.In some embodiments,
The form and dimension of one encapsulation part 313 coordinates with the form and dimension of fingerprint recognition chip 32.
In other words, the shape of fingerprint recognition chip 32 is similar or identical with the shape of the first encapsulation part 313, for example, fingerprint
Identification chip 32 is in cuboid, and the shape of the first encapsulation part 313 is in cuboid or fillet cuboid.
The size for being slightly larger in dimension than fingerprint recognition chip 32 of the first encapsulation part 313 is realizing encapsulating fingerprint recognition chip 32
Effect.Therefore, can so cause the structure of fingerprint chip-packaging structure 30 compacter.
In some embodiments, the rounded cuboid of shape of the first encapsulation part 313.
Thus, the first packaging body 31 can preferably coordinate with fingerprint recognition chip 32.Further, the first encapsulation part
313 shape and the form fit for avoiding hole 222, that is to say, that avoid the shape in hole 222 also rounded cuboid.
In some embodiments, the second encapsulation part 314 includes the top surface 3141 being connected with side 312, fingerprint chip envelope
Assembling structure 30 includes the cover plate 34 being fixed on the top surface 3141 of the second encapsulation part 314.For example, cover plate 34 is solid by colloid
It is scheduled on the top surface 3141 of the second encapsulation part 314.
When fingerprint recognition operation is carried out, finger can be pressed against in cover plate 34 user.Cover plate 34 can be with tamper seal
Dress body 31 is without damage, to improve the reliability of fingerprint chip-packaging structure 30.
Cover plate 34 due to be often subject to touching, therefore, cover plate 34 can be made using the higher material of hardness, for example with
On the sapphire material that refers to.
In some embodiments, the shape of the top surface 3141 of the form and dimension of cover plate 34 and the second encapsulation part 314
And size coordinates.
For example, the shape of top surface 3141 is in Long Circle, and the shape of cover plate 34 is also in Long Circle.The area of cover plate 34 is omited
More than the area of the top surface 3141 of the second encapsulation part 314.Therefore, cover plate 34 can be completely covered the second encapsulation part 314.
In some embodiments, input module includes sealing member 60, the sealing fingerprint of sealing member 60 chip-packaging structure 30
With the gap between support edge 22.
Thus, sealing member 60 can prevent the foreign bodies such as water and dust between fingerprint chip-packaging structure 30 and case ring 20
Gap enter terminal 1000 in, improve the water proof and dust proof effect of terminal 1000.
Specifically, in this utility model example, sealing member 60 is arranged between the second encapsulation part 314 and support edge 22
In gap, sealing member 60 seals the gap between the second encapsulation part 314 and support edge 22.Sealing member 60 is for example made up of silica gel
(as shown in Figure 2).
In some embodiments, depressed part 33 include the first face 331 and connection the first face 331 the second face 332, first
Face 331 is perpendicular to the second face 332.
Thus, depressed part 33 is easily formed, the first face 331 is easily connected with support edge 22.First face 331 and the second face
332 vertically cause packaging body 31 in step-like.
Specifically, sealing member 60 is arranged between the first face 331 and support edge 22.
In some embodiments, the rounded transition shape in the junction in the first face 331 and the second face 332.
Thus, the defects such as crackle are less likely to occur for the junction in the first face 331 and the second face 332, and depressed part 33 holds
Easily formed.
Please join Fig. 1 and Fig. 2, a kind of terminal 1000 of this utility model embodiment, including as above any embodiment
Input module 100.
Therefore, in the terminal 1000 of this utility model embodiment, due to the ground area 41 of fingerprint flexible PCB 40
Electrical connection case ring 20, therefore, the user's finger contacts case ring 20 in fingerprint recognition just causes fingerprint chip-packaging structure 30
Reliable purpose altogether is reached by fingerprint flexible PCB 40 and user's finger, and said structure is simple, advantageously reduces
The cost of input module 100 and terminal 1000.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically enforcement
The description of mode ", " example ", " specific example " or " some examples " etc. means to combine the embodiment or example describes
Specific features, structure, material or feature are contained at least one embodiment of the present utility model or example.In this explanation
In book, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.And, the concrete spy of description
Levy, structure, material or feature can in an appropriate manner be combined in any one or more embodiments or example.
While there has been shown and described that embodiment of the present utility model, one of ordinary skill in the art can manage
Solution:These embodiments can be carried out in the case of without departing from principle of the present utility model and objective various changes, modification,
Replace and modification, scope of the present utility model is limited by claim and its equivalent.
Claims (14)
1. a kind of input module, it is characterised in that include:
Conductive case ring;
Fingerprint chip-packaging structure, the fingerprint chip-packaging structure is arranged in the case ring;
Flexible PCB, the flexible PCB is arranged on the bottom surface of the fingerprint chip-packaging structure and electrically connects the fingerprint
Chip-packaging structure, the flexible PCB includes ground area, and the ground area is electrically connected to the case ring.
2. input module as claimed in claim 1, it is characterised in that the input module includes touch panel, the touch
Panel offers through hole, and the case ring wears the through hole.
3. input module as claimed in claim 1, it is characterised in that the input module includes conducting resinl, the conducting resinl
Connect the ground area and the case ring.
4. input module as claimed in claim 1, it is characterised in that the ground area is with the case ring by welding
Mode connects.
5. input module as claimed in claim 1, it is characterised in that the ground area is relative to the fingerprint chip package
Structure is protruded.
6. input module as claimed in claim 1, it is characterised in that the fingerprint chip-packaging structure includes:
Packaging body, the packaging body includes bottom surface and connects the side of the bottom surface, the junction of the bottom surface and the side
It is formed with depressed part;And
It is arranged on the internal fingerprint recognition chip of the encapsulation.
7. input module as claimed in claim 6, it is characterised in that the packaging body includes that the first encapsulation part and connection are described
Second encapsulation part of the first encapsulation part, first encapsulation part includes the bottom surface, and second encapsulation part includes the side,
The fingerprint recognition chip is arranged in first encapsulation part.
8. input module as claimed in claim 7, it is characterised in that second encapsulation part includes what is be connected with the side
Top surface, the fingerprint chip-packaging structure includes fixed cover plate on the top surface.
9. input module as claimed in claim 6, it is characterised in that the depressed part includes the first face and connection described first
Second face in face, first face and the rounded transition shape in the junction in second face.
10. input module as claimed in claim 1, it is characterised in that the case ring includes:
Rosette;And
From the support edge that the inwall of the rosette extends internally, the fingerprint chip-packaging structure is supported on the support edge
On.
11. input modules as claimed in claim 10, it is characterised in that the rosette includes the top being connected with the inwall
Wall, the roof is included towards the guide ramp in the case ring.
12. input modules as claimed in claim 10, it is characterised in that the support edge is formed with avoidance hole and escape groove,
The escape groove is formed on the side wall in the avoidance hole along the axial direction in the avoidance hole, the escape groove and the avoidance
Hole connects.
13. input modules as claimed in claim 10, it is characterised in that the case ring is included relative to the rosette
The flange that outer wall stretches out.
14. a kind of terminals, it is characterised in that include the input module as described in any one of claim 1-13.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620889021.8U CN206133367U (en) | 2016-08-16 | 2016-08-16 | Input group spare and terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620889021.8U CN206133367U (en) | 2016-08-16 | 2016-08-16 | Input group spare and terminal |
Publications (1)
Publication Number | Publication Date |
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CN206133367U true CN206133367U (en) | 2017-04-26 |
Family
ID=58564510
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Application Number | Title | Priority Date | Filing Date |
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CN201620889021.8U Expired - Fee Related CN206133367U (en) | 2016-08-16 | 2016-08-16 | Input group spare and terminal |
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CN (1) | CN206133367U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018032882A1 (en) * | 2016-08-16 | 2018-02-22 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint chip package structure, input assembly and terminal |
CN108875571A (en) * | 2018-05-10 | 2018-11-23 | Oppo广东移动通信有限公司 | Fingerprint recognition module group assembling method, fingerprint recognition mould group and electronic device |
-
2016
- 2016-08-16 CN CN201620889021.8U patent/CN206133367U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018032882A1 (en) * | 2016-08-16 | 2018-02-22 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint chip package structure, input assembly and terminal |
US10565426B2 (en) | 2016-08-16 | 2020-02-18 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint chip package structure, input assembly and terminal |
CN108875571A (en) * | 2018-05-10 | 2018-11-23 | Oppo广东移动通信有限公司 | Fingerprint recognition module group assembling method, fingerprint recognition mould group and electronic device |
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GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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Granted publication date: 20170426 |