CN107241469A - Case ring, cover plate assembly, the preparation method of electronic installation and cover plate assembly - Google Patents
Case ring, cover plate assembly, the preparation method of electronic installation and cover plate assembly Download PDFInfo
- Publication number
- CN107241469A CN107241469A CN201710382349.XA CN201710382349A CN107241469A CN 107241469 A CN107241469 A CN 107241469A CN 201710382349 A CN201710382349 A CN 201710382349A CN 107241469 A CN107241469 A CN 107241469A
- Authority
- CN
- China
- Prior art keywords
- cover plate
- ring
- face
- case ring
- basic ring
- Prior art date
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses the manufacture method of a kind of case ring, cover plate assembly, electronic installation and cover plate assembly.Case ring includes basic ring and support division.Basic ring has centre bore.Support division stretches out from the top of basic ring.Support division includes the supporting surface being connected with the lateral surface of basic ring；The touch surface being connected with the medial surface of centre bore, touch surface is opposite with support division；With connection supporting surface and the bonding plane of touch surface, the lateral surface of bonding plane, supporting surface and basic ring is used to the gap that the medial surface formation with the installation through-hole of the cover plate of electronic installation enters for colloid.In the case ring of embodiment of the present invention, cover plate assembly, the preparation method of electronic installation and cover plate assembly, because case ring is formed with bonding plane, colloid is entered in the gap between case ring and cover plate from the upper surface of cover plate and the top of case ring, dispensing process is convenient and simple.
Description
Technical field
The present invention relates to field of electronic devices, more particularly to a kind of case ring, cover plate assembly, electronic installation and cover plate assembly
Preparation method.
Background technology
In the related art, case ring is provided with the cover plate of the electronic installation such as mobile phone, it is used for decorative ring to be passed in collecting fingerprint
Sensor.Therefore, how by case ring by better simply mode fix on the cover board turn into it is to be solved the problem of.
The content of the invention
Embodiment of the present invention provides a kind of case ring, a kind of cover plate assembly, a kind of electronic installation and a kind of cover plate assembly
Preparation method.
The case ring of embodiment of the present invention includes basic ring and support division.The basic ring has centre bore.The support division
Stretch out from the top of the basic ring.Support division includes the supporting surface being connected with the lateral surface of the basic ring；With the center
The touch surface of the medial surface connection in hole, the touch surface is opposite with the support division；With the connection supporting surface and the touch
The bonding plane in face, the lateral surface of the bonding plane, the supporting surface and the basic ring is used to the peace with the cover plate of electronic installation
Fill the gap that the medial surface formation of through hole enters for colloid.
In some embodiments, the angle between the lateral surface of the supporting surface and the basic ring is right angle or obtuse angle.
In some embodiments, the touch surface is the inclined-plane towards in the centre bore and tilted down.
In some embodiments, the case ring includes the support chip extended internally from the medial surface of the centre bore,
The upper surface of the support chip is provided with multiple projections, circumferentially-spaced distribution of the multiple projection around the basic ring.
In some embodiments, the height of the projection is more than or equal to 0.07mm.
In some embodiments, waterproof seal is provided with the lateral surface of the basic ring, the waterproof seal encloses
Around the basic ring, the waterproof seal is structure as a whole with the case ring.
In some embodiments, the lateral surface of the basic ring is formed with the circumferentially extending groove along the basic ring, institute
Waterproof seal is stated partly to be housed in the groove.
The cover plate assembly of embodiment of the present invention includes cover plate and the case ring of any of the above embodiment, and the cover plate is opened
Provided with installation through-hole, the case ring is arranged in the installation through-hole.The bonding plane, the supporting surface and the basic ring
The bonding case ring and the lid are provided with medial surface formation gap of the lateral surface with the installation through-hole, the gap
The colloid of plate.
In some embodiments, the medial surface of the installation through-hole includes：
First face relative with the lateral surface of the basic ring, first face connects the lower surface of the cover plate, and described the
Simultaneously with the first gap of lateral surface formation of the basic ring；
The second face being connected with first face, second face is relative with the supporting surface, second face with it is described
Supporting surface is formed with the second gap；With
The 3rd face of second face and the upper surface of the cover plate is connected, the 3rd face is relative with the bonding plane,
3rd face is formed with third space with the bonding plane；
The colloid is provided with first gap, second gap and the third space.
In some embodiments, the width of the third space is more than or equal to 0.03mm.
In some embodiments, the cover plate assembly includes the fingerprint identification module being housed in the centre bore.
The electronic installation of embodiment of the present invention includes the cover plate assembly of any of the above embodiment.
The preparation method of the cover plate assembly of embodiment of the present invention includes step：
Case ring described in any of the above embodiment is provided；
Cover plate is provided, the cover plate offers installation through-hole；
The case ring is fitted into the installation through-hole, and makes the bonding plane, the supporting surface and the basic ring
Medial surface formation gap of the lateral surface with the installation through-hole；With
Colloid is set in the gap and the colloid is bonded the case ring and the cover plate.
In the case ring of embodiment of the present invention, cover plate assembly, the preparation method of electronic installation and cover plate assembly, due to dress
Decorative circle is formed with bonding plane so that colloid can enter between case ring and cover plate from the upper surface of cover plate and the top of case ring
Gap in, dispensing process is convenient and simple.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become from description of the accompanying drawings below to embodiment is combined
Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the floor map of the cover plate assembly of embodiment of the present invention；
Fig. 2 be Fig. 1 cover plate assembly II-II to partial cutaway schematic view；
Fig. 3 is the partial schematic diagram of the cover plate assembly of embodiment of the present invention；
Fig. 4 is the schematic perspective view of the electronic installation of embodiment of the present invention；
Fig. 5 is another partial schematic diagram of the cover plate assembly of embodiment of the present invention；
Fig. 6 is the diagrammatic cross-section of the case ring of embodiment of the present invention；
Fig. 7 is the schematic perspective view of the case ring of embodiment of the present invention；
Fig. 8 is the floor map of the case ring of embodiment of the present invention；
Fig. 9 is the schematic flow sheet of the manufacture method of the cover plate assembly of embodiment of the present invention.
Main element symbol description：
Cover plate assembly 100, electronic installation 200；
Cover plate 10, upper surface 11, lower surface 12, installation through-hole 13, the medial surface 131 of installation through-hole 13, the first face 132,
Second face 133, the 3rd face 134, gap 41, the first gap 411, the second gap 412, third space 413；
Case ring 20, basic ring 21, the lateral surface 211 of basic ring, the medial surface 212 of centre bore, centre bore 213, bottom surface 214,
Groove 215, support division 22, supporting surface 221, touch surface 222, bonding plane 223, support chip 23, the upper surface 232 of support chip, branch
Lower surface 234, avoidance hole 231, the projection 24 of blade；
Fingerprint identification module 30, packaging body 31, fingerprint recognition chip 32, cover plate 33；
Colloid 40；
Waterproof grommet 50；
Flexible PCB 60.
Embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element or element with same or like function are represented to same or similar label eventually.Below by ginseng
The embodiment for examining accompanying drawing description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be for only for ease of
The description present invention and simplified description, rather than indicate or imply that the device or element of meaning must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that indicating or implying relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, one or more feature can be expressed or be implicitly included to the feature of " second ".
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not direct contact but by it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.Certainly, they are only merely illustrative, and
And purpose does not lie in the limitation present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between discussed various embodiments itself are not indicated and/or are set
Relation.In addition, the invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Fig. 1-Fig. 3 is referred to, the cover plate assembly 100 of embodiment of the present invention, which includes cover plate 10, case ring 20 and fingerprint, to be known
Other module 30.Case ring 20 is arranged in cover plate 10, and fingerprint identification module 30 is arranged in case ring 20.
Incorporated by reference to Fig. 4, the cover plate assembly 100 of embodiment of the present invention can be applied to electronic installation 200, electronic installation 200
The for example, electronic installation such as mobile phone, Intelligent worn device or tablet personal computer.It is appreciated that electronic installation 200 includes but is not limited to
The example of present embodiment.
Specifically, referring to Fig. 2, cover plate 10 includes upper surface 11 and lower surface 12.It is appreciated that the upper surface of cover plate 10
11 be the appearance of cover plate assembly 100, towards user.User can carry out gesture operation on upper surface 11, for example click on or
Slide to control electronic installation 200 to realize corresponding function.
Cover plate 10 can be made up of light transmissive materials such as glass, plastics, ceramics or sapphires.Because cover plate 10 is due to being used as electricity
The input part of sub-device 200, cover plate 10 is often subject to collide or the contact such as scratches.For example, electronic installation 200 is put into by user
During pocket, cover plate 10 may be scratched and damaged by the key in user's pocket.
Therefore, the material of cover plate 10 can be using the larger material of hardness, such as sapphire material.It is of course also possible to
Set up protection board to prevent cover plate 10 to be scraped off in the upper surface 11 of cover plate 10.
Because cover plate 10 is made up of light transmissive material, therefore, user can check the screen of electronic installation 200 by cover plate 10
Shown content.
It is appreciated that the shape of cover plate 10 can be according to the shape specific design of electronic installation 200, for example, fillet square
Shape.
Further, cover plate 10 offers installation through-hole 13.In present embodiment, installation through-hole 13 is through cover plate 10
The through hole of the lower surface 12 of upper surface 11 and cover plate 10.
In present embodiment, installation through-hole 13 is in the oval bodily form.Certainly, in other embodiments, installation through-hole 13 can
To take on a different shape, such as circular or ellipse shape.Therefore, the example of the shape of the installation through-hole 13 of present embodiment
It is not considered as limiting the invention.
In some embodiments, case ring 20 is arranged in installation through-hole 13, and is fixedly connected with cover plate 10.
Usually, the receiver of electronic installation 200 is arranged on the top area of electronic installation 200.Therefore, in order to prevent peace
Dress through hole 13 is interfered with receiver, it is preferred that installation through-hole 13 is opened in the bottom section of cover plate 10, so that logical to install
The larger design space of offer in hole 13.In addition, installation through-hole 13 is opened in the centre position of the bottom section of cover plate 10 so that lid
The substantially symmetrical structure of plate 10.So so that electronic installation 200 is more attractive in appearance, two is user-friendly.
Incorporated by reference to Fig. 3 and Fig. 6, the case ring 20 of embodiment of the present invention includes basic ring 21 and support division 22.Basic ring 21 has
There is centre bore 213.The top of support division 22 from basic ring 21 stretches out.
Support division 22 includes supporting surface 221, touch surface 222 and bonding plane 223.The lateral surface of supporting surface 221 and basic ring 21
211 connections.Touch surface 222 is connected and opposite with supporting surface 221 with the medial surface 212 of centre bore 213.The connection of bonding plane 223 is supported
Hold face 221 and touch surface 222.The lateral surface 211 of bonding plane 223, supporting surface 221 and basic ring 21 is used to and installation through-hole 13
The gap 41 that the formation of medial surface 131 enters for colloid 40.
Therefore, in the cover plate assembly 100 of embodiment of the present invention, case ring 20 is arranged in installation through-hole 13, bonding plane
223rd, in the formation of medial surface 131 gap 41 of the lateral surface 211 of supporting surface 221 and basic ring 21 with installation through-hole 13, gap 41
It is provided with the colloid 40 of bonding case ring 20 and cover plate 10.
In this way, in the case ring 40, cover plate assembly 100 and electronic installation 200 of embodiment of the present invention, due to case ring
40 are formed with bonding plane 223 so that colloid 40 can enter case ring from the top of the upper surface 11 of cover plate 10 and case ring 20
In gap 41 between 20 and cover plate 10, dispensing process is convenient and simple.
In addition, case ring 20 can be resisted against on cover plate 10 by supporting surface 221 and colloid 40, so as to limit case ring 20
Moved down relative to cover plate 10, be conducive to Consumer's Experience.
Specifically, in present embodiment, basic ring 21 is in the oval bodily form.Certainly, in other embodiments, basic ring 21 can be with
Take on a different shape, the shape such as circular or ellipse.Therefore, the example of the shape of the basic ring 21 of present embodiment can not be managed
Solve as limitation of the present invention.
Centre bore 213 can be in right cylinder shape, in other words, and the medial surface 212 of centre bore 213 is in plane, in order to which fingerprint is known
Other module 30 rapidly loads in centre bore 213.
The material that centre bore 213 and support chip 23 can be removed on part by way of machining is formed, can also
It is integrally formed by modes such as castings.
In order to ensure the intensity of case ring 20, it is preferred that the material of case ring 20 is metal, such as stainless steel material, from
And the intensity requirement of case ring 20 is met, also with corrosion resistance, improve the life-span of case ring 20.Certainly, case ring 20
The other materials such as plastics can be used to be made.
Referring to Fig. 3, in some embodiments, the medial surface 131 of installation through-hole 13 includes the first face 132, the
Two faces 133 and the 3rd face 134.First face 132 relative and connecting cover plate 10 lower surface 12 with the lateral surface 211 of basic ring 21.The
Simultaneously 132 with the first gap 411 of the lateral surface 211 of basic ring 21 formation.Second face 133 is connected and and supporting surface with the first face 132
221 is relative.Second face 133 is formed with the second gap 412 with supporting surface 211.3rd face 134 connects the second face 133 and cover plate 10
Upper surface 11 and relative with bonding plane 223.3rd face 134 is formed with third space 413 with bonding plane 223.First gap
411st, it is provided with colloid 40 in the second gap 412 and third space 413.
In this way, the shape of the medial surface 131 of installation through-hole 13 and the shape of case ring 20 match so that cover plate 10 and decoration
Fit structure between circle 20 is compacter.
In some embodiments, the width W of third space 413 is more than or equal to 0.03mm.
In this way, the width W of third space 413 can cause colloid 40 to smoothly enter case ring 20 and installation through-hole 13
In gap 41 between medial surface 131, and colloid 40 can be caused to be bonded case ring 20 and cover plate 10 securely.
In some embodiments, the included angle A between the second face 133 and the 3rd face 134 is right angle or obtuse angle.So cause
Supporting surface 221 can be resisted against on the second face 133.Because the second face 133 and supporting surface 221 are relative, the 3rd face 134 and bonding plane
223 is relative.Therefore, the included angle B (see Fig. 6) between the supporting surface 221 and bonding plane 223 of case ring 20 is also right angle or obtuse angle.
In the example of fig. 3, the included angle A between the second face 133 and the 3rd face 134 in obtuse angle, in the example of hgure 5,
Included angle A between two faces 133 and the 3rd face 134 is rectangular.
Fig. 3 and Fig. 6 is referred to, in some embodiments, the folder between the lateral surface 211 of supporting surface 221 and basic ring 21
Angle C is right angle or obtuse angle.So cause, the shape of basic ring 21 matches with the shape of installation through-hole 131, so that supporting surface
211 can be resisted against on the second face 133.
In some embodiments, touch surface 222 is the inclined-plane towards in centre bore 213 and tilted down.
In this way, the finger that touch surface 222 can guide user smoothly enters in case ring 20 to carry out fingerprint recognition operation, can
Improve the accuracy rate that user carries out fingerprint recognition operation.It is possible to further plate shinny metal level in touch surface 222
(such as layers of chrome), so that case ring 20 is more attractive in appearance.
It is appreciated that touch surface 222 is ring surface, it can so facilitate user that finger is inserted into case ring 20 from all directions
It is interior to press fingerprint identification module 30, so as to carry out fingerprint recognition operation.
Also referring to Fig. 3, Fig. 6 and Fig. 7, in some embodiments, case ring 20 includes support chip 23.Support chip 23
Extended internally from the medial surface 212 of centre bore 213.The upper surface 232 of support chip 23 is provided with multiple projections 24, multiple projections 24
Around the circumferentially-spaced distribution of basic ring 21.
In this way, fingerprint identification module 30 can be housed in centre bore 213, and is supported on multiple projections 24, projection 24 can
To ensure the thickness of the viscose glue between the upper surface 232 of support chip 23 and fingerprint identification module 30, so that fingerprint identification module 30
It is be bonded with case ring 20 firm, so as to prevent fingerprint identification module 30 from being come off from case ring 20.
In some embodiments, the height H of projection 24 is more than or equal to 0.07mm, i.e. H >=0.07mm.For example, H is
0.07mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.2mm equidimension.
In this way, the height H of projection 24 can ensure the upper table of fingerprint identification module 30 and support chip 23 in range above
The thickness of viscose glue between face 232, so that fingerprint identification module 30 and the fixation of case ring 20.
Incorporated by reference to Fig. 7, in some embodiments, multiple projections 24 connect the medial surface 212 of centre bore 213.In this way, convex
Block 24 easily by support chip 23 remove material formed.
In some embodiments, the opposite both sides of centre bore 213 are respectively arranged with least one projection 24.Such as Fig. 7
Example in, the upper side and lower side of centre bore 213 is respectively arranged with two projections 24.Certainly, in one example, centre bore
213 left side and right side can set a projection 24 respectively.
Fig. 3 and Fig. 6 is referred to, in some embodiments, waterproof seal is provided with the lateral surface 211 of basic ring 21
50, waterproof seal 50 surrounds basic ring 21, and waterproof seal 50 is structure as a whole with case ring 20.
In this way, because waterproof seal 50 is structure as a whole with case ring 20, dress of the waterproof seal 50 in case ring 20
Various pieces deflection is more consistent during matching somebody with somebody, and can effectively seal against the medial surface 131 and dress of the installation through-hole 13 of cover plate 10
Gap between decorative circle 20, it is ensured that waterproof seal.It so can further prevent water, dust and other impurities from basic ring 21
Gap between lateral surface 211 and installation through-hole 13 enters in electronic installation 200 and influences the normal work of electronic installation 200.
Such as silica gel waterproof seal of waterproof seal 50, in one example, the forming process of waterproof seal 50 is such as
Under, liquid repellent glue is first set on the lateral surface 211 of basic ring 21, and liquid repellent glue is surrounded basic ring 21, solidification liquid is prevented
So as to form the waterproof seal 50 being structure as a whole with case ring 20 after glue.
In some embodiments, the upper surface 232 of support chip 23 and the medial surface 212 of centre bore 213 are vertical.
In this way, support chip 23 is easily formed, the manufacturing cost of case ring 20 can be reduced.In addition, when manufacture cover plate assembly
When 100, support chip 23 is horizontally situated, and the medial surface 212 of centre bore 213 is located at vertical position so that be bonded with support chip 23
The face of the fingerprint identification module 30 of cooperation is horizontal plane, can so simplify the fingerprint identification module 30 being supported on support chip 23
Structure.
In some embodiments, basic ring 21 includes bottom surface 214, and bottom surface 214 is connected with the lateral surface 211 of basic ring 21, props up
The lower surface 234 of blade 23 is concordant with the bottom surface 214 of basic ring 21.
In the basic ring 21 of equal height, such as arrangement above can form larger accommodation space in basic ring 21, to ensure
Fingerprint identification module 30 can be housed in basic ring 21.In other words, in the case where the thickness of fingerprint identification module 30 is constant, base
The height of ring 21 is smaller, so as to reduce the thickness of cover plate assembly 100, and then can be thinned for the thickness of electronic installation 200
Design basis is provided.
In some embodiments, support chip 23 is formed with the avoidance hole 231 connected with the centre bore 213 of basic ring 21.
Incorporated by reference to Fig. 2, in this way, avoiding hole 231 is conducive to walking for the flexible PCB 60 being connected with fingerprint identification module 30
Line is laid out.For example, flexible PCB 60 can be connected through hole 231 is avoided with fingerprint identification module 30.
In some embodiments, the lateral surface 211 of basic ring 21 is formed with the circumferentially extending groove 215 along basic ring 21,
Waterproof seal 50 is partly housed in groove 215.
In this way, groove 215 is conducive to increasing the connection area of waterproof seal 50 and case ring 20, be conducive to waterproof sealing
Part 50 is better secured on case ring 20.Meanwhile, groove 215 is arranged in the preparation method of case ring 20 so that liquid
Marine glue is easier to be arranged on the lateral surface 211 of case ring 20.
Incorporated by reference to Fig. 2, in some embodiments, fingerprint identification module 30 is housed in centre bore 213.Specifically, refer to
Line identification module 30 includes packaging body 31 and fingerprint recognition chip 32, the encapsulation fingerprint recognition of packaging body 31 chip 32.
Specifically, when user carries out the operation of unlocked by fingerprint electronic installation 200, finger can be placed on and fingerprint recognition core
The corresponding position of piece 32.The signal of fingerprint recognition chip 32, to gather the fingerprint pattern of identification user, will be used through packaging body 31
The fingerprint pattern at family is matched with the fingerprint pattern prestored, if the match is successful, unlocks electronic installation 200.
It is appreciated that the surface of fingerprint recognition chip 32 towards the finger of user is provided with sensor pixel array, to gather
The fingerprint pattern of user.The encapsulation fingerprint recognition of packaging body 31 chip 32 can reduce sensor pixel array when gathering fingerprint pattern
Influenceed by other interference signals, to improve the accuracy rate of identification.
In some embodiments, the top surface of fingerprint identification module 30 is provided with cover plate 33.For example, cover plate 33 passes through
Colloid is fixed on the top surface of fingerprint identification module 30.
User is when carrying out fingerprint recognition operation, and finger can be pressed against in cover plate 33.Cover plate 33 can be with tamper seal
Body 31 is filled without damage, to improve the reliability of fingerprint identification module 30.
Cover plate 33 due to be often subject to touching, therefore, the material that cover plate 33 can be used hardness higher is made, for example with
On the sapphire material that refers to.
In some embodiments, the shape of the top surface of the form and dimension of cover plate 33 and fingerprint identification module 30 and big
It is small to coordinate.
For example, the shape of the top surface of fingerprint identification module 30 is in Long Circle, the shape of cover plate 33 is also in Long Circle.Covering
Area of the area of plate 33 slightly larger than the top surface of fingerprint identification module 30.Therefore, fingerprint recognition can be completely covered in cover plate 33
Module 30.
Referring to Fig. 9, the preparation method of the cover plate assembly 100 of embodiment of the present invention includes step：
There is provided the case ring 20 of any of the above embodiment by S10；
S20 offers installation through-hole 131 there is provided cover plate 10, cover plate 10；
S30, case ring 20 is fitted into installation through-hole 131, and makes the outside of bonding plane 223, supporting surface 221 and basic ring 21
Medial surface 131 formation gap 41 of the face 211 with installation through-hole 13；With
S40, colloid 40 is set in gap 41 and colloid 40 is bonded case ring 20 and cover plate 10.
In the manufacture method of embodiment of the present invention, because case ring 20 is formed with bonding plane 223 so that colloid 40 can be with
Enter from the upper surface 11 of cover plate 10 and the top of case ring 20 in the gap 41 between case ring 20 and cover plate 10, dispensing process
It is convenient and simple.
Specifically, in step s 40, the colloid of liquid can be clicked and entered into gap 41 from the upper surface 11 of cover plate 10, liquid is treated
After the colloid solidification of state, colloid 40 can be bonded case ring 20 and cover plate 10 securely.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description
Specific features, structure, material or feature are contained at least one embodiment of the present invention or example.In this specification
In, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description
Levy, structure, material or feature can in an appropriate manner be combined in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
These embodiments can be carried out with a variety of changes, modification in the case of not departing from the principle and objective of the present invention, replace and become
Type, the scope of the present invention is limited by claim and its equivalent.
Claims (14)
1. a kind of case ring, it is characterised in that including：
Basic ring, the basic ring has centre bore；With
The support division stretched out from the top of the basic ring, the support division includes：
The supporting surface being connected with the lateral surface of the basic ring；
The touch surface being connected with the medial surface of the centre bore, the touch surface is opposite with the support division；With
Connect the bonding plane of the supporting surface and the touch surface, the outside of the bonding plane, the supporting surface and the basic ring
Face is used to the gap that the medial surface formation with the installation through-hole of the cover plate of electronic installation enters for colloid.
2. case ring as claimed in claim 1, it is characterised in that the folder between the lateral surface of the supporting surface and the basic ring
Angle is right angle or obtuse angle.
3. case ring as claimed in claim 1, it is characterised in that the touch surface is towards in the centre bore and dipped down
Oblique inclined-plane.
4. case ring as claimed in claim 1, it is characterised in that the case ring include from the inner side of the centre bore towards
The support chip of interior extension, the upper surface of the support chip is provided with multiple projections, circumference of the multiple projection around the basic ring
It is spaced apart.
5. case ring as claimed in claim 4, it is characterised in that the height of the projection is more than or equal to 0.07mm.
6. case ring as claimed in claim 1, it is characterised in that be provided with waterproof seal on the lateral surface of the basic ring,
The waterproof seal surrounds the basic ring, and the waterproof seal is structure as a whole with the case ring.
7. case ring as claimed in claim 6, it is characterised in that the lateral surface of the basic ring is formed with the week along the basic ring
To the groove of extension, the waterproof seal is partly housed in the groove.
8. a kind of cover plate assembly, it is characterised in that including：
Case ring described in claim 1-7 any one；With
Cover plate, the cover plate offers installation through-hole, and the case ring is arranged in the installation through-hole, the bonding plane, institute
State be provided with medial surface formation gap of the lateral surface of supporting surface and the basic ring with the installation through-hole, the gap it is viscous
Connect the colloid of the case ring and the cover plate.
9. cover plate assembly as claimed in claim 8, it is characterised in that the medial surface of the installation through-hole includes：
First face relative with the lateral surface of the basic ring, first face connects the lower surface of the cover plate, first face
With the first gap of lateral surface formation of the basic ring；
The second face being connected with first face, second face is relative with the supporting surface, and second face is supported with described
Face is formed with the second gap；With
The 3rd face of second face and the upper surface of the cover plate is connected, the 3rd face is relative with the bonding plane, described
3rd face is formed with third space with the bonding plane；
The colloid is provided with first gap, second gap and the third space.
10. cover plate assembly as claimed in claim 9, it is characterised in that the width of the third space is more than or equal to
0.03mm。
11. cover plate assembly as claimed in claim 9, it is characterised in that the angle between second face and the 3rd face
For right angle or obtuse angle.
12. cover plate assembly as claimed in claim 9, it is characterised in that the cover plate assembly includes being housed in the centre bore
In fingerprint identification module.
13. a kind of electronic installation, it is characterised in that including the cover plate assembly described in claim 8-12 any one.
14. a kind of preparation method of cover plate assembly, it is characterised in that including step：
Case ring described in claim 1-7 any one is provided；
Cover plate is provided, the cover plate offers installation through-hole；
The case ring is fitted into the installation through-hole, and makes the outside of the bonding plane, the supporting surface and the basic ring
Medial surface formation gap of the face with the installation through-hole；With
Colloid is set in the gap and the colloid is bonded the case ring and the cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710382349.XA CN107241469B (en) | 2017-05-26 | 2017-05-26 | Decorative ring, cover plate assembly, electronic device and manufacturing method of cover plate assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710382349.XA CN107241469B (en) | 2017-05-26 | 2017-05-26 | Decorative ring, cover plate assembly, electronic device and manufacturing method of cover plate assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107241469A true CN107241469A (en) | 2017-10-10 |
| CN107241469B CN107241469B (en) | 2020-06-23 |
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ID=59985631
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710382349.XA Active CN107241469B (en) | 2017-05-26 | 2017-05-26 | Decorative ring, cover plate assembly, electronic device and manufacturing method of cover plate assembly |
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| Country | Link |
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| CN (1) | CN107241469B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108390977A (en) * | 2018-03-22 | 2018-08-10 | 江苏赛博宇华科技有限公司 | A kind of mobile fingerprint identification device |
| CN108683762A (en) * | 2018-05-22 | 2018-10-19 | Oppo广东移动通信有限公司 | The processing method of case ring, functional unit, electronic device and case ring |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105512652A (en) * | 2016-01-26 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile terminal and fingerprint recognizing and sensing device |
| CN205318405U (en) * | 2015-11-20 | 2016-06-15 | 维沃移动通信有限公司 | Fingerprint identification module and terminal equipment |
| CN205485758U (en) * | 2016-02-26 | 2016-08-17 | 联想(北京)有限公司 | Electronic equipment |
| US20170013101A1 (en) * | 2015-07-07 | 2017-01-12 | Ichia Technologies,Inc. | Waterproof housing |
| CN205961205U (en) * | 2016-08-16 | 2017-02-15 | 广东欧珀移动通信有限公司 | Input module and terminal |
-
2017
- 2017-05-26 CN CN201710382349.XA patent/CN107241469B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170013101A1 (en) * | 2015-07-07 | 2017-01-12 | Ichia Technologies,Inc. | Waterproof housing |
| CN205318405U (en) * | 2015-11-20 | 2016-06-15 | 维沃移动通信有限公司 | Fingerprint identification module and terminal equipment |
| CN105512652A (en) * | 2016-01-26 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile terminal and fingerprint recognizing and sensing device |
| CN205485758U (en) * | 2016-02-26 | 2016-08-17 | 联想(北京)有限公司 | Electronic equipment |
| CN205961205U (en) * | 2016-08-16 | 2017-02-15 | 广东欧珀移动通信有限公司 | Input module and terminal |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108390977A (en) * | 2018-03-22 | 2018-08-10 | 江苏赛博宇华科技有限公司 | A kind of mobile fingerprint identification device |
| CN108683762A (en) * | 2018-05-22 | 2018-10-19 | Oppo广东移动通信有限公司 | The processing method of case ring, functional unit, electronic device and case ring |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107241469B (en) | 2020-06-23 |
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| CB02 | Change of applicant information |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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