CN106612591A - Method for making flexible printed circuit board - Google Patents
Method for making flexible printed circuit board Download PDFInfo
- Publication number
- CN106612591A CN106612591A CN201510681991.9A CN201510681991A CN106612591A CN 106612591 A CN106612591 A CN 106612591A CN 201510681991 A CN201510681991 A CN 201510681991A CN 106612591 A CN106612591 A CN 106612591A
- Authority
- CN
- China
- Prior art keywords
- conductor substrate
- dielectric films
- flexible dielectric
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a method for making a flexible printed circuit board, comprising the following steps: providing a conductor substrate, wherein the conductor substrate includes an upper surface and a lower surface which are parallel to each other substantially; pasting a first flexible insulating film on the upper surface of the conductor substrate, wherein the first flexible insulating film partially covers the upper surface of the conductor substrate; patterning the conductor substrate; and pasting a second flexible insulating film on the lower surface of the conductor substrate, wherein the second flexible insulating film partially covers the lower surface of the conductor substrate. The conductor substrate after patterning includes an exposed part which is not covered by the first flexible insulating film and the second flexible insulating film. Compared with an ordinary technology, drilling and electroplating, which cause high yield loss in an FPC process, are avoided.
Description
Technical field
The present invention relates to flexible circuit board machining process field, relates in particular to a kind of manufacture method of flexibility printed circuit board.
Background technology
Referring to Fig. 1, the FPCA of existing two-sided conductive contact is made using two-sided copper foil base material 1, and the electrical connection of two sides circuit is realized by drilling plating 2；Unwanted Copper Foil is etched away by exposure imaging 3, retains remaining Copper Foil.Then again the part coverlay 4 of the conductive contact that need not leak outside is bonded, the part for not attaching coverlay is exactly two-sided conduction contact part 5.
But sometimes, as long as several circuits need double-side conduction to contact, in this way with regard to some waste of materials and operation.
The content of the invention
For the problems referred to above, the present invention provides a kind of manufacture method of flexibility printed circuit board, to solve the problems of the prior art.
To achieve these goals, technical scheme is as follows：
A kind of manufacture method of flexibility printed circuit board, it is characterised in that the manufacture method is comprised the following steps：
Conductor substrate is provided, the conductor substrate includes the upper and lower surface being substantially parallel to each other;
The first flexible dielectric films are attached in the upper surface of the conductor substrate, the first flexible dielectric films part covers the upper surface of the conductor substrate;
Technique is patterned to the conductor substrate;And
The second flexible dielectric films are attached in the lower surface of the conductor substrate, the first flexible dielectric films part covers the upper surface of the conductor substrate and relative to first flexible dielectric films;
Wherein, the conductor substrate Jing after patterning process includes an exposed part, and the exposed part is not covered by first flexible dielectric films and the second flexible dielectric films.
In a preferred embodiment of the invention, the structure for being formed after the patterning process is not in contact with each other two-by-two.
Further, first flexible dielectric films and the second flexible dielectric films are the one kind in polyimides and mylar.
Further, the conductor substrate is monolayer Copper Foil.
A kind of flexibility printed circuit board, it is characterised in that, the flexible print circuit board includes：
The first flexible dielectric films, conductor substrate and the second flexible dielectric films formed with stacked structure, the conductor substrate is arranged between first flexible dielectric films and second insulation film and has a patterned structures, wherein described conductor substrate includes an exposed part, and the exposed part is not covered by first flexible dielectric films and the second flexible dielectric films.
In a preferred embodiment of the invention, the patterned structures are not in contact with each other two-by-two.
Further, first flexible dielectric films and the second flexible dielectric films are the one kind in polyimides and mylar.
Further, the conductor substrate is monolayer Copper Foil.
The invention has the beneficial effects as follows：
1st, save material cost.Common solution adopts double face copper and two sides PI films；The present invention adopts monolayer Copper Foil and two sides PI films.
2nd, simplified processing process.The processing technique that the present invention is adopted is compared compared with common process, eliminates drilling and electroplating technology, and this technique belongs to the higher technique of yield loss in FPC processing procedures.
The characteristics of of the invention, see the detailed description of this case schema and following preferable embodiment and is well understood to.
Description of the drawings
Schematic diagrams of the Fig. 1 for prior art processing technique.
Fig. 2 is the schematic diagram of processing technique of the present invention.
Specific embodiment
In order that technological means, creation characteristic, reached purpose and effect that the present invention is realized are easy to understand, the present invention is expanded on further with reference to specific embodiment.
Referring to Fig. 2, a kind of manufacture method of flexibility printed circuit board, manufacture method are comprised the following steps：
Conductor substrate 10 is provided, conductor substrate is monolayer Copper Foil.Monolayer Copper Foil 10 includes the upper and lower surface being substantially parallel to each other;
The first flexible dielectric films 20 are attached in the upper surface of monolayer Copper Foil 10, the first flexible dielectric films part covers the upper surface of the conductor substrate;
Technique is patterned to the conductor substrate;The structure formed after patterning process is not in contact with each other two-by-two.
The second flexible dielectric films 40 are attached in the lower surface of the conductor substrate, the first flexible dielectric films part covers the upper surface of the conductor substrate and relative to first flexible dielectric films;In the present embodiment, the first flexible dielectric films and the second flexible dielectric films are the one kind in polyimides and mylar.
Wherein, the conductor substrate Jing after patterning process includes an exposed part 50, and the exposed part is not covered by first flexible dielectric films and the second flexible dielectric films.
The flexibility printed circuit board for finally giving, including：
The first flexible dielectric films 20, conductor substrate 10 and the second flexible dielectric films 40 formed with stacked structure, conductor substrate is arranged between first flexible dielectric films and second insulation film and has a patterned structures 30, wherein described conductor substrate includes an exposed part 50, and exposed part is not covered by first flexible dielectric films and the second flexible dielectric films.
The processing technique that the present invention is adopted is compared compared with common process, eliminates drilling and electroplating technology, and this technique belongs to the higher technique of yield loss in FPC processing procedures.
Ultimate principle, principal character and the advantages of the present invention of the present invention has been shown and described above.It should be understood by those skilled in the art that; the present invention is not restricted to the described embodiments; the principle of the simply present invention described in above-described embodiment and description; the present invention also has various changes and modifications without departing from the spirit and scope of the present invention, and these changes and improvements are both fallen within the range of claimed invention.The protection domain of application claims is defined by appending claims and its equivalent.
Claims (8)
1. a kind of manufacture method of flexibility printed circuit board, it is characterised in that the manufacture method is comprised the following steps：
Conductor substrate is provided, the conductor substrate includes the upper and lower surface being substantially parallel to each other;
The first flexible dielectric films are attached in the upper surface of the conductor substrate, the first flexible dielectric films part covers the upper surface of the conductor substrate;
Technique is patterned to the conductor substrate;
And
The second flexible dielectric films are attached in the lower surface of the conductor substrate, the first flexible dielectric films part covers the upper surface of the conductor substrate and relative to first flexible dielectric films;
Wherein, the conductor substrate Jing after patterning process includes an exposed part, and the exposed part is not covered by first flexible dielectric films and the second flexible dielectric films.
2. the manufacture method of flexibility printed circuit board according to claim 2, it is characterised in that the structure formed after the patterning process is not in contact with each other two-by-two.
3. the manufacture method of flexibility printed circuit board according to claim 2, it is characterised in that first flexible dielectric films and the second flexible dielectric films are the one kind in polyimides and mylar.
4. the manufacture method of flexibility printed circuit board according to claim 2, it is characterised in that the conductor substrate is monolayer Copper Foil.
5. a kind of flexibility printed circuit board, it is characterised in that, the flexible print circuit board includes：
The first flexible dielectric films, conductor substrate and the second flexible dielectric films formed with stacked structure, the conductor substrate is arranged between first flexible dielectric films and second insulation film and has a patterned structures, wherein described conductor substrate includes an exposed part, and the exposed part is not covered by first flexible dielectric films and the second flexible dielectric films.
6. flexibility printed circuit board according to claim 5, it is characterised in that the patterned structures are not in contact with each other two-by-two.
7. flexibility printed circuit board according to claim 6, it is characterised in that first flexible dielectric films and the second flexible dielectric films are the one kind in polyimides and mylar.
8. flexibility printed circuit board according to claim 6, it is characterised in that the conductor substrate is monolayer Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510681991.9A CN106612591A (en) | 2015-10-21 | 2015-10-21 | Method for making flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510681991.9A CN106612591A (en) | 2015-10-21 | 2015-10-21 | Method for making flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106612591A true CN106612591A (en) | 2017-05-03 |
Family
ID=58611289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510681991.9A Pending CN106612591A (en) | 2015-10-21 | 2015-10-21 | Method for making flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106612591A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107911939A (en) * | 2017-11-24 | 2018-04-13 | 惠州市鹏程电子科技有限公司 | A kind of flexible printed circuit board |
| CN110012605A (en) * | 2019-04-23 | 2019-07-12 | 珠海元盛电子科技股份有限公司 | A kind of thickness copper hollow out window FPC production method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050284657A1 (en) * | 2002-12-30 | 2005-12-29 | Sumsung Electro-Mechanics Co., Ltd. | Double-sided printed circuit board without via holes and method of fabricating the same |
| CN101553079A (en) * | 2009-05-11 | 2009-10-07 | 昆山亿富达电子有限公司 | Hollow-out flexible printed circuit board |
| CN201403249Y (en) * | 2009-04-30 | 2010-02-10 | 厦门新福莱科斯电子有限公司 | Flexible circuit board structure with anti-electromagnetic interference function |
| CN103167738A (en) * | 2011-12-15 | 2013-06-19 | 北大方正集团有限公司 | Metal image manufacturing method and metal image semi-finished plate |
| CN203301854U (en) * | 2013-06-09 | 2013-11-20 | 宁波赛特信息科技发展有限公司 | Pseudo dual-side type flexible circuit board |
-
2015
- 2015-10-21 CN CN201510681991.9A patent/CN106612591A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050284657A1 (en) * | 2002-12-30 | 2005-12-29 | Sumsung Electro-Mechanics Co., Ltd. | Double-sided printed circuit board without via holes and method of fabricating the same |
| CN201403249Y (en) * | 2009-04-30 | 2010-02-10 | 厦门新福莱科斯电子有限公司 | Flexible circuit board structure with anti-electromagnetic interference function |
| CN101553079A (en) * | 2009-05-11 | 2009-10-07 | 昆山亿富达电子有限公司 | Hollow-out flexible printed circuit board |
| CN103167738A (en) * | 2011-12-15 | 2013-06-19 | 北大方正集团有限公司 | Metal image manufacturing method and metal image semi-finished plate |
| CN203301854U (en) * | 2013-06-09 | 2013-11-20 | 宁波赛特信息科技发展有限公司 | Pseudo dual-side type flexible circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107911939A (en) * | 2017-11-24 | 2018-04-13 | 惠州市鹏程电子科技有限公司 | A kind of flexible printed circuit board |
| CN107911939B (en) * | 2017-11-24 | 2024-05-10 | 惠州市鹏程电子科技有限公司 | Flexible printed circuit board |
| CN110012605A (en) * | 2019-04-23 | 2019-07-12 | 珠海元盛电子科技股份有限公司 | A kind of thickness copper hollow out window FPC production method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170503 |
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| WD01 | Invention patent application deemed withdrawn after publication |