CN105914174A - Processing apparatus - Google Patents
Processing apparatus Download PDFInfo
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- CN105914174A CN105914174A CN201610090290.2A CN201610090290A CN105914174A CN 105914174 A CN105914174 A CN 105914174A CN 201610090290 A CN201610090290 A CN 201610090290A CN 105914174 A CN105914174 A CN 105914174A
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- image
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- low range
- view data
- optical system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Abstract
The invention provides a processing apparatus which simplifies the structure of a calibration device. The processing apparatus processes an image which is photographed by one optical system (71) and an image photographing unit (72), thereby obtaining a low-magnification image (P1) and a high-magnification image (P2). Therefore, in acquiring the low-magnification image (P1) and the low-magnification image (P2), arrangement of an optical system (71) and an image photographing unit (72) for high magnificiation and an optical system (71) and an image photographing unit (72) for low magnification are not required, thereby reducing cost of the optical system (71) and the image photographing unit (72) and reducing maintenance cost of the optical system (71) and the image photographing unit (72). Furthermore, in acquiring the low-magnification image (P1) and the high-magnification image (P2), positioning for shaft motion of the optical system (71) can be finished through one-time operation, thereby reduucing number of shaft motions.
Description
Technical field
The present invention relates to processing unit (plant), particularly to alignment unit.
Background technology
Based on to semiconductor wafer and be formed with the wafer of optics, the base plate for packaging being formed with electronic unit and pottery
The machined object of the various tabular such as substrate, glass substrate carries out the purpose of segmentation etc. and uses topping machanism and Laser Processing
The processing unit (plant) of device etc..Processing unit (plant) utilizes image unit to being held in the front of machined object and the back of the body of chuck table
The key pattern formed on face images, and deduces region to be processed (segmentation preset lines) with key pattern for clue.
The image unit imaging key pattern possessed macroscopical microscope of low range and powerful micrometer microscope in the past,
It is by macroscopic view microscopic examination key pattern, and is estimated the position of key pattern accurately by micrometer microscope (specially
Profit document 1).Additionally, be also contemplated that the optical axis concentrating 2 image units 1 optical system (microscope)
Calibrating installation (patent documentation 2).
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2005-85973 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2005-166991 publication
But, in this case except occurring for carrying in addition to 2 microscopical costs, in addition it is also necessary to carry out for
Each microscopical initial setting (settings of alignment focal position etc.) and maintenance.Additionally, in order to obtain expectation multiplying power
Image, it is necessary to shifting axle so that microscope is positioned at camera position, location time need the consuming time.Additionally,
Using when 1 optical system concentrates the calibrating installation of optical axis of 2 camera heads, camera head is still 2.
Summary of the invention
Then, the present invention is exactly to complete in view of the foregoing, its object is to provide one to simplify calibrating installation
The processing unit (plant) of structure.
In order to solve above-mentioned problem, reaching purpose, the processing unit (plant) of the present invention has: chuck table, and it utilizes holding face
Keep machined object；Machining cell, the machined object kept in this chuck table is processed by it；And calibration is single
Unit, the machined object kept in this chuck table is imaged, detects region to be processed by it, it is characterised in that should
Alignment unit has: optical system, and it obtains optical image；Image unit, its optical image that this optical system is obtained
Image；Graphics processing unit, the image obtained by the shooting of this image unit is processed, obtains low power by it
Rate image and high magnification image；And display unit, the image after its display process, this graphics processing unit is low from this
In multiplying power image, the region to regulation is amplified processing, and obtains this high magnification image.
Additionally, above-mentioned processing unit (plant) is preferably configured as, the view data that shooting is obtained by this graphics processing unit is pressed
Contracting processes and as this low range image, the compression not carrying out this view data processes, or low less than this by compression ratio
The compression of multiplying power image processes and obtains this high magnification image.
The effect of invention
The processing unit (plant) of the present invention uses 1 optical system and image unit to process captured image respectively
To obtain low range image and high magnification image, thus the cost that can either cut down optical system and image unit again can
Reduce optical system and the maintenance man-hours of image unit, additionally it is possible to reduce the axle action of location optical system.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the structure example of the processing unit (plant) representing the 1st embodiment.
Fig. 2 is the axonometric chart of the camera watch region of the wafer representing the 1st embodiment.
Fig. 3 is the block diagram of the structure example of the alignment unit representing the 1st embodiment.
Fig. 4 is the flow chart of the action example of the alignment unit representing the 1st embodiment.
Fig. 5 is the block diagram of the structure example of the alignment unit representing the 2nd embodiment.
Fig. 6 is the flow chart of the action example of the alignment unit representing the 2nd embodiment.
Label declaration
1A, 1B: processing unit (plant), 10: chuck table, 20: machining cell, 40: processing feed unit, 50: point
Degree feed unit, 60: incision feed unit, 70A, 70B: alignment unit, 71: optical system, 72: shooting
Unit, E1, E2: camera watch region, KP: key pattern, L: segmentation preset lines, P1: low range image, P2:
High magnification image, V: display picture, V1, V2: viewing area, W: wafer, WS: front.
Detailed description of the invention
Mode (embodiment) for implement the present invention is explained in detail with reference to the accompanying drawings.The present invention is not limited to following
Embodiment described in content.Additionally, the structural element of the following stated includes that those of ordinary skill in the art can
The key element being readily apparent that or being substantially the same.And then, can be with the structure of appropriately combined the following stated.Furthermore, it is possible to
Without departing from carrying out the various omissions of structure in the range of present subject matter, replacing or change.
1st embodiment
The structure example of the processing unit (plant) of explanation the 1st embodiment below.Fig. 1 be represent the 1st embodiment add frock
The axonometric chart of the structure example put.Fig. 2 is the axonometric chart of the camera watch region of the wafer representing the 1st embodiment.Fig. 3
It it is the block diagram of the structure example of the alignment unit representing the 1st embodiment.
Processing unit (plant) 1A is used for cutting wafer W.Processing unit (plant) 1A has chuck table 10, machining cell 20, door
Type framework 30, processing feed unit 40, index feed unit 50, incision feed unit 60, alignment unit 70A,
Control unit 80.
Wafer W is to be formed with semiconductor device and the semiconductor wafer of optical device and optical device wafer, inorganic material base
The various machined objects such as plate, ductility resin material substrate, ceramic substrate and glass substrate.Wafer W as in figure 2 it is shown,
Be formed as discoideus, its front WS is formed in clathrate on multiple regions of arrangement in clathrate IC,
The device D of LSI etc..Wafer W is supported in ring-shaped frame F across adhesive tape T.Such as, ring-shaped frame F
On be formed with notch Fa along X, Y direction, and so that be formed as the arrangement side of cancellate device D
To being parallel to the mode of notch Fa, wafer W is supported on ring-shaped frame F.
Here, X-direction is that the wafer W being held in chuck table 10 is processed the direction of feeding.Y-axis
Direction be with X-direction in same level orthogonal, and make index feed unit 50 relative in chuck table 10
The wafer W of upper holding and the direction of index feed.Z-direction is the direction orthogonal with X-direction and Y direction,
It is vertical direction in the present embodiment.
Chuck table 10 along the peristome 2a arranged in the X-axis direction so that device can be disposed in the way of moving
The upper surface of main body 2.Chuck table 10 has holding face 11 and multiple maintaining part 12.Chuck table 10 is formed as plectane
Shape, and rotated by the rotary shaft orthogonal with the center keeping face 11 by not shown rotary unit.Holding face
11 is the upper surface of the vertical direction of chuck table 10, and is formed as smooth with horizontal plane and is connected.Holding face 11 is such as
It is made up of porous ceramics etc., and the attracting holding wafer W by the negative pressure in not shown vacuum attraction source.Multiple guarantors
Hold 4 positions that portion 12 is equipped on the surrounding in holding face 11, clamping the notch of stationary ring framework F
Fa。
Machining cell 20 is for being processed the wafer W kept in chuck table 10.Machining cell 20 is by dividing
Degree feed unit 50 is fixed on gate frame 30 with cutting feed unit 60, and this gate frame 30 is with at Y
Cross over the mode of the peristome 2a of the upper surface being arranged at apparatus main body 2 on direction of principal axis and be uprightly arranged at apparatus main body
2.Machining cell 20 has cutting tool 21, main shaft 22, shell 23.Cutting tool 21 is created as very thin
Discoideus and be formed as ring-type cutting grinding stone.The end of main shaft 22 is provided with cutting edge in the way of can dismounting
Tool 21.Shell 23 has the driving source of not shown motor etc., and can rotate around the rotary shaft of Y direction
Mode supporting spindle 22.Cutting tool 21 is utilized to cut wafer W by making main shaft 22 high-speed rotary.
Processing feed unit 40 is used for making chuck table 10 and machining cell 20 relative movement in the X-axis direction.Such as,
Processing feed unit 40 has the driving of the not shown ball-screw extended in the X-axis direction and pulse motor etc.
Source, makes the not shown X-axis of supporting chuck table 10 move base station and moves in the X-axis direction.It addition, at peristome
The covering X-axis that is equipped with 2a moves the cap assembly 41 of base station and extends along X-direction before and after cap assembly 41
Serpentis web part 42.
Index feed unit 50 is used for making chuck table 10 and cutting unit 20 relative movement in the Y-axis direction.Such as,
Index feed unit 50 has: the pair of guide rails 51 extended in the Y-axis direction；The rolling of arranging parallel with guide rail 51
Ballscrew 52；Y-axis moves base station 53, and it is fixed in the not shown nut screwed togather on ball-screw 52, and
Can be disposed in the way of sliding on guide rail 51；And make the not shown pulse motor that ball-screw 52 rotates.
Index feed unit 50 makes ball-screw 52 rotate by pulse motor, so that supporting incision feed unit
The Y-axis of 60 moves base station 53 and moves in the Y-axis direction.
Incision feed unit 60 is for making cutting unit 20 in the Z-direction orthogonal with the holding face 11 of chuck table 10
Upper movement.Such as, incision feed unit 60 has: extends in the Z-axis direction, and is fixed in Y-axis and moves base
Pair of guide rails 61 on platform 53；The ball-screw 62 of arranging parallel with guide rail 61；Z axis moves base station 63, its quilt
It is fixed on the not shown nut screwed togather on ball-screw 62, and so that guide rail 61 can be disposed in the way of sliding
On；And make the pulse motor 64 that ball-screw 62 rotates.Incision feed unit 60 is by pulse motor 64
Ball-screw 62 is made to rotate, so that the Z axis of supporting cutting unit 20 moves base station 63 and moves in the Z-axis direction.
As it is shown on figure 3, the wafer W being held in chuck table 10 is imaged by alignment unit 70A, detection
Region to be processed, i.e. segmentation preset lines L.Device D is formed the key pattern for detecting segmentation preset lines L
KP.Key pattern KP, such as in cross shape, is set with 1 key pattern KP at the assigned position of device D.School
Quasi-unit 70A has optical system 71, image unit 72, graphics processing unit 73, display unit 74.
Optical system 71 is for obtaining the optical image of the front WS of the wafer W being held in chuck table 10.Light
System 71 is integrally constituted with image unit 72, and by index feed unit 50 and incision feed unit 60
And it is fixed in gate frame 30.Optical system 71 is set at assigned position relative to wafer W, make into
Photoimaging after penetrating is to form optical image on image unit 72.Such as, the multiplying power of optical image is about 1 times.
Image unit 72, for imaging the optical image of the wafer W that optical system 71 obtains, e.g. uses
The camera etc. of CCD (Charge Coupled Device: charge coupled cell) image sensor.Image unit 72
Optical image is carried out light-to-current inversion to export view data to graphics processing unit 73.
Graphics processing unit 73 carries out image procossing from image unit 72 input image data.Graphics processing unit
73 according to the view data inputted, and is amplified the region of regulation based on low range image P1 processing to obtain
High magnification image P2.Graphics processing unit 73 has not shown image processing engine, low range image acquisition unit
731, high magnification image acquisition unit 732, memory element 733.Image processing engine exports from image unit 72
View data, carry out the image procossing of brightness adjustment and setting contrast etc..
Low range image acquisition unit 731 is used for obtaining low range image P1.Low range image acquisition unit 731 takes
Must be from the view data (low range view data) of image processing engine output.Low range view data is not accompanied
With the view data occurring that multiplying power changes.
High magnification image acquisition unit 732 has amplifying unit 732a, to obtain high magnification image P2.Amplifying unit
732a improves the resolution in the regulation region from the low range view data of low range image acquisition unit 731 output.
Such as, amplifying unit 732a obtains the narrow regions G in low range view data containing key pattern KP, and to narrow
Zonule G carries out sub-pix process.Such as, 1 pixel is decomposed into 1/10 and obtains 0.1 by amplifying unit 732a
The high-resolution view data (high magnification view data) of pixel unit.
Memory element 733 is used for storing low range view data and high magnification view data.Additionally, memory element 733
Storage has the view data etc. of the key pattern of Graphic Pattern Matching.
Display unit 74 e.g. touch panel, is equipped at the assigned position of apparatus main body 2.Display unit 74
Image after display is processed by graphics processing unit 73, or input processing conditions etc. for operator.Such as,
The display picture V of display unit 74 have viewing area V1, V2.Viewing area V1 is display low range
The region of image P1, substantially occupies the left-half of display picture V.Viewing area V2 is display high magnification figure
As the region of P2, substantially occupy the right half part of display picture V.
Control unit 80 is for controlling each structural element of processing unit (plant) 1A.Such as, control unit 80 adds with driving
The not shown driving of the pulse motor of work feed unit 40, index feed unit 50 and incision feed unit 60
Circuit connects, and controls drive circuit to determine that chuck table 10 position in the X-axis direction and machining cell 20 are at Y
Position on direction of principal axis and Z-direction.Control unit 80 is configured to include above-mentioned graphics processing unit 73.
Then, the action example of alignment unit 70A is described.Fig. 4 is alignment unit dynamic representing the 1st embodiment
Make the flow chart of example.In this example, as the premise of explanation, the retaining ring by the maintaining part 12 of chuck table 10
The notch Fa of shape framework F, the orientation of the device D in wafer W is set to X, Y direction.
First, the regulation region of wafer W is imaged (step S1).Such as, control unit 80 controls processing
Feed unit 40, index feed unit 50 and incision feed unit 60, be set in wafer W by optical system 71
At assigned position on camera watch region E1, E2.Here, camera watch region E1 and camera watch region E2 is positioned at X-axis side
On same straight line upwards.Image unit 72 carries out light-to-current inversion to incite somebody to action to by the optical image of optical system 71 imaging
The view data of camera watch region E1, E2 exports to image processing engine.
Then, low range image P1 (step S2) is obtained.Such as, image processing engine is to camera watch region E1, E2
View data carry out the image procossing of brightness adjustment and setting contrast etc., and to low range image acquisition unit 731
Output view data.Low range image acquisition unit 731 using the view data that exports from image processing engine as low power
Rate view data and obtain.Low range view data is exported and takes to high magnification image by low range image acquisition unit 731
Obtain unit 732 and be stored in memory element 733.
Then, high magnification image P2 (step S3) is obtained.Such as, high magnification image acquisition unit 732 is transfused to take the photograph
As the low range view data of region E1, E2, and obtain in camera watch region E1, E2, comprise key pattern KP's
The low range view data of narrow regions G.Such as, high magnification image acquisition unit 732 with reference to memory element 733,
The view data of the key pattern according to Graphic Pattern Matching, by Graphic Pattern Matching detect at camera watch region E1, E2 low
The key pattern KP comprised in multiplying power view data, and based on detected key pattern KP using regulation scope as
Narrow regions G.Such as, high magnification image acquisition unit 732 center KPc based on key pattern KP and will be
The scope of rectangle made using the length scale of regulation in X-direction and Y direction is as narrow regions G.High magnification
The narrow regions G of low range view data is carried out at sub-pix by image acquisition unit 732 by amplifying unit 732a
Reason, obtains high-resolution view data (high magnification view data) and is stored in memory element 733.
Then, the angle adjustment (step S4) of wafer W is carried out.Such as, control unit 80 with reference to memory element 733,
Obtain the high magnification view data in the narrow regions G of camera watch region E1, E2.And, control unit 80 so that
The Y coordinate of the key pattern KP obtaining camera watch region E1 is consistent with the Y coordinate of the key pattern KP of camera watch region E2
Mode, rotary chuck platform 10 is to carry out angle adjustment.Such as, control unit 80 is so that camera watch region E1, E2
Key pattern KP on the Y coordinate of corner portion of regulation mode consistent with each other, make chuck table 10 rotate,
Carry out angle adjustment.Additionally, control unit 80 is with reference to memory element 733, obtain the low power of camera watch region E1, E2
Rate view data, demonstrates the low range image P1 of camera watch region E1 or E2 on the V1 of viewing area, and amplifies
The narrow regions G comprising key pattern KP of low range image P1, is shown in viewing area by high magnification image P2
V2。
Then, segmentation preset lines L (step S5) of wafer W is detected.Such as, control unit 80 is according to high magnification
Key pattern KP detection segmentation preset lines L of view data.Such as, key pattern KP and the center splitting preset lines L
Distance between line sets beforehand through operator.Control unit 80 will from key pattern KP in the Y-axis direction from
The position opening the distance set by operator is defined as splitting preset lines L.
As it has been described above, according to the processing unit (plant) 1A of the 1st embodiment, use 1 optical system 71 and shooting respectively
The image that shooting is obtained by unit 72 processes, to obtain low range image P1 and high magnification image P2.Thus,
When obtaining low range image P1 and high magnification image P2, it is not necessary to arrange the optical system of 2 high magnifications respectively
71 and the optical system 71 of image unit 72 and low range and image unit 72, therefore, it is possible to cut down optical system
System 71 and the cost of image unit 72, and optical system 71 and the maintenance man-hours of image unit 72 can be reduced.
And then, when obtaining low range image P1 and high magnification image P2, can complete for 1 time to position optical system 71
Axle action, it is possible to reduce axle action.
2nd embodiment
Then, the processing unit (plant) of the 2nd embodiment is described.Fig. 5 is the knot of the alignment unit representing the 2nd embodiment
The block diagram of structure example.The difference of the alignment unit 70A of the alignment unit 70B shown in Fig. 5 and the 1st embodiment
Being, low range image acquisition unit 731 possesses image compression unit 731a.
Image compression unit 731a compression low range view data, such as, use JPEG (Joint Photograph
Experts Group: joint image expert group) or GIF (Graphics Interchange Format: figures exchange
Form) etc. method with by low range Image Data Compression is several points about 1.
The action example of alignment unit 70B is described below.Fig. 6 is the action of the alignment unit representing the 2nd embodiment
The flow chart of example.In this example, as the premise of explanation, keep ring-type by the maintaining part 12 of chuck table 10
The notch Fa of framework F, the orientation of the device D in wafer W is set to X, Y direction.
First, regulation region, such as camera watch region E1, E2 of wafer W is imaged (step S11).Connect
, compression low range image P1 (step S12).Such as, image compression unit 731a will be defeated from image processing engine
The Image Data Compression gone out is about the 1 of several points, obtains the 1st low range view data and is stored in memory element
733.Additionally, image compression unit 731a obtains the after compressing with the compression ratio less than the 1st low range view data
2 low range view data or unpressed low range view data, and by the 2nd acquired low range view data or
Unpressed low range view data exports to high magnification image acquisition unit 732.
High magnification image acquisition unit 732 according to the 2nd low range view data or unpressed low range view data,
Obtain high magnification view data and be stored in memory element 733 (step S13).Control unit 80 is according to high magnification figure
As the key pattern KP of data carries out the angle adjustment (step S14) of wafer W.After angle adjustment, control unit
80 detect segmentation preset lines L (step S15) of wafer W according to the key pattern KP of high magnification view data.
As it has been described above, according to the processing unit (plant) 1B of the 2nd embodiment, there is the effect of the 1st embodiment, and
Low range view data is compressed, therefore, it is possible to the storage cutting down memory element 733 is held by image compression unit 731a
Amount.Additionally, due to use the low range view data before relatively low compression ratio or compression to obtain high magnification view data,
Therefore, it is possible to the image quality of suppression high magnification view data reduces.
Variation
When obtaining high magnification view data, illustrate to carry out the example of sub-pix process, but be not limited to this.Such as,
Can also use and obtain high magnification view data closest to algorithm, bilinear interpolation, bicubic interpolation etc..
Claims (2)
1. a processing unit (plant), it has: chuck table, and it utilizes holding face to keep machined object；Machining cell,
The machined object kept in this chuck table is processed by it；And alignment unit, it keeps in this chuck table
Machined object image, detect region to be processed,
This processing unit (plant) is characterised by,
This alignment unit has:
Optical system, it obtains optical image；
Image unit, its optical image obtaining this optical system images；
Graphics processing unit, the image obtained by the shooting of this image unit is processed, obtains low range image by it
With high magnification image；And
Display unit, the image after its display process,
The region specified is amplified processing from this low range image by this graphics processing unit, obtains this high magnification figure
Picture.
Processing unit (plant) the most according to claim 1, it is characterised in that
This graphics processing unit be compressed processing to the view data that obtains of shooting and as this low range image,
The compression not carrying out this view data processes, or is processed less than the compression of this low range image by compression ratio and take
Obtain this high magnification image.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-035688 | 2015-02-25 | ||
| JP2015035688A JP2016157870A (en) | 2015-02-25 | 2015-02-25 | Processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105914174A true CN105914174A (en) | 2016-08-31 |
Family
ID=56744431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610090290.2A Pending CN105914174A (en) | 2015-02-25 | 2016-02-18 | Processing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016157870A (en) |
| KR (1) | KR20160103921A (en) |
| CN (1) | CN105914174A (en) |
| TW (1) | TW201642335A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110328560A (en) * | 2019-07-31 | 2019-10-15 | 上海建桥学院 | A kind of mechanical arm system and method for processing complicated sphere curved surface shell |
| CN110783246A (en) * | 2018-07-26 | 2020-02-11 | 株式会社迪思科 | Alignment method |
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| JP6955955B2 (en) * | 2017-10-12 | 2021-10-27 | 株式会社ディスコ | Wafer processing method |
| JP7208732B2 (en) * | 2018-07-26 | 2023-01-19 | 株式会社ディスコ | Alignment method |
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| CN110783246A (en) * | 2018-07-26 | 2020-02-11 | 株式会社迪思科 | Alignment method |
| CN110783246B (en) * | 2018-07-26 | 2023-08-18 | 株式会社迪思科 | Alignment method |
| CN110328560A (en) * | 2019-07-31 | 2019-10-15 | 上海建桥学院 | A kind of mechanical arm system and method for processing complicated sphere curved surface shell |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016157870A (en) | 2016-09-01 |
| KR20160103921A (en) | 2016-09-02 |
| TW201642335A (en) | 2016-12-01 |
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