CN105830208B - 基板保持装置、曝光装置及器件制造方法 - Google Patents

基板保持装置、曝光装置及器件制造方法 Download PDF

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Publication number
CN105830208B
CN105830208B CN201480070325.5A CN201480070325A CN105830208B CN 105830208 B CN105830208 B CN 105830208B CN 201480070325 A CN201480070325 A CN 201480070325A CN 105830208 B CN105830208 B CN 105830208B
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China
Prior art keywords
substrate
moving parts
adsorption section
base plate
wafer
Prior art date
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CN201480070325.5A
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English (en)
Chinese (zh)
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CN105830208A (zh
Inventor
柴崎祐一
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Polarising Elements (AREA)
CN201480070325.5A 2013-10-30 2014-10-29 基板保持装置、曝光装置及器件制造方法 Active CN105830208B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-224843 2013-10-30
JP2013224843 2013-10-30
PCT/JP2014/078713 WO2015064613A1 (ja) 2013-10-30 2014-10-29 基板保持装置、露光装置及びデバイス製造方法

Publications (2)

Publication Number Publication Date
CN105830208A CN105830208A (zh) 2016-08-03
CN105830208B true CN105830208B (zh) 2019-07-16

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CN201480070325.5A Active CN105830208B (zh) 2013-10-30 2014-10-29 基板保持装置、曝光装置及器件制造方法

Country Status (8)

Country Link
US (2) US9921490B2 (ko)
EP (2) EP3065165B1 (ko)
JP (2) JP6436090B2 (ko)
KR (3) KR102411747B1 (ko)
CN (1) CN105830208B (ko)
HK (1) HK1221819A1 (ko)
TW (3) TWI644391B (ko)
WO (1) WO2015064613A1 (ko)

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US10381258B2 (en) * 2015-12-02 2019-08-13 Tokyo Electron Limited Apparatus of processing workpiece in depressurized space
EP3391149B1 (en) * 2015-12-15 2020-01-01 ASML Netherlands B.V. A substrate holder, a lithographic apparatus and method of manufacturing devices
US10998219B2 (en) * 2016-06-13 2021-05-04 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer support device and method for removing lift pin therefrom
JP6711168B2 (ja) * 2016-06-23 2020-06-17 東京エレクトロン株式会社 基板載置装置及び基板載置方法
JP6774507B2 (ja) * 2016-07-06 2020-10-28 エーエスエムエル ネザーランズ ビー．ブイ． 基板ホルダ及び基板ホルダを製造する方法
CN109952537B (zh) 2016-10-20 2021-12-24 分子印记公司 在压印光刻过程中定位基板
JP6899217B2 (ja) * 2016-12-28 2021-07-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法および基板処理システム
CN106802537B (zh) * 2017-03-27 2020-04-14 京东方科技集团股份有限公司 承载机台和曝光方法
JP6867229B2 (ja) * 2017-05-26 2021-04-28 アピックヤマダ株式会社 樹脂モールド金型
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CN111566798B (zh) * 2018-01-19 2023-10-27 株式会社塞米克斯 晶片探测器
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JP7419030B2 (ja) * 2019-11-18 2024-01-22 キヤノン株式会社 保持装置、露光装置、及び物品の製造方法
JP6788922B1 (ja) * 2020-01-10 2020-11-25 上野精機株式会社 電子部品の処理装置
EP3851916A1 (en) * 2020-01-17 2021-07-21 ASML Netherlands B.V. Suction clamp, object handler, stage apparatus and lithographic apparatus
CN113830700A (zh) * 2020-06-24 2021-12-24 拓荆科技股份有限公司 水平自动调整的升降***及方法
CN113838787A (zh) * 2020-06-24 2021-12-24 拓荆科技股份有限公司 晶圆承载组件、晶圆传递装置及晶圆传递之方法

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Also Published As

Publication number Publication date
JP6855010B2 (ja) 2021-04-07
EP3065165A1 (en) 2016-09-07
HK1221819A1 (zh) 2017-06-09
CN105830208A (zh) 2016-08-03
JP2019054264A (ja) 2019-04-04
JPWO2015064613A1 (ja) 2017-03-09
US10359707B2 (en) 2019-07-23
KR102411747B1 (ko) 2022-06-22
US20160370712A1 (en) 2016-12-22
TW201907517A (zh) 2019-02-16
KR20220088807A (ko) 2022-06-28
TWI644391B (zh) 2018-12-11
JP6855010B6 (ja) 2022-06-07
EP3065165A4 (en) 2017-04-12
JP6436090B2 (ja) 2018-12-12
US9921490B2 (en) 2018-03-20
TWI695451B (zh) 2020-06-01
TW201530688A (zh) 2015-08-01
EP3065165B1 (en) 2022-12-07
EP4145226A3 (en) 2023-06-21
WO2015064613A1 (ja) 2015-05-07
KR20160078413A (ko) 2016-07-04
EP4145226A2 (en) 2023-03-08
TW202034450A (zh) 2020-09-16
KR102247936B1 (ko) 2021-05-04
KR20210049981A (ko) 2021-05-06
TWI770500B (zh) 2022-07-11
US20180173114A1 (en) 2018-06-21

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