CN105813397A - 一种提高金手指耐腐蚀性的方法 - Google Patents

一种提高金手指耐腐蚀性的方法 Download PDF

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CN105813397A
CN105813397A CN201610225878.4A CN201610225878A CN105813397A CN 105813397 A CN105813397 A CN 105813397A CN 201610225878 A CN201610225878 A CN 201610225878A CN 105813397 A CN105813397 A CN 105813397A
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golden finger
outer lead
welding resistance
electro
optical package
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郝强立
庞立
陈黎阳
乔书晓
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Guangzhou Xingsen Electronic Co Ltd
Shenzhen Fastprint Circuit Tech Co Ltd
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Guangzhou Xingsen Electronic Co Ltd
Shenzhen Fastprint Circuit Tech Co Ltd
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Publication of CN105813397A publication Critical patent/CN105813397A/zh
Priority to PCT/CN2017/078926 priority patent/WO2017177832A1/zh
Priority to US16/092,928 priority patent/US10978599B2/en
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    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/022433—Particular geometry of the grid contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
    • H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
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Abstract

本发明提供一种提高金手指耐腐蚀性的方法，适用于含有金手指的光电板，该光电板的金手指的根部设有导线，该方法依次包括以下步骤：1)电气连接：通过外引线使光电板的所有金手指电气连接；2)阻焊：对外引线以外的区域进行阻焊；3)给金手指镀金；4)蚀刻外引线；5)阻焊：对蚀刻引线后的空位进行阻焊。该方法通过设置外引线将光电板的所有金手指电气连接，可以使金手指的四面全部镀上金，极大程度上提高了金手指的耐腐蚀性。

Description

一种提高金手指耐腐蚀性的方法
技术领域
本发明涉及PCB板加工领域，具体涉及一种提高金手指耐腐蚀性的方法。
背景技术
目前行业内光电板的金手指镀金多数都是通过在金手指的前端设计引线与主导线连接的方式，进而与板边相连以实现电气连接，然后通过手撕引线或湿膜蚀刻的工艺来除去引线。得到的金手指为三面包金，金手指的前端是漏铜的，产品的可靠性较差，无法通过“金手指可以通过MFG(混合腐蚀性气体测试)测试”。
发明内容
为了克服现有技术的不足，本发明的目的在于提供一种提高金手指耐腐蚀性的方法。
为解决上述问题，本发明所采用的技术方案如下：
一种提高金手指耐腐蚀性的方法，适用于含有金手指的光电板，该光电板的金手指的根部设有导线，该方法依次包括以下步骤：
1)电气连接：通过外引线使光电板的所有金手指电气连接；所述外引线设置于导线的两侧；
2)阻焊：对外引线以外的区域进行阻焊；
3)给金手指镀金；
4)蚀刻外引线；
5)阻焊：对蚀刻引线后的空位进行阻焊。
作为优选，步骤1)中，所述光电板的金手指区域设有金属化孔，所述金属化孔内设有内引线。
作为优选，步骤1)中；所述光电板中相邻的金手指通过外引线连接或通过内引线连接。
作为优选，步骤1)中，所述外引线的设置位置距离金手指根部1-10mm。
作为优选，步骤2)中，所述阻焊的具体操作为：对光电板进行阻焊操作，在外引线位置阻焊显影，露出外引线，使外引线位置不盖阻焊。
作为优选，步骤2)中，不盖阻焊的区域比外引线的宽度宽1-10mil。
作为优选，步骤3)中，所述给金手指镀金步骤具体包括以下步骤：
a)进行外层覆干膜，仅露出金手指区域；
b)对金手指镀金；
c)褪去步骤a)的干膜。
作为优选，步骤3)中，采用3-5ASF的电流密度电镀硬金。
作为优选，步骤4)中，所述蚀刻外引线具体包括以下步骤：
i)进行外层覆干膜，外引线位置干膜文件设计开窗；
ii)蚀刻外引线；
iii)褪去步骤i)的干膜。
相比现有技术，本发明的有益效果在于：
本发明提供的提高金手指耐腐蚀性的方法，该方法通过设置外引线将光电板的所有金手指电气连接，可以使金手指的四面全部镀上金，极大程度上提高了金手指的耐腐蚀性；引线设计在导线的两侧，前端无需去除引线，可改善金手指引线残留的缺陷，提高品质。
下面结合附图和具体实施方式对本发明作进一步详细说明。
附图说明
图1为实施例1中步骤1)处理后的光电板的结构示意图；
图1中，各附图标记：1、光电板；2、金手指；3、导线；4、外引线。
具体实施方式
本发明公开一种提高金手指板耐腐蚀性的方法，适用于含有金手指的光电板，如图1所示，该光电板1的金手指2的根部设有导线3，该方法依次包括以下步骤：
1)电气连接：通过外引线4使光电板的所有金手指电气连接；所述外引线设置于导线的两侧；
2)阻焊：对外引线以外的区域进行阻焊；
3)给金手指镀金；
4)蚀刻外引线；
5)阻焊：对蚀刻引线后的空位进行阻焊。
该方法通过设置外引线将光电板的所有金手指电气连接，可以使金手指的四面全部镀上金，极大程度上提高了金手指的耐腐蚀性。本发明中，通过外引线将导线连接，从而使光电板的所有金手指电气连接；步骤2)阻焊是对外引线以外的区域进行阻焊；步骤3)给金手指镀金是指仅对金手指进行镀金；步骤4)蚀刻外引线应该保证其它的位置不受影响；步骤5)阻焊是为了覆盖蚀刻外引线后的留下的空位。
实施例1：
一种提高金手指耐腐蚀性的方法，适用于含有金手指的光电板，如图1所示，光电板的金手指的根部设有导线，该方法包括以下步骤：
1)通过外引线使光电板的所有金手指电气连接；所述外引线设置于导线的两侧；所述外引线的设置位置距离金手指根部1-10mm；
2)进行第一次阻焊操作，外引线位置不盖阻焊，单边开窗比外引线宽1-10mil；
3)进行外层覆干膜，仅露出金手指区域；
4)金手指镀金，褪去步骤3)的干膜；
5)再次进行外层覆干膜，仅露出外引线位置，单边开窗比外引线宽1-10mil；
6)蚀刻外引线，褪去步骤5)的干膜；
7)对蚀刻外引线外的空位进行第二次阻焊操作。
本实施例1的方法，适用于常规类型的光电板，如光电板的金手指区域的设有金属化孔，金属化孔内设有内引线，通过内引线将部分相邻的金手指内层连接，而其它相邻的金手指则通过外引线连接。
本实施例1中，所述外引线的设置于导线的两侧，引线设计在导线的两侧，前端无需去除引线，可改善金手指引线残留的缺陷，提高品质。
本实施例1中，步骤2)中，第一次阻焊操作采用超粗化前处理，以降低阻焊掉落的风险。
上述实施方式仅为本发明的优选实施方式，不能以此来限定本发明保护的范围，本领域的技术人员在本发明的基础上所做的任何非实质性的变化及替换均属于本发明所要求保护的范围。

Claims (9)

1.一种提高金手指耐腐蚀性的方法，适用于含有金手指的光电板，该光电板的金手指的根部设有导线，该方法依次包括以下步骤：
1)电气连接：通过外引线使光电板的所有金手指电气连接；所述外引线设置于导线的两侧；
2)阻焊：对外引线以外的区域进行阻焊；
3)给金手指镀金；
4)蚀刻外引线；
5)阻焊：对蚀刻引线后的空位进行阻焊。
2.如权利要求1所述的方法，其特征在于，步骤1)中，所述光电板的金手指区域设有金属化孔，所述金属化孔内设有内引线。
3.如权利要求2所述的方法，其特征在于，步骤1)中，所述光电板中相邻的金手指通过外引线连接或通过内引线连接。
4.如权利要求1所述的方法，其特征在于，步骤1)中，所述外引线的设置位置距离金手指根部1-10mm。
5.如权利要求1所述的方法，其特征在于，步骤2)中，所述阻焊的具体操作为：对光电板进行阻焊操作，在外引线位置阻焊显影，露出外引线，使外引线位置不盖阻焊。
6.如权利要求5所述的方法，其特征在于，步骤2)中，不盖阻焊的区域比外引线的宽度宽1-10mil。
7.如权利要求1所述的方法，其特征在于，步骤3)中，所述给金手指镀金步骤具体包括以下步骤：
a)进行外层覆干膜，仅露出金手指区域；
b)对金手指镀金；
c)褪去步骤a)的干膜。
8.如权利要求1所述的方法，其特征在于，步骤3)中，采用3-5ASF的电流密度电镀硬金。
9.如权利要求1所述的方法，其特征在于，步骤4)中，所述蚀刻外引线具体包括以下步骤：
i)进行外层覆干膜，外引线位置干膜文件设计开窗；
ii)蚀刻外引线；
iii)褪去步骤i)的干膜。
CN201610225878.4A 2016-04-11 2016-04-11 一种提高金手指耐腐蚀性的方法 Pending CN105813397A (zh)

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US16/092,928 US10978599B2 (en) 2016-04-11 2017-03-31 Method for improving corrosion resistance of gold finger

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017177832A1 (zh) * 2016-04-11 2017-10-19 广州兴森快捷电路科技有限公司 一种提高金手指耐腐蚀性的方法
CN108811318A (zh) * 2018-08-21 2018-11-13 记忆科技(深圳)有限公司 一种金手指引线结构及其加工工艺方法
CN111050491A (zh) * 2019-12-19 2020-04-21 广州兴森快捷电路科技有限公司 无引线四面包金工艺制作方法
CN111417265A (zh) * 2020-05-14 2020-07-14 广德牧泰莱电路技术有限公司 一种包含长短金手指的pcb板制作方法及pcb板
CN114745869A (zh) * 2022-03-31 2022-07-12 广州广合科技股份有限公司 一种带金手指的pcb板的加工方法及pcb板

Families Citing this family (2)

* Cited by examiner, † Cited by third party
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102014579A (zh) * 2010-11-24 2011-04-13 深南电路有限公司 长短金手指的镀金方法
CN102014585A (zh) * 2010-11-24 2011-04-13 深南电路有限公司 长短金手指的镀金工艺
CN102045957A (zh) * 2010-12-28 2011-05-04 深南电路有限公司 等长金手指的镀金方法
CN102045956A (zh) * 2010-12-28 2011-05-04 深南电路有限公司 等长金手指的镀金方法
CN102045960A (zh) * 2010-12-28 2011-05-04 深南电路有限公司 等长金手指的镀金方法
CN105451454A (zh) * 2015-12-14 2016-03-30 谢兴龙 一种镀金手指板的制作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI334320B (en) * 2007-07-16 2010-12-01 Nanya Technology Corp Fabricating method of gold finger of circuit board
CN101643927B (zh) * 2008-08-05 2011-04-20 北大方正集团有限公司 印制线路板金手指的制作方法
CN101699940B (zh) 2009-11-10 2011-07-13 广州兴森快捷电路科技有限公司 一种金手指印制板的制作方法
CN102045963B (zh) 2010-12-28 2012-07-04 深南电路有限公司 等长金手指的镀金方法
CN102271465B (zh) 2011-06-28 2013-01-02 深圳市博敏电子有限公司 一种带电插拔金手指pcb板的制作方法
US9412891B2 (en) * 2012-12-17 2016-08-09 International Business Machines Corporation Thermal receiver for high power solar concentrators and method of assembly
CN203435230U (zh) 2013-09-27 2014-02-12 胜宏科技（惠州）股份有限公司 一种多层印刷电路板镀金手指结构
CN105813397A (zh) 2016-04-11 2016-07-27 广州兴森快捷电路科技有限公司 一种提高金手指耐腐蚀性的方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102014579A (zh) * 2010-11-24 2011-04-13 深南电路有限公司 长短金手指的镀金方法
CN102014585A (zh) * 2010-11-24 2011-04-13 深南电路有限公司 长短金手指的镀金工艺
CN102045957A (zh) * 2010-12-28 2011-05-04 深南电路有限公司 等长金手指的镀金方法
CN102045956A (zh) * 2010-12-28 2011-05-04 深南电路有限公司 等长金手指的镀金方法
CN102045960A (zh) * 2010-12-28 2011-05-04 深南电路有限公司 等长金手指的镀金方法
CN105451454A (zh) * 2015-12-14 2016-03-30 谢兴龙 一种镀金手指板的制作方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017177832A1 (zh) * 2016-04-11 2017-10-19 广州兴森快捷电路科技有限公司 一种提高金手指耐腐蚀性的方法
US10978599B2 (en) 2016-04-11 2021-04-13 Guangzhou Fastprint Circuit Tech Co., Ltd. Method for improving corrosion resistance of gold finger
CN108811318A (zh) * 2018-08-21 2018-11-13 记忆科技(深圳)有限公司 一种金手指引线结构及其加工工艺方法
CN111050491A (zh) * 2019-12-19 2020-04-21 广州兴森快捷电路科技有限公司 无引线四面包金工艺制作方法
CN111050491B (zh) * 2019-12-19 2021-07-20 广州兴森快捷电路科技有限公司 无引线四面包金工艺制作方法
CN111417265A (zh) * 2020-05-14 2020-07-14 广德牧泰莱电路技术有限公司 一种包含长短金手指的pcb板制作方法及pcb板
CN114745869A (zh) * 2022-03-31 2022-07-12 广州广合科技股份有限公司 一种带金手指的pcb板的加工方法及pcb板

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