CN105813389B - A kind of production technology of electric light source integral LED aluminum-based circuit board - Google Patents

A kind of production technology of electric light source integral LED aluminum-based circuit board Download PDF

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Publication number
CN105813389B
CN105813389B CN201610303355.7A CN201610303355A CN105813389B CN 105813389 B CN105813389 B CN 105813389B CN 201610303355 A CN201610303355 A CN 201610303355A CN 105813389 B CN105813389 B CN 105813389B
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China
Prior art keywords
aluminum
aluminium sheet
circuit board
light source
copper
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CN201610303355.7A
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CN105813389A (en
Inventor
楼方寿
楼红卫
郑天德
施跃进
王章荣
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Zhejiang Rochtek Technology Co., Ltd.
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ZHEJIANG LUOQI TAIKE ELECTRONIC Co Ltd
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Priority to CN201610303355.7A priority Critical patent/CN105813389B/en
Publication of CN105813389A publication Critical patent/CN105813389A/en
Priority to PCT/CN2017/073584 priority patent/WO2017193660A1/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789Aqueous acid solution, e.g. for cleaning or etching

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

The present invention relates to a kind of production technologies of electric light source integral LED aluminum-based circuit board, striping → target practice technology hole → circuit on-off test → welding resistance white oil coating → exposure → development → character printing is etched through aluminium sheet list processing → preparation heat-conducting glue → gluing → laminating copper foil lamination → sawing sheet → brill location hole → pre-treatment → line map forms → and solidification → punching → v is cut → anti-oxidation technique → obtain finished product, wherein gluing sprays heat-conducting glue using the heavy curtain that spray knife is formed, it can be mass-produced the aluminium base route of electric light source one by the technique, and the LED and power supply of production all have good thermal diffusivity.

Description

A kind of production technology of electric light source integral LED aluminum-based circuit board
Technical field
The present invention relates to LED light electro-technical field, specifically a kind of electric light source integral LED aluminum-based circuit board Production technology.
Background technique
Pursue it is light and handy, be conveniently the trend of current LED illumination electric appliance, it is intended that have it is a kind of collect power unit and light source in The LED illumination utensil of one, can greatly facilitate routine use.Production aluminum-based circuit board generally include production aluminum-based copper-clad plate and To make aluminum-based circuit board two large divisions based on it, during making aluminum-based copper-clad plate, glue application step is using rolling at present It applies, printing and spraying these types, these types of gluing mode have the disadvantage that
1, roller coating, the thickness of glue are difficult adjustment, became uneven, and speed of production is slower: generally in 3-4m/min or so;
2, it prints, low efficiency, speed are slow, and product size is small, and common product width is in 60cm hereinafter, size cannot be produced Big specification aluminum-based copper-clad plate as 1m*2m;
3, curtain is sprayed, product can spray very uniform, can also produce large-sized plates, but a large amount of colloidal substances are drifted in air ring Border in addition to seriously affecting environment, and largely wastes raw material.
Moreover, copper-clad plate plate is in gluing process, if there are dust or the bad situation of flatness in surface, to rolling It applies and printing technology all has an impact, such as tend to have gap between heat-conducting glue and aluminium sheet, copper foil, the problems such as adhesive force is not strong occur, To influence the quality of aluminum-based copper-clad plate.
On the other hand, integrate at present power unit and light source there are two types of ways, one of way is in aluminium base Driving power is partially disposed within LED circuit of light sources directly in a manner of patch on wiring board, is driven in a manner of AC-AC Dynamic, this mode LED has scintillation, and is influenced by factors such as line surges, and driving chip easily damages, LED The stability of lamps and lanterns is severely impacted.Another way is with FR4 the or CEM-1 plate for milling (or made with punching machine) size Make substrate, be mounted on the aluminium sheet for milling (or made) same size, then apply layer of cloth, is covered with copper foil plate and presses, then into The shortcomings that processing of row line plate, is made power light source integral LED lamp, this method is machined to this height, production effect Rate is very low, can only manufacture on a small quantity, can not large-scale production;And when pressing, generated when being cut due to substrate and aluminium sheet itself Thickness error, substrate are embedded in the dust generated when the error and punching that occur on aluminium sheet and fall on aluminium sheet, these factors The combination that insulating layer and copper foil, aluminium sheet will be seriously affected eventually affects the peel strength of product, insulating properties and thermally conductive Property.
Summary of the invention
The present invention provides a kind of production technologies of electric light source integral LED aluminum-based circuit board, can be large quantities of by the technique Amount production aluminium base route, and the LED and power supply that make all have good thermal diffusivity.
The present invention is achieved by the following technical solutions: a kind of production work of electric light source integral LED aluminum-based circuit board Skill, production including aluminum-based copper-clad plate and makes aluminum-based circuit board based on aluminum-based copper-clad plate, comprising the following steps:
(1) aluminium sheet list processing: aluminium substrate plate 0.2-1.5mm washes drying after processing, is prepared into aluminium base bottom plate;
(2) heat-conducting glue is prepared;
(3) spray heat-conducting glue: using spray knife spraying technology directly by heat-conducting glue spray on aluminium sheet, the aluminium sheet sprayed is put It is toasted in continuous tunnel furnace, and controls the gel time of semi-cured state at heat-conducting glue at 50-70 seconds;Using spray knife spraying technology, Existing several gluing mode bring defects are solved, what high pressure spray knife sprayed thereunder is heavy curtain, can be equably to wiring board Gluing is carried out, and saves ink or glue, operating rate is fast, can go to 20-25 meters per minute, labor efficiency is at geometric multiple Growth.
(4) laminating copper foil: will be layered on the aluminium sheet of the conductive adhesive film coated with a thickness of the copper foil of 0.018-0.072mm, And laminated, shear forming, obtain aluminum-based copper-clad plate;
(5) sawing sheet, brill location hole, pre-treatment;
(6) line map forms: aluminium face is printed first, and the ink material of printing is all light curable type, the scraper pressure of aluminium face printing Power is 2.5-3.5kg, and aluminium face light energy reaches 900-1000mJ;Then copper face prints, and the scraper pressure of copper face printing is 1.8-2.5kg, copper face figure are 650-800 mJ;
(7) it etches striping: behind aluminium face and copper face printing molding, being put into acid medical fluid and be etched striping, liquid concentration Beryllium value 1.19-1.21, fluid temperature are 35-45 DEG C, carry out punching after striping again and pour, hydraulic pressure control is 2.4-3.6kg's or more High pressure water pours, and punching is poured the time and reached 20 seconds or more;
(8) target practice technology hole, circuit on-off test;
(9) coating of welding resistance white oil;
(10) it exposes;
(11) develop;
(12) character printing and solidification;
(13) punching;
(14) v is cut;
(15) anti-oxidation technique: aluminum-based circuit board is obtained.
Further, step (1) the aluminium sheet list processing method particularly includes: the aluminium sheet a, is immersed in 10%- 12%, the alkaline etching slot that temperature is 56-60 ° is handled 3.5-4.5 minutes, and the good aluminium sheet of b, alkaline etching is steeped after washing in nitric acid content It is handled 2-3 minutes for the neutralization chamber of 10%-12%, further removes surface of aluminum plate residue, c, the aluminium sheet handled well washing Drying.
Further, the thickness of the heat-conducting glue in step (3) is sprayed at 400 μm or more by the thickness adjustment of heat-conducting glue Number, for each coating thickness between 50um-150um, the aluminium sheet sprayed puts condition of the continuous tunnel furnace at 140 DEG C -150 DEG C Under, it toasts 4-6 minutes.
Further, one layer of prepreg of coating, then laminating copper foil are added after spraying heat-conducting glue, prepreg uses glass Cloth, thermal coefficient is 1 or more.
Further, in step (4), typesetted composite aluminum substrate is first transferred to press heating, pressurization, vacuumizes pressure It closes, aluminium sheet, conductive adhesive film, copper foil is made to combine, then the good aluminum substrate of hot pressing is transferred to cold press cooling.
Further, in the step (5), aluminum-based copper-clad plate is heated by drying tunnel budget, drying tunnel temperature parameter is 160-180 DEG C, transmission speed was at 3.5-4M/ minutes.
Further, in step (10), the film ink sheet of a 0.1-0.15mm thickness is padded in this face of aluminium face.
Further, step (11) is developed, and using sodium carbonate liquor, concentration is 0.8-1.2%, and speed 3.2m-4m/ divides Clock, pressure 1.8-2.4kg, it is 2.5-3.5kg that power is sprayed under cleaning, and hot wind knife pressure is 2.0-3.0kg.
This invention takes above-mentioned corrective measure progress, its advantages are significant: the present invention, which can be mass-produced, collects electric light Source one aluminum-based circuit board, changes the traditional form of wiring board, is implanted into new function for wiring board, forgoing, it is recessed to open up in aluminium sheet Slot inlays FR4 or CEM-1 plate again, falls ash when no processing, and copper foil adhesive force is strong, and product has high-termal conductivity, high pressure resistant Property, thermal diffusivity it is good, thus it is possible to vary the assembling structure of the indoor and outdoor lightings lamps and lanterns such as current LED downlight, shot-light, flat lamp has energy conservation Consumption reduction, section Zhi Zengxiao feature, also change the traditional method of LED power, light source separation, can greatly facilitate lamps and lanterns manufacturer Production and transport and user of service's installs and uses.
Detailed description of the invention
Fig. 1 is the production technology block diagram of aluminum-based copper-clad plate of the present invention;
Fig. 2 is the block diagram for producing aluminum-based circuit board.
Specific embodiment
Below against attached drawing, the present invention is further illustrated in conjunction with the embodiments:
Shown in reference picture 1, Fig. 2, a kind of production technology of electric light source integral LED aluminum-based circuit board generally includes to make Aluminum-based copper-clad plate and to make aluminum-based circuit board two large divisions based on it, step includes:
(1) aluminium sheet list processing: the aluminium sheet a, is immersed in 10%-12%, the alkaline etching slot that temperature is 56-60 ° is handled 3.5-4.5 minutes, the good aluminium sheet of b, alkaline etching steeps after washing handled 2-3 points in the neutralization chamber that nitric acid content is 10%-12% Clock further removes surface of aluminum plate residue, c, the aluminium sheet handled well washing drying.
(2) heat-conducting glue is prepared: 901 resins for being 15% by mass percent, 3% 295 resins, 6.7% 128 trees Rouge, 3.2% plasticiser, 0.57% dicyandiamide, 1.2% DDS curing agent, 0.19% levelling agent, 0.47% coupling Agent, 0.07% catalyst, 15.6% DMF solvent is uniformly mixed, and after continuously stirring 30-40 minutes, is stood 1-3 hours and is made Obtain epoxy resin intermixture;It is that 54% aluminium oxide and 46% epoxy resin intermixture are uniformly mixed by mass percent, stirs After mixing 2-3 hours, through ball-milling treatment, be distributed filler and resin homogeneously, then after being cleaned it is stand-by.
(3) heat-conducting glue is sprayed: using spray knife spraying technology directly by heat-conducting glue spray on aluminium sheet, by the thickness of heat-conducting glue The number of spraying is adjusted, each coating thickness, can be by adjusting spraying transmission speed and glue pump between 50um-150um The film thickness that motor frequency conversion is required, the aluminium sheet sprayed put continuous tunnel furnace under conditions of 140 DEG C -150 DEG C, and 4-6 points of baking Clock, and control the gel time of semi-cured state at heat-conducting glue at 50-70 seconds;
After spraying heat-conducting glue plus it can be coated with one layer of prepreg, then laminating copper foil, prepreg uses glass cloth, thermally conductive Coefficient is 1 or more.
(4) laminating copper foil: will be layered on the aluminium sheet of the conductive adhesive film coated with a thickness of the copper foil of 0.018-0.072mm, Typesetted composite aluminum substrate is first transferred to press heating, pressurization, vacuumizes pressing, aluminium sheet, conductive adhesive film, copper foil is made to combine one It rises, technological parameter needed for pressing is that (a) initial temperature is 180 DEG C, is warming up to 185 DEG C, and pressurize 50kgf, (b) keeps the temperature 185 DEG C and adds It is pressed onto 70kgf, the time is 2 minutes, (c) keeps the temperature 185 DEG C and is pressurized to 120kgf, and the time is 7 minutes, (d) keeps the temperature 185 DEG C and is pressurized to 180kgf, time are 17 minutes, (e) keep the temperature 185 DEG C and are forced into 200kgf, press 20 minutes, (f) be warming up to 210 DEG C by 185 °, Time is 5 minutes, and pressure increases to 250kgf, (h) keeps the temperature 210 DEG C, and pressure presses 22 minutes under conditions of being 250kgf, (i) rises Temperature to 215 DEG C the heating-up time 5 minutes, pressure increase to 280kgf presses 50 minutes, (j) cools to 180 DEG C by 215 °, and the time is 6 minutes, pressure was reduced to 50kgf, (k) was cooled to 150 DEG C, and the time is 4 minutes, and pressure is reduced to 4Kgf, and hot pressing is completed;Hot pressing is good Aluminum substrate be transferred to that cold press is cooling, and pressure 100kgf, cooling time is 100 minutes.
(5) sawing sheet, brill location hole, pre-treatment: sawing sheet, since the characteristic of this material is that aluminium layer is relatively thin, dielectric layer is thicker Toughness reduces, and can only use shearing bed cutting.It is heated before cutting by drying tunnel budget, and drying tunnel temperature parameter is 160-180 DEG C, transmission speed was at 3.5-4M/ minutes, primarily to the heat effect toughening of dielectric layer, the layering side for reducing section is split not It is good.Effective back gauge, which is arranged, reaches 2.5mm-3.5mm simultaneously, it is ensured that after etching, the frame after edging is in rear process die cut edge The integrality of frame reduces frame fracture and falls into punch die in the indentation bad of generation;Working plate after sawing sheet first cleans, drying Processing.Main purpose be prevent plate bits etc foreign matter there are gaps among lamination, reuse the dedicated wolfram steel of aluminum substrate Or diamond cutter drills;Do again and require before line pattern to remove oxidation processes by cleaning, with 98 ﹪ concentration sulfuric acid proportion at The aqueous sulfuric acid of the concentration of volume ratio 2-3 ﹪ can make copper face and aluminium face obtain oxidation removal simultaneously, throw brush rumble brush up and down Mesh however it is same, upper brush is in 350 mesh or so, and polishing scratch is in 12-15MM, and in 500 mesh, polishing scratch exists lower brush in 6-9MM, drying temperature 60-70 DEG C of can guarantee that copper face and aluminium face are clean in this way, and the binding force of ink is made to reach requirement.
(6) line map forms: aluminium face is printed first, and the ink material of printing is all light curable type, the scraper pressure of aluminium face printing Power is 2.5-3.5kg, and aluminium face light energy reaches 900-1000mJ, then solidifies through UV;Then copper face prints, and copper face printing is scraped Knife pressure is 1.8-2.5kg, and copper face figure is 650-800mJ, then is solidified through UV.
(7) it etches striping: behind aluminium face and copper face printing molding, being put into acid medical fluid and be etched striping, liquid concentration Beryllium value 1.19-1.21, fluid temperature are 35-45 DEG C, carry out punching after striping again and pour, hydraulic pressure control is 2.4-3.6kg's or more High pressure water pours, and punching is poured the time and reached 20 seconds or more.
(8) target practice technology hole, circuit on-off test.
(9) coating of welding resistance white oil: coating and printing clean will be handled, and chemical solution dilute sulfuric acid concentration is controlled in 3- 5%, can guarantee the effect of copper face and aluminium face, the throwing brush fiber brush and mesh number of copper face, wear scar width in technique as single sided board, No longer describe.It is to be exposed after being dried after white oil coating etc..
(10) it exposes: because dielectric layer is thin, and being translucent, so a 0.1-0.15mm thickness must be padded in this face of aluminium face Film ink sheet, prevent the phenomenon that upper and lower frames are with when exposing, having when exposure influences development effect to Exposing Lamp scattering process.
(11) develop: using sodium carbonate liquor.Concentration is 0.8-1.2%.Speed 3.2m-4m/ minutes, pressure 1.8- 2.4kg.Because there is hollow out in aluminium face, so 2.5-3.5kg will be increased to by spraying power under cleaning, hot wind knife pressure will reach 2.0- 3.0kg enables moisture to dispel complete drying, prevents moisture from dissolving in interlayer and aluminium base.
(12) character printing and solidification: requirement needed for character printing is different, some are element identifiers, some are trade mark types Number.Because of aluminium face, some are uneven, and hollow part character can not be completed by printing, so by Trademark design on aluminium face, and other All component symbol designs white oil face preferably.The working plate for printing character will be in the item of 45 minutes time of 150 DEG C of temperature Heat cure under part.
(13) punching: 1, digital control hole drilling is mainly the first platinum aperture for boring driving plate, and drilling speed will be adjusted, and parameter is 3-4 Ten thousand brills are advisable;2, aperture and shape are once completed with punching machine, white oil can be completed down.
(14) v is cut.
(15) anti-oxidation technique: using concentration for the hydrogen peroxide of 5-6%, sulfuric acid concentration 4-5%, reduces to aluminium base Microetch damage.2.5-3.5kg will be increased to by spraying power under anti-oxidation rear cleaning, and hot wind knife pressure will reach 2.0- 3.0kg, enables moisture to dispel complete drying, and temperature controls between 65-80 degree.
The above list is only specific embodiments of the present invention, it is clear that present invention is not limited to the above embodiments, this field All deformations that those of ordinary skill directly can export or associate from present disclosure, should belong to guarantor of the invention Protect range.

Claims (6)

1. a kind of production technology of electric light source integral LED aluminum-based circuit board, production including aluminum-based copper-clad plate and it is based on aluminium Base copper-clad plate makes aluminum-based circuit board, which comprises the following steps:
(1) surface of aluminum plate is handled: aluminium substrate plate 0.2-1.5mm washes drying after processing, is prepared into aluminium base bottom plate;
(2) heat-conducting glue is prepared;
(3) spray heat-conducting glue: using spray knife spraying technology directly by heat-conducting glue spray on aluminium sheet, the aluminium sheet sprayed puts tunnel It is toasted in furnace, and controls the gel time of semi-cured state at heat-conducting glue at 50-70 seconds;
(4) laminating copper foil: it will be layered on the aluminium sheet of the conductive adhesive film coated, and pass through with a thickness of the copper foil of 0.018-0.072mm Lamination, shear forming, obtain aluminum-based copper-clad plate;
(5) sawing sheet, brill location hole, pre-treatment;
(6) line map forms: aluminium sheet face is printed first, and the ink material of printing is all light curable type, and aluminium sheet face light consolidates energy hole In 900-1000mj;Then copper-clad surface line pattern prints, and copper-clad surface light consolidates energy hole in 650-800mj;
(7) it etches striping: behind aluminium sheet face and copper-clad surface printing forming and hardening, being etched, striping, carry out surface after striping again Cleaning, drying, in 2.4-3.6kg, washing time reaches 20 seconds or more surface clean hydraulic pressure control;
(8) target practice technology hole, circuit on-off test;
(9) coating of welding resistance white oil;
(10) it exposes;
(11) develop;
(12) character printing and solidification;
(13) punching;
(14) v is cut;
(15) anti-oxidation technique: aluminum-based circuit board is obtained;
The thickness of heat-conducting glue in step (3), by the number of the thickness adjustment spraying of heat-conducting glue, sprays every time at 300 μm or more Continuous tunnel furnace is put under conditions of 140 DEG C -150 DEG C with a thickness of the aluminium sheet between 50um-150um, sprayed, is toasted 4-6 minutes;
Step (11) development, using sodium carbonate liquor, concentration is 0.8-1.2%, speed 3.2mm-4mm/ minutes, pressure 1.8- 2.4kg, it is 2.5-3.5kg that power is sprayed under cleaning, and hot wind knife pressure is 2.0-3.0kg.
2. the production technology of electric light source integral LED aluminum-based circuit board according to claim 1, which is characterized in that described The processing of step (1) surface of aluminum plate method particularly includes: the aluminium sheet a, is immersed in 10%-12%, the alkaline etching slot that temperature is 56-60 ° Processing 3.5-4.5 minutes, the good aluminium sheet of b, alkaline etching steeps after washing handles 2-3 points in the neutralization chamber that nitric acid content is 10%-12% Clock further removes surface of aluminum plate residue, c, the aluminium sheet handled well washing drying.
3. the production technology of electric light source integral LED aluminum-based circuit board according to claim 1, which is characterized in that spraying After painting heat-conducting glue plus one layer of prepreg, then laminating copper foil are covered, prepreg uses glass cloth, and thermal coefficient is in 1W/mk or more.
4. the production technology of electric light source integral LED aluminum-based circuit board according to claim 1, which is characterized in that step (4) in, typesetted composite aluminum substrate is first transferred to press heating, pressurization, pressing is vacuumized, makes aluminium sheet, conductive adhesive film, copper foil It combines, then the good aluminum substrate of hot pressing is transferred to cold press cooling.
5. the production technology of electric light source integral LED aluminum-based circuit board according to claim 1, which is characterized in that described In step (5), aluminum-based copper-clad plate is heated by drying tunnel budget, drying tunnel temperature parameter is 160-180 DEG C, and transmission speed exists 3.5-4M/ minute.
6. the production technology of electric light source integral LED aluminum-based circuit board according to claim 1, which is characterized in that step (10) in, in the film ink sheet of aluminium sheet face pad 0.1-0.15mm thickness, route welding resistance is exposed.
CN201610303355.7A 2016-05-10 2016-05-10 A kind of production technology of electric light source integral LED aluminum-based circuit board Active CN105813389B (en)

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PCT/CN2017/073584 WO2017193660A1 (en) 2016-05-10 2017-02-15 Method for manufacturing metal led circuit board integrating power and light sources

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