CN102523700B - Method for burying and plugging holes on HDI (high-density interconnection) circuit boards - Google Patents
Method for burying and plugging holes on HDI (high-density interconnection) circuit boards Download PDFInfo
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- CN102523700B CN102523700B CN201110437166.6A CN201110437166A CN102523700B CN 102523700 B CN102523700 B CN 102523700B CN 201110437166 A CN201110437166 A CN 201110437166A CN 102523700 B CN102523700 B CN 102523700B
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Abstract
The invention belongs to the technical field of manufacturing circuit boards, relates to a burying and plugging process of HDI (high-density interconnection) circuit boards, in particular to a method for burying and plugging holes on the HDI circuit boards. The method for burying and plugging holes on the HDI circuit boards aims to solve the problems that brownification and press are generally performed after baking of buried and plugged holes in the existing process of burying and plugging holes on the HDI circuit boards so that performance of the PCBs is affected due to the fact that resin ink has a water absorption function during brownification and press, and includes: a, the brownification step of the HDI circuit boards distributed with wires; b, the step of hole burying and plugging by a screen printer; c, the process step of resin ink on the holes and d, the baking step. By the aid of the technical scheme, the above technical problems can be solved effectively.
Description
Technical field
The invention belongs to wiring board manufacturing technology field, what relate to HDI wiring board buries plug processing procedure, is specifically related to a kind of method of burying consent on HDI wiring board.
Background technology
After circuit board line, consent is a kind of method of HDI circuit board manufacturing process, and what plug buried act as the phenomenon such as the plate starved after preventing pressing, depression and layering occurs, and reduces to scrap risk after pressing, and saves time, saves money.
As an example, existing HDI wiring board to bury blocking method processing step substantially as follows: the plate after copper facing directly uses screen-printing machine consent; Toast after consent; 6 axle grinder grinding 1-2 time is re-used after having toasted; Circuit is made, then normal pressing after grinding.
Also namely brown pressing is generally carry out after burying consent baking, and the drawback done like this is that the resin ink burying plug exists water sorption when brown pressing and affects the performance of PCB.
Summary of the invention
Technical problem to be solved by this invention be existing HDI wiring board to bury in the technique of consent general brown pressing is arranged in bury consent baking after, there is water sorption due to the resin ink that buries plug when brown pressing and affect the problem of PCB performance, and provide a kind of method of burying consent on HDI wiring board for this problem, comprising:
A, the HDI wiring board having crossed line is carried out to the step of brown;
B, bury the step of consent with screen-printing machine;
C, treatment step to the resin ink on hole;
The step of d, baking.
Before the step (being also a step) of the HDI wiring board having crossed line being carried out to brown is arranged in and buries consent step (being also b step) by the present invention, except HDI PCB surface roughness can be increased, outside the adhesion of increase copper face and PP, can not the problems referred to above be produced, the final quality of HDI wiring board also almost not affected simultaneously.
What is more important, existing HDI wiring board described in background technology part buries the technique of consent generally containing grinding process, except the existing HDI wiring board described in background technology part buries except the technique of consent, nearest Chinese patent application the method and system of buried via hole consent " on a kind of circuit board " (application number 200910088289.6) also discloses a kind of method of the consent of buried via hole on circuit boards, the method comprises aims at the lower ink dot of the consent web plate in consent screen-printing machine with the hole on described circuit board, then rabbet ink is filled in hole, toast subsequently, grinding, this patent application changes buried via hole consent by manually-operated traditional mode, improve production efficiency and the stability of product to a certain extent.
But, the existence of grinding steps can make the production time of whole HDI wiring board be difficult to shorten, in addition, the maintenance cost of milling apparatus often higher (such as the maintenance of brushing wheel), cause the production cost of HDI wiring board to be difficult to decline, in production practices, solve the above-mentioned needs by grinding process institute elicitation technique problem although have, but directly grinding process itself is improved, be often difficult to prove effective.
The present invention finds, if the step (being also a step) of the HDI wiring board having crossed line being carried out to brown is arranged in before burying consent step (being also b step), the technology of alternative grinding process then at least can be made to be intended to have the possibility of realization, such as, the present invention just achieves this technology intention: described step c adopts and processes the resin ink on hole the mode that resin ink flattens.
Resin ink is flattened and does not need to use grinder, before baking procedure, resin ink is flattened on HDI wiring board, reaches the degree that hole is filled up, after ensureing baking procedure, follow-up to the interlayer quality after HDI circuit board pressing.
The present invention finds to adopt leveling fashion to replace grinding process at least to there is following technique effect:
The first, along with electronic product is towards light, thin, little trend development, a large amount of uses of grinder, make the thickness of HDI wiring board more and more thinner.Prior art grinder grinds resin ink, also namely directly the resin ink on HDI circuit plate hole is ground with the brushing wheel on grinder, as mentioned previously, grinder price is more expensive, grinding can cause the consumption of brushing wheel on grinder, thus the cost of consent on HDI wiring board is improved.
Resin ink on HDI circuit plate hole is flattened, the quality of HDI wiring board can be ensured, in fact, on HDI wiring board, the resin quantity of ink of consent is quite limited, only leave very fritter area, very rare ink in HDI wiring board plate face after leveling, this there is no impact to the thickness of whole HDI wiring board.
Although second, grinder can the resin ink that overflows from HDI circuit plate hole of bald spot, make overall HDI wiring board thinning, but easily cause extra risk, namely overgrinding will make that HDI copper surface of circuit board is partially thin so that base material is exposed, grinding then causes HDI wiring board rate best in quality to decline not, and this risk is uncontrollable often owing to cannot accomplish accurately to grind.
Of the present invention resin ink on hole to be flattened, do not need to flatten for the hole on each HDI wiring board, but whole HDI wiring board is carried out flattening, thus, be controlled to the quality of HDI wiring board, there is not risk.
Three, the leveling fashion that the present invention adopts has great lifting compared to the efficiency of grinding, and from second point, grinding is often carried out a hole or multiple hole, and leveling is that whole HDI wiring board once completes.
The present invention further have employed following technical scheme:
B step comprises: frame aeroscopic plate also adjusts aeroscopic plate, makes it to merge with the screen-printing machine web plate kissing locked to be fixed on screen-printing machine table top;
Aeroscopic plate is fixed PIN nail, HDI circuit grillage is nailed at aeroscopic plate PIN, use screen-printing machine table top contraposition fine setting, HDI wiring board and screen-printing machine web plate are matched;
The scraper angle of screen-printing machine scraper is adjusted to 0-15 °, consent is buried to HDI wiring board;
Described screen-printing machine scraper pressure is adjusted to 5-8 Kg/cm
2, gait of march controls at 2-4 lattice;
Described step c comprises and is arranged on manual film laminator by the PE diaphragm of dry film, flattens HDI wiring board;
The air pressure of manual film laminator is 4-6Kg/cm2, and temperature is 17 DEG C-23 DEG C, and speed is 2-3m/min;
Baking described in Step d is bay baking;
Baking condition in described Step d is 140 DEG C-160 DEG C, and baking time is 25min-35min.
Accompanying drawing explanation
Fig. 1 is a kind of flow chart burying the method for consent on HDI wiring board described in embodiment.
Embodiment
On a kind of basis of burying the method for consent on HDI wiring board adopting summary of the invention introduction, this part is not given to this part the technical scheme disclosed in detail and is introduced in detail.
The present invention is optimized each step involved by a kind of disclosed method of burying consent on HDI wiring board:
For b step, it comprises: frame aeroscopic plate also adjusts aeroscopic plate, makes it to merge with the screen-printing machine web plate kissing locked to be fixed on screen-printing machine table top;
Aeroscopic plate is fixed PIN nail, HDI circuit grillage is nailed at aeroscopic plate PIN, use screen-printing machine table top contraposition fine setting, HDI wiring board and screen-printing machine web plate are matched;
The scraper angle of screen-printing machine scraper is adjusted to 0-15 °, consent is buried to HDI wiring board.This kind of angular range can make to bury consent active force and roughly just push away, and improves and buries consent effect.
Further, the scraper pressure of screen-printing machine can be adjusted to 5-8kg/cm
2, gait of march controls at 2-4 lattice, in fact, after arranging and bury consent, does not have light leakage phenomenon occur and bury consent plumpness between 70%-110% after follow-up baking according to above-mentioned parameter.
As described in summary of the invention; carry out smoothly can producing corresponding technique effect to the resin ink on hole; and the equipment specifically implementing flattening operation can be manual film laminator; this cost of equipment maintenance is low; the PE diaphragm used can be the dry film PE using circuit processing procedure to use; facts have proved, the dry film PE using circuit processing procedure to use can not affect quality, thus can reduce costs further.
Further, the air pressure of manual film laminator can be set to 4-6Kg/cm2, temperature is set to 17 DEG C-23 DEG C, and speed is set to 2-3m/min.
For Step d, the baking condition in described Step d is 140 DEG C-160 DEG C, and baking time is 25min-35min.
Certainly, should avoid destroying brown layer in practical operation and affect the pressing reliability of PCB, one of them counter-measure makes the baking described in Step d be bay baking.
Embodiment
Manual film laminator described in the present embodiment and screen-printing machine are conventional equipment, and the web plate that wherein screen-printing machine uses is aluminum web plate.
A method for consent in the circuit board, comprising:
1., the HDI wiring board having crossed line is carried out to the step of brown pressing;
2. the step of consent, is buried with screen-printing machine;
3., to the step that the resin ink on hole flattens;
4., the step of baking.
Wherein 1. step conventionally operates, and no longer illustrates here, and 2. step comprises:
1. confirm that whether aluminium flake web plate is consistent with the multiplying power of wiring board, whether whether inspection aluminium flake web plate meets the requirements (such as aluminium flake web plate surface jagged, pollutant, stopple etc.);
2. the good aluminium flake web plate of smooth frame also pins web plate;
3. frame general-purpose aeroscopic plate adjust aeroscopic plate, makes it to merge with aluminium flake web plate kissing to be fixed on screen-printing machine table top;
4. use two-sided PIN nail on general-purpose aeroscopic plate, planted PIN and followed closely and fix PIN nail;
5. nail at the PIN of aeroscopic plate with the HDI circuit grillage burying plug corresponding to aluminium flake web plate, use screen-printing machine table top contraposition fine setting, adjust the contraposition of HDI wiring board and web plate, make it to match with aluminium flake web plate;
6. the scraper pressure of screen-printing machine is adjusted at 7kg/cm
2, scraper angle is adjusted to 10 °, and gait of march controls at 3 lattice, carries out burying consent.
Carry out examination plug by parameter described in 6 steps, under the prerequisite adjusting contraposition, the inclined ﹑ of resin ink uncork burying plug leaks the situations such as plug (wiring board that the thickness for wiring board is less than 0.7mm can have single-point printing opacity) ﹑ overfill and occurs.
3. step comprises:
The PE diaphragm of dry film is arranged on manual film laminator, allows manual film laminator connect source of the gas, and open manual film laminator total power switch, open film laminator fuselage starting switch, HDI wiring board is flattened.
The setting parameter of leveling is: manual film laminator air pressure is transferred to 4Kg/cm2; temperature is set as 20 DEG C, and speed is transferred to 3m/min, carries out visual to leveling HDI wiring board; smooth, the concrete behaviour that the described PE diaphragm by dry film is arranged on manual film laminator in addition can be:
Pull down manual film laminator carriage, cleaning roller, taken off by one end lock tube on PE film axle, PE film is put on, is loaded on lock tube, two ends lock tube tightens a little; Both hands are held with a firm grip PE film axle two ends, make PE film expansion direction in a clockwise direction, take on upper pedestal by PE film axle, aim at left end bayonet socket and firmly extrude left, right-hand member is aimed at simultaneously, and then unclamps hand, load axle PE film by the method loading onto axle PE film, lower shaft PE film expansion direction is counterclockwise;
Upper axle PE film is moved to centre position, and locking two ends lock tube, rotates ruler above and writes down scale value to PE film edge, then following ruler is turned on PE film and to align upper and lower PE film and lock two ends according to upper axle PE film scale;
Upper and lower PE film strips is crossed other one side, and on the following roller that the head of film is overturn, head is above received on a roller above, these 4 rollers is unanimously rotated, reaches the object of folding and unfolding.
4. step comprises:
HDI wiring board after leveling is put into oven cooking cycle, and baking condition is 150 DEG C, baking 30min.
In order to avoid destroying brown layer, cause because adhesion is bad and plate bursting after pressing, in 1. step to 2. this process of step, should be noted that the action of taking and placing HDI wiring board, anti-oxidation gloves must be worn by plate, handle with care, the baking in addition 4. in step is bay baking.
The HDI wiring board finally obtained, confirm through section, burying consent plumpness is 100%.
Claims (4)
1. on HDI wiring board, bury a method for consent, comprising: a, the HDI wiring board having crossed line is carried out to the step of brown; B, bury the step of consent with screen-printing machine; C, treatment step to the resin ink on hole; The step of d, baking; Wherein, b step comprises: frame aeroscopic plate also adjusts aeroscopic plate, makes it to merge with the screen-printing machine web plate kissing locked to be fixed on screen-printing machine table top; Aeroscopic plate is fixed PIN nail, HDI circuit grillage is nailed at aeroscopic plate PIN, use screen-printing machine table top contraposition fine setting, HDI wiring board and screen-printing machine web plate are matched; Described step c adopts and processes the resin ink on hole the mode that resin ink flattens; Described step c comprises and is arranged on manual film laminator by the PE diaphragm of dry film, flattens HDI wiring board; Described b step also comprises the scraper angle of screen-printing machine scraper is adjusted to 0-15 °, buries consent to HDI wiring board; Described screen-printing machine scraper pressure is adjusted to 5-8 Kg/cm
2, gait of march controls at 2-4 lattice.
2. a kind of method of burying consent on HDI wiring board according to claim 1, is characterized in that: the air pressure of manual film laminator is 4-6Kg/cm2, and temperature is 17 DEG C-23 DEG C, and speed is 2-3m/min.
3. a kind of method of burying consent on HDI wiring board according to claim 1 and 2, is characterized in that: baking described in Step d is bay baking.
4. a kind of method of burying consent on HDI wiring board according to claim 1 and 2, it is characterized in that: the baking condition in described Step d is 140 DEG C-160 DEG C, baking time is 25min-35min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110437166.6A CN102523700B (en) | 2011-12-23 | 2011-12-23 | Method for burying and plugging holes on HDI (high-density interconnection) circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110437166.6A CN102523700B (en) | 2011-12-23 | 2011-12-23 | Method for burying and plugging holes on HDI (high-density interconnection) circuit boards |
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| Publication Number | Publication Date |
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| CN102523700A CN102523700A (en) | 2012-06-27 |
| CN102523700B true CN102523700B (en) | 2015-05-27 |
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| CN201110437166.6A Active CN102523700B (en) | 2011-12-23 | 2011-12-23 | Method for burying and plugging holes on HDI (high-density interconnection) circuit boards |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411108B (en) * | 2014-11-24 | 2017-07-07 | 东莞康源电子有限公司 | The preparation method of solder mask wiring board |
| CN105263268A (en) * | 2015-11-03 | 2016-01-20 | 胜宏科技（惠州）股份有限公司 | Resistance-welding hole filling device and resistance-welding processing method |
| CN107835590A (en) * | 2017-10-18 | 2018-03-23 | 深圳市景旺电子股份有限公司 | A kind of preparation method of buried via hole circuit board |
| CN111093330A (en) * | 2020-01-06 | 2020-05-01 | 东莞市五株电子科技有限公司 | Method for plugging buried hole with resin in circuit board |
| CN113766751B (en) * | 2021-09-28 | 2023-03-14 | 信利半导体有限公司 | Compound screen plate for plugging holes and manufacturing process thereof |
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| CN101478862A (en) * | 2008-11-29 | 2009-07-08 | 鸿源科技（杭州）有限公司 | Process for blind hole, buried hole, and filled hole of multi-layered high density interconnected printed circuit board |
| CN101720167A (en) * | 2009-11-20 | 2010-06-02 | 深圳崇达多层线路板有限公司 | Method for producing circuit board by filling resin in holes on inner core plate |
| CN101772280A (en) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | Mesh screen plughole process method |
| CN101959372A (en) * | 2010-05-24 | 2011-01-26 | 大连太平洋多层线路板有限公司 | Super-thick copper circuit board solder resisting processing method |
| CN102248738A (en) * | 2011-04-25 | 2011-11-23 | 衢州威盛精密电子科技有限公司 | Liquid pore-filling vacuum stitching process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2006076609A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101478862A (en) * | 2008-11-29 | 2009-07-08 | 鸿源科技（杭州）有限公司 | Process for blind hole, buried hole, and filled hole of multi-layered high density interconnected printed circuit board |
| CN101720167A (en) * | 2009-11-20 | 2010-06-02 | 深圳崇达多层线路板有限公司 | Method for producing circuit board by filling resin in holes on inner core plate |
| CN101772280A (en) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | Mesh screen plughole process method |
| CN101959372A (en) * | 2010-05-24 | 2011-01-26 | 大连太平洋多层线路板有限公司 | Super-thick copper circuit board solder resisting processing method |
| CN102248738A (en) * | 2011-04-25 | 2011-11-23 | 衢州威盛精密电子科技有限公司 | Liquid pore-filling vacuum stitching process |
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