CN105764241A - Method for testing alignment of printed board product - Google Patents
Method for testing alignment of printed board product Download PDFInfo
- Publication number
- CN105764241A CN105764241A CN201610171700.6A CN201610171700A CN105764241A CN 105764241 A CN105764241 A CN 105764241A CN 201610171700 A CN201610171700 A CN 201610171700A CN 105764241 A CN105764241 A CN 105764241A
- Authority
- CN
- China
- Prior art keywords
- printed board
- board product
- aligning degree
- testing
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/003—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring position, not involving coordinate determination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention relates to a method for testing the alignment of a printed board product. The method is high in operating efficiency, low in cost, and good in practicality and comprises a step 1 of arranging a drill hole testing strip and an alignment testing strip on each of four corners of the process sides of the printed board product, wherein each of the drill hole testing strip and the alignment testing strip is provided with a series of bonding pads and anti-pads with gradually-increased diameters at intervals; a step 2 of transferring the drill hole testing strips, the alignment testing strips, and the circuit pattern of the printed board product to a corresponding an internal layer core board, and successively compacting all internal layer core boards to obtain a semi-finished printed board product; a step 3 of successively processing via holes on the bonding pads and the anti-pads of the overlapped drill hole testing strips and alignment testing strips in the semi-finished printed board product to form soldering rings and isolating rings; and a step 4 of determining the deviation and ring damage of the via holes on the drill hole testing strips and alignment testing strips in virtue of an X-RAY inspector and an electric measurement way in order to estimate the deviation degree and the deviation reason of the drilled holes of the printed board product and the alignment of the final printed board product.
Description
Technical field
The present invention relates to printed board manufacturing technology field, be specially a kind of printed board product Aligning degree test side
Method.
Background technology
Along with high speed and the densification development of electron trade, the increase of wiring density, between hole to copper
Away from more and more less, the para-position Capability Requirement in printed board manufacture process is more and more higher, the control of critical process
And detection is increasingly difficult to, more client is in order to meet the demand of wiring, it is intended to fine rule and aperture set
Meter, as it is shown in figure 1, especially hole to copper apart from (D2M) design less, thus to printed board
Manufacturing technology propose higher demand.
Add printed board in the fabrication process, in order to improve plate utilization rate and working (machining) efficiency, typically adopt
Make of big layout, when running into D2M distance and being less, to printed board, especially multi-layer sheet processing
Crucial restriction process proposes more requirement, such as inner figure para-position, lamination para-position and boring para-position etc. three
The technical need that big operation integrates is higher, the most preferably carries out process control and promotes processing
Ability, it appears particularly important；Side-play amount during boring cannot be monitored and judge by prior art,
Scrappage is higher, and operation is required height.
Summary of the invention
For problems of the prior art, the present invention provide one can effective monitoring and weigh print
Twist drill hole side-play amount and end product quality, reduce scrappage, the printed board product Aligning degree increased the benefit
Method of testing.
The present invention is to be achieved through the following technical solutions:
A kind of printed board product Aligning degree method of testing, comprises the steps,
Step 1, is respectively provided with borehole test bar and Aligning degree test in the technique edges corner of printed board product
Bar；Being arranged at intervals with the pad of a series of increasing diameter on described borehole test bar, described accuracy is surveyed
The anti-pad of a series of increasing diameter it is arranged at intervals with in strip；The minimum diameter of pad and anti-pad is more than
Minimum-value aperture in printed board product；
Step 2, by photoimaging by borehole test bar and Aligning degree test strip together with the electricity of printed board product
Road figure is transferred on the core material of correspondence；Then all core materials are suppressed successively and obtain printed board
Semi-finished product；
Step 3, the pad on borehole test bar overlapping in printed board semi-finished product and Aligning degree test strip
Form weld-ring and shading ring with processing via in anti-pad successively, via aperture be in printed board product
Small-bore；
By X-RAY, step 4, checks that the mode of machine and electrical measurement judges that borehole test bar and Aligning degree are surveyed
The skew of via and broken ring situation in strip, side-play amount during to weigh the boring of printed board product, offset former
Cause and the Aligning degree ability of final products.
Preferably, on borehole test bar weld-ring be followed successively by 0.5mil, 1mil, 1.5mil, 2mil and
2.5mil。
Preferably, Aligning degree test strip shading ring be followed successively by 2mil, 2.5mil, 3mil, 3.5mil and
4.0mil。
Preferably, Aligning degree test strip is machined with a via before first shading ring former as test
Point.
Further, use electrical measurement mode in Aligning degree test strip, with first hole for test initial point, use
Flying probe tester or circuit tester, from the beginning of minimum shading ring, measure the short-circuit feelings between heterogeneous networks successively
Condition, for pass judgment on printed board product to capability.
Compared with prior art, the present invention has a following useful technique effect:
Method of the present invention is surveyed by increasing borehole test bar and Aligning degree respectively in the corner of technique edges
Strip, and corresponding core material is together transferred to the circuitous pattern of printed board product, then by lamination
Realize borehole test bar and the overlap of Aligning degree test strip on every layer of core material, in internal layer and lamination
In just can relate to the problem of Aligning degree, by drilling operating utilizes carry out in advance at technique edges
Test process, it is possible to judge side-play amount and the producing cause of boring, effectively solves printed board semi-finished product because of right
The problem scrapped that accuracy problem just can determine that to electrical measurement operation, can improve efficiency, cost-effective, energy
Enough more easily evaluation process abilities, in production process, practicality is the strongest.
Accompanying drawing explanation
Fig. 1 be in prior art printed board product mesopore to the structural representation of copper.
Fig. 2 is the borehole test bar described in present example.
Fig. 3 is the Aligning degree test strip described in present example.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in further detail, described in be to the present invention
Explanation rather than restriction.
The present invention, when engineering preparation makes data, adds brill as shown in Figure 2 respectively in technique edges corner
Hole test strip and Aligning degree test strip as shown in Figure 3, for carrying out side-play amount monitoring and the outer layer holed
After etching, the Aligning degree of printed board product is measured, it is simple to preferably carry out process control and quality testing.
Concrete, it comprises the steps.
1, borehole test bar adds.
As in figure 2 it is shown, arrange the pad Pad of a series of increasing diameter, mistake in the technique edges corner of jigsaw
Aperture, hole is set to the minimum-value aperture in jigsaw, it is ensured that the weld-ring formed with pad after boring is followed successively by
0.5mil, 1mil, 1.5mil, 2mil and 2.5mil；And the most in advance on borehole test bar
Carry out borehole test.
2, Aligning degree test strip is added.
As it is shown on figure 3, arrange the anti-pad of a series of increasing diameter in the technique edges corner of jigsaw
Antipad, via aperture is set to minimum-value aperture in unit, it is ensured that form isolation with anti-pad after boring
Ring be followed successively by 2mil, 2.5mil, 3mil, 3.5mil and 4.0mil, and Aligning degree test strip
Between one shading ring, one via of processing is as test initial point, and test initial point is without shading ring.
3, boring.
Whole boring procedure is relatively simple, transfers boring instruction according to normal bore mode, only surveys boring
Pad corresponding in strip and Aligning degree test strip and anti-pad and test initial point are holed, after completing
Using X-RAY to bore the perspective function of target drone, on observation borehole test bar, different size of weld-ring breaks feelings partially
Condition and offset manner, technical staff the most optionally adjusts and can complete Aligning degree adjustment.
4, electrical measurement after outer layer etching.
In Aligning degree test strip, with first hole for test initial point, with flying probe tester or general-purpose
Table, from the beginning of minimum shading ring, measures the short-circuit conditions between heterogeneous networks successively.For passing judgment on printed board
Product aligning ability, can improve efficiency, preferably carry out technological evaluation.
Claims (5)
1. a printed board product Aligning degree method of testing, it is characterised in that comprise the steps,
Step 1, is respectively provided with borehole test bar and Aligning degree test in the technique edges corner of printed board product
Bar；Being arranged at intervals with the pad of a series of increasing diameter on described borehole test bar, described accuracy is surveyed
The anti-pad of a series of increasing diameter it is arranged at intervals with in strip；The minimum diameter of pad and anti-pad is more than
Minimum-value aperture in printed board product；
Step 2, by photoimaging by borehole test bar and Aligning degree test strip together with the electricity of printed board product
Road figure is transferred on the core material of correspondence；Then all core materials are suppressed successively and obtain printed board
Semi-finished product；
Step 3, the pad on borehole test bar overlapping in printed board semi-finished product and Aligning degree test strip
Form weld-ring and shading ring with processing via in anti-pad successively, via aperture be in printed board product
Small-bore；
By X-RAY, step 4, checks that the mode of machine and electrical measurement judges that borehole test bar and Aligning degree are surveyed
The skew of via and broken ring situation in strip, side-play amount during to weigh the boring of printed board product, offset former
Cause and the Aligning degree ability of final products.
A kind of printed board product Aligning degree method of testing the most according to claim 1, its feature exists
In, on borehole test bar, weld-ring is followed successively by 0.5mil, 1mil, 1.5mil, 2mil and 2.5mil.
A kind of printed board product Aligning degree method of testing the most according to claim 1, its feature exists
In, Aligning degree test strip shading ring is followed successively by 2mil, 2.5mil, 3mil, 3.5mil and 4.0mil.
A kind of printed board product Aligning degree method of testing the most according to claim 1, its feature exists
In, Aligning degree test strip is machined with a via as test initial point before first shading ring.
A kind of printed board product Aligning degree method of testing the most according to claim 4, its feature exists
In, use electrical measurement mode in Aligning degree test strip, with first hole for test initial point, use flying probe
Machine or circuit tester, from the beginning of minimum shading ring, measure the short-circuit conditions between heterogeneous networks successively, be used for
Pass judgment on printed board product to capability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610171700.6A CN105764241A (en) | 2016-03-23 | 2016-03-23 | Method for testing alignment of printed board product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610171700.6A CN105764241A (en) | 2016-03-23 | 2016-03-23 | Method for testing alignment of printed board product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105764241A true CN105764241A (en) | 2016-07-13 |
Family
ID=56345615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610171700.6A Pending CN105764241A (en) | 2016-03-23 | 2016-03-23 | Method for testing alignment of printed board product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105764241A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106771824A (en) * | 2017-02-15 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of pcb board and its method for being applied to radium-shine hole skew test point |
| CN110191569A (en) * | 2019-04-17 | 2019-08-30 | 奥士康科技股份有限公司 | A kind of test structures and methods of the back drill Aligning degree of 5G circuit board |
| CN110493977A (en) * | 2019-05-17 | 2019-11-22 | 惠州市特创电子科技有限公司 | A kind of inclined detection structure of layer and method of high frequency plate |
| CN110493961A (en) * | 2019-08-13 | 2019-11-22 | 沪士电子股份有限公司 | A kind of pcb board outer layer repeatedly drills Aligning degree monitoring method |
| CN110856337A (en) * | 2019-10-10 | 2020-02-28 | 宜兴硅谷电子科技有限公司 | Novel PCB production process with self-monitoring alignment degree |
| CN112504183A (en) * | 2020-11-07 | 2021-03-16 | 奥士康科技股份有限公司 | Hole deviation detection method |
| CN112654141A (en) * | 2020-12-25 | 2021-04-13 | 天津普林电路股份有限公司 | Method for checking alignment between mechanical hole and inner layer pattern |
| CN112911791A (en) * | 2021-01-29 | 2021-06-04 | 深圳市强达电路有限公司 | Printed circuit board for detecting deviation of drilling hole |
| CN114375099A (en) * | 2021-12-31 | 2022-04-19 | 惠州中京电子科技有限公司 | Method for controlling deviation of holes drilled by MiniLED plate |
Citations (3)
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|---|---|---|---|---|
| US4432037A (en) * | 1980-12-02 | 1984-02-14 | Siemens Aktiengesellschaft | Multi-layer printed circuit board and method for determining the actual position of internally located terminal areas |
| JPH06152150A (en) * | 1992-11-06 | 1994-05-31 | Toshiba Chem Corp | Manufacture of multilayer printed wiring board |
| CN104582284A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Method for manufacturing package substrate |
-
2016
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Patent Citations (3)
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|---|---|---|---|---|
| US4432037A (en) * | 1980-12-02 | 1984-02-14 | Siemens Aktiengesellschaft | Multi-layer printed circuit board and method for determining the actual position of internally located terminal areas |
| JPH06152150A (en) * | 1992-11-06 | 1994-05-31 | Toshiba Chem Corp | Manufacture of multilayer printed wiring board |
| CN104582284A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Method for manufacturing package substrate |
Non-Patent Citations (1)
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|---|
| 曾金: "PCB板对准度设计能力研究", 《印制电路信息》 * |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106771824A (en) * | 2017-02-15 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of pcb board and its method for being applied to radium-shine hole skew test point |
| CN110191569A (en) * | 2019-04-17 | 2019-08-30 | 奥士康科技股份有限公司 | A kind of test structures and methods of the back drill Aligning degree of 5G circuit board |
| CN110493977A (en) * | 2019-05-17 | 2019-11-22 | 惠州市特创电子科技有限公司 | A kind of inclined detection structure of layer and method of high frequency plate |
| CN110493961A (en) * | 2019-08-13 | 2019-11-22 | 沪士电子股份有限公司 | A kind of pcb board outer layer repeatedly drills Aligning degree monitoring method |
| CN110493961B (en) * | 2019-08-13 | 2021-05-11 | 沪士电子股份有限公司 | Method for monitoring alignment degree of outer layer of PCB (printed circuit board) during multiple drilling |
| CN110856337A (en) * | 2019-10-10 | 2020-02-28 | 宜兴硅谷电子科技有限公司 | Novel PCB production process with self-monitoring alignment degree |
| CN112504183A (en) * | 2020-11-07 | 2021-03-16 | 奥士康科技股份有限公司 | Hole deviation detection method |
| CN112654141A (en) * | 2020-12-25 | 2021-04-13 | 天津普林电路股份有限公司 | Method for checking alignment between mechanical hole and inner layer pattern |
| CN112911791A (en) * | 2021-01-29 | 2021-06-04 | 深圳市强达电路有限公司 | Printed circuit board for detecting deviation of drilling hole |
| CN114375099A (en) * | 2021-12-31 | 2022-04-19 | 惠州中京电子科技有限公司 | Method for controlling deviation of holes drilled by MiniLED plate |
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Legal Events
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160713 |
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| RJ01 | Rejection of invention patent application after publication |