CN107295749A - A kind of inclined management-control method in pcb board hole - Google Patents
A kind of inclined management-control method in pcb board hole Download PDFInfo
- Publication number
- CN107295749A CN107295749A CN201710563809.9A CN201710563809A CN107295749A CN 107295749 A CN107295749 A CN 107295749A CN 201710563809 A CN201710563809 A CN 201710563809A CN 107295749 A CN107295749 A CN 107295749A
- Authority
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- China
- Prior art keywords
- film
- hole
- egative film
- control
- development
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Abstract
The invention discloses a kind of inclined management-control method in pcb board hole, comprise the following steps：(1) drill；(2) heavy copper；(3) pattern transfer, the pattern transfer includes pre-treatment, press mold, standing, contraposition, exposure, development；The method of the present invention is in the case where equipment is constant, by drilling parameter control, the control of outer layer exposure parameter, line film Data Design optimization, so as to playing supervisory function bit in actual production process, it is to avoid batch hole partially occur abnormal；The solution of the present invention can effectively prevent batch hole partially to scrap, and the inclined hole of reduction is bad, improve product first-pass yield.
Description
Technical field
The present invention relates to pcb board production technical field, more particularly to a kind of inclined management-control method in pcb board hole.
Background technology
With the multifunctionality development of electronic product, PCB application is more and more extensive, and printed circuit board (PCB) is intended to volume
It is small, slimming, high-accuracy, orifice ring design≤4mil of more and more consumer products.Two inclined big reasons of hole are caused to be bored for drilling
Partially, circuit is to inclined；In most of printed circuit board (PCB) factory, orifice ring≤4mil wiring board, the inclined scrappage in acid etching flow hole compared with
It is high；Therefore, it is a problem of circuit board industry that how the inclined hole of management and control is bad, to reduce inclined hole bad.
The content of the invention
The technical problems to be solved by the invention, which are to provide one kind, can prevent pcb board batch hole partially to scrap, and reduce inclined hole
It is bad, improve the inclined management-control method in pcb board hole of product yield.
To solve above technical problem, the technical solution adopted by the present invention is：A kind of inclined management-control method in pcb board hole, including
Following steps：
(1) drill；
(2) heavy copper；
(3) pattern transfer, the pattern transfer includes pre-treatment, press mold, standing, contraposition, exposure, development；
Wherein, in step (1), drilling lamination parameter is：
Drilling board is selected：Board main shaft beat dynamic RUNOUT values≤15um；Drill maximum offset≤3mil；
CPK≥1.33；
In step (3), the control of outer layer exposure parameter：1., take 4/4 pattern (contraposition, 4 point inspections) at 4 points, open divide equally,
Egative film audit function；
2. egative film error amount setting≤50um；Egative film harmomegathus value setting≤50um；Workpiece ← → upper and lower egative film setting value≤
50um；The equal score value setting≤50um of workpiece ← → Best Point；
3. platform frame degree of exhaustion：20Hg—30Hg；Egative film vacuum：-680mmHg—-760mmHg；
In step (3), the development film harmomegathus management and control is：New film harmomegathus value ± 1mil, extreme difference 1.5mil；The old film
Harmomegathus value ± 2mil, extreme difference 2mil；
Outer layer film drone design is：GTL faces center is an external diameter 2.0mm, internal diameter 1.4mm, ring width 0.3mm ring；
GBL faces center is the circle of a 1.0mm diameter；Two sides is at 3.2mm wad cutter hole walls 10mil plus 8mil ring width
Ring.
In summary, with technical scheme, have the advantages that：The solution of the present invention is constant in equipment
In the case of, by drilling parameter control, the control of outer layer exposure parameter, line film Data Design optimization, so as to reality
Supervisory function bit is played in production process, it is to avoid batch hole partially occur abnormal；The solution of the present invention can effectively prevent batch hole partially
Scrap, the inclined hole of reduction is bad, improve product first-pass yield.
Brief description of the drawings
Fig. 1 is GTL faces of the present invention schematic diagram；
Fig. 2 is GBL faces of the present invention schematic diagram；
Fig. 3 is effect after existing wad cutter design development of the invention；
Fig. 4 is effect after wad cutter design development after present invention optimization.
Fig. 5 is wad cutter detects schematic diagram after optimization.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, but does not constitute limiting the scope of the invention.
The present invention provides a kind of inclined management-control method in pcb board hole, specifically includes following steps：
(1) drill：Including upper PIN → automatic adhesive-tape application → plate → upper plate to be drilled → brill initial workpiece → lower plate → X-RAY is examined
(multilayer) → plate → lower plate → examination board → nog plate → ejecting plate is bored, these belong to the conventional method of this area, are not of the invention
Emphasis, is not being discussed herein；
(2) heavy copper：Copper → VCP plating is sunk including, nog plate → PTH；These belong to the conventional method of this area, are not these
The emphasis of invention, is not being discussed herein；
(3) pattern transfer, the pattern transfer includes pre-treatment, press mold, standing, contraposition, exposure, development；
Wherein, pre-treatment：That is nog plate, using pin brush or volcanic ash two ways；
Wherein, pin brush line nog plate comprises the following steps：Enter plate-pickling-washing-pin brush-high cutting-pressure (hydraulic) water
Wash-water column type flushing-addition washing-DI washings-sponge blot-high wind drying-hot blast drying-cooling wind is (dustless
It is indoor)；
Volcano gray line nog plate comprises the following steps：Enter the washing of plate-pickling-washing-high cutting-volcanic ash-dirt removal-
Pressurization washing-ultrasonic wave embathes-wash water that overflows washes-water column type flushing-pressurization washing-sponge and blots-high wind drying-heat
Wind is dry-step such as cooling wind；
Press mold：It is clean by copper that PCB is firmly attached to by heating, the hot pressing rumble of pressurization, by photosensitive semi-solid medium dry film
Process on face；
Stand；
Contraposition；
Exposure：Including cleaning board, the Fei Sen-dress film-frame gas guide bar-cleaning table top/film-- CCD pairs of upper plate
Position-suction vacuum-exposure-lower plate-standing；
Development；Even if with light actuating resisting corrosion dry film, the transfer of outer graphics is completed by exposure imaging, so that lower process is entered
Row is manufactured；Specifically, development includes but is not limited to below scheme：Put plate -1 section of development cylinder-wave-develop 2 sections of cylinder -
Wave-develop 3 sections of cylinder-wave-dirt removal water-pressurization washing-clear water wash-high wind drying-hot blast drying-QC fishplate bars insert
Frame；
Wherein, in step (1), drilling lamination parameter is：
Drilling board is selected：Board main shaft beat dynamic RUNOUT values≤15um；Drill maximum offset≤3mil；
CPK≥1.33；
In step (3), the control of outer layer exposure parameter：1. 4/4 pattern (4 points of contrapositions, 4 point inspections), is taken, to ensure PCB
The Aligning degree of plate and the film up and down, exposure machine takes wad cutter center and the phenanthrene at four camera crawl pcb boards, four angles when exposing
The center of woods target；Open divide equally and (prevent from occurring pcb board during exposure aligning with respect to the inclined phenomenon in the overall past one side of the film),
Egative film (film) audit function (whether the film shifts, deforms above and below inspection)；A series of measures above is provided to carry
Its high Aligning degree, can be achieved this function in equipment.
2. egative film (film) error amount setting≤50um；Egative film harmomegathus value setting≤50um；Workpiece ← → upper and lower egative film is set
Definite value≤50um；The equal score value setting≤50um of workpiece ← → Best Point；
3. platform frame degree of exhaustion：20Hg—30Hg；Egative film vacuum：-680mmHg—-760mmHg；
In step (3), the development film harmomegathus management and control is：New film harmomegathus value ± 1mil, extreme difference 1.5mil；The old film
Harmomegathus value ± 2mil, extreme difference 2mil；
As shown in Figure 1, 2, outer layer film drone design is：GTL faces center is an external diameter 2.0mm, internal diameter 1.4mm, ring
Wide 0.3mm ring；GBL faces center is the circle of a 1.0mm diameter；Two sides is adding one at 3.2mm wad cutter hole walls 10mil
The ring of 8mil ring widthes.
It is the Contrast on effect after the inventive method development, with advantages below as shown in Fig. 3,4,5：
1st, clearly device to hole monitoring can be carried out partially, be for drilling or line while effectively differentiating the process for oblique presentation life of portalling
Road；
2nd, after developing outside 4 target holes the ring of a 8mil ring width more, according to the distance and deviation on hole Bian Daohuan sides
Analysis, reaches a kind of partially real-time monitoring means in pcb board hole；
3rd, GBL is as effect after the development of GTL2 faces, and consistent one side is presented partially with ring in such as 4 target holes, then is determined as
Circuit is to inclined, as 4 target holes and 2 faces of ring presentation are consistent while partially, being then determined as that drilling is inclined.(timely device to hole can be answered inclined
Producing cause, makes Improving Measurements).
4th, the development before after excellent only shows with a hole, it is excellent after development also include a detection annulus.
The solution of the present invention is in the case where equipment is constant, by drilling parameter control, the control of outer layer exposure parameter, line
Road film Data Design optimization, so as to playing supervisory function bit in actual production process, it is to avoid batch hole partially occur abnormal；This hair
Bright scheme can effectively prevent batch hole partially to scrap, and the inclined hole of reduction is bad, improve product first-pass yield.
I takes charge of production plate because inclined hole causes the area scrapped monthly 0.82% at present, and drilling parameter control, outer layer are exposed
State modulator, the optimization of line film Data Design, it is possible to decrease scrappage 0.23%.By my driller hole monthly ㎡ of output 120000,
Per 400 yuan of calculating of square meter, annual reduction scrap cost is as follows：
Ten thousand ㎡ * of 0.23%*12,400 yuan of * December=132.48 ten thousand yuan.
Inventor draws a kind of side improved drilling, outer layer aligning accuracy and monitored to actual production process by research and development
Method, reduces inclined hole scrappage, improves me and takes charge of the lifting of making technology ability, better meets the requirement of client.
Described above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (1)
1. a kind of inclined management-control method in pcb board hole, it is characterised in that comprise the following steps：
(1) drill；
(2) heavy copper；
(3) pattern transfer, the pattern transfer includes pre-treatment, press mold, standing, contraposition, exposure, development；
Wherein, in step (1), drilling lamination parameter is：
Drilling board is selected：Board main shaft beat dynamic RUNOUT values≤15um；Drill maximum offset≤3mil；CPK≥
1.33；
In step (3), the control of outer layer exposure parameter：1. 4/4 pattern (4 points of contrapositions, 4 point inspections), is taken, unlatching is divided equally, egative film
Audit function；
2. egative film error amount setting≤50um；Egative film harmomegathus value setting≤50um；Workpiece ← → upper and lower egative film setting value≤
50um；The equal score value setting≤50um of workpiece ← → Best Point；
3. platform frame degree of exhaustion：20Hg—30Hg；Egative film vacuum：-680mmHg—-760mmHg；
In step (3), the development film harmomegathus management and control is：New film harmomegathus value ± 1mil, extreme difference 1.5mil；Old film harmomegathus
Value ± 2mil, extreme difference 2mil；
Outer layer film drone design is：GTL faces center is an external diameter 2.0mm, internal diameter 1.4mm, ring width 0.3mm ring；GBL faces
Center is the circle of a 1.0mm diameter；Two sides is adding the ring of a 8mil ring width at 3.2mm wad cutter hole walls 10mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710563809.9A CN107295749B (en) | 2017-07-12 | 2017-07-12 | A kind of inclined management-control method in pcb board hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710563809.9A CN107295749B (en) | 2017-07-12 | 2017-07-12 | A kind of inclined management-control method in pcb board hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107295749A true CN107295749A (en) | 2017-10-24 |
| CN107295749B CN107295749B (en) | 2019-09-17 |
Family
ID=60101123
Family Applications (1)
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|---|---|---|---|
| CN201710563809.9A Active CN107295749B (en) | 2017-07-12 | 2017-07-12 | A kind of inclined management-control method in pcb board hole |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109104822A (en) * | 2018-11-15 | 2018-12-28 | 梅州市志浩电子科技有限公司 | The alignment method of the film and exposure machine |
| CN109195342A (en) * | 2018-09-14 | 2019-01-11 | 奥士康精密电路（惠州）有限公司 | A kind of broken method for generating and improving efficiency of anti-film |
| CN112672525A (en) * | 2020-11-12 | 2021-04-16 | 广州广合科技股份有限公司 | Treatment method for incomplete etching in PCB negative film process |
| CN114179163A (en) * | 2021-12-03 | 2022-03-15 | 苏州市伟杰电子有限公司 | PCB (printed circuit board) hole forming device and hole forming method |
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| CN105282983A (en) * | 2015-10-14 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Lead wire etching technology with gold fingers with three surfaces wrapped by gold |
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| CN101166392A (en) * | 2006-10-18 | 2008-04-23 | 比亚迪股份有限公司 | A laminated multi-layer flexible printed circuit board and its making method |
| CN101537505A (en) * | 2008-12-30 | 2009-09-23 | 南京依利安达电子有限公司 | Small-aperture high-density drilling method of printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109195342A (en) * | 2018-09-14 | 2019-01-11 | 奥士康精密电路（惠州）有限公司 | A kind of broken method for generating and improving efficiency of anti-film |
| CN109104822A (en) * | 2018-11-15 | 2018-12-28 | 梅州市志浩电子科技有限公司 | The alignment method of the film and exposure machine |
| CN112672525A (en) * | 2020-11-12 | 2021-04-16 | 广州广合科技股份有限公司 | Treatment method for incomplete etching in PCB negative film process |
| CN112672525B (en) * | 2020-11-12 | 2022-05-17 | 广州广合科技股份有限公司 | Treatment method for incomplete etching in PCB negative film process |
| CN114179163A (en) * | 2021-12-03 | 2022-03-15 | 苏州市伟杰电子有限公司 | PCB (printed circuit board) hole forming device and hole forming method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107295749B (en) | 2019-09-17 |
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Effective date of registration: 20230629 Address after: 526070 Floor 1, Building 1, Xizhen Science Park, No. 11, Kechuang Avenue, Zhaoqing New District, Dinghu District, Huizhou City, Guangdong Province Patentee after: Guangdong Xizhen Circuit Technology Co.,Ltd. Address before: Xin Wei Zhen Chang Bu Cun, Huizhou District of Huiyang City, Guangdong province 516223 Patentee before: AOSHIKONG PRECISION CIRCUIT (HUIZHOU) Co.,Ltd. |