CN105683320B - Electroconductive adhesive sheet and electronic equipment - Google Patents
Electroconductive adhesive sheet and electronic equipment Download PDFInfo
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- CN105683320B CN105683320B CN201480060436.8A CN201480060436A CN105683320B CN 105683320 B CN105683320 B CN 105683320B CN 201480060436 A CN201480060436 A CN 201480060436A CN 105683320 B CN105683320 B CN 105683320B
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- electroconductive
- adhesive sheet
- conductive adhesive
- adhesive
- conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Conductive Materials (AREA)
Abstract
Even if the invention solves problem be to provide with it is existing be in a ratio of it is slim, it may have the electroconductive adhesive sheet of good adhesivity and electric conductivity.The present invention relates to a kind of slim electroconductive adhesive sheet, it is characterized in that, it is electroconductive adhesive sheet of the gross thickness below 30 μm, its conductive base material and the conductive adhesive oxidant layer containing electroconductive particle, scopes of the particle diameter d85 of the electroconductive particle at 5 μm~9 μm, and the thickness of described adhesive layer is in 1 μm~6 μm of scope.
Description
Technical field
The present invention relates to a kind of the electroconductive adhesive sheet on electronic equipment etc. is attached to for the purpose of electromagnetic wave shielding etc..
Background technology
Using mobile electronic terminal as in the electronic equipment of representative, more using so-called electroconductive adhesive sheet for masking by
Form the issuable electromagnetic wave of part of electronic equipment.
As the electroconductive adhesive sheet, with the slimming of the electronic equipment, the more slim production of industrial quarters demand
Product, for example, it is known on conductive substrate, there is the bonding sheet of the adhesive phase comprising conductive adhesive, the conductive adhesive
Agent is electroconductive stuffing is scattered in (with reference to patent document 1 and 2) formed in adhesive material.
But as electronic equipment further minimizes and be thinned, it is necessary to electroconductive adhesive sheet is further thinned,
But among these, even if not yet occurring more slim compared with existing, it may have excellent electric conductivity and the extremely thin type of adhesivity are led
Electrical bonding sheet.
Prior art literature
Patent document
Patent document 1：Japanese Patent Laid-Open 2004-263030 publications
Patent document 2：Japanese Patent Laid-Open 2009-79127 publications
The content of the invention
Problems to be solved by the invention
Even if the problem to be solved in the present invention is to provide more slim compared with existing, it may have good adhesivity and conduction
The electroconductive adhesive sheet of property.
The means solved the problems, such as
The inventors discovered that can by the thickness of the particle diameter and adhesive phase that combine electroconductive particle in a specific range
To solve the above problems.
That is, the present invention relates to a kind of electroconductive adhesive sheet, it is characterised in that it is electric conductivity of the gross thickness below 30 μm
Bonding sheet, its conductive base material and the conductive adhesive oxidant layer containing electroconductive particle, the particle diameter of the electroconductive particle
D85 is 5 μm~9 μm, and the thickness of the conductive adhesive oxidant layer is 1 μm~6 μm.
Invention effect
Although the electroconductive adhesive sheet of the present invention is extremely thin type, there is the adhesivity and electric conductivity good with adherend,
Therefore for example available for masking caused by the part for forming electronic equipment the purposes of electromagnetic wave, the dead earth purposes of antistatic
Deng.In addition, the electroconductive adhesive sheet of the present invention is applicable to need further slimming and electronic equipment internal volume limits
In the occasions that manufactures such as strict mobile electronic terminal.
Brief description of the drawings
Fig. 1 is the figure for an example for representing the electroconductive adhesive sheet configuration example of the present invention.
Fig. 2 is the figure for an example for representing the electroconductive adhesive sheet configuration example of the present invention.
Fig. 3 is an example of the electron micrograph of the electroconductive particle used in embodiment 1.
Fig. 4 is an example of the electron micrograph of the electroconductive particle used in comparative example 1.
Embodiment
The electroconductive adhesive sheet of the present invention is characterised by that it is electroconductive adhesive sheet of the gross thickness below 30 μm, its
Conductive base material and the conductive adhesive oxidant layer containing electroconductive particle, the particle diameter d85 of the electroconductive particle for 5 μm~
9 μm, the thickness of the conductive adhesive oxidant layer is 1 μm~6 μm.
The electroconductive adhesive sheet of the present invention is the conductive adhesive phase in the single side face of the conductive substrate
The bonding sheet of bonding sheet conductive adhesive phase either in the two sided of conductive substrate.The conductive adhesive
Layer can also be directly or via other layer stackups on the conductive substrate.
In addition, the electroconductive adhesive sheet of the present invention can also be laminated with the demoulding on the surface of the conductive adhesive oxidant layer
Piece.It is explained, " piece " alleged by the present invention includes product form all such as sheet, web-like, banding (tape shapes).
The present invention electroconductive adhesive sheet be gross thickness below 30 μm, preferably below 20 μm, more preferably 15 μm with
Under, the electroconductive adhesive sheet of extremely thin type further preferably below 12 μm.The lower limit of the gross thickness of the electroconductive adhesive sheet
It is preferred that substantially at 2 μm.It is explained, the gross thickness refers to the thickness of the electroconductive adhesive sheet not comprising release liner.
(conductive adhesive oxidant layer)
Conductive adhesive oxidant layer possessed by the electroconductive adhesive sheet of the present invention is containing specific electroconductive particle and glued
Thickness is 1 μm~6 μm in the adhesive phase of synthesis point, and preferably 2 μm~5 μm, more preferably 2.5 μm~4.5 μ ms glue
Mixture layer.Even the thickness of the conductive adhesive oxidant layer extremely thin type, can also have concurrently excellent electric conductivity with it is excellent
Adhesivity.
In addition, by using the conductive adhesive oxidant layer, even if gross thickness is thin in the extreme below 30 μm, can also obtain
To the electroconductive adhesive sheet for having excellent electric conductivity and excellent adhesivity concurrently.
The conductive adhesive oxidant layer can be by using the adhesive group containing the electroconductive particle and adhesive composition
Compound is formed.
(electroconductive particle)
As the electroconductive particle contained by the conductive adhesive oxidant layer, using its particle diameter d85 in 5 μm~9 μ ms
Particle.Thus, it is possible to obtain having concurrently the electroconductive adhesive sheet of excellent electric conductivity and adhesivity.
The particle diameter d85 of the electroconductive particle is preferably in 5.5 μm~8.5 μm of scope, more preferably at 6.0 μm~8.0 μm
Scope, further preferably in 6.5 μm~7.5 μm of scope.
It is explained, the particle diameter d85 refers to 85% accumulated value in size distribution, is surveyed by laser diffraction and scattering method
Fixed value.It can be enumerated as measure device：Microtrac MT3000II of Nikkiso Company Limited, Shimadzu Seisakusho Ltd.
Laser diffraction formula sedimentograph SALD-3000 etc..
As adjusting to the particle diameter d85 of scope method, such as it can enumerate and crush electric conductivity grain with airslide disintegrating mill
The method of son or the sieve method using sieve etc..
Relative to the thickness of the conductive adhesive oxidant layer, the particle diameter d85 of the electroconductive particle is preferably 80%~
330%, more preferably 100%~250%, from the aspect of more excellent electric conductivity and adhesivity is had concurrently, further preferably
For 120%~220%.
As the electroconductive particle, while being the particle diameter d85 of the determined scope, particle diameter d50 preferably 3 μm~
6 μm of scope, more preferably in 3.5 μm~5.5 μm of scope, from the conduction for obtaining having concurrently more excellent electric conductivity and adhesivity
From the aspect of property bonding sheet, further preferably in 3.5 μm~4.5 μm of scope.It is explained, the particle diameter d50 refers in grain
50% accumulated value (intermediate value) in degree distribution, is the value determined by laser diffraction and scattering method.
As the electroconductive particle, the metallics such as gold, silver, copper, nickel, aluminium can be used；The electric conductivity tree such as carbon, graphite
Fat granule；Part or all of the surface of the electroconductive resin particle, solid glass pearl or Hollow Glass Sphere is by metal bag
Particle covered etc..Wherein, as the electroconductive particle, from the aspect of more excellent electric conductivity and adhesivity is had concurrently, enter
One step preferably uses nickel particles, copper particle or silver particles, further preferably using on the particle surface manufactured by carbonyl process
Surface needle-like nickel particles with many needle-likes, smoothing techniques (pulverization process) are carried out to surface acicular particles and manufactured
Spherical particle, the copper particle manufactured with super-pressure rotary spray method or silver particles etc., particularly preferably using silver particles.
As the shape of the electroconductive particle, preferably spherical or surface needle-like.The aspect ratio of the electroconductive particle does not have
There are special limitation, preferably 1~2, more preferably 1~1.5, most preferably 1~1.2.Aspect ratio can use scanning electron
Measurement microscope.
As the electroconductive particle, such as it can use and bonding etc. is formed between many electroconductive particles shown in Fig. 4
Be connected form read beaded particles, preferably using the most of each independent particle of the electroconductive particle shown in Fig. 3, because it can be with
It is not easy to produce coating striped and the excellent conductive adhesive oxidant layer of adhesivity to be slim even if being formed.Leading shown in described Fig. 3
Conductive particles, such as can be obtained with pulverization process such as airslide disintegrating mills.
Relative to the total amount of the conductive adhesive oxidant layer, the electroconductive particle preferably comprises the matter of 1 mass %~50
Measure %, the mass % of further preferably 5 mass %~25 mass %, further preferably 8 mass %~20, from obtaining having concurrently more
From the aspect of the electroconductive adhesive sheet for adding excellent electric conductivity and adhesivity, particularly preferably containing the mass % of 8 mass %~15.
(adhesive composition)
As adhesive composition used in the conductive adhesive oxidant layer is formed, it can use and contain the electric conductivity
Also the composition containing adhesive composition while particle.
As the adhesive composition, such as can use in (methyl) acrylic adhesive composition, carbamate
It is adhesive composition, synthetic rubber system adhesive composition, natural rubber system adhesive composition, silicone-based adhesive combination
Composition containing electroconductive particle in thing etc., excellent electric conductivity is not damaged and even if to be slim with excellent from being formed yet
Adhesive tension, and from the aspect of excellent conductive adhesive oxidant layer in weatherability and heat resistance, preferably use with acrylic acid series
Polymer is substrate polymer and contains the additive such as the conductive particle and tackifying resin as needed, crosslinking agent
Acrylic adhesive composition.
As the acrylic acid series polymeric compounds, for example, can suitably using make the monomer containing (methyl) acrylate monomer into
Acrylic acid series polymeric compounds obtained from dividing polymerization, wherein, (methyl) acrylate monomer has the alkyl of carbon number 1~14.
As (methyl) acrylate with the alkyl of carbon number 1~14, such as it can be used a kind of or be applied in combination two
(methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) n-butyl acrylate, (methyl) i-butyl more than kind
Ester, (methyl) tert-butyl acrylate, (methyl) the just own ester of acrylic acid, (methyl) n-octyl, (methyl) acrylic acid are different pungent
Ester, the different nonyl ester of (methyl) acrylic acid, (methyl) cyclohexyl acrylate, (methyl) 2-EHA etc..
Wherein, as (methyl) acrylate with the alkyl of carbon number 1~14, preferably using has carbon atom
Number is (methyl) acrylate of 4~12 alkyl, is more preferably used with the straight or branched structure alkane that carbon number is 4~9
(methyl) acrylate of base, is further preferably used singly or in combination two or more n-butyl acrylates, acrylic acid
2- ethylhexyls.
Relative to the total amount for manufacturing the monomer component used in the acrylic acid series polymeric compounds, there is the carbon atom
The content of (methyl) acrylate of the alkyl of number 1~14 is preferably in the mass % of 80 mass %~98.5 scope, more preferably 90
The mass % of quality %~98.5 scope.
As monomer component workable for manufacturing the acrylic acid series polymeric compounds, in addition to the composition, as needed
It is preferred that use highly polar vinyl monomer.
As the highly polar vinyl monomer, the two or more second with carboxyl is can be used alone or is applied in combination
Alkenyl monomer, the vinyl monomer with hydroxyl, vinyl monomer with amide groups etc..Wherein, as the highly polar second
Alkenyl monomer, preferably using the vinyl monomer with carboxyl, because it easily exists the adhesivity adjustment of conductive adhesive oxidant layer
In suitable scope.
As the vinyl monomer with carboxyl, for example, can be used acrylic acid, methacrylic acid, itaconic acid, maleic acid,
(methyl) acrylic acid dimer, crotonic acid, ethylene-oxide-modified butanedioic acid acrylate etc., wherein it is preferred that using acrylic acid.
During using vinyl monomer with carboxyl, relative to monomer component used in manufacture acrylic acid series polymeric compounds
Total amount, preferably its content are the mass % of 0.2 mass %~15 mass %, more preferably 0.4 mass %~10, due to easily will be viscous
The adhesivity of mixture is adjusted in suitable scope, the mass % of therefore more preferably 0.5 mass %~6.
As the vinyl monomer with hydroxyl, such as (methyl) acrylic acid 2- hydroxy methacrylates, (methyl) propylene can be used
Sour 2- hydroxy propyl esters, (methyl) acrylic acid 4- hydroxybutyls, the own ester of (methyl) acrylic acid 6- hydroxyls etc..
As the vinyl monomer with amide groups, such as NVP, N- vinyl acyl in oneself can be used
Amine, acryloyl morpholine, acrylamide, N,N-DMAA etc..
As other highly polar vinyl monomers, such as vinyl acetate, ethylene-oxide-modified butanedioic acid third can be used
Olefin(e) acid ester, 2- acrylamide-2-methyl propane sulfonics etc. contain sulfonic monomer；(methyl) acrylic acid 2- methoxy acrylates, (first
Base) end alkoxy group such as acrylic acid 2- phenoxy ethyls is modified (methyl) acrylate etc..
Relative to manufacture acrylic acid series polymeric compounds used in monomer component total amount, the highly polar vinyl monomer
Content is preferably the mass % of 0.2 mass %~15, the mass % of more preferably 0.4 mass %~10, due to easily by adhesive
Adhesivity is adjusted in suitable scope, the mass % of therefore more preferably 0.5 mass %~6.
The acrylic acid series polymeric compounds can be by using solution polymerization process, mass polymerization, suspension polymerization, emulsion polymerization
The method Deng known to makes described polymerizing monomer components and manufactured.Wherein, in terms of reducing its production cost and improving productivity ratio
Consider, it is preferred to use the solution polymerization process.
As the acrylic acid series polymeric compounds obtained with methods described, preferably using has weight average molecular weight 300,000~150
The polymer of ten thousand scopes, more preferably use the polymer with weight average molecular weight in 500,000~1,200,000 scopes.
As adhesive composition workable for forming the conductive adhesive oxidant layer, can be used as needed containing various
The composition of additive.
As the additive, such as in order to more improve the bonding force of conductive adhesive oxidant layer, can be used containing thickening
The additive of resin.
As the tackifying resin, rosin series resin, terpenic series resin, aliphatic (C5 systems) or aromatic series (C9 can be used
System) etc. Petropols, phenylethylene resin series, phenolic aldehyde system resin, diformazan benzene series resin, metha crylic resin etc., preferably make
With rosin series resin, more preferably using newtrex system resin.
Relative to the mass parts of acrylic acid series polymeric compounds 100, preferably used in the scope of the mass parts of 10 mass parts~50
The tackifying resin.
As the additive, in addition to described, dispersant, sagging inhibitor, plasticizer, soft can be used as needed
Agent, matal deactivator, antioxidant, pigment, dyestuff etc..
From the aspect of preventing electroconductive particle contained in described adhesive composition with time settlement, preferably using institute
State dispersant and sagging inhibitor.
As the sagging inhibitor, preferably use such as fatty acid amide resin, polyurethane resin.
Relative to the solid constituent of adhesive ingredients, preferably the mass % of 0.5 mass %~10 scope use it is described anti-
Sedimentation agent, more preferably used in the mass % of 1 mass %~6 scope, further preferably the model in the mass % of 1.5 mass %~3
Enclose use.
As adhesive composition workable for forming the conductive adhesive oxidant layer, can be used as needed containing crosslinking
The composition of agent.
As the crosslinking agent, such as isocyanates system crosslinking agent, epoxy crosslinking agent, the crosslinking of chelate system can be used
Agent, aziridine system crosslinking agent etc..
The species and usage amount of the crosslinking agent are preferably according to possessed by the adhesive compositions such as the acrylic acid series polymeric compounds
The species and amount of functional groups of functional group are suitably selected.
Can suitably it adjust using the crosslinking agent so that the gel fraction of conductive adhesive oxidant layer reaches 25 mass %~60
Quality % scope.
(gel fraction of conductive adhesive oxidant layer)
From the aspect of more excellent cohesiveness is showed, as the conductive adhesive oxidant layer, preferably using with three
Tie up the adhesive phase of cross-linked structure.Combined as the index of the cross-linked structure, such as using (methyl) acrylic adhesive
During thing, it can enumerate when the conductive adhesive oxidant layer is impregnated 24 hours in its good solvent toluene, be obtained according to its insoluble component
The gel fraction gone out.The gel fraction of the conductive adhesive oxidant layer is preferably the mass % of 25 mass %~60, due to can be
Spalling resistance is improved while the cohesiveness for more improving shear direction, the mass % of therefore more preferably 30 mass %~40.
Gel fraction is calculated by following formula.
Gel fraction (quality %)=(the conductive adhesive oxidant layer quality remained after being impregnated in toluene)/(in toluene
Conductive adhesive oxidant layer quality before dipping) } × 100
Conductive adhesive oxidant layer quality=(quality of electroconductive adhesive sheet)-(quality of conductive substrate)
Adhesive composition for example can be by making containing the acrylic acid workable for forming the conductive adhesive oxidant layer
The composition of based polymer and described electroconductive particle etc. are mixed and manufactured.
As the mixed method, such as can enumerate such as making with dispersator containing the acrylic acid series polymeric compounds
Deng composition, electroconductive particle and additive as needed etc. mix and scattered method.As the dispersator,
It can include and made dissolvers, dish-style mixer, BDM biaxial rneaders, planetary stirring machine are made on well, preferably using not
Understand the electroconductive particles such as adhesion-promoting metal powder and easy dispersed dissolvers, dish-style mixer.
As adhesive composition workable for forming the conductive adhesive oxidant layer, preferably using has 100mPas
The composition of~10000mPas scope viscosity, more preferably using the group with 500mPas~8000mPas scope viscosity
Compound, prevent to examine in terms of being coated with striped with time settlement and in coating adhesive composition from electroconductive particle is prevented
Consider, further preferably using the composition with 1000Pas~3000mPas scope viscosity.
Adjusted as by the viscosity of described adhesive composition to the method for the scope, the kind of adjustment solvent can be included
The species of the adhesive material such as class and usage amount, acrylic acid series polymeric compounds and the method for its molecular weight etc., preferably adjust solvent
The method of species and usage amount.
As the involatile constituent of described adhesive composition, it is not particularly limited, preferably in the matter of 10 mass %~35
% scope, the more preferably scope in the mass % of 15 mass %~30 are measured, further preferably the mass %'s of 17 mass %~25
Scope.
(conductive substrate)
As manufacture the present invention electroconductive adhesive sheet used in conductive substrate, can include metal base,
Graphite substrate etc..
As the metal base, such as the base for including gold, silver, copper, aluminium, nickel, iron, tin and their alloy etc. can be used
Material, preferably using the base material for including aluminium, copper, because the excellent in workability and cost of conductive substrate are relatively low.
As the base material for including the aluminium, such as the aluminium foil (6 μm of thickness) of light aluminium foil Co. Ltd. system, three can be included
The aluminium foil (6.5 μm of thickness) of water chestnut aluminium Co. Ltd. system, aluminium foil (5 μm of thickness) of Japan's aluminium Co. Ltd. system etc..As aluminium foil
Material, 1N30,8079 etc. can be enumerated.
As the base material for including the aluminium, preferably using the base material of soft (O states material), because it is soft, can suppress manufacturing
Fold is produced during electroconductive adhesive sheet.
In addition, as the base material for including the copper, such as the base material for including cathode copper can be used including roll the base material of copper
Deng.
As the base material for including the cathode copper, the CF-T9FZ- of Fukuda Metal Foil ＆ POwder Co., Ltd. can be used
HS-9 (9 μm of thickness), CF-T9FZ-HS-9 (9 μm of thickness)；3EC-M2S-VLP (the thickness 7 of Mitsu Mining ＆ Smelting Co., Ltd
μm) etc..
As the rolled copper foil, TCU-H-g-RT (8 μm of thickness), the JX day ore deposits of Japanese foliation Co. Ltd. system can be used
TPC (6 μm of thickness) of day stone metal Co. Ltd. system etc..
As conductive substrate, preferred thickness is 1 μm~26 μm, and more preferably thickness is 2 μm~1g μm, from obtain it is slim and
It is metal foil of 3 μ~7 μm etc. further preferably using thickness from the aspect of the electroconductive adhesive sheet of excellent in workability.
(release liner)
On the surface of the conductive adhesive oxidant layer for the electroconductive adhesive sheet for forming the present invention, it can also be laminated as needed
Release liner.
As the release liner, it is not particularly limited, the paper such as usable brown paper, Ge Laxin paper, without wood pulp paper
Class；The resin films such as polyethylene, polypropylene (OPP, CPP), polyethylene terephthalate；The stationery and resin film be laminated and
Into laminated paper；The material that the surface of the stationery is formed using the progress joint filling processing such as clay, polyvinyl alcohol；Filled out described in warp
Stitch the existing known material such as the material formed on the single or double of processing using the progress such as silicone-based resin lift-off processing.
The electroconductive adhesive sheet of the present invention can for example be contained by being coated with the single or double of the conductive substrate
The described adhesive composition of electroconductive particle is simultaneously dried and manufactured (i.e. straight coating).
In addition, the electroconductive adhesive sheet of the present invention can also manufacture by the following method：By in advance in the table of release liner
The described adhesive composition containing the electroconductive particle is coated with face and is dried and forms conductive adhesive oxidant layer, is connect
, the conductive adhesive oxidant layer is transferred on the single or double of the conductive substrate (i.e. transfer printing).
From the aspect of the cross-linking reaction for promoting the conductive adhesive oxidant layer, preferably led with what any means manufactured
Electrical bonding sheet then conserves more than 48 hours in the range of 20 DEG C~50 DEG C.
As the method being applied to the conductive adhesive compositions on the release liner or conductive substrate, example
The coating method with chipping wheel coater, the coating method with gravure coater, the coating with lip type coating machine can such as be included
Method etc..Wherein, as the coating method, it is preferred to use the coating method with gravure coater or the painting with lip type coating machine
Cloth method, from the thickness that can be formed accurately conductive adhesive oxidant layer, its result has more excellent electric conductivity and adhesivity concurrently
From the aspect of, more preferably using the coating method with micro- gravure coater.
The example of the preferred structure of the electroconductive adhesive sheet of the present invention is as depicted in figs. 1 and 2.Fig. 1 is in conductive substrate 1
On be laminated with the one side bonding sheet of conductive adhesive layer 2.In addition, Fig. 2 be conductive substrate 1 it is two-sided on be laminated with conduction
The double-sided adhesive sheet of property adhesive phase 2.In these structures, it is preferably used in and is provided with peeling liner on the surface of adhesive phase 2
The composition of pad.
The present invention electroconductive adhesive sheet due to existing compared with even if more it is slim can also have concurrently excellent adhesive tension with
Electric conductivity, therefore suitably using the mobile electronic terminal for needing further to be thinned and minimize as the electronic equipment of representative
Used in occasions that manufacture.
Embodiment
Embodiment is specifically explained below, but the invention is not restricted to these embodiments.
(electroconductive particle A preparation)
N1255 (nickel powder, particle diameter d50 by using airslide disintegrating mill to Inco Limited：22 μm, particle diameter
d85：43 μm) pulverization process is carried out, obtain particle diameter d50：4 μm and particle diameter d85：6.5 μm of electroconductive particle A.
(electroconductive particle B preparation)
N1255 (nickel powder, particle diameter d50 by using airslide disintegrating mill to Inco Limited：22 μm, particle diameter
d85：43 μm) pulverization process is carried out, obtain particle diameter d50：4.8 μm and particle diameter d85：8.5 μm of electroconductive particle B.
(electroconductive particle C preparation)
N1255 (nickel powder, particle diameter d50 by using airslide disintegrating mill to Inco Limited：22 μm, particle diameter
d85：43 μm) pulverization process is carried out, obtain particle diameter d50：3 μm and particle diameter d85：5.5 μm of electroconductive particle C.
The particle diameter of the electroconductive particle is the laser diffraction formula particle size distribution with Shimadzu Scisakusho Ltd
Device SALD-3000 is simultaneously measured in decentralized medium using isopropanol.
(preparation of acrylic adhesive composition 1)
In the reaction vessel for possessing condenser pipe, agitator, thermometer and dropping funel, by the matter of n-butyl acrylate 75.0
Measure part, the mass parts of 2-EHA 19.0, the mass parts of vinyl acetate 3.9, the mass parts of acrylic acid 2.0, acrylic acid -2-
The mass parts of hydroxyl ethyl ester 0.1 and 2 as polymerization initiator, the mass parts of 2 '-azodiisobutyronitrile 0.1 are dissolved in ethyl acetate 100
In mass parts, after nitrogen displacement, it polymerize 12 hours at 80 DEG C, thus obtains the acrylic polymeric that weight average molecular weight is 600,000
The ethyl acetate solution of thing.
Relative to the mass parts of solid constituent 100 of the ethyl acetate solution of the acrylic acid series polymeric compounds, coordinate PENSEL
D-135 (Arakawa Chemical Industries, Ltd.'s system, newtrex pentaerythritol ester, 135 DEG C of softening point) 10 mass parts, SUPER
ESTER A-100 (Arakawa Chemical Industries, Ltd.'s system, disproportionated rosin glyceride, 100 DEG C of softening point) 10 mass parts, use acetic acid
Thus the solid component concentration of ethyl ester adjustment acrylic acid series polymeric compounds obtains acrylic adhesive composition 1 to 45 mass %.
[preparations of conductive adhesive compositions]
(conductive adhesive compositions A preparation)
With dispersator to the mass parts of acrylic adhesive composition 1 100, the electroconductive particle A 4.5
Mass parts and BURNOCK NC40 (the isocyanates system crosslinking agent of Dainippon Ink Chemicals, the matter of solid constituent 40 as crosslinking agent
Measure %) 2 mass parts mix 10 minutes, so as to prepare conductive adhesive compositions A.
(conductive adhesive compositions B preparation)
With dispersator to the mass parts of acrylic adhesive composition 1 100, the electroconductive particle B 4.5
Mass parts and BURNOCK NC40 (the isocyanates system crosslinking agent of Dainippon Ink Chemicals, the matter of solid constituent 40 as crosslinking agent
Measure %) 2 mass parts mix 10 minutes, so as to prepare conductive adhesive compositions B.
(conductive adhesive compositions C preparation)
With dispersator to the mass parts of acrylic adhesive composition 1 100, the electroconductive particle C 4.5
Mass parts and BURNOCK NC40 (the isocyanates system crosslinking agent of Dainippon Ink Chemicals, the matter of solid constituent 40 as crosslinking agent
Measure %) 2 mass parts mix 10 minutes, so as to prepare conductive adhesive compositions C.
(conductive adhesive compositions D preparation)
With dispersator to the mass parts of acrylic adhesive composition 1 100,1400Y (Mitsui Metal Co., Ltd.'s mining industry
Co. Ltd. system, copper powder, particle diameter d50：5.6 μm, particle diameter d85：7 μm) 4.5 mass parts and the BURNOCK NC40 as crosslinking agent
(the isocyanates system crosslinking agent, the mass % of solid constituent 40 of Dainippon Ink Chemicals) 2 mass parts mix 10 minutes, so as to prepare
Conductive adhesive compositions D.
(conductive adhesive compositions E preparation)
With dispersator to the mass parts of acrylic adhesive composition 1 100, the electroconductive particle A
2.25 mass parts and BURNOCK NC40 (the isocyanates system crosslinking agent, the solid constituents of Dainippon Ink Chemicals as crosslinking agent
40 mass %) 2 mass parts mix 10 minutes, so as to prepare conductive adhesive compositions E.
(conductive adhesive compositions F preparation)
With dispersator to the mass parts of acrylic adhesive composition 1 100, the electroconductive particle A13.5
Mass parts and BURNOCK NC40 (the isocyanates system crosslinking agent of Dainippon Ink Chemicals, the matter of solid constituent 40 as crosslinking agent
Measure %) 2 mass parts mix 10 minutes, so as to prepare conductive adhesive compositions F.
(conductive adhesive compositions G preparation)
With dispersator to the mass parts of acrylic adhesive composition 1 100, the electroconductive particle A22.5
Mass parts and BURNOCK NC40 (the isocyanates system crosslinking agent of Dainippon Ink Chemicals, the matter of solid constituent 40 as crosslinking agent
Measure %) 2 mass parts mix 10 minutes, so as to prepare conductive adhesive compositions G.
(conductive adhesive compositions H preparation)
With dispersator to the mass parts of acrylic adhesive composition 1 100, Inco Limited system
NI255 (particle diameter d50：21 μm, particle diameter d85：45 μm, nickel powder) 4.5 mass parts and the BURNOCK NC40 as crosslinking agent
(the isocyanates system crosslinking agent, the mass % of solid constituent 40 of Dainippon Ink Chemicals) 2 mass parts mix 10 minutes, so as to prepare
Conductive adhesive compositions H.
(conductive adhesive compositions I preparation)
With dispersator to the mass parts of acrylic adhesive composition 1 100, NI123J (FUKUDA METAL's paper tinsel powder
Industrial Co., Ltd's system, particle diameter d50：6.3 μm, particle diameter d85：10 μm, nickel powder) 4.5 mass parts and the BURNOCK as crosslinking agent
NC40 (the isocyanates system crosslinking agent, the mass % of solid constituent 40 of Dainippon Ink Chemicals) 2 mass parts mix 10 minutes, so as to
Prepare conductive adhesive compositions I.
(conductive adhesive compositions J preparation)
With dispersator to the mass parts of acrylic adhesive composition J 100, MA-C025K (Mitsui Metal Co., Ltd.'s ore deposits
Industry Co. Ltd. system, particle diameter d50：2.4 μm, particle diameter d85：4.8 μm, copper powder) 4.5 mass parts and the BURNOCK as crosslinking agent
NC40 (the isocyanates system crosslinking agent, the mass % of solid constituent 40 of Dainippon Ink Chemicals) 2 mass parts mix 10 minutes, so as to
Prepare conductive adhesive compositions J.
(embodiment 1)
[making of electroconductive adhesive sheet]
Conductive adhesive compositions A is coated on to the stripping film of NIPPA Co. Ltd. systems with chipping wheel coater
On " PET38 × 1 A3 ", the thickness for making dried conductive adhesive oxidant layer is 3 μm, is dried 2 minutes in 80 DEG C of drier
Afterwards, aluminium foil (Mitsubishi Aluminum Co., Ltd.'s system, the material of 6 μm of thickness are attached to：It is 1N30, quenched：It is soft) it is two-sided after, at 40 DEG C
Maintenance 48 hours, so as to obtain electroconductive adhesive sheet.
(embodiment 2)
Conductive adhesive compositions A is replaced with conductive adhesive compositions B, in addition, by same with embodiment 1
The method of sample obtains electroconductive adhesive sheet.
(embodiment 3)
Conductive adhesive compositions A is replaced with conductive adhesive compositions C, in addition, by same with embodiment 1
The method of sample obtains electroconductive adhesive sheet.
(embodiment 4)
Conductive adhesive compositions A is replaced with conductive adhesive compositions D, in addition, by same with embodiment 1
The method of sample obtains electroconductive adhesive sheet.
(embodiment 5)
Conductive adhesive compositions A is replaced with conductive adhesive compositions E, in addition, by same with embodiment 1
The method of sample obtains electroconductive adhesive sheet.
(embodiment 6)
Conductive adhesive compositions A is replaced with conductive adhesive compositions F, in addition, by same with embodiment 1
The method of sample obtains electroconductive adhesive sheet.
(embodiment 7)
Conductive adhesive compositions A is replaced with conductive adhesive compositions G, in addition, by same with embodiment 1
The method of sample obtains electroconductive adhesive sheet.
(embodiment 8)
The thickness of dried conductive adhesive oxidant layer is changed to 2 μm by 3 μm, in addition, by same with embodiment 1
The method of sample obtains electroconductive adhesive sheet.
(embodiment 9)
The thickness of dried conductive adhesive oxidant layer is changed to 4 μm by 3 μm, in addition, by same with embodiment 1
The method of sample obtains electroconductive adhesive sheet.
(embodiment 10)
Conductive adhesive compositions A is coated on to the stripping film of NIPPA Co. Ltd. systems with chipping wheel coater
On " PET38 × 1 A3 ", the thickness for making dried conductive adhesive oxidant layer is 3 μm, is dried 2 minutes in 80 DEG C of drier
Afterwards, aluminium foil (Mitsubishi Aluminum Co., Ltd.'s system, the material of 6 μm of thickness are attached to：It is 1N30, quenched：It is soft) one side (glassy surface) after,
Conserved 48 hours at 40 DEG C, so as to obtain electroconductive adhesive sheet.
(embodiment 11)
The aluminium foil (three of 6 μm of thickness is replaced with 6 μm of rolled copper foil (JX Nippon Mining ＆ Metals Co., Ltd.'s system, TPC) of thickness
Water chestnut aluminium Co. Ltd. system, material：It is 1N30, quenched：Hard), in addition, conduction is obtained by method similarly to Example 1
Property bonding sheet.
(comparative example 1)
Conductive adhesive compositions A is replaced with conductive adhesive compositions H, in addition, by same with embodiment 1
The method of sample is attempted to make electroconductive adhesive sheet.
But in methods described, coating striped is produced on the surface of conductive adhesive oxidant layer, fails to be fabricated to electric conductivity and glues
Close piece.
(comparative example 2)
Conductive adhesive compositions A is replaced with conductive adhesive compositions I, in addition, by same with embodiment 1
The method of sample makes electroconductive adhesive sheet.
(comparative example 3)
Conductive adhesive compositions A is replaced with conductive adhesive compositions J, in addition, by same with embodiment 1
The method of sample makes electroconductive adhesive sheet.
(comparative example 4)
The thickness of dried conductive adhesive oxidant layer is changed to 10 μm by 3 μm, in addition, by with embodiment 1
Same method obtains electroconductive adhesive sheet.
(evaluation)
Gross thickness, electric conductivity and the adhesive tension of the electroconductive adhesive sheet obtained in evaluation embodiment and comparative example.
[assay method of the gross thickness of electroconductive adhesive sheet]
The gross thickness of the electroconductive adhesive sheet is determined with thickness gauge " TH-102 " (TESTER Industry Co., Ltd system).Institute
When to state electroconductive adhesive sheet be double-sided adhesive sheet, its gross thickness is below 30 μm to be qualified；When being one side bonding sheet, its gross thickness
To be qualified below 20 μm.
[assay method of adhesive phase thickness]
Extract used, in the release liner when electroconductive adhesive sheet is made in above-described embodiment and comparative example
A part for the conductive adhesive oxidant layer formed on surface, its one side is with S25 (Unitika Corp's system, poly- terephthaldehyde
25 μm of sour glycol ester film, thickness) lining, so as to make sample.
Release liner is peeled off from the sample, it is thick to determine it with thickness gauge " TH-102 " (TESTER Industry Co., Ltd system)
Degree, will subtract thickness of the value as conductive adhesive oxidant layer of S25 thickness.
[evaluation method (assay method of resistance value) of electric conductivity]
On the face that the conductive adhesive oxidant layer by electroconductive adhesive sheet side wide × wide 30mm 30mm is formed, length is attached
25mm × wide 25mm brass electrode.
Long 30mm × wide 80mm copper foil (35 μm of thickness) is attached on the face of the electroconductive adhesive sheet opposite side.
In the environment of 23 DEG C and 50%RH, apply surface pressing 20N load from the upper surface of the brass electrode,
Connect terminals on brass electrode and copper foil, flowed with milliohmmeter (Co., Ltd. NF loops design system) measure in this case
Cross resistance value during 10 μ A electric currents.
When the resistance value is below 200m Ω, excellent electric conductivity is evaluated as.
[evaluation method of adhesivity]
The stainless steel plate (hereinafter referred to as " stainless steel plate ") of hairline milled processed is being carried out with #360 water-fast pouncing paper
On surface, in the environment of 23 DEG C and 60%RH, back and forth pressurizeed by 2.0kg rollers 1, so as to attach the wide conductive adhesives of 20mm
Piece.
After the attaching thing is placed into 1 hour at normal temperatures, with cupping machine (TENSILON RTA-100, strain formula meeting
Society's A＆D systems) adhesive tension is peeled off with draw speed 300mm/min measure 180 degrees at normal temperatures.It is explained, uses both-sided adhesive
When piece is as electroconductive adhesive sheet, the conductive adhesive oxidant layer S25 (You Niji of the opposite side of the stainless steel plate face are attached at
Can Co. Ltd. system, polyethylene terephthalate film, 25 μm of thickness) lining.
(evaluation criterion of adhesive tension)
◎：More than 4N/20mm
○：More than 3N/20mm and less than 4N/20mm
×：Less than 2N/20mm
[table 1]
[table 2]
[table 3]
As the table shows, the electroconductive adhesive sheet of embodiments of the invention 1~11 also has well even if for extremely thin type
Adhesivity, electric conductivity.On the other hand, the bonding sheet of comparative example 1~4 can not have excellent electric conductivity and adhesivity concurrently.
Symbol description
1：Conductive substrate, 2：Conductive adhesive oxidant layer.
Claims (7)
1. a kind of electroconductive adhesive sheet, it is characterised in that its gross thickness is below 30 μm, its conductive base material and containing leading
The conductive adhesive oxidant layer of conductive particles, the particle diameter d85 of the electroconductive particle is 5 μm~9 μm, the conductive adhesive oxidant layer
Thickness for 1 μm less than 6 μm.
2. electroconductive adhesive sheet as claimed in claim 1, wherein, relative to the total amount of the conductive adhesive oxidant layer, contain
The mass % of the mass % of electroconductive particle 1~50.
3. electroconductive adhesive sheet as claimed in claim 1 or 2, wherein, the particle diameter d50 of the electroconductive particle is 3 μm~6 μ
m。
4. electroconductive adhesive sheet as claimed in claim 1 or 2, wherein, relative to the thickness of the conductive adhesive oxidant layer, institute
The particle diameter d85 for stating electroconductive particle is 80%~330%.
5. electroconductive adhesive sheet as claimed in claim 1 or 2, wherein, the conductive substrate is metal base.
6. electroconductive adhesive sheet as claimed in claim 1 or 2, wherein, the conductive adhesive oxidant layer is to use acrylic acid series
Adhesive composition and formed, the acrylic adhesive composition contains acrylic acid series polymeric compounds and the electric conductivity grain
Son.
7. a kind of electronic equipment, it is pasted with electroconductive adhesive sheet according to any one of claims 1 to 6.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-239879 | 2013-11-20 | ||
| JP2013239879 | 2013-11-20 | ||
| PCT/JP2014/080046 WO2015076174A1 (en) | 2013-11-20 | 2014-11-13 | Conductive adhesive sheet and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105683320A CN105683320A (en) | 2016-06-15 |
| CN105683320B true CN105683320B (en) | 2018-04-03 |
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| CN201480060436.8A Active CN105683320B (en) | 2013-11-20 | 2014-11-13 | Electroconductive adhesive sheet and electronic equipment |
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| Country | Link |
|---|---|
| JP (1) | JP5858317B2 (en) |
| KR (1) | KR101819529B1 (en) |
| CN (1) | CN105683320B (en) |
| WO (1) | WO2015076174A1 (en) |
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| JP7023836B2 (en) * | 2016-03-23 | 2022-02-22 | タツタ電線株式会社 | Electromagnetic wave shield film |
| JPWO2017170371A1 (en) * | 2016-03-30 | 2019-02-07 | 積水化学工業株式会社 | Conductive adhesive tape |
| JP6783106B2 (en) * | 2016-09-29 | 2020-11-11 | 日東電工株式会社 | Conductive adhesive tape |
| JPWO2018110285A1 (en) * | 2016-12-12 | 2019-04-18 | Dic株式会社 | Conductive adhesive tape |
| JP6930239B2 (en) * | 2017-06-15 | 2021-09-01 | Dic株式会社 | Conductive adhesive sheet |
| KR20190015652A (en) * | 2017-08-03 | 2019-02-14 | (주)트러스 | Conductive adhesive tape using compressible conductive powder and manufacturing method thereof |
| JP6506461B1 (en) | 2018-02-01 | 2019-04-24 | 積水化学工業株式会社 | Conductive adhesive tape |
| CN109796899A (en) * | 2018-12-25 | 2019-05-24 | 太仓金煜电子材料有限公司 | A kind of production method of ultra-thin conductive metal tape |
| JP7436191B2 (en) * | 2019-11-29 | 2024-02-21 | 日東電工株式会社 | adhesive sheet |
| JP7344812B2 (en) * | 2020-02-21 | 2023-09-14 | 株式会社巴川製紙所 | double-sided adhesive sheet |
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| CN101809105A (en) * | 2007-09-26 | 2010-08-18 | 日东电工株式会社 | Electroconductive pressure-sensitive adhesive tape |
| CN102725369A (en) * | 2010-01-26 | 2012-10-10 | 日东电工株式会社 | Conductive adhesive tape |
| CN103421439A (en) * | 2012-05-23 | 2013-12-04 | Dic株式会社 | Electtroconductive thin adhesive sheet |
| CN103666306A (en) * | 2012-09-13 | 2014-03-26 | Dic株式会社 | Bonding sheet, electromagnetic wave shielding sheet and electronic equipment |
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| JP2002212518A (en) * | 2001-01-18 | 2002-07-31 | Cosmo Tec:Kk | Anisotropic conductive adhesive sheet and electric and/or electronic element using the same |
| JP4403360B2 (en) | 2003-02-28 | 2010-01-27 | Ｄｉｃ株式会社 | Conductive adhesive sheet |
| JP2005277145A (en) * | 2004-03-25 | 2005-10-06 | Dainippon Ink & Chem Inc | Adhesive sheet for shielding electromagnetic wave |
| JP2010274546A (en) * | 2009-05-29 | 2010-12-09 | Kitagawa Ind Co Ltd | Metal film with adhesive and method for manufacturing the same |
| JP5899031B2 (en) * | 2012-04-06 | 2016-04-06 | 信越ポリマー株式会社 | Conductive adhesive sheet, method for producing the same, and printed wiring board |
| JP6098180B2 (en) * | 2013-01-18 | 2017-03-22 | Dic株式会社 | Conductive adhesive sheet |
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- 2014-11-13 CN CN201480060436.8A patent/CN105683320B/en active Active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101809105A (en) * | 2007-09-26 | 2010-08-18 | 日东电工株式会社 | Electroconductive pressure-sensitive adhesive tape |
| CN102725369A (en) * | 2010-01-26 | 2012-10-10 | 日东电工株式会社 | Conductive adhesive tape |
| CN103421439A (en) * | 2012-05-23 | 2013-12-04 | Dic株式会社 | Electtroconductive thin adhesive sheet |
| CN103666306A (en) * | 2012-09-13 | 2014-03-26 | Dic株式会社 | Bonding sheet, electromagnetic wave shielding sheet and electronic equipment |
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|---|---|
| KR101819529B1 (en) | 2018-01-17 |
| JPWO2015076174A1 (en) | 2017-03-16 |
| CN105683320A (en) | 2016-06-15 |
| WO2015076174A1 (en) | 2015-05-28 |
| JP5858317B2 (en) | 2016-02-10 |
| KR20160065907A (en) | 2016-06-09 |
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