CN105637285B - 具有封闭的光导和集成的热导的固态灯 - Google Patents

具有封闭的光导和集成的热导的固态灯 Download PDF

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CN105637285B
CN105637285B CN201480056554.1A CN201480056554A CN105637285B CN 105637285 B CN105637285 B CN 105637285B CN 201480056554 A CN201480056554 A CN 201480056554A CN 105637285 B CN105637285 B CN 105637285B
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light guide
lamp
thermal conductivity
light
light source
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CN105637285A (zh
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雷蒙德·P·约翰斯顿
查尔斯·N·德沃尔
马丁·J·沃斯
保罗·E·洪帕尔
罗伯特·L·布罗特
凯拉·A·麦克格拉斯
哈米德·R·莫尔塔扎维
詹姆斯·F·波奇
迈克尔·A·迈斯
蒂莫西·J·波默
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3M Innovative Properties Co
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/004—Reflecting paints; Signal paints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0096—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the lights guides being of the hollow type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Wood Science & Technology (AREA)
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Abstract

本发明提供了一种固态灯，其具有：诸如LED的固态灯源；具有封闭的内部体积(诸如球形形状)但无通气孔的光导；以及热导。光导耦合到光源以用于接收和分布来自光源的光。热导被至少部分地包含在内部体积内，使得热导的一部分与光导之间存在气隙。热导提供来自光源的热传导和通过对流及辐射进行的消散热以将灯冷却。

Description

具有封闭的光导和集成的热导的固态灯
背景技术
在工业、消费品和建筑照明应用中，照明的能量效率已成为重要的考量因素。随著固态灯技术的发展，发光二极管(LED)已变得比荧光灯更具能量效率。另外，市场对于白炽灯、荧光灯和高强度放电灯具有庞大的已建立的装置基础。由于LED的固有点光源特性，并且需要以相对低的温度操作，故这些类型的应用对于LED提出了重大的技术挑战。现今存在许多解决这些问题覆解决方案，包括风扇、散热片、散热管等等。然而，这些方法因增加复杂性、成本、效率损失、增加故障模式、不期望的形状系数和光照分布而限制了应用。仍需要寻找能以吸引人的制造成本和设计提供光学和电学效率以及装置使用寿命优点的解决方案。
发明内容
符合本发明的具有集成的光导和热导的灯包括光源、灯段、耦合到灯段的光导、和热导。所述光导具有第一表面和背对所述第一表面的第二表面以及在所述第一表面和所述第二表面之间的边缘。所述第二表面形成封闭的内部体积。所述光导与所述光源相连通以用于接收和分布来自所述光源的光，并且所述光在所述光导内传送，直到所述光从所述第一表面或所述第二表面离开为止。所述光源位于所述光导的所述边缘处，以便任选地使所述光光学地耦合到所述光导中。所述热导被至少部分地包含在所述内部体积内并与所述光导集成，用于提供来自所述光源的热传导以将所述灯冷却，并且在所述热导的至少一部分与所述光导的所述第二表面之间存在气隙。
附图说明
附图并入本说明书中并构成本说明书的一部分，它们连同具体实施方式阐明本发明的优点和原理。在这些附图中，
图1为组装好的固态灯的透视图；
图2为固态灯的分解透视图；
图3为固态灯的侧面剖视图；
图4为用于固态灯的灯段的透视图，并且其示出在安装于灯段内的柔性电路板上的LED；以及
图5为在安装于固态灯的灯段中之前的柔性电路板的图。
具体实施方式
本发明的实施例包括LED灯泡，该LED灯泡具有带有封闭的内部体积的光导，和被至少部分地包含在该内部体积内的热导。固态灯的示例在下列专利中有所描述，这些专利均如完全示出的那样以引用方式并入本文中：美国专利号8,487,518；和美国专利申请公布号2012/0194054和2011/0032708。
图1为组装好的固态灯10的透视图。图2和图3分别为固态灯10的分解透视图和侧面剖视图。灯10包括具有上部12和下部14的光导、灯段16、基座18和热导20。光导具有外表面31和形成封闭的内部体积的内表面32，这意味着光导不具有允许空气经光导进入到内部体积中的孔(通气孔)。外表面31和内表面32形成边缘33。内表面32可任选地具有光提取特征结构，如由特征结构13所表示，以便提供来自光导的均匀或特定的光分布。光提取特征结构13可包括例如在内表面32上的点或其它形状的经印刷的图案。只在内表面32上设置光提取特征结构13可为灯10提供平滑的外观和光导外表面31上的平滑触感。
电路板26包括多个光源27、诸如集成电路芯片的驱动电路28、连接器29和中性焊盘30。光源27位于由外表面31和内表面32形成的光导的边缘处，例如边缘33，以便任选地使光耦合到光导中。光例如以全内反射在光导中传送，直到光从外表面31、内表面32或两者引出为止。连接器29与引脚19电连接，以便接收来自功率源诸如灯插座的功率。任选地带有中性夹片的中性焊盘30与基座18电连接。
灯段16包括用于支撑光源27的脊部34和用于支撑与边缘33相邻的光导的外表面31的部分35。在一些实施例中，边缘33与光源27之间不存在气隙。例如，边缘33可直接紧贴光源27放置，或者光学粘合剂可在边缘33和光源27之间。反射环22和24可与光源27相邻并在光源的相对侧上，以便帮助将光从光源27耦合到光导中。反射环22和24可用反射膜实现。反射膜的示例是来自明尼苏达州圣保罗市3M公司(3M Company，St.Paul，Minnesota)的增强型镜面反射(ESR)膜产品。绝缘体17位于灯段16和基座18之间。在一些实施例中，灯段16在光导和基座18之间没有孔(通气孔)(见图1)。灯段16可任选地在其外表面上包括装饰性刻面或压痕15。
热导20被至少部分地包含在光导的内部体积内，用于提供来自光源27的热传导以将灯冷却。热导20具有用于放置在灯段16内的基座21和部分23。热导20可以变化的或不同的量延伸到光导的内部体积中，例如其可只是稍微延伸到内部体积中，或者几乎延伸穿过内部体积，或者以其它量延伸。热导与光导可具有机械干涉作用，以将光导保持在灯段16上。具体地，部分23可朝向光导轻微地成角度，以便使光导抵靠灯段16的部分35而保持在适当的位置。在一些实施例中，部分23和部分35可具有肋部或突出部来保持光导下部14与反射环22和24之间的小间隙。另选地，肋部或突出部可被放置在表面31和表面32上来保持光导下部14与反射环22和24之间的小气隙。热导20可封闭光导与灯段16之间的光导的内部体积，在这种情况下，内部体积被完全封闭以阻止空气(以及水分和微粒)从灯外进入到内部体积中。例如，基座21可与延伸到光导内部体积中的柱子一起实现为无孔(通气孔)，并且基座21可提供抵靠光导内表面32的周边密封。气隙在热导20的至少一部分与光导的内表面32之间形成。在一些实施例中，气隙在热导20与光导的内表面32之间基本上围绕热导20(见图2)。
图4为用于固态灯10的灯段16的透视图，其示出在安装于灯段16内的电路板26上的LED。图5为在安装于灯段16中之前的电路板26的图。在一些实施例中，电路板26可用柔性一体式材料实现且被折叠以安装在灯段16内。带有光源27的电路板26的部分可被折叠到脊部34上。包含驱动电路28的电路板26的部分可被折叠以延伸到灯段16的内部中。包含连接器29的电路板26的部分可被折叠以与引脚19电连接。连接器29可另选地具有不同的形状因数，以降低在电路板26中的折叠次数。中性焊盘30可围绕绝缘体17折叠以与基座18电连接。以这种方式，例如电路板26可被安装在灯内而无需单独的电连接器或电路板。中性焊盘30也可用于将热从电路板26传导至基座18以帮助使灯冷却。电路板26可另选地至少部分地由放置在脊部34上的带有LED的圆形(刚性的或非折叠的)板实现。
下面是用于本文所述固态灯的示例性材料、部件和构造。
光源可用LED、有机LED(OLED)或其他固态光源实现。灯可包括一个光源或多个光源。另外，灯可使用未封装的LED光源。
驱动电路可用能够接收来自功率源的功率并基于所接收的功率驱动光源的任何电路或部件实现。
电路板可用能够装配在灯内并支撑驱动电路、光源以及可能其它部件的任何柔性板实现。电路板可为例如单个柔性电路板来容纳那些部件并为它们建立电连接。电路板可另选地用刚性板或柔性板与刚性板的组合实现。
灯段可用例如金属材料诸如铝实现。灯段也可用其它金属材料、陶瓷材料、导热聚合物或此类材料的组合实现。灯段可充当散热器，并且灯段的尺寸可调节以消散特定量来自灯的热。灯段可具有圆或圆形形状(如图所示)或其它形状，这取决于例如光导的形状。
基座可用(例如)与常规灯泡插座一起使用的白炽灯基座、或被配置成用于连接到其他类型的灯具连接件的基座来实现。另选地，灯可被配置为不具有灯具接口(诸如白炽灯基座)的照明设备。
热导直接或间接地与光源充分接触，以便传导并消散来自光源的热。热导可与光源直接物理接触，或者与它们间接接触，诸如通过其它部件接触。热导可用金属材料诸如铝实现。热导也可用其它金属材料、陶瓷材料、导热聚合物或此类材料的组合实现。热导可以是中空的(如图所示)或者由实心材料组成，并且其可包括圆柱形柱子(如图所示)或具有至少部分地延伸到光导内部体积中的其它形状的其它柱子。例如，热导可被成型为人造长丝以类似于白炽光灯泡，或者可具有其它装饰性的形状或特征结构。热导可任选地具有反射涂层。
光导可用例如能够接收来自一个或多个固态光源的光并发射光的透明或半透明材料实现。例如，光导可由光学上合适的材料制成，诸如丙烯酸类树脂、聚碳酸酯、聚丙烯酸酯诸如聚甲基丙烯酸甲酯、聚苯乙烯、玻璃或具有充分高折射率的许多不同的塑性材料。可对材料进行例如浇铸或模制，以形成光导。可任选地抛光光导的表面。光导可任选地包括批量散射元件，诸如光导内的颗粒，以在光导被固态光源照射时提供柔性发光外观。
光导可由用例如粘合剂或机械扣合粘合在一起的多个部分组成。这些部分在使用时可永久性地粘合在一起或者可移除地附接在一起。另选地，光导可为单个一体件材料。光导可具有球形形状(如图所示)或其它形状，诸如球体、圆柱体、立方体、锥体或形成内部体积的其它形状。
光导可任选地渐缩。该任选的渐缩可包括光导完全渐缩为整个光导具有不一致的厚度，或者光导部分地渐缩为光导的一部分具有不一致的厚度并且另一部分具有一致的厚度。例如，光导或其一部分可在距灯段更远的部分处更薄。
光导可在其外表面上包括任选的涂层，诸如紫外线(UV)涂层。此外，光导或热导或两者可包含可含有光频率偏移发色团的基质材料，以获得更期望的显色指数，并且基质稳定染料的示例于美国专利号5,387,458中有所描述，其如全文所示以引用方式并入本文。另外，灯可在任何部件上包含这种基质材料，其中在所述部件处，来自光源的光与基质材料进行交互。

Claims (9)

1.一种具有集成的光导和热导的灯，所述灯包括：
光源；
灯段，所述灯段具有第一侧面和背对所述第一侧面的第二侧面；
光导，所述光导耦合到所述灯段的所述第二侧面，所述光导包括具有第一表面和背对所述第一表面的第二表面的材料以及在所述第一表面与所述第二表面之间的边缘，其中所述第二表面形成封闭的内部体积，所述光导与所述光源连通用于接收和分布来自所述光源的光，并且所述光在所述光导内传送直到所述光从所述第一表面或所述第二表面离开为止，其中所述光源位于所述光导的所述边缘处，以便任选地在所述边缘处使所述光光学地耦合到所述光导中；和
热导，所述热导被至少部分地包含在所述内部体积内并与所述光导集成，用于提供来自所述光源的热传导以冷却所述灯，其中在所述热导的至少一部分与所述光导的所述第二表面之间形成气隙，其中，所述热导可从所述灯段分离，所述热导与所述光导具有机械干涉作用，以便将所述光导保持在所述灯段上，并且所述机械干涉作用包括所述热导的抵靠所述灯段的所述第二表面放置并且使所述光导的所述第一表面抵靠所述灯段的一部分而保持的部分。
2.根据权利要求1所述的灯，其中所述光导包括在所述第二表面上的光提取特征结构。
3.根据权利要求1所述的灯，还包括在所述热导上的反射涂层。
4.根据权利要求1所述的灯，其中所述封闭的内部体积被封闭在所述光导和所述灯段之间。
5.根据权利要求1所述的灯，其中所述气隙在所述热导和所述光导的所述第二表面之间基本上围绕所述热导。
6.根据权利要求1所述的灯，其中所述灯段在所述第一侧面和所述第二侧面之间没有孔。
7.根据权利要求1所述的灯，还包括在所述光导的所述第一表面上的UV涂层。
8.根据权利要求1所述的灯，其中所述热导包括延伸到所述内部体积中的柱。
9.根据权利要求1所述的灯，还包括位于与所述光源相邻的所述灯段的所述第二侧面处的反射膜。
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