CN105622057A - 一种用于拼接轮廓图画的陶瓷板及配方工艺 - Google Patents
一种用于拼接轮廓图画的陶瓷板及配方工艺 Download PDFInfo
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Abstract
一种用于拼接轮廓图画的陶瓷板及配方工艺,拼接轮廓图画的陶瓷板由坯体层和釉面层构成,坯体层分为正面和粘接面,正面为平面而粘接面为有凹槽的凹凸面,坯体层的规格包括800mm×800mm和600mm×600mm两种,厚度为10mm,釉面层分为釉面底层、色彩层和釉面面层,釉面底层均匀覆盖在坯体层的正面,色彩层覆盖在釉面底层的上面,釉面面层覆盖在色彩层上面,釉面层的厚度至少为0.3mm;配方包括坯体层配方、釉面底层配方和釉面面层配方,工艺流程中的干压成型压力为280MPa,干燥温度为120℃~312℃,干燥周期为39min,烧成温度为上温1194℃,下温1191℃,烧成周期为48.2min。
Description
技术领域
本发明涉及一种陶瓷板,特别涉及一种用于拼接轮廓图画的陶瓷板及配方工艺,属陶瓷工业技术领域。
背景技术
陶瓷图画很多人已经很熟悉。传统的陶瓷图画是将许多片瓷砖拼合之后,然后再在瓷砖的釉面上根据图画的不同色彩结构,采用各种不同颜色的色釉进行作画,画作完成后在瓷砖的背面边编号边收起,经高温处理后一幅拼合式的陶瓷图画就算完成。还有一种陶瓷艺术作品即大型陶瓷轮廓图画,这种艺术作品对陶瓷板有特殊的要求,就是陶瓷板的表面不能有光泽而且颜色要稳定一致。。
发明内容
为了解决上述拼接轮廓图画对陶瓷板的特殊要求,本发明提供一种用于拼接轮廓图画的陶瓷板及配方工艺。
本发明所采用的技术方案是:一种用于拼接轮廓图画的陶瓷板及配方工艺,拼接轮廓图画的陶瓷板由坯体层和釉面层构成,坯体层分为正面和粘接面,正面为平面而粘接面为有凹槽的凹凸面,坯体层的规格包括800mm×800mm和600mm×600mm两种,厚度为10mm,釉面层分为釉面底层、色彩层和釉面面层,釉面底层均匀覆盖在坯体层的正面,色彩层覆盖在釉面底层的上面,釉面面层覆盖在色彩层上面,釉面层的厚度至少为0.3mm;配方包括坯体层配方、釉面底层配方和釉面面层配方,工艺流程中的干压成型压力为280MPa,干燥温度为120℃~312℃,干燥周期为39min,烧成温度为上温1194℃,下温1191℃,烧成周期为48.2min。
坯体层配方按重量百分比包括永安钠长石14.4%,大坪石米13.8%,龙海长石12.8%,漳平风化石11.3%,漳浦灰土8.88%,漳平长石块8.3%,大南白土7.89%,程溪水洗7%,江东水洗土6.0%,透辉石5%,宜春黑滑石2.5%,膨润土1%,腐植酸钠0.41%,硅酸钠0.41%,凹凸棒土0.3%,甲基纤维素0.01%。
釉面底层配方按重量百分比包括石英石42.2%,龙岩钠长石14.14%,星子高岭土10.7%,硅酸锆8.8%,方解石5.8%,煅烧高岭土5.8%,硅辉石3.8%,吉马球土3.2%,滑石粉2.9%,氧化锌2.2%,三聚磷酸钠0.4%,甲基纤维素0.06%。
釉面面层配方按重量百分比包括硅石31.3%,白熔块20.18%,锻烧高岭土15.5%,龙岩钠长石13.9%,吉马球土8.6%,烧滑石8.5%,氧化铝1.5%,三聚磷酸钠0.46%,甲基纤维素0.06%。
本发明的有益效果是:采用喷墨印色可以达到高标准的色彩效果,面釉为亚光釉即能凸显轮廓画的特殊艺术效果,在色彩层上面覆盖釉面面层能有效防止色彩层的风化等外界因素侵袭。
附图说明
下面结合附图对本发明进一步说明:
图1为本发明的横截面结构示意图。
图中1、坯体层,2、釉面底层,3、色彩层,4、釉面面层。
具体实施方式
在图1的实施例中,一种用于拼接轮廓图画的陶瓷板及配方工艺,拼接轮廓图画的陶瓷板由坯体层1和釉面层构成,坯体层1分为正面和粘接面,正面为平面而粘接面为有凹槽的凹凸面,坯体层1的规格包括800mm×800mm和600mm×600mm两种,厚度为10mm,釉面层分为釉面底层2、色彩层3和釉面面层4,釉面底层2均匀覆盖在坯体层1的正面,色彩层3覆盖在釉面底层2的上面,釉面面层4覆盖在色彩层3上面,釉面层的厚度至少为0.3mm;配方包括坯体层1配方、釉面底层2配方和釉面面层4配方,工艺流程中的干压成型压力为280MPa,干燥温度为120℃~312℃,干燥周期为39min,烧成温度为上温1194℃,下温1191℃,烧成周期为48.2min。
坯体层1配方包括永安钠长石14.4%,大坪石米13.8%,龙海长石12.8%,漳平风化石11.3%,漳浦灰土8.88%,漳平长石块8.3%,大南白土7.89%,程溪水洗7%,江东水洗土6.0%,透辉石5%,宜春黑滑石2.5%,膨润土1%,腐植酸钠0.41%,硅酸钠0.41%,凹凸棒土0.3%,甲基纤维素0.01%。
釉面底层2配方按重量百分比包括石英石42.2%,龙岩钠长石14.14%,星子高岭土10.7%,硅酸锆8.8%,方解石5.8%,煅烧高岭土5.8%,硅辉石3.8%,吉马球土3.2%,滑石粉2.9%,氧化锌2.2%,三聚磷酸钠0.4%,甲基纤维素0.06%。
釉面面层4配方按重量百分比包括硅石31.3%,白熔块20.18%,锻烧高岭土15.5%,龙岩钠长石13.9%,吉马球土8.6%,烧滑石8.5%,氧化铝1.5%,三聚磷酸钠0.46%,甲基纤维素0.06%。
实施例:首先按比例将原料配备好,再将原料加水投入到球磨机磨成高细度的泥浆,泥浆磨好后经过过筛除铁后送入粉料干燥塔进行喷雾干燥,将干燥后的粉料通过大型油压机在模具上干压成型,将成型后的大规格陶瓷板坯体送入烘干窑烘干;对达到一定干燥程度的陶瓷坯体进行施涂釉面底层2后进行色彩层3喷墨印色,再施涂釉面面层4。最后将完成前期工艺的拼接轮廓图画的陶瓷板坯体送入辊道窑烧制成包括坯体层1、釉面底层2、色彩层3和釉面面层4在内的拼接轮廓图画的陶瓷板,再经磨边分选打包后即可作为成品入库。
Claims (4)
1.一种用于拼接轮廓图画的陶瓷板及配方工艺,其特征是:拼接轮廓图画的陶瓷板由坯体层和釉面层构成,坯体层分为正面和粘接面,正面为平面而粘接面为有凹槽的凹凸面,坯体层的规格包括800mm×800mm和600mm×600mm两种,厚度为10mm,釉面层分为釉面底层、色彩层和釉面面层,釉面底层均匀覆盖在坯体层的正面,色彩层覆盖在釉面底层的上面,釉面面层覆盖在色彩层上面,釉面层的厚度至少为0.3mm;配方包括坯体层配方、釉面底层配方和釉面面层配方,工艺流程中的干压成型压力为280MPa,干燥温度为120℃~312℃,干燥周期为39min,烧成温度为上温1194℃,下温1191℃,烧成周期为48.2min。
2.根据权利要求1所述的一种用于拼接轮廓图画的陶瓷板及配方工艺,其特征是:所述的坯体层配方按重量百分比包括永安钠长石14.4%,大坪石米13.8%,龙海长石12.8%,漳平风化石11.3%,漳浦灰土8.88%,漳平长石块8.3%,大南白土7.89%,程溪水洗7%,江东水洗土6.0%,透辉石5%,宜春黑滑石2.5%,膨润土1%,腐植酸钠0.41%,硅酸钠0.41%,凹凸棒土0.3%,甲基纤维素0.01%。
3.根据权利要求1所述的一种用于拼接轮廓图画的陶瓷板及配方工艺,其特征是:所述的釉面底层配方按重量百分比包括石英石42.2%,龙岩钠长石14.14%,星子高岭土10.7%,硅酸锆8.8%,方解石5.8%,煅烧高岭土5.8%,硅辉石3.8%,吉马球土3.2%,滑石粉2.9%,氧化锌2.2%,三聚磷酸钠0.4%,甲基纤维素0.06%。
4.根据权利要求1所述的一种用于拼接轮廓图画的陶瓷板及配方工艺,其特征是:所述的釉面面层配方按重量百分比包括硅石31.3%,白熔块20.18%,锻烧高岭土15.5%,龙岩钠长石13.9%,吉马球土8.6%,烧滑石8.5%,氧化铝1.5%,三聚磷酸钠0.46%,甲基纤维素0.06%。
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CN107555978A (zh) * | 2017-08-03 | 2018-01-09 | 福建省晋江万利瓷业有限公司 | 一种挤压成型的厚陶板及制备工艺 |
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