CN105601093A - Scribing method and scribing device - Google Patents
Scribing method and scribing device Download PDFInfo
- Publication number
- CN105601093A CN105601093A CN201510778518.2A CN201510778518A CN105601093A CN 105601093 A CN105601093 A CN 105601093A CN 201510778518 A CN201510778518 A CN 201510778518A CN 105601093 A CN105601093 A CN 105601093A
- Authority
- CN
- China
- Prior art keywords
- glass substrate
- scribing
- resin sheet
- absorptive table
- preset lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention provides a scribing method and a scribing device, which can form a cut crack with high precision with laser scribing even for a relatively thin membrane like glass substrate. The scribing method is characterized in that the surface of a glass substrate (M) sucked to a suction table (1) is heated along a scribing preset line by using laser and a refrigerant is used for shock cooling of the heated area, and thus the trigger formed at the starting portion of the scribing preset line advances because of the thermal pressure generated in the glass substrate (M) and the cut crack (S) along the scribing preset line is generated on the surface of the glass substrate (M); a porous plate (3) with a pore diameter of 1-10 microns and the pore rate of 10-40% forms the suction surface of the suction table (1) and the glass substrate (M) is bonded to a resin sheet (20); with the resin sheet (20) as the lower side, the glass substrate (M) sucked and retained on the suction table (1); the laser scribing is performed in the state, and thus a crack (S) along the scribing preset line is formed.
Description
Technical field
The present invention relates to the delineation of processing slight crack for disjunction (crackle) on a kind of glass sheet substrate comprising alkali-free glass etc.Method and scoring device. Especially the present invention relates to a kind of to for the flat board such as liquid crystal display or plasma scopeRose method and scoring device that the glass sheet substrate of display (FPD) is delineated.
Background technology
All the time, known following a kind of technology: use laser grooving and scribing method, for example as patent documentation 1 to glass-basedPlate processing edge disconnects the slight crack for disjunction (crackle) of preset lines, or as patent documentation 2, carries out complete disjunction and (entirely cut(fullcut) processing), described laser grooving and scribing method is that illuminating laser beam scans on one side on one side, makes substrate produce thermal stress and dividesCloth and the method for delineating.
Laser grooving and scribing method is up to now on the absorptive table with multiple suction holes, load glass substrate and it is fixed,Use CO2Laser or YAG (YttriumAluminumGarnet, Yttrium-Aluminium-Garnet) laser etc. are along delineation preset linesThe near surface of glass substrate is scanned to heating, and thereupon from the nozzle of cooling body to heating region injected coolMatchmaker. Thus, produce compression stress by the heating of first implementing, produce tensile stress by the quenching of then implementing,Utilize the thermal stress distribution being produced by described compression stress and described tensile stress, initial slight crack (triggering) is made progress and at glassThe surface of glass substrate produces disjunction slight crack, or makes slight crack permeate whole thickness and entirely cut processing.
The absorptive table that keeps glass substrate about absorption in the time delineating, has by have multiple machining of passing through on metallic plateAnd the absorptive table that the metallic plate of SS of making forms and using has the porous scutums such as the pottery of multiple pores andThe absorptive table forming, in the time carrying out laser grooving and scribing, absorptive table utilization suction air aspirates and keeps glass substrate. SoAnd, in recent years, because lightweight or the slimming of the image displays such as smart mobile phone are sent out the thin-walled property of glass substrateExhibition, requires for example film-form glass substrate below 0.2mm, if utilize absorptive table to adsorb the glass-based of this thin-walledPlate, can produce following problem so and be difficult to carry out laser grooving and scribing.
The aperture of the SS of metal platform in the past is generally about 1～2mm, and the aperture of the pore of Porous platform is less than 1～2Mm, forms with approximately 50～60 μ m. If the peristome that makes glass substrate be adsorbed on this SS or pore carries out laserDelineation, is having between the position of peristome 21 and the par 22 of imperforation portion 21 so as shown in FIG. 6, because ofHave or not the variation of the heat radiation that touches absorptive table 23 and cause can cause the thermal stress generation in glass substrate M poor. This heatMore obvious in the thin glass substrate of the difference of stress below 0.2mm, thereby cannot spread all over, to delineate the total length of preset lines equalDeng real estate heat-dissipating stress, slight crack not exclusively or produce uneven and cannot precision carry out well laser grooving and scribing.
In addition, tackle described heat dissipation problem, in patent documentation 3, disclose a kind of following method: from glass substrateSide's blow air and glass substrate is floated, is remaining on glass substrate under the state on absorptive table in non-contacting modeCarry out laser grooving and scribing.
But the method for patent documentation 3 is because be from below blow air, glass substrate to be floated, so compare glassGlass substrate is unstable to connect airtight the method keeping in the posture absorption of absorptive table. Especially the thin glass below 0.2mmGlass substrate, the bending or phenomenon of generation as playing wave upward, so be difficult to flatly keep. And, sometimesIn delineation process, air can spill upward from the gap of the slight crack of disjunction, causes glass substrate vibration and makes a point sectionBe in contact with one another, thereby cause producing defective work dividing section generation breach or irregular slight crack to extend.
Therefore, a kind of following method is disclosed in patent documentation 4: glass substrate (glass-film) is sticked on resin sheet,By the below blow air from resin sheet, resin sheet is floated together with glass substrate, and carry out laser grooving and scribing.
[background technology document]
[patent documentation]
[patent documentation 1] international publication number WO2003/008352 communique
[patent documentation 2] Japanese Patent Laid-Open 2001-170786 communique
[patent documentation 3] Japanese Patent Laid-Open 2007-246298 communique
[patent documentation 4] international publication number WO2012/011445 communique
Summary of the invention
[problem that invention will solve]
According to the method for patent documentation 4, utilize resin sheet that air can not spilt upward in delineation process, thus energyEnough solution spills the described problem causing because of air. But, make to keep glass substrate owing to utilizing from the air of belowResin sheet float and carry out laser grooving and scribing, and resin sheet has pliability, so there is the level maintenance side of glass substrateStill there is the problems such as unstability in face. Especially the thin glass substrate below 0.2mm, even if slight curving, by addingThermal stress hot or cooling and that produce also can be relaxed, and the success or not of laser grooving and scribing is produced to significant impact, so difficultSo that thin glass substrate is utilized to which.
Therefore, the object of the present invention is to provide a kind of rose method and scoring device, even if below 0.2mmThe membranaceous glass substrate of thinner thickness, also can utilize laser grooving and scribing precision to form well disjunction slight crack.
[technological means of dealing with problems]
In order to reach described object, take in the present invention following technological means. , the invention is characterized in: provideA kind of rose method, it is to use laser along delineation preset lines, the surface that is adsorbed on the glass substrate on absorptive table to be carried outHeating, and utilize refrigerant to make this heating region quenching, utilize thus the thermal stress producing in described glass substrate to make shapeBecome the triggering progress in the beginning portion of described delineation preset lines, thereby produce along described delineation on the surface of described glass substrateThe disjunction slight crack of preset lines; And by thering is the porous that hole diameter is 1～10 μ m, the porosity pore that is 10～40%Scutum forms the adsorption plane of described absorptive table, described glass substrate sticked on resin sheet, and taking this resin sheet as downside,The absorption of described glass substrate is remained on described Porous absorptive table, under this state, carries out laser grooving and scribing, thus alongDescribed delineation preset lines forms described slight crack.
Described resin sheet be preferably by tolerating temperature rise because irradiating the glass that causes of laser and thickness be 50～The soft material of 200 μ m forms.
And feature of the present invention is also: a kind of scoring device is provided, and it is to use laser along delineation preset lines pairHeat on the surface that is adsorbed on the glass substrate on absorptive table, and utilize refrigerant to make this heating region quenching, thus profitMake the triggering progress of the beginning portion that is formed on described delineation preset lines by the thermal stress producing in described glass substrate, therebySurface at described glass substrate produces the disjunction slight crack along described delineation preset lines; The adsorption plane of described absorptive table is by toolHaving hole diameter is that the porous scutum of 1～10 μ m, the porosity pore that is 10～40% forms, described glass substrate be withFollowing mode forms, that is, is secured on resin sheet, and so that described in the state absorption that this resin sheet is downside remains onPorous absorptive table.
[effect of invention]
According to the present invention, because the hole diameter of Porous absorptive table is little of 1～10 μ m, so the peristome of this pore,And the position of pore-free peristome downwards heat radiation difference diminish, the heat producing in glass substrate in laser scanning processThe difference of stress exists hardly. Thus, can spread all over the total length of delineating preset lines and produce equably thermal stress, thus canWithout fitly forming unevenly slight crack.
And then, in addition, in the present invention, put between absorptive table and glass substrate by resin sheet is situated between, and have as followsTexts: directly aspirate compared with the situation of glass substrate with making absorptive table, glass substrate utilization produces in the time of laser grooving and scribingThermal stress and want the free degree of the power of opening to the left and right as boundary line taking slight crack to uprise, and can promote the formation of slight crack,Be thin glass substrate, also can positively form slight crack.
Brief description of the drawings
Fig. 1 makes the summary front view of expression for an embodiment of the scoring device of the inventive method.
Fig. 2 is the cutaway view that represents the absorptive table in the present invention.
Fig. 3 is the stereogram of the state on the absorptive table that represents to make glass substrate Jie be adsorbed on Fig. 2 every resin sheet.
Fig. 4 a, Fig. 4 b are the key diagrams of the effect of the state of Fig. 3.
Fig. 5 a is the table that is illustrated in the laser grooving and scribing experimental result in the situation of not pasting resin sheet on glass substrate.
Fig. 5 b is the table that is illustrated in the laser grooving and scribing experimental result in the situation of pasting resin sheet on glass substrate.
Fig. 6 is adsorbed on absorptive table glass substrate and the key diagram that carries out the problem in the past in the situation of laser grooving and scribing.
Detailed description of the invention
Below, the embodiment based on shown in figure describes details of the present invention. In the present embodiment,As the glass substrate of delineation object, the membranaceous alkali-free glass plate that used thickness is 0.03～0.2mm.
Fig. 1 represents the scoring device A for the inventive method, and scoring device A possesses mounting and adsorbs maintenance glass-basedThe absorptive table 1 of plate M.
As shown in Figure 2, the adsorption plane of absorptive table 1 is formed by the porous such as pottery or the carbon scutum 3 with multiple pores. ManyHole scutum 3 is kept by frame material 4, and is formed as by utilizing suction pump P to aspirate the chamber 5 that is formed on below, and at gasThe peristome in hole produces suction force, thereby absorption keeps glass substrate M.
The hole diameter that is preferably porous scutum 3 forms with 1～10 μ m, and the porosity forms with 10～40%, in this realityExecute in example, hole diameter forms with 5 μ m, and the porosity is with 35% formation.
And absorptive table 1 can be upper mobile in Y-direction (fore-and-aft direction of Fig. 1) along the track of level 6, and by profitWith motor (not shown), the screw shaft 7 of rotation drives.
And then absorptive table 1 can utilize the rotary driving part 8 of built-in motor and turn in horizontal plane.
Bridge portion 11 to be to arrange across the mode on absorptive table 1, and this bridge portion 11 comprises across absorptive table 1 and the both sides that arrangeSupport column 9,9 and along the horizontally extending crossbeam of directions X (horizontal wattle) 10. Arranging along directions X water at crossbeam 10The flat guiding element 12 extending. At this guiding element 12, engraving head 15 is installed, this engraving head 15 comprises for carrying out laser grooving and scribingLaser irradiating part 13 and make just to irradiate the coolant injection nozzle 14 of the heating part quenching after laser.
And then, at guiding element 12, engraving head 17 being set, this engraving head 17 is predetermined to being used in the delineation of glass substrate MThe cutting wheel 16 that the beginning part processing of line triggers (initial slight crack) keeps. Engraving head 15,17 can utilize with horseReaching 18 travel mechanisms as drive source (not shown) moves on directions X along guiding element 12.
The laser irradiating from laser irradiating part 13 can use CO2Laser or YAG laser etc.
Next, the rose method of the present invention that uses described device is described.
First, glass substrate M is sticked on resin sheet 20, and so that the state that this resin sheet 20 is downside load alsoAbsorption remains on the absorptive table 1 with porous scutum 3. Resin sheet 20 is preferably following resin sheet, that is, and and Neng GounaiBe subject to the temperature rise because irradiating the glass that causes of laser, and be selected from soft material, for example polyethylene, polyvinyl chloride,The fluoropolymer resin such as polypropylene, polyester, and thickness is 50～200 μ m.
And, before carrying out laser grooving and scribing, first become the part profit of the front end of delineation preset lines on glass substrate M surfaceWith cutting wheel 16 processing triggerings (initial slight crack). The processing of this triggering is to enter slightly to the inside from the ora terminalis of glass substrate MThe position entering, by making cutting wheel 16 decline and form towards the surface of glass substrate M. As be used for processing triggerCutting wheel 16, for example, is preferably and uses the cutting with groove that is alternately forming groove (otch) and point of a knife along circumference crest lineCut wheel.
Then, as shown in Figure 3, taking described triggering as starting point, swash from laser irradiating part 13 scannings along delineation preset linesLight and heating, and spray refrigerant from coolant injection nozzle 14 to heating region thereupon. Thus, utilize by firstThe heating of implementing and the compression stress that produces and drawing of producing on the surface of glass substrate M by the quenching of then implementingStretch stress, forming to trigger along delineation preset lines is the disjunction slight crack S of starting point. Now, because glass substrate M is(be situated between every resin sheet 20 and) is adsorbed on absorptive table 1, thus can tensile stress be relaxed because glass substrate M is bending,The tensile stress that the surface of glass substrate M produces is used for forming slight crack S specially.
In the time carrying out this laser grooving and scribing, because the hole diameter of the porous scutum 3 of absorptive table 1 is little to 5 μ m, so porePeristome and the difference of heat radiation downwards at the position of pore-free peristome diminish, glass substrate M in laser scanning processThe difference of interior produced thermal stress exists hardly. Thus, can spread all over the total length of delineating preset lines produce equably heat shouldPower, thus can be without fitly forming unevenly slight crack S.
Especially put between absorptive table 1 and glass substrate M by resin sheet 20 is situated between, and can obtain following effect.
Fig. 4 a is situated between resin sheet 20 to put the figure between absorptive table 1 and glass substrate M, and Fig. 4 b makes glass substrateM is directly adsorbed on the figure on absorptive table 1.
In Fig. 4 a, resin sheet 20 is because the absorption affinity of absorptive table 1 is strongly aspirated as shown in arrow downKeep, under this state, by laser grooving and scribing by glass substrate M heating and cooling, thereby utilize thermal stress in glass-basedPlate M forms slight crack S. Now, taking slight crack S as boundary line, as shown in arrow, want the masterpiece of opening to be to the left and right used inGlass substrate M, but because Jie is putting resin sheet 20 between glass substrate M and absorptive table 1, thus with the glass of Fig. 4 bThe situation that glass substrate M is directly aspirated is compared, and the direction that glass substrate M opens to slight crack S centered by slight crack S becomesThe free degree of shape uprises, thereby promotes the formation of slight crack S.
Fig. 5 represents that glass substrate M is directly adsorbed on to have the absorptive table that hole diameter is the porous scutum 3 of 5 μ m(Fig. 5 a) and be situated between and put resin sheet 20 and make the situation (laser incising of Fig. 5 under b) of glass substrate M absorption for situation on 1The table of the experimental result of drawing. The people such as inventor change respectively output and the sweep speed of laser, and thick by glass substrate MDegree is made as 0.145mm, 0.1mm, 0.07mm and tests. Glass substrate M uses alkali-free glass, andFrequency of utilization is the laser of 25kHz. In addition the part representing with hachure in figure, represents normally forming slight crackRegion.
The result of experiment is that the in the situation that of Fig. 5 a, the normal region part representing with hachure is less, especially thickDegree when the 0.07mm, does not almost normally form slight crack, with respect to this, the in the situation that of Fig. 5 b, comprise the thinnestThe glass substrate of 0.07mm in interior all experiments were, can normally form slight crack on a large scale. Think this be because,The free degree of the Direction distortion that glass substrate M when described laser grooving and scribing opens to slight crack S uprises, the cracking of slight crack SBecome easy.
In addition, in the present embodiment, the slight crack S forming by laser grooving and scribing is not complete disjunction, but with glass-based80～95% the degree of depth of the thickness entirety of plate M is as desired value, but also can make slight crack S infiltration thickness entirety and completeFull disjunction.
Above, representative embodiment of the present invention is illustrated, but the present invention is not necessarily specifically for described embodiment,Can suitably revise, change reaching object of the present invention and do not depart from the scope of claims.
[industrial utilizability]
On the thin glass substrate that it is 0.03～0.2mm and so on that the present invention is mainly used at thickness, form swashing of disjunction slight crackPhotoetching is drawn.
[explanation of symbol]
A scoring device
M glass substrate
S slight crack
1 absorptive table
3 porous scutums
13 laser irradiating parts
14 coolant injection nozzles
20 resin sheets
Claims (4)
1. a rose method, is characterized in that: use laser along delineating preset lines to being adsorbed on the glass-based on absorptive tableHeat on the surface of plate, and utilize refrigerant to make this heating region quenching, utilizes thus institute in described glass substrateThe thermal stress producing makes the triggering progress of the beginning portion that is formed on described delineation preset lines,
Thereby the surface at described glass substrate produces the disjunction slight crack along described delineation preset lines; And
Be described in the porous scutum of 1～10 μ m, the porosity pore that is 10～40% forms by thering is hole diameterThe adsorption plane of absorptive table,
Described glass substrate is sticked on resin sheet, taking this resin sheet as downside, described glass substrate absorption is protectedBe held on the absorptive table of described Porous, under this state, carry out laser grooving and scribing, thus along described delineation preset linesForm described slight crack.
2. rose method according to claim 1, the material of wherein said resin sheet be selected from polyethylene, polyvinyl chloride,The fluoropolymer resin of polypropylene, polyester, and thickness is 50～200 μ m.
3. rose method according to claim 1 and 2, the thickness of wherein said glass substrate is 0.03～0.2mm.
4. a scoring device, uses laser along delineation preset lines, the surface that is adsorbed on the glass substrate on absorptive table to be carried outHeating, and utilize refrigerant to make this heating region quenching, utilize thus the thermal stress producing in described glass substrateMake the triggering progress of the beginning portion that is formed on described delineation preset lines,
Thereby the surface at described glass substrate produces the disjunction slight crack along described delineation preset lines; And
The adsorption plane of described absorptive table is the pore that 1～10 μ m, the porosity are 10～40% by having hole diameterPorous scutum form,
Described glass substrate forms as follows, that is, is secured on resin sheet, and so that under this resin sheet isThe state absorption of side remains on described Porous absorptive table.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-230342 | 2014-11-13 | ||
| JP2014230342 | 2014-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105601093A true CN105601093A (en) | 2016-05-25 |
Family
ID=55981525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510778518.2A Withdrawn CN105601093A (en) | 2014-11-13 | 2015-11-13 | Scribing method and scribing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016102048A (en) |
| KR (1) | KR20160057334A (en) |
| CN (1) | CN105601093A (en) |
| TW (1) | TW201623173A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6924379B2 (en) * | 2017-09-08 | 2021-08-25 | 日本電気硝子株式会社 | Glass film manufacturing method |
| JP7143021B2 (en) * | 2018-07-09 | 2022-09-28 | 株式会社ディスコ | POROUS CHUCK TABLE, POROUS CHUCK TABLE MANUFACTURING METHOD, AND PROCESSING APPARATUS |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001170786A (en) * | 1999-12-10 | 2001-06-26 | Hitachi Cable Ltd | Method and device for machining substrate of non- metallic material |
| CN101032843A (en) * | 2006-03-07 | 2007-09-12 | 株式会社迪斯科 | Wafer division method |
| JP2007290304A (en) * | 2006-04-27 | 2007-11-08 | Casio Comput Co Ltd | Dividing method of brittle sheet material and its device |
| CN101809718A (en) * | 2007-12-20 | 2010-08-18 | 立山机械股份有限公司 | Sticking method and sticking device of sticking material |
| CN101927402A (en) * | 2009-06-17 | 2010-12-29 | 三星钻石工业股份有限公司 | Method for cutting off brittle material substrate |
| CN101959814A (en) * | 2008-02-29 | 2011-01-26 | 旭硝子株式会社 | Glass substrate suction table, and method for processing of glass substrate |
| JP2012025614A (en) * | 2010-07-22 | 2012-02-09 | Nippon Electric Glass Co Ltd | Method for cleaving glass film, method for manufacturing glass roll, and apparatus for cleaving glass film cleaving apparatus for glass film |
| CN102964059A (en) * | 2011-08-30 | 2013-03-13 | 三星钻石工业股份有限公司 | Glass substrate scribing method and processing device |
-
2015
- 2015-10-23 JP JP2015208748A patent/JP2016102048A/en active Pending
- 2015-11-12 KR KR1020150158798A patent/KR20160057334A/en unknown
- 2015-11-13 CN CN201510778518.2A patent/CN105601093A/en not_active Withdrawn
- 2015-11-13 TW TW104137599A patent/TW201623173A/en unknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001170786A (en) * | 1999-12-10 | 2001-06-26 | Hitachi Cable Ltd | Method and device for machining substrate of non- metallic material |
| CN101032843A (en) * | 2006-03-07 | 2007-09-12 | 株式会社迪斯科 | Wafer division method |
| JP2007290304A (en) * | 2006-04-27 | 2007-11-08 | Casio Comput Co Ltd | Dividing method of brittle sheet material and its device |
| CN101809718A (en) * | 2007-12-20 | 2010-08-18 | 立山机械股份有限公司 | Sticking method and sticking device of sticking material |
| CN101959814A (en) * | 2008-02-29 | 2011-01-26 | 旭硝子株式会社 | Glass substrate suction table, and method for processing of glass substrate |
| CN101927402A (en) * | 2009-06-17 | 2010-12-29 | 三星钻石工业股份有限公司 | Method for cutting off brittle material substrate |
| JP2012025614A (en) * | 2010-07-22 | 2012-02-09 | Nippon Electric Glass Co Ltd | Method for cleaving glass film, method for manufacturing glass roll, and apparatus for cleaving glass film cleaving apparatus for glass film |
| CN102964059A (en) * | 2011-08-30 | 2013-03-13 | 三星钻石工业股份有限公司 | Glass substrate scribing method and processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016102048A (en) | 2016-06-02 |
| KR20160057334A (en) | 2016-05-23 |
| TW201623173A (en) | 2016-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI573186B (en) | Methods and apparatus for machining strengthened glass and articles produced thereby | |
| JP6032464B2 (en) | Laminate cutting method | |
| US9260337B2 (en) | Methods and apparatus for free-shape cutting of flexible thin glass | |
| TWI491573B (en) | Method for scribing a glass board and a processing device | |
| KR101467157B1 (en) | Scribe method for brittle material substrate | |
| CN1468695A (en) | Marking method and marking apparatus | |
| JP5888158B2 (en) | Cleaving method of glass film | |
| CN105461207A (en) | Cutting method and cutting device | |
| KR101073459B1 (en) | Method for processing terminal of bonded substrate | |
| CN1264768C (en) | Device and method for scribing fragile material substrate | |
| JP2015209357A (en) | Break method and break device | |
| JP2015223589A (en) | METHOD FOR PRODUCTION OF SiC PLATE-LIKE WORKPIECE | |
| CN105601093A (en) | Scribing method and scribing device | |
| JP2017014031A (en) | Scribe method and scribe device | |
| TWI532693B (en) | Processing method for brittle material substrate | |
| JP2010089143A (en) | Method and device for cutting brittle material substrate | |
| JP2017014032A (en) | Scribe method and scribe device | |
| JP2010116272A (en) | Glass substrate cutting device and glass substrate cutting method | |
| KR20160049207A (en) | Method for processing substrate using laser | |
| JP2019156651A (en) | Glass substrate cutting device and production method of liquid crystal panel using the same | |
| JP2015160769A (en) | Method of cutting glass substrate | |
| JP2011183434A (en) | Laser beam machining method | |
| JP5993684B2 (en) | Method for dividing brittle material substrate and scribing apparatus | |
| KR20150003780U (en) | Laminated glass | |
| JP2014177369A (en) | Manufacturing method of tempered glass member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20160525 |
|
| WW01 | Invention patent application withdrawn after publication |