TWI532693B - Processing method for brittle material substrate - Google Patents

Processing method for brittle material substrate Download PDF

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TWI532693B
TWI532693B TW101113560A TW101113560A TWI532693B TW I532693 B TWI532693 B TW I532693B TW 101113560 A TW101113560 A TW 101113560A TW 101113560 A TW101113560 A TW 101113560A TW I532693 B TWI532693 B TW I532693B
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laser light
pulsed laser
substrate
processing
brittle material
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TW101113560A
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TW201247575A (en
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福原健司
岡本浩和
荒川美紀
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三星鑽石工業股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Description

脆性材料基板的加工方法 Method for processing brittle material substrate

本發明係關於一種脆性材料基板的加工方法，特別是關於用以將脈衝雷射(pulsed laser)光沿著格子狀的切割預定線照射至脆性材料基板，並切斷脆性材料基板的加工方法。 The present invention relates to a method of processing a brittle material substrate, and more particularly to a processing method for irradiating pulsed laser light onto a brittle material substrate along a grid-shaped cutting line and cutting the brittle material substrate.

以將液晶顯示器等所使用之玻璃予以加工之方法而言，例如有一種於專利文獻1所揭示之方法。該專利文獻所揭示之方法，係為使用紫外線區域作為脈衝雷射，並以在各照射部位的脈衝數之合計成為2667至8000脈衝數的範圍之方式，一面使脈衝雷射相對移動而一面照射，並於玻璃厚度之1.8至6.3%的深度形成切割(scribe)溝者。 For the method of processing a glass used for a liquid crystal display or the like, for example, there is a method disclosed in Patent Document 1. In the method disclosed in the patent document, the ultraviolet region is used as a pulsed laser, and the pulse laser is relatively moved while being irradiated in a range of 2,667 to 8,000 pulses in total in the number of pulses of each irradiation portion. And forming a scribe groove at a depth of 1.8 to 6.3% of the thickness of the glass.

藉由該專利文獻1所揭示之方法來切斷玻璃，即使在形成交叉之切割溝時，亦不需要繁雜的作業。 By cutting the glass by the method disclosed in Patent Document 1, even when forming the intersecting cutting grooves, complicated work is not required.

(專利文獻) (Patent Literature)

(專利文獻1) (Patent Document 1)

日本特開2005-314127號公報 Japanese Special Publication 2005-314127

最近之觸控面板(touch panel)等所使用之玻璃，使用線膨脹係數較無鹼玻璃(non-alkali glass)大的玻璃的情況為多。於此種玻璃形成格子狀的切割溝(cross scribe)，並切斷時，在習知的方法中，會產生缺陷而無法 進行良好的切斷。具體而言，於第1方向形成第1切割溝，且在其後於與第1方向正交之第2方向形成第2切割溝之情況，在第2切割溝之形成時，熱雖會欲傳播至周圍，但熱的傳達會被第1切割溝遮斷，特別是在第1切割溝與第2切割溝之交點部份會殘留大的內部應力。因為該熱影響而會隨著時間經過產生缺陷，並於切斷時在端面產生毛邊或缺口。 Recently, glass used for a touch panel or the like has a large amount of glass having a larger coefficient of linear expansion than non-alkali glass. When such a glass is formed into a lattice-shaped cutting groove and cut, in the conventional method, defects are generated and cannot be formed. Make a good cut. Specifically, when the first dicing groove is formed in the first direction and the second dicing groove is formed in the second direction orthogonal to the first direction, the heat is likely to be formed when the second dicing groove is formed. It spreads to the surroundings, but the heat is blocked by the first cutting groove, and in particular, a large internal stress remains at the intersection of the first cutting groove and the second cutting groove. Because of this heat effect, defects occur over time, and burrs or nicks are formed on the end faces when cutting.

本發明之課題係在於線膨脹係數較大之脆性材料基板形成格子狀的切割溝，並予以切斷時減少切斷不良。 An object of the present invention is to form a lattice-shaped cutting groove in a brittle material substrate having a large linear expansion coefficient, and to reduce cutting failure when cutting.

關於第1發明之脆性材料基板的加工方法，係為用以將脈衝雷射光沿著格子狀之切斷預定線照射至脆性材料基板，並切斷脆性材料基板之加工方法，係包含第1步驟、第2步驟、及第3步驟。第1步驟係沿著朝第1方向延伸之切斷預定線掃描脈衝雷射光，並於基板表面形成第1切割溝。第2步驟係於形成第1切割溝之後，沿著朝與第1方向正交之第2方向延伸的切斷預定線，以不使脈衝雷射光重疊且使脈衝雷射光對基板所造成之加工痕重疊的方式，照射脈衝雷射光，並於基板表面形成第2切割溝。第3步驟係按壓各切割溝的兩側而沿著各切割溝切斷基板。 The method for processing a brittle material substrate according to the first aspect of the invention is a method for processing a pulsed laser beam to a brittle material substrate along a grid-shaped cutting line and cutting the brittle material substrate, and the first step is included , the second step, and the third step. In the first step, the pulsed laser light is scanned along a line to cut extending in the first direction, and a first dicing groove is formed on the surface of the substrate. In the second step, after the first dicing groove is formed, the laser beam is irradiated to the substrate without overlapping the pulsed laser light along the line to cut extending in the second direction orthogonal to the first direction. The pattern of the marks overlaps, and the pulsed laser light is irradiated to form a second dicing groove on the surface of the substrate. In the third step, the both sides of each of the cutting grooves are pressed to cut the substrate along each of the cutting grooves.

在此，首先，使脈衝雷射光沿著朝第1方向延伸之切斷預定線掃描，形成第1切割溝於基板表面。接著，沿著朝第2方向延伸之切斷預定線，以不使脈衝雷射光重疊且使脈衝雷射光對基板所造成之加工痕重疊的方式，照射脈 衝雷射光，並形成第2切割溝。在如同以上方式進行而形成各切割溝之後，按壓各切割溝的兩側來切斷基板。 Here, first, the pulsed laser light is scanned along a line to cut extending in the first direction to form a first dicing groove on the surface of the substrate. Then, along the line to cut extending in the second direction, the pulse is irradiated without overlapping the pulsed laser light and overlapping the processing marks caused by the pulsed laser light on the substrate. The laser is fired and a second cutting groove is formed. After each of the dicing grooves is formed as described above, the both sides of each dicing groove are pressed to cut the substrate.

在以上的加工方法中，相較於以習知之加工方法的方式使脈衝雷射光重疊而形成切割溝的情況，較能抑制對基板的熱影響。因此，即使在基板切斷後時間經過，亦難以產生缺陷。亦即，能減少切斷不良。 In the above processing method, the thermal influence on the substrate can be suppressed more than when the pulsed laser light is superimposed to form a dicing groove by a conventional processing method. Therefore, even if the time passes after the substrate is cut, it is difficult to cause defects. That is, it is possible to reduce the poor cutting.

關於第2發明之脆性材料基板的加工方法，係為於第1發明之加工方法中，在第1步驟中，係沿著切斷預定線，以不使脈衝雷射光重疊且使脈衝雷射光對基板所造成之加工痕重疊的方式，照射脈衝雷射光。 In the processing method of the first aspect of the invention, in the processing method according to the first aspect of the invention, in the first step, the pulsed laser beam is not overlapped and the pulsed laser light is paired along the line to cut. The pulsed laser light is irradiated in such a manner that the processing marks caused by the substrate overlap.

在此，不僅於第2切割溝之形成時，於第1切割溝形成時，亦以不使脈衝雷射光重疊且使脈衝雷射光對基板所造成之加工痕重疊的方式，照射脈衝雷射光。因此，能更加抑制對基板的熱影響，並能進一步使切斷不良變小。 Here, not only when the first dicing groove is formed, but also when the first dicing groove is formed, the pulsed laser light is irradiated so as not to overlap the pulsed laser light and to overlap the processing marks caused by the pulsed laser light on the substrate. Therefore, the thermal influence on the substrate can be further suppressed, and the cutting failure can be further reduced.

關於第3發明之脆性材料基板的加工方法，係為於第1或第2發明之加工方法中，脆性材料基板係為線膨脹係數較無鹼玻璃為大之玻璃材料基板。 In the processing method of the brittle material substrate according to the third aspect of the invention, the brittle material substrate is a glass material substrate having a linear expansion coefficient larger than that of the alkali-free glass.

在線膨脹係數比較大之玻璃材料基板中，因熱影響所造成之缺口或裂紋等缺陷產生之可能性大，故藉由將本發明應用於該種玻璃基板，能有效地抑制切斷不良。 In the glass material substrate having a relatively large coefficient of linear expansion, defects such as cracks or cracks due to thermal influence are likely to occur, and therefore, by applying the present invention to such a glass substrate, it is possible to effectively suppress the cutting failure.

關於第4發明之脆性材料基板的加工方法，係為於第1至第3發明之任一種加工方法中，在第2步驟中，脈衝雷射光的重疊率設定為-47%以下至-97%以上，且雷射強度設定為3.1×1010[W/cm2]以上至5.1×1010[W/cm2]以下。 In the processing method of the brittle material substrate according to the fourth aspect of the invention, in the processing method according to any one of the first to third aspects, in the second step, the overlapping ratio of the pulsed laser light is set to -47% or less to -97%. The above, and the laser intensity is set to be 3.1 × 10 10 [W/cm 2 ] or more to 5.1 × 10 10 [W/cm 2 ] or less.

在以上之本發明中，特別是於線膨脹係數比較大的脆性材料基板形成格子狀的切割溝，並切斷時，能減少切斷不良。 In the above invention, in particular, when the brittle material substrate having a relatively large linear expansion coefficient forms a lattice-shaped dicing groove and is cut, the cutting failure can be reduced.

[加工對象] [Processing object]

本發明之一實施形態之加工方法，主要係適用於對線膨脹係數較無鹼玻璃大之D263(SCHOTT製)等玻璃形成交叉切割溝(cross scribe)的情況。 The processing method according to an embodiment of the present invention is mainly applied to a case where a cross-cutting groove is formed in a glass such as D263 (manufactured by SCHOTT) having a linear expansion coefficient larger than that of an alkali-free glass.

[雷射加工裝置] [Laser processing device]

第1圖係為用以實施本發明之一實施形態的加工方法之雷射加工裝置5的概略構成圖者。雷射加工裝置5係具有包含雷射光線振盪器6a及雷射控制部6b之雷射光線振盪單元6、包含用以將雷射光朝預定之方向導引之複數個鏡片(mirror)的傳送光學系統7、及用以使來自傳送光學系統7的雷射光聚光之聚光透鏡8。從雷射光線振盪單元6射出光束強度等照射條件經控制的脈衝雷射光(以下會有僅記載為雷射光的情形)。再者，玻璃基板1係載置於平台9。平台9係藉由驅動控制部20來驅動控制，能在水平面內移動。亦即，載置於平台9之玻璃基板1與從聚光透鏡8照射之雷射光線係在水平面內可相對移動。此外，雷射光與供載置玻璃基板1的平台9，係為可相對性朝上下方向移動。雷射控制部6b及驅動控制部20係藉由加工控制部21而控制。 Fig. 1 is a schematic configuration diagram of a laser processing apparatus 5 for carrying out a processing method according to an embodiment of the present invention. The laser processing apparatus 5 has a laser beam oscillating unit 6 including a laser beam oscillator 6a and a laser control unit 6b, and a transmission optical lens including a plurality of lenses for guiding the laser light in a predetermined direction. The system 7 and a collecting lens 8 for collecting the laser light from the transmitting optical system 7 are condensed. Pulsed laser light whose irradiation conditions are controlled such as the beam intensity is emitted from the laser light oscillating unit 6 (hereinafter, only the case of laser light is described). Furthermore, the glass substrate 1 is placed on the stage 9. The platform 9 is driven and controlled by the drive control unit 20 and is movable in a horizontal plane. That is, the glass substrate 1 placed on the stage 9 and the laser beam irradiated from the collecting lens 8 are relatively movable in a horizontal plane. Further, the laser light and the stage 9 on which the glass substrate 1 is placed are relatively movable in the vertical direction. The laser control unit 6b and the drive control unit 20 are controlled by the machining control unit 21.

加工控制部21係以微電腦構成，並控制雷射控制部6b及驅動控制部20以執行以下之處理。 The machining control unit 21 is configured by a microcomputer, and controls the laser control unit 6b and the drive control unit 20 to execute the following processing.

(1)將光束強度經調整之雷射光朝玻璃基板1照射，並且沿著第1方向及朝與第1方向正交之第2方向延伸之切斷預定線掃描，沿著切斷預定線形成交叉的切割溝。亦即，進行交叉切割。 (1) The laser beam whose beam intensity is adjusted is irradiated toward the glass substrate 1, and is scanned along the first direction and the line to cut extending in the second direction orthogonal to the first direction, and formed along the line to cut. Cross cutting groove. That is, cross cutting is performed.

(2)在切割溝之形成時，不使脈衝雷射光重疊(overlap)，而以脈衝雷射光所造成之加工痕重疊的方式，設定雷射光的照射條件。 (2) When the dicing groove is formed, the pulsed laser light is not overlapped, and the irradiation conditions of the laser light are set so that the processing marks caused by the pulsed laser light overlap.

[雷射加工方法] [Laser processing method]

在將玻璃基板切斷時，首先，藉由雷射加工裝置5沿著各切斷預定線形成切割溝。此時，如同前述，不使脈衝雷射光重疊，而以脈衝雷射光所造成之加工痕重疊的方式照射雷射光。 When the glass substrate is cut, first, a cutting groove is formed along the respective cutting planned lines by the laser processing apparatus 5. At this time, as described above, the laser light is irradiated so that the pulsed laser light does not overlap, and the processing marks caused by the pulsed laser light overlap.

接著，對切割溝的兩側施加壓力。藉此，玻璃基板會沿著切割溝切斷。 Next, pressure is applied to both sides of the cutting groove. Thereby, the glass substrate is cut along the cutting groove.

[實驗例] [Experimental example]

第2圖係為顯示採用D263為例作為加工對象基板，形成格子狀的切割溝(cross scribe)，並切斷之情況的實驗例。 FIG. 2 is an experimental example showing a case where D263 is used as a substrate to be processed, and a grid-shaped dicing groove is formed and cut.

-實驗例1- -Experimental Example 1 <雷射條件> <Laser condition>

波長：266nm Wavelength: 266nm

脈衝寬度：18ns Pulse width: 18ns

聚光徑(基板上表面的直徑)：3.4μm Converging path (diameter of the upper surface of the substrate): 3.4 μm

重複頻率：60kHz Repeat frequency: 60kHz

強度：3.08×1010W/cm2 Strength: 3.08×10 10 W/cm 2

掃描強度：300mm/s---重疊率：-47.3% Scanning intensity: 300mm/s---overlap rate: -47.3%

焦點位置：基板上表面 Focus position: upper surface of the substrate

掃描次數：1次 Scan times: 1 time

<基板> <Substrate>

種類：D263(SCHOTT製) Type: D263 (made by SCHOTT)

厚度：0.3mm Thickness: 0.3mm

再者，「重疊率」係為根據以下的式子所算出的值。 In addition, the "overlap rate" is a value calculated based on the following formula.

重疊率(%)=(1-(掃描速度[mm/s]/(重複頻率[Hz]×聚光徑[mm]))) Overlap rate (%) = (1 - (scanning speed [mm / s] / (repetition frequency [Hz] × concentration path [mm])))

將使用以上之條件加工之結果顯示於第2圖。第2圖(a)係為將切割溝加工後之基板上表面的模樣予以擴大顯示者。根據該圖可明瞭脈衝雷射光所造成之加工痕重疊之情形。第2圖(b)係為將從上方觀察切斷後之端面的模樣予以擴大顯示者。此外，第2圖(c)係為將切斷後之切斷面的模樣予以顯示者。根據該等第2圖(b)、(c)，可確認在切斷後於切割溝的交點部並未產生毛邊或缺口等缺陷。 The results of processing using the above conditions are shown in Fig. 2. Fig. 2(a) shows an enlarged display of the upper surface of the substrate after the dicing process. According to the figure, the overlap of the processing marks caused by the pulsed laser light can be clarified. Fig. 2(b) shows an enlarged view of the pattern of the end surface after cutting from the upper side. Further, Fig. 2(c) shows the appearance of the cut surface after cutting. According to the second drawings (b) and (c), it was confirmed that defects such as burrs or notches were not formed at the intersection of the dicing grooves after the cutting.

-實驗例2- - Experimental Example 2

接著，將使雷射強度及重疊率變化之情況的切斷評估顯示於第1表。在該第1表中，係顯示使雷射強度在1.0 至5.1×1010W/cm2之範圍變化、且使重疊率在75.4至-96.8%的範圍變化之情況的切斷品質之結果。再者，關於其他的雷射條件及加工對象，係為與實驗例1相同。 Next, the cut evaluation of the case where the laser intensity and the overlap ratio are changed is displayed in the first table. In the first table, the results of the cutting quality in the case where the laser intensity is changed in the range of 1.0 to 5.1 × 10 10 W/cm 2 and the overlap ratio is changed in the range of 75.4 to -96.8% are shown. Further, the other laser conditions and processing targets were the same as in Experimental Example 1.

○：可切斷(品質：良好) ○: Can be cut off (quality: good)

×：切斷不良(產生缺口或裂紋(crack)) ×: poor cutting (causing a crack or crack)

根據以上之實驗結果，在切割溝之形成時，可得知藉由脈衝雷射光的重疊率設定為-47%以下至-97%以上，且雷射強度設定為3.1×1010W/cm2以上至5.1×1010W/cm2以下，能以良好的切斷品質進行交叉切割。 According to the above experimental results, when the dicing groove is formed, it is found that the overlap ratio of the pulsed laser light is set to -47% or less to -97% or more, and the laser intensity is set to 3.1 × 10 10 W/cm 2 . From the above to 5.1 × 10 10 W/cm 2 or less, cross cutting can be performed with good cutting quality.

[其他實施形態] [Other Embodiments]

本發明並非為限定於以上之實施形態者，且可在不脫離本發明之範圍進行種種變形或修正。 The present invention is not limited to the embodiments described above, and various modifications and changes can be made without departing from the scope of the invention.

例如在前述實施形態中，雖以D263作為加工對象， 但亦可同樣地應用於線膨脹係數比較大之其他的脆性材料基板。 For example, in the above embodiment, D263 is used as a processing target. However, it can be similarly applied to other brittle material substrates having a relatively large linear expansion coefficient.

(產業上之利用可能性) (industrial use possibility)

在本發明之加工方法中，係於線膨脹係數比較大的脆性材料基板形成格子狀的切割溝並切斷時，特別能減少切斷不良。 In the processing method of the present invention, when the brittle material substrate having a relatively large linear expansion coefficient is formed into a lattice-shaped dicing groove and is cut, the cutting failure can be particularly reduced.

1‧‧‧玻璃基板 1‧‧‧ glass substrate

5‧‧‧雷射加工裝置 5‧‧‧ Laser processing equipment

6‧‧‧雷射光線振盪單元 6‧‧‧Laser light oscillating unit

6a‧‧‧雷射光線振盪器 6a‧‧‧Laser light oscillator

6b‧‧‧雷射控制部 6b‧‧‧Laser Control Department

7‧‧‧傳送光學系統 7‧‧‧Transmission optical system

8‧‧‧聚光透鏡 8‧‧‧ Concentrating lens

9‧‧‧平台 9‧‧‧ platform

20‧‧‧驅動控制部 20‧‧‧Drive Control Department

21‧‧‧加工控制部 21‧‧‧Processing Control Department

第1圖係為用以實施本發明之一實施形態的加工方法之雷射加工裝置的概略構成圖。 Fig. 1 is a schematic configuration diagram of a laser processing apparatus for carrying out a processing method according to an embodiment of the present invention.

第2圖(a)至(c)係為顯示交叉切割之實驗例1的切割溝及切斷結果的加工樣品之照片。 Fig. 2 (a) to (c) are photographs showing the cut grooves of the experimental example 1 of the cross cutting and the processed samples of the cutting results.

Claims (4)

一種脆性材料基板的加工方法，係為用以將脈衝雷射光沿著格子狀之切斷預定線照射至脆性材料基板，並切斷脆性材料基板之加工方法，係包含：第1步驟，係沿著朝第1方向延伸之切斷預定線掃描脈衝雷射光，並於基板表面形成第1切割溝；第2步驟，係於形成前述第1切割溝後，沿著朝與前述第1方向正交之第2方向延伸的切斷預定線，以不使脈衝雷射光重疊且使脈衝雷射光對基板所造成之加工痕重疊的方式，照射脈衝雷射光，並於基板表面形成第2切割溝；以及第3步驟，係按壓前述各切割溝的兩側而沿著前述各切割溝切斷基板。 A method for processing a brittle material substrate is a method for processing a pulsed laser beam to a brittle material substrate along a grid-shaped cutting line and cutting the brittle material substrate, comprising: a first step, a Scanning pulsed laser light in a predetermined direction extending in the first direction to form a first dicing groove on the surface of the substrate; and second step, after forming the first dicing groove, along the first direction The planned cutting line extending in the second direction is irradiated with pulsed laser light so as not to overlap the pulsed laser light and superimposes the processing marks caused by the pulsed laser light on the substrate, and forms a second dicing groove on the surface of the substrate; In the third step, the both sides of the respective cutting grooves are pressed to cut the substrate along the respective cutting grooves. 如申請專利範圍第1項所述之脆性材料基板的加工方法，其中，在前述第1步驟中，係沿著切斷預定線，以不使脈衝雷射光重疊且使脈衝雷射光對基板所造成之加工痕重疊的方式，照射脈衝雷射光。 The method for processing a brittle material substrate according to the first aspect of the invention, wherein, in the first step, the laser beam is not overlapped and the pulsed laser light is caused on the substrate along the line to cut. The pulsed laser light is irradiated in such a manner that the processing marks overlap. 如申請專利範圍第1項所述之脆性材料基板的加工方法，其中，前述脆性材料基板係為線膨脹係數較無鹼玻璃為大之玻璃材料基板。 The method for processing a brittle material substrate according to claim 1, wherein the brittle material substrate is a glass material substrate having a linear expansion coefficient larger than that of the alkali-free glass. 如申請專利範圍第1項所述之脆性材料基板的加工方法，其中，在前述第2步驟中，脈衝雷射光的重疊率設定為-47%以下至-97%以上，且雷射強度設定為3.1×1010[W/cm2]以上至5.1×1010[W/cm2]以下。 The method for processing a brittle material substrate according to claim 1, wherein in the second step, the overlap ratio of the pulsed laser light is set to -47% or less to -97% or more, and the laser intensity is set to 3.1 × 10 10 [W/cm 2 ] or more to 5.1 × 10 10 [W/cm 2 ] or less.
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