CN105592639A - 电路板及其制作方法 - Google Patents
电路板及其制作方法 Download PDFInfo
- Publication number
- CN105592639A CN105592639A CN201410569679.6A CN201410569679A CN105592639A CN 105592639 A CN105592639 A CN 105592639A CN 201410569679 A CN201410569679 A CN 201410569679A CN 105592639 A CN105592639 A CN 105592639A
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- layer
- conducting wire
- copper foil
- insulating barrier
- circuit board
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
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Claims (13)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410569679.6A CN105592639B (zh) | 2014-10-23 | 2014-10-23 | 电路板及其制作方法 |
TW103146461A TWI606763B (zh) | 2014-10-23 | 2014-12-31 | 電路板及其製作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410569679.6A CN105592639B (zh) | 2014-10-23 | 2014-10-23 | 电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN105592639A true CN105592639A (zh) | 2016-05-18 |
CN105592639B CN105592639B (zh) | 2019-01-25 |
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Application Number | Title | Priority Date | Filing Date |
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CN201410569679.6A Active CN105592639B (zh) | 2014-10-23 | 2014-10-23 | 电路板及其制作方法 |
Country Status (2)
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CN (1) | CN105592639B (zh) |
TW (1) | TWI606763B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111405770A (zh) * | 2020-03-19 | 2020-07-10 | 盐城维信电子有限公司 | 一种线路板及其制造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200087479A (ko) * | 2019-01-11 | 2020-07-21 | 스템코 주식회사 | 다층 기판 및 그 제조 방법 |
CN115379669A (zh) * | 2021-05-20 | 2022-11-22 | 鹏鼎控股(深圳)股份有限公司 | 多层线路板及其制造方法 |
TWI824303B (zh) * | 2021-09-23 | 2023-12-01 | 欣興電子股份有限公司 | 電路板線路結構改良方法及電路板線路改良結構 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1959964A (zh) * | 2005-08-24 | 2007-05-09 | 东京毅力科创株式会社 | 电容器及其制造方法 |
CN101351087A (zh) * | 2007-07-17 | 2009-01-21 | 欣兴电子股份有限公司 | 内埋式线路结构及其工艺 |
US20100044083A1 (en) * | 2008-08-22 | 2010-02-25 | Chih-Peng Fan | Build-up printed circuit board structure for increasing fine circuit density and method of manufacturing the same |
WO2010126989A1 (en) * | 2009-04-28 | 2010-11-04 | E. I. Du Pont De Nemours And Company | Thin-film capacitor structures embedded in semiconductor packages and methods of making |
CN102762039A (zh) * | 2011-04-27 | 2012-10-31 | 欣兴电子股份有限公司 | 线路板及其制作方法 |
CN103187314A (zh) * | 2011-12-30 | 2013-07-03 | 旭德科技股份有限公司 | 封装载板及其制作方法 |
CN103379726A (zh) * | 2012-04-17 | 2013-10-30 | 景硕科技股份有限公司 | 线路积层板的复层线路结构 |
CN103416109A (zh) * | 2010-12-24 | 2013-11-27 | Lg伊诺特有限公司 | 印刷电路板及其制造方法 |
CN103491729A (zh) * | 2012-06-11 | 2014-01-01 | 欣兴电子股份有限公司 | 线路板及其制作方法 |
CN103687339A (zh) * | 2012-09-26 | 2014-03-26 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
CN103731979A (zh) * | 2012-10-16 | 2014-04-16 | 三星电机株式会社 | 混合层压基板、其制造方法和封装基板 |
CN103889169A (zh) * | 2012-12-22 | 2014-06-25 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
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2014
- 2014-10-23 CN CN201410569679.6A patent/CN105592639B/zh active Active
- 2014-12-31 TW TW103146461A patent/TWI606763B/zh active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1959964A (zh) * | 2005-08-24 | 2007-05-09 | 东京毅力科创株式会社 | 电容器及其制造方法 |
CN101351087A (zh) * | 2007-07-17 | 2009-01-21 | 欣兴电子股份有限公司 | 内埋式线路结构及其工艺 |
US20100044083A1 (en) * | 2008-08-22 | 2010-02-25 | Chih-Peng Fan | Build-up printed circuit board structure for increasing fine circuit density and method of manufacturing the same |
WO2010126989A1 (en) * | 2009-04-28 | 2010-11-04 | E. I. Du Pont De Nemours And Company | Thin-film capacitor structures embedded in semiconductor packages and methods of making |
CN103416109A (zh) * | 2010-12-24 | 2013-11-27 | Lg伊诺特有限公司 | 印刷电路板及其制造方法 |
CN102762039A (zh) * | 2011-04-27 | 2012-10-31 | 欣兴电子股份有限公司 | 线路板及其制作方法 |
CN103187314A (zh) * | 2011-12-30 | 2013-07-03 | 旭德科技股份有限公司 | 封装载板及其制作方法 |
CN103379726A (zh) * | 2012-04-17 | 2013-10-30 | 景硕科技股份有限公司 | 线路积层板的复层线路结构 |
CN103491729A (zh) * | 2012-06-11 | 2014-01-01 | 欣兴电子股份有限公司 | 线路板及其制作方法 |
CN103687339A (zh) * | 2012-09-26 | 2014-03-26 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
CN103731979A (zh) * | 2012-10-16 | 2014-04-16 | 三星电机株式会社 | 混合层压基板、其制造方法和封装基板 |
CN103889169A (zh) * | 2012-12-22 | 2014-06-25 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111405770A (zh) * | 2020-03-19 | 2020-07-10 | 盐城维信电子有限公司 | 一种线路板及其制造方法 |
CN111405770B (zh) * | 2020-03-19 | 2021-10-22 | 盐城维信电子有限公司 | 一种线路板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI606763B (zh) | 2017-11-21 |
CN105592639B (zh) | 2019-01-25 |
TW201618622A (zh) | 2016-05-16 |
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Effective date of registration: 20161219 Address after: 066004 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant after: Qi Ding Technology Qinhuangdao Co.,Ltd. Applicant after: Zhen Ding Technology Co.,Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant before: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. Applicant before: Zhen Ding Technology Co.,Ltd. |
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Effective date of registration: 20230923 Address after: 066004 No. 18-2, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: No.18, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province 066004 Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |